CN104735900A - Circuit board with side face metal structure and manufacturing method thereof - Google Patents
Circuit board with side face metal structure and manufacturing method thereof Download PDFInfo
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- CN104735900A CN104735900A CN201310722790.XA CN201310722790A CN104735900A CN 104735900 A CN104735900 A CN 104735900A CN 201310722790 A CN201310722790 A CN 201310722790A CN 104735900 A CN104735900 A CN 104735900A
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- circuit board
- holes
- limit groove
- circuit substrate
- groove
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Abstract
The invention discloses a method for manufacturing a circuit board with a side face metal structure. The method aims to overcome the defects existing in an existing circuit board side face metallization process. The method includes the steps that a circuit base board including at least one circuit board unit is provided; at least one group, namely two through holes are formed in at least one boundary line of the peripheral regions of the circuit board units; edge slots formed in the circuit board unit regions and adjacent to the boundary lines are formed in the circuit base board, the two ends of each edge slot are adjacent to and connected with the corresponding two through holes respectively, but the edge slots are not communicated with the two through holes; the two through holes are filled with resin or metal slurry and cured; the inner walls of the edge slots are metalized, and metalized side walls of the circuit board units are formed; the circuit base board is cut, and the cutting path passes through the two through holes and the adjoining positions of the edge slots and the two through holes; the adjoining positions of the edge slots and the two through holes are removed through drilling.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of to there is circuit board of side metal structure and preparation method thereof.
Background technology
At present, occurred a kind of circuit board with side metal structure, diversified welding manner supported by this kind of circuit board, be applicable to encapsulate there is more pins electronic component as chip etc.
The manufacture method of this kind of circuit board is: first drill flute, then heavy copper, and plating thickeies, do graphic plating, the inwall of groove is metallized, will to metallize groove mill off half finally by milling profile technique, thus form sidewall metallization groove, the obtained circuit board with side metal structure.
Practice finds, said method has following defect: when milling profile, because milling cutter is from metallization groove process, the metallization inwall of groove (hole copper) drawknot can be caused to become silk, forms burr and remains on metallization groove, affect reliability and outward appearance.
Summary of the invention
The embodiment of the present invention provides a kind of and has circuit board of side metal structure and preparation method thereof, there is above-mentioned defect to solve existing circuit board side metallization process.
First aspect present invention provides a kind of manufacture method with the circuit board of side metal structure, comprising:
There is provided circuit substrate, described circuit substrate comprises at least one circuit board unit; Described at least one circuit board unit neighboring area at least one boundary line on process at least one group of through hole, described one group of through hole specifically comprises two through holes; On described circuit substrate, processing is positioned at described circuit board unit region and the limit groove of contiguous described boundary line, and the two ends of described limit groove adjoin with described two through holes respectively, but described limit groove is not communicated with described two through holes; Potting resin or metal paste in described two through holes also solidify; The inwall of described limit groove is metallized, forms the metalized sidewall of described circuit board unit; Cut described circuit substrate, the path of cutting is through the adjoiner of described two through holes and described limit groove and described two through holes; The adjoiner of described limit groove and described two through holes is removed by boring.
Second aspect present invention provides a kind of circuit board with side metal structure, described circuit board has the limit groove being positioned at side, the sidewall of described limit groove is metallized, and the two ends of described limit groove have a groove respectively, are inlaid with resin or metal paste solid block in described groove.
Therefore, the embodiment of the present invention adopts on circuit substrate, processes through hole and limit groove, potting resin or metal paste in through-holes, then opposite side groove metallizes, cut milling profile again, and after cutting, the technical scheme removed the junction of limit groove and through hole by boring, achieves following technique effect:
Due to the path of cutting through two through holes without the inwall of limit groove, and two through holes are not metallized because being filled with resin or metal paste, thus can reduce or avoid the formation of burr in cutting process; For the burr that the adjoiner of limit groove and through hole may be formed, can remove in last drill process;
Visible, embodiment of the present invention method solves the defect of meeting at circuit board side formation burr of existing circuit board side metallization process existence, and then improves product appearance, improves product reliability.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart with the manufacture method of the circuit board of side metal structure that the embodiment of the present invention provides;
Fig. 2 a is the schematic diagram processing through hole on circuit substrate;
Fig. 2 b is the schematic diagram processing limit groove on circuit substrate;
Fig. 2 c is the partial schematic diagram at circuit substrate top groove and through hole;
Fig. 2 d is at the schematic diagram to potting resin in through hole or metal paste;
Fig. 2 e is the schematic diagram forming outer-layer circuit on circuit substrate;
Fig. 2 f is the schematic diagram of the cutting path of circuit substrate;
Fig. 2 g is the schematic diagram cutting the circuit board unit obtained.
Embodiment
The embodiment of the present invention provides a kind of manufacture method with the circuit board of side metal structure, there is above-mentioned number of drawbacks to solve existing circuit board side metallization process.The present invention also provides side to have the board structure of circuit of metal structure, has burr to solve side metal structure and has a strong impact on the technical barrier of circuit board outward appearance and reliability.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of manufacture method with the circuit board of side metal structure, can comprise:
110, provide circuit substrate, described circuit substrate comprises at least one circuit board unit; Described at least one circuit board unit neighboring area at least one boundary line on process at least one group of through hole, described one group of through hole specifically comprises two through holes; And on circuit substrate, processing is positioned at circuit board unit region and the limit groove of contiguous described boundary line, and the two ends of limit groove adjoin with two through holes respectively, but limit groove is not communicated with two through holes.
In the embodiment of the present invention, said circuit substrate can be copper-clad plate or the multi-layer sheet based on copper-clad plate lamination, and copper-clad plate can be single-side coated copper plate or double face copper.The present embodiment take circuit substrate as multi-layer sheet is example, and this multilager base plate can comprise one or more internal layer circuit layer, and is positioned at two coating metal layers on multilager base plate two sides.Said circuit substrate can comprise more than one circuit board unit, and each circuit board unit can be cut out after following process becomes independently circuit board.
The operation of this step processing through hole and limit groove can perform after lamination.
As shown in Figure 2 a, this step processes through hole 201 on circuit substrate 200.Wherein, circuit substrate 200 comprises at least one circuit board unit 210.The quantity of through hole 201 is even number and is at least two, and wherein every two through holes 201 are one group, and two through holes 201 of each group are positioned on a boundary line 202 of a circuit board unit, a boundary line 202 can comprise more than one group through hole 201.The diameter of through hole 201 is advisable with 0.3-0.5mm.
As shown in Figure 2 b, this step also processes limit groove 203 on circuit substrate 200.This limit groove 201 can be the groove running through circuit substrate 200.Wherein, the quantity of limit groove 203 can be identical with the group number of through hole 201, and each group through hole 201 corresponds to a limit groove 203.Limit groove 203 can be an elongated slot, such as semi-moon shaped elongated slot, and this limit groove 203 all can be positioned at circuit board unit 210 region, but near the boundary line 202 of circuit board unit 210.The two ends of limit groove 203 adjoin with two through holes 201 of a group respectively, but limit groove 203 is not communicated with through hole 201.As can be seen from the figure, through hole 201 and the adjoiner of limit groove 203 are very narrow regions, and in the present embodiment, the minimum widith of this adjoiner even can reach 0.02mm, and the Breadth Maximum of this adjoiner is advisable to be not more than 0.2mm.
In a kind of execution mode, as shown in Figure 2 c, the center of circle of two through holes 201 of a group can be positioned on a boundary line 202, and limit groove 203 can be an oval part, the major axis of this ellipse overlaps with boundary line 202, and the two ends of transverse can be the center of circle of two through holes 201 respectively.Limit groove 203 is semilune, and its arc-shaped side 203a overlaps with ellipse, and its straight flange 203b can be parallel with boundary line 202, and the vertical range of its straight flange 203b and boundary line 202 should be more than or equal to the radius of through hole 201.
In this step, power auger processes through hole 201 can be adopted, control dark milling processes limit groove 203 can be adopted; In this step, also can adopt the boring of other type of power auger processes.
120, potting resin or metal paste solidify in described two through holes.
As shown in Figure 2 d, in this step in through hole 201 potting resin or metal paste 205, and to solidify.In the present embodiment, said resin can be conduction or non-conductive resin.Said metal paste refers to puts into small metallic particles or powder the mixture formed in the carriers such as liquid resin, can also include adhesive or diluent etc. to improve its performance such as adhesiveness or mobility in this mixture.In the present embodiment, described metal paste can be specifically copper slurry.
The operation that potting resin or metal paste also solidify in through-holes of this step specifically can comprise:
1201, at a pasting protective film of described circuit substrate 200; Described diaphragm can be specifically high temperature without sulphur paper or other exotic material, for the one end open of through hole 201 is blocked.
1202, adopt silk-screen printing technique from the another side (opening of through hole 201 on this surface be not by shutoff) of described circuit substrate 200 to potting resin or metal paste 205 described through hole 201.
1203, adopt progressively elevated cure technique that described resin or metal paste 205 are solidified.Progressively elevated cure technique can by the bubble in resin or metal paste 205 or the expeling such as the adhesive that may exist or diluent.In a kind of execution mode, described progressively elevated cure technique refers to that according to the mode of 20 DEG C of heating up per half an hour, temperature being warmed up to 150 DEG C from 70 DEG C toasts.
1204, described diaphragm is removed.In embody rule, directly manual mode can tear high temperature without sulphur paper, then, can also carry out evening operation out, so as more than weeding residual without sulphur paper and unnecessary resin or metal paste 205, ensure that circuit board surface is smooth.
130, the inwall of described limit groove is metallized, form the metalized sidewall of described circuit board unit.
In this step, circuit substrate 200 carries out heavy copper and plating, realize the inwall metallization of opposite side groove 203, follow-uply cut out independently after circuit board unit 210, the metallization inwall of the arc-shaped side 203a of this limit groove 203, using a part for the side as circuit board unit 210, becomes the metalized sidewall of circuit board unit 210.
After above-mentioned metallization step, as shown in Figure 2 e, common process can also be adopted to make outer-layer circuit 206 on the surface of circuit substrate 200.
140, cut described circuit substrate, the adjoiner of described limit groove and described two through holes through the adjoiner of described two through holes and described limit groove and described two through holes, and is removed in the path of cutting by boring.
To circuit substrate milling profile in this step, by cutting, each circuit board unit is separated, becomes independently circuit board.As shown in figure 2f, the path 204 of cutting is: the part beyond limit groove 203, cutting path along circuit board unit 210 boundary line 202 and through through hole 201, in one end of limit groove 203, the path of cutting is after the adjoiner 207 of limit groove 203 and through hole 201, enter into the hollow region of limit groove 203, arrive the other end of limit groove 203, the path of cutting again through limit groove 203 with the adjoiner 207 of through hole 201 and overlap with boundary line 202 after through hole 201.
In above-mentioned cutting process, only can be cut and generating portion burr at the metallization inwall of limit groove 203 with the adjoiner 207 of through hole 201, but as can be seen from the figure, the adjoiner 207 of this limit groove 203 and through hole 201 is not on the arc-shaped side 203a of limit groove 203.In the present embodiment, power auger technique can be adopted to hole at adjoiner 207, adjoiner 207 is removed, remain on circuit board unit to avoid the burr of adjoiner 207.
Relatively horizontal cutting, boring is vertically downward, and thus, in boring procedure, the metallization inwall of adjoiner 207 can not produce new burr.
The circuit board unit 210 obtained after cutting is as shown in Figure 2 g, visible, and the metallization inwall of the arc-shaped side 203a of limit groove 203 becomes a part for the sidewall of circuit board unit 210, so, obtain the circuit board with side metal structure.
To sum up, the embodiment of the invention discloses a kind of manufacture method of circuit board, adopt on circuit substrate, process through hole and limit groove, potting resin or metal paste in through-holes, then opposite side groove metallizes, then cuts milling profile, and after cutting, by the technical scheme that the junction of limit groove and through hole is removed by boring, achieve following technique effect:
Due to the path of cutting through two through holes without the inwall of limit groove, and two through holes are not metallized because being filled with resin or metal paste, thus can reduce or avoid the formation of burr in cutting process; For the burr that the adjoiner of limit groove and through hole may be formed, can remove in last drill process;
Visible, embodiment of the present invention method solves the defect of meeting at circuit board side formation burr of existing circuit board side metallization process existence, and then improves product appearance, improves product reliability.
Embodiment one,
Please refer to Fig. 2 g, the embodiment of the present invention provides a kind of circuit board 210 with side metal structure.
Described circuit board 210 has the limit groove 203 being positioned at side, and the sidewall 203a of described limit groove is metallized, and the two ends of described limit groove 203 have a groove respectively, is inlaid with resin or the metal paste 205 of solidification in described groove.
Wherein, described circuit board can be double-sided wiring board or multilayer circuit board.
Above, the embodiment of the invention discloses a kind of circuit board with side metal structure, this circuit board can adopt method disclosed in embodiment one to obtain, and the more detailed description about this circuit board please refer to the record in embodiment one.
The circuit board of the embodiment of the present invention, owing to being designed with groove respectively at the two ends of side face edge groove, and in groove, be inlaid with resin or the metal paste of solidification, make, when this kind of circuit board milling profile obtained processing, cutting path must through being filled with the groove of resin or metal paste, and without the need to the metalized sidewall through limit groove, therefore, because reducing or avoid to be formed in cutting process burr, and then improve product appearance, improve product reliability.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.
The manufacture method with the circuit board of side metal structure provided the embodiment of the present invention above and structure are described in detail, but the explanation of above embodiment just understands method of the present invention, structure and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (10)
1. there is a manufacture method for the circuit board of side metal structure, it is characterized in that, comprising:
There is provided circuit substrate, described circuit substrate comprises at least one circuit board unit;
Described at least one circuit board unit neighboring area at least one boundary line on process at least one group of through hole, described one group of through hole specifically comprises two through holes;
On described circuit substrate, processing is positioned at described circuit board unit region and the limit groove of contiguous described boundary line, and the two ends of described limit groove adjoin with described two through holes respectively, but described limit groove is not communicated with described two through holes;
Potting resin or metal paste in described two through holes also solidify;
The inwall of described limit groove is metallized, forms the metalized sidewall of described circuit board unit;
Cut described circuit substrate, the path of cutting is through the adjoiner of described two through holes and described limit groove and described two through holes;
The adjoiner of described limit groove and described two through holes is removed by boring.
2. method according to claim 1, is characterized in that, potting resin or metal paste in described two through holes solidification comprise:
At a pasting protective film of described circuit substrate;
Adopt silk-screen printing technique from the another side of described circuit substrate to potting resin or metal paste the groove of described limit;
Progressively elevated cure technique is adopted to make described resin or metal paste solidification;
Remove described diaphragm.
3. method according to claim 1, is characterized in that,
Described diaphragm is that high temperature is without sulphur paper.
4. method according to claim 1, is characterized in that, in described two through holes, potting resin or metal paste also comprise after also solidifying:
Resin unnecessary for the aperture place of described two through holes or metal paste are rooted out totally.
5. method according to claim 1, is characterized in that, also comprises before cutting to described circuit substrate:
Described circuit substrate makes outer-layer circuit figure.
6. method according to claim 2, is characterized in that, also comprises:
Described circuit substrate makes in the process of outer-layer circuit figure, the etching metal layer around the aperture of described two through holes is removed.
7. method according to claim 1, is characterized in that,
Described circuit substrate is copper-clad plate or the multi-layer sheet based on copper-clad plate lamination.
8. method according to claim 1, is characterized in that,
Described limit groove is the groove running through described circuit substrate.
9. one kind has the circuit board of side metal structure, it is characterized in that, described circuit board has the limit groove being positioned at side, and the sidewall of described limit groove is metallized, the two ends of described limit groove have a groove respectively, are inlaid with resin or metal paste solid block in described groove.
10. circuit board according to claim 9, is characterized in that,
Described circuit board is double-sided wiring board or multilayer circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310722790.XA CN104735900B (en) | 2013-12-24 | 2013-12-24 | Circuit board with side metal structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310722790.XA CN104735900B (en) | 2013-12-24 | 2013-12-24 | Circuit board with side metal structure and preparation method thereof |
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| CN104735900A true CN104735900A (en) | 2015-06-24 |
| CN104735900B CN104735900B (en) | 2018-01-26 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112351585A (en) * | 2020-09-16 | 2021-02-09 | 东莞康源电子有限公司 | PCB side wall metallization manufacturing method |
| CN112739031A (en) * | 2021-03-30 | 2021-04-30 | 四川英创力电子科技股份有限公司 | Printed circuit board with side-face metalized groove and processing technology thereof |
| CN113015325A (en) * | 2021-01-09 | 2021-06-22 | 勤基电路板（深圳）有限公司 | PCB and electric potential side metallization process thereof |
| CN113518515A (en) * | 2021-03-15 | 2021-10-19 | 江西宇睿电子科技有限公司 | Method for manufacturing broken-joint metalized edge and circuit board |
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| JPS6467995A (en) * | 1987-09-08 | 1989-03-14 | Seiko Keiyo Kogyo Kk | Manufacture of printed circuit board with side face electrode |
| JPH10126024A (en) * | 1996-10-24 | 1998-05-15 | Hitachi Aic Inc | Wiring board having end-face through hole |
| CN1305338A (en) * | 1999-10-25 | 2001-07-25 | 株式会社村田制作所 | Module substrate and its manufacturing method |
| CN101416567A (en) * | 2006-04-10 | 2009-04-22 | 松下电器产业株式会社 | Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate |
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2013
- 2013-12-24 CN CN201310722790.XA patent/CN104735900B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6467995A (en) * | 1987-09-08 | 1989-03-14 | Seiko Keiyo Kogyo Kk | Manufacture of printed circuit board with side face electrode |
| JPH10126024A (en) * | 1996-10-24 | 1998-05-15 | Hitachi Aic Inc | Wiring board having end-face through hole |
| CN1305338A (en) * | 1999-10-25 | 2001-07-25 | 株式会社村田制作所 | Module substrate and its manufacturing method |
| CN101416567A (en) * | 2006-04-10 | 2009-04-22 | 松下电器产业株式会社 | Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112351585A (en) * | 2020-09-16 | 2021-02-09 | 东莞康源电子有限公司 | PCB side wall metallization manufacturing method |
| CN113015325A (en) * | 2021-01-09 | 2021-06-22 | 勤基电路板（深圳）有限公司 | PCB and electric potential side metallization process thereof |
| CN113015325B (en) * | 2021-01-09 | 2022-09-20 | 勤基电路板（深圳）有限公司 | PCB and electric potential side metallization process thereof |
| CN113518515A (en) * | 2021-03-15 | 2021-10-19 | 江西宇睿电子科技有限公司 | Method for manufacturing broken-joint metalized edge and circuit board |
| CN113518515B (en) * | 2021-03-15 | 2023-09-08 | 江西宇睿电子科技有限公司 | Method for manufacturing broken joint metalized edge and circuit board |
| CN112739031A (en) * | 2021-03-30 | 2021-04-30 | 四川英创力电子科技股份有限公司 | Printed circuit board with side-face metalized groove and processing technology thereof |
| CN112739031B (en) * | 2021-03-30 | 2021-06-08 | 四川英创力电子科技股份有限公司 | Printed circuit board with side-face metalized groove and processing technology thereof |
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| CN104735900B (en) | 2018-01-26 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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