CN102821551B - Manufacturing method for heavy-copper printed circuit boards - Google Patents
Manufacturing method for heavy-copper printed circuit boards Download PDFInfo
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- CN102821551B CN102821551B CN201210308620.2A CN201210308620A CN102821551B CN 102821551 B CN102821551 B CN 102821551B CN 201210308620 A CN201210308620 A CN 201210308620A CN 102821551 B CN102821551 B CN 102821551B
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Abstract
The invention discloses a manufacturing method for heavy-copper printed circuit boards. The manufacturing method includes steps of (1), providing an inner substrate; (2), pressing and fitting; (3) boring; (4) electroplating; (5), manufacturing outer circuits; (6), printing solder masks; (7), milling frames and hollow-out areas before spraying solders; (8) spraying the solders; and (9) molding. By the manufacturing method, problems such as poor quality and waste of time, manpower and material resources due to high temperature during solder spraying are solved, and board delamination during solder spraying in manufacturing of the heavy-copper printed circuit boards is overcome. In addition, by the manufacturing method which is simple and feasible, the yield of the solder spraying (especially lead-free solder spraying) process for heavy-copper boards can be improved greatly and production cost can be reduced further.
Description
Technical field
The present invention relates to a kind of manufacture method of printed wiring board, especially relate to a kind of manufacture method of thick copper type printed circuit board, belong to printed wiring board and make field.
Background technology
At present, this kind of thick copper type printed circuit board generally adopts first Baking out when spraying tin, plate surface temperature is suitably raised, then preliminary treatment before spray tin, upper scaling powder, spray tin is carried out, the shortcoming of the method is: reliability risk is higher afterwards in spray tin (especially lead-free tin spray), easily has plate bursting problem.
Summary of the invention
In order to the plate bursting problem that the stress solving Yin Gaowen generation in thick copper coin spray tin process causes, the present invention spray tin before mill off wiring board frame and between the non-effective graphics field of edges of boards or typesetting spacing milling some vacancy sections with releasing heat stress, overcome the risk that spray tin reliability is low, solve plate bursting problem, spray the use amount that tin also can reduce tin after mill off frame, reduce further the cost of spray tin.
In order to achieve the above object, the technical solution used in the present invention is:
A manufacture method for thick copper type printed circuit board, is characterized in that: comprise the following steps:
(1) provide internal substrate: provide at least two pieces of internal substrates first as required, and etch all internal layer circuits on every block internal substrate;
(2) pressing: be placed on by bonding sheet between internal substrate, stacks each internal substrate simultaneously, utilizes press pressing by the order designed in advance;
(3) hole: utilize on the wiring board of drilling machine after pressing and get out the hole designed in advance;
(4) electroplate: by boring after circuit plate hole in and surface electrical plated with copper;
(5) outer-layer circuit: etched the circuit designed in advance by line transitions at skin;
(6) welding resistance printing: solder mask on wiring board surface printing;
(7) milling frame and vacancy section before spraying tin: before spray tin, use forming machine mill off wiring board frame between the non-effective graphics field of edges of boards or typesetting spacing, to add milling vacancy section simultaneously;
(8) tin is sprayed: under 265 DEG C of high temperature, use tin-spraying machine to spray tin to wiring board;
(9) shaping: to utilize forming machine to mill out required wiring board external form, obtain this kind of thick copper type printed circuit board finished product.
Further technical scheme is:
Further comprising the steps of between described step (7) and step (8): baking sheet: to use baking box to carry out pre-baked to wiring board.
Further comprising the steps of between described step (7) and step (8): pre-treatment: before spray tin, to use liquid medicine to clean wiring board.
Further comprising the steps of between described step (7) and step (8): upper scaling powder: before spray tin in PCB surface coating scaling powder.
In above-mentioned steps (1), described internal substrate have at least one deck copper thick >=3oz.
In above-mentioned steps (7), the length of described vacancy section is not less than 10mm, and is not more than 1/2 of whole plate length, and width is 1 ~ 5mm.
In above-mentioned steps (7), described vacancy section is strip.
The invention has the beneficial effects as follows: the present invention utilizes new simple process to spray by milling frame and vacancy section before spray tin the thermal stress produced in tin process in order to release, effectively ensure that reliability, the reliability of thick copper coin after spray tin, improve the yield after thick copper type printed circuit board spray tin, avoid the risk of plate bursting.
Accompanying drawing explanation
Fig. 1 is process chart of the present invention;
Stacked configuration schematic diagram when Fig. 2 is product pressing of the present invention;
Fig. 3 is milling frame and vacancy section structural representation before spray tin of the present invention.
In figure, Main Reference Numerals implication is:
1. the first internal substrate;
2. the second internal substrate;
3. bonding sheet;
A. the frame of mill off before tin is sprayed;
B. the vacancy section of the front milling between the non-effective graphics field of edges of boards and typesetting spacing of tin is sprayed.
Embodiment
For disclosing technical scheme of the present invention further, embodiments of the present invention are described in detail: as shown in Figure 2, a kind of thick copper type printed circuit board, comprises at least two pieces of internal substrates below in conjunction with accompanying drawing, namely bonding sheet 3 is provided with between the first internal substrate 1 and the second internal substrate 2, two pieces of internal substrates.As shown in Figure 3, between the non-effective graphics field of edges of boards or typesetting spacing, vacancy section b is provided with.
As shown in Figure 1 to Figure 3, a kind of manufacture method of thick copper type printed circuit board, comprises the following steps:
(1) provide internal substrate: provide at least two pieces of internal substrates first as required, i.e. the first internal substrate 1 and the second internal substrate 2, have at least the copper of one deck internal substrate thick >=3oz, every block internal substrate etches all internal layer circuits;
(2) pressing: be placed on by bonding sheet 3 between first internal substrate 1 and the second internal substrate 2, stacks each internal substrate simultaneously, utilizes press pressing by the order designed in advance;
(3) hole: utilize on the wiring board of drilling machine after pressing and get out the hole designed in advance;
(4) electroplate: by boring after circuit plate hole in and surface electrical plated with copper;
(5) outer-layer circuit: made the circuit designed in advance by line transitions at skin;
(6) welding resistance printing: solder mask on wiring board surface printing;
(7) milling frame and vacancy section before spraying tin: before spray tin, use forming machine mill off wiring board frame a, between the non-effective graphics field of edges of boards or typesetting spacing, add milling vacancy section b simultaneously, the active graphical design of wiring board can not be affected, vacancy section b is strip, its length is not less than 10mm, and being not more than 1/2 of whole plate length, width is 1 ~ 5mm;
(8) baking sheet: use baking box to carry out pre-baked to wiring board;
(9) pre-treatment: use liquid medicine to clean wiring board before spray tin;
(10) upper scaling powder: before spray tin in PCB surface coating scaling powder;
(11) tin is sprayed: under 265 DEG C of high temperature, use tin-spraying machine to spray tin to wiring board, be beneficial to and weld and protect copper face;
(12) shaping: to utilize forming machine to mill out required wiring board external form, obtain this kind of thick copper type printed circuit board finished product.
Due to high temperature in thick copper type printed circuit board spray tin process, and because the thick too thick reason of copper makes the thermal shock suffered by wiring board more strong (copper is thick, and wiring board heat radiator is faster).
The present invention is by the single of mill off frame and milling vacancy section before using spray tin or combinationally use, and solves that thick copper type printed circuit board reliability after spray tin is poor, the problem of easily plate bursting, also reduce further simultaneously and sprays tin cost.
More than show and describe general principle of the present invention, principal character and advantage.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection range is defined by appending claims and equivalent thereof.
Claims (5)
1. a manufacture method for thick copper type printed circuit board, is characterized in that: comprise the following steps:
(1) provide internal substrate: provide at least two pieces of internal substrates first as required, and etch all internal layer circuits on every block internal substrate;
(2) pressing: be placed on by bonding sheet between internal substrate, stacks each internal substrate simultaneously, utilizes press pressing by the order designed in advance;
(3) hole: utilize on the wiring board of drilling machine after pressing and get out the hole designed in advance;
(4) electroplate: by boring after circuit plate hole in and surface electrical plated with copper;
(5) outer-layer circuit: etched the circuit designed in advance by line transitions at skin;
(6) welding resistance printing: solder mask on wiring board surface printing;
(7) milling frame and vacancy section before spraying tin: before spray tin, use forming machine mill off wiring board frame between typesetting spacing, to add milling vacancy section simultaneously, the length of described vacancy section is not less than 10mm, and being not more than 1/2 of whole plate length, width is 1 ~ 5mm, and described vacancy section is strip;
(8) tin is sprayed: under 265 DEG C of high temperature, use tin-spraying machine to spray tin to wiring board;
(9) shaping: to utilize forming machine to mill out required wiring board external form, obtain this kind of thick copper type printed circuit board finished product.
2. the manufacture method of thick copper type printed circuit board according to claim 1, is characterized in that: further comprising the steps of between described step (7) and step (8): baking sheet: use baking box to carry out pre-baked to wiring board.
3. the manufacture method of thick copper type printed circuit board according to claim 1, is characterized in that: further comprising the steps of between described step (7) and step (8): pre-treatment: use liquid medicine to clean wiring board before spray tin.
4. the manufacture method of thick copper type printed circuit board according to claim 1, is characterized in that: further comprising the steps of between described step (7) and step (8): upper scaling powder: before spray tin in PCB surface coating scaling powder.
5. the manufacture method of thick copper type printed circuit board according to claim 1, is characterized in that: in above-mentioned steps (1), described internal substrate have at least one deck copper thick >=3oz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210308620.2A CN102821551B (en) | 2012-08-28 | 2012-08-28 | Manufacturing method for heavy-copper printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210308620.2A CN102821551B (en) | 2012-08-28 | 2012-08-28 | Manufacturing method for heavy-copper printed circuit boards |
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| Publication Number | Publication Date |
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| CN102821551A CN102821551A (en) | 2012-12-12 |
| CN102821551B true CN102821551B (en) | 2015-06-03 |
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| CN201210308620.2A Active CN102821551B (en) | 2012-08-28 | 2012-08-28 | Manufacturing method for heavy-copper printed circuit boards |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103266336B (en) * | 2013-04-26 | 2016-06-01 | 胜宏科技（惠州）股份有限公司 | A kind of thick copper circuit board copper face thickening method |
| CN103730375B (en) * | 2014-01-14 | 2016-08-17 | 无锡江南计算技术研究所 | OSP surface processes base plate for packaging molding milling method |
| CN104812158B (en) * | 2014-01-28 | 2018-03-06 | 北大方正集团有限公司 | The substrate of the anti-method for being layered plate bursting of circuit board, the preparation method of circuit board and circuit board |
| CN105376961A (en) * | 2015-11-03 | 2016-03-02 | 江门崇达电路技术有限公司 | HASL surface treatment PCB manufacturing method |
| CN107058930B (en) * | 2017-05-15 | 2019-06-11 | 深圳市景旺电子股份有限公司 | It is a kind of thickness pcb board and its spray tin method |
| CN108055774A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of selectivity thick copper circuit production method |
| CN109379854A (en) * | 2018-09-20 | 2019-02-22 | 奥士康精密电路（惠州）有限公司 | A kind of low TG spray tin plays the control method of white point |
| CN110099507B (en) * | 2019-05-29 | 2022-04-05 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and manufacturing method thereof |
| CN111031674B (en) * | 2019-11-21 | 2023-04-21 | 惠州美锐电子科技有限公司 | Method for removing selective electroplating edge at specific position on PCB |
| CN113395842A (en) * | 2021-06-07 | 2021-09-14 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with suspended circuit layer |
| CN114340188A (en) * | 2021-12-30 | 2022-04-12 | 清远市富盈电子有限公司 | Production method for improving blistering layering of copper layer of PTH slot of lead-free tin-sprayed plate |
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|---|---|---|---|---|
| TW200841779A (en) * | 2007-04-13 | 2008-10-16 | Asia Electronic Material Co | Copper clad laminate for manufacturing flexible printed circuit board and the method for making the same |
| CN101695218A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for manufacturing printed circuit board with half-edge hole |
| CN102036462A (en) * | 2010-08-31 | 2011-04-27 | 北大方正集团有限公司 | Printed circuit board and protection method thereof |
| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
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2012
- 2012-08-28 CN CN201210308620.2A patent/CN102821551B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200841779A (en) * | 2007-04-13 | 2008-10-16 | Asia Electronic Material Co | Copper clad laminate for manufacturing flexible printed circuit board and the method for making the same |
| CN101695218A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for manufacturing printed circuit board with half-edge hole |
| CN102036462A (en) * | 2010-08-31 | 2011-04-27 | 北大方正集团有限公司 | Printed circuit board and protection method thereof |
| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
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| Publication number | Publication date |
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| CN102821551A (en) | 2012-12-12 |
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