CN104470234A - Method for producing step copper-plated PCB - Google Patents
Method for producing step copper-plated PCB Download PDFInfo
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- CN104470234A CN104470234A CN201410708380.4A CN201410708380A CN104470234A CN 104470234 A CN104470234 A CN 104470234A CN 201410708380 A CN201410708380 A CN 201410708380A CN 104470234 A CN104470234 A CN 104470234A
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Abstract
Provided is a method for producing a step copper-plated PCB. The PCB comprises a thick copper area and a thin copper area which are plated with copper layers of different thicknesses. The method comprises the following steps that (A) a front process is conducted; (B) drilling is conducted; (C) copper deposition and padpower are conducted; (D) figure electrocoppering is conducted, a copper layer of the thickness required by the thin copper area is electroplated on the entire board face of the PCB; (E) a thick copper film is plated on the outer layer, and the position, except the thick copper area, of the outer layer is completely covered by a dry film; (F) the thick copper area is additionally plated in a figure electricity mode, large-current and long-time electroplating is conducted to enable the copper layer in the thick copper area to meet the thickness demand, and then the operation of taking off the dry film is executed; (G) a figure is transferred, the dry film is attached to the face of the board, and exposure film compensation is designed according to different copper thicknesses; (H) inner layer acid etching is conducted to obtain a figure circuit. According to the method, only one-time figure transfer is conducted in the process, the process is shortened, the probability of quality defects is reduced, the material and labor cost is reduced, and the delivery time is shortened.
Description
Technical field
The present invention relates to printed circuit board (PCB), the copper-plated PCB production method of especially a kind of ladder.
Background technology
Along with making rapid progress and the demand of multifunction of electronic product, part PCB wiring board is when designing, and zones of different has the thick requirement of different copper, and when namely completing outer graphics, to have ladder copper thick for wiring board.For solving the copper-plated problem of this ladder, two kinds of methods are had in prior art, wherein a kind of is exactly adopt first to do the way that thick copper does thin copper again, the method adopts the method for first electroplating and subtracting copper afterwards in thin copper part preparation, in the preparation of thin copper part, just have passed through twice plating like this and subtract copper operation for 1 time, the uniformity that copper is thick and reliability are difficult to reach designing requirement.
Another kind method is if application number is for disclosed in CN201310723917--comprise PCB wiring board of the thick figure of ladder copper and preparation method thereof, the technical scheme of the document needs 2 Graphic transitions, at every turn all through dry film, and etching, take off membrane process, flow process is loaded down with trivial details easily there is the defects such as figure off normal; Simultaneously 2 Graphic transitions need the 2 different film of cover and other tools of production, cost of idleness and consuming timely longly affect the friendship phase.
Summary of the invention
For solving the problems of the technologies described above, the object of this invention is to provide a kind of PCB ladder copper facing production method only needing Graphic transitions, stay in grade.
The technical solution used in the present invention is:
The copper-plated PCB production method of a kind of ladder, this PCB comprises Hou Tongqu and Bao Tongqu with plating different-thickness layers of copper, comprises the following steps: (A) front operation; (B) hole; (C) heavy copper, plate electricity; (D) figure electro-coppering, the layers of copper of thickness required by the plating thin copper district, integral slab face of PCB; (E) the thick copper film of outer plating, all covers the position outside Hou Tong district with dry film; (F) figure electricity Jia Duhou copper district, the layers of copper that big current electroplates Shi Houtong district for a long time reaches thickness requirement, then takes off membrane operations; (G) Graphic transitions, dry film is pasted in the plate face after step (F), according to the thick design exposure film of different Cu; (H) internal layer acid etching: development, etching, takes off film and makes figure circuit.
Further, thick copper region need be bored and be chewed by the pre-large at least 1 grade of selection in finished hole footpath by described step (B) boring.
Wherein, pad pasting temperature 100-110 DEG C is controlled in described step (G), pad pasting speed 2.0m/min, pressure 4.0kg/cm
2.
Further, in described step (G), also the Xu Duihoutong district figure film compensates according to Hou Tong district copper is thick, and compensates by Bao Tong district copper is thick the Bao Tong district figure film.
Further, also need in described step (E) to plate thick copper to pcb board periphery design.
Beneficial effect of the present invention:
The present invention only has 1 Graphic transitions (the Graphic transitions negative film film) in flow process, and shorten flow process, also just decrease the probability occurring quality defect, other instrument such as the film can be done less, decreases material and cost of labor, shortens the friendship phase.
In addition, optimize brill and chew selection and meet finished product pore size, the design thickening film during copper is to improve the thick uniformity of thick copper region copper, and when rationally arranging Graphic transitions, parameter and the film compensate, and reach the requirement of actual linewidth line gap.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further.
Fig. 1 is ladder of the present invention copper-plated PCB production method flow chart;
Fig. 2 is the drilling effect figure of PCB production method flow process of the present invention;
Fig. 3 is the heavy copper/plate electricity design sketch of PCB production method flow process of the present invention;
Fig. 4 is the figure electro-coppering design sketch of PCB production method flow process of the present invention;
Fig. 5 is that the skin of PCB production method flow process of the present invention plates thick copper film design sketch;
Fig. 6 is the figure electricity Jia Duhou copper district design sketch of PCB production method flow process of the present invention;
Fig. 7 be PCB production method flow process of the present invention take off dry film design sketch;
Fig. 8 is the Graphic transitions design sketch of PCB production method flow process of the present invention.
Embodiment
As shown in figures 1-8, be the copper-plated PCB production method of a kind of ladder of the present invention, this PCB comprise Hou Tongqu and Bao Tongqu with different-thickness layers of copper to be plated, comprise the following steps:
(A) front operation: sawing sheet, selects base copper, sawing sheet size 23*19.4inch, outer end copper copper thick H OZ(ounce);
(B) hole, thick copper region is bored and is chewed by finished hole footpath for large 2 grades of selections, selects 0.45mm to bore chew as 0.35mm finished product aperture;
(C) heavy copper, plate electricity, normally heavy copper, plate electrical quantity 21ASF*36min, hole copper requires plating 0.4mil min, ensures backlight >=9 grade;
(D) figure electro-coppering, the integral slab face of PCB is electroplated to the layers of copper (12-55um) of thickness required by Bao Tong district, electroplating parameter 16asf*85min, and copper thick average electrical in hole is plating to 1.0mil, and after completing, copper is thick controls at 12-55um;
(E) the thick copper film of outer plating, all covers the position outside Hou Tong district with dry film; Every block PCB pattern periphery need be designed to plate thick copper, increases copper facing area, promotes the thick uniformity of thick copper region copper;
(F) figure electricity Jia Duhou copper district, the layers of copper in big current long-time copper facing Shi Houtong district reaches thickness requirement 55-100um, electroplating parameter 16ASF*85min; Meet thickening copper thickness and need >20um, then take off membrane operations;
(G) Graphic transitions, dry film is pasted in the plate face after step (F), and exposes by the film designed by circuit; Due to thick copper and low copper connecting position, pad pasting is insecure, easily causes drying film, therefore, by reducing pad pasting speed, improving pad pasting pressure and controlling, arranging pad pasting temperature 100-110 DEG C, pad pasting speed 2.0m/min, pressure 4.0kg/cm in the present embodiment
2, exposure energy controls at 7 lattice full;
In addition, in this step (G), also the Xu Duihoutong district figure film compensates according to base copper 1 OZ, and compensates by base copper 2 OZ the Bao Tong district figure film, thus reaches actual linewidth requirement.
(H) internal layer acid etching, draws figure circuit by plate in (G) by internal layer acid etching; Wherein, etching controls by 1 OZ base copper etching speed, and measures thick, thin copper region live width/line gap, to ensure that live width/line gap meets the requirements at first plate.
As mentioned above, the present invention only has 1 Graphic transitions (the Graphic transitions negative film film) in flow process, and shorten flow process, thus decrease the probability occurring quality defect, other instrument such as the film can be done less, reduces material and cost of labor, shortens the friendship phase.
The foregoing is only preferred embodiments of the present invention, the present invention is not limited to above-mentioned execution mode, as long as the technical scheme realizing the object of the invention with basic same approach all belongs within protection scope of the present invention.
Claims (5)
1. the copper-plated PCB production method of ladder, this PCB comprises Hou Tongqu and Bao Tongqu with different-thickness layers of copper to be plated, it is characterized in that comprising the following steps: (A) front operation; (B) hole; (C) heavy copper, plate electricity; (D) figure electro-coppering, the layers of copper of thickness required by the plating thin copper district, integral slab face of PCB; (E) the thick copper film of outer plating, all covers the position outside Hou Tong district with dry film; (F) figure electricity Jia Duhou copper district, the layers of copper that big current electroplates Shi Houtong district for a long time reaches thickness requirement, then takes off membrane operations; (G) Graphic transitions, dry film is pasted in the plate face after step (F), compensates according to the thick design exposure film of different Cu; (H) internal layer acid etching: development, etching, takes off film and makes figure circuit.
2. the copper-plated PCB production method of a kind of ladder according to claim 1, is characterized in that: thick copper region need be bored and be chewed by the pre-large at least 1 grade of selection in finished hole footpath by described step (B) boring.
3. the copper-plated PCB production method of a kind of ladder according to claim 1, is characterized in that: control pad pasting temperature 100-110 DEG C in described step (G), pad pasting speed 2.0m/min, pressure 4.0kg/cm
2.
4. the copper-plated PCB production method of a kind of ladder according to claim 1 or 3, it is characterized in that: in described step (G), also the Xu Duihoutong district figure film compensates according to Hou Tong district copper is thick, and compensates by Bao Tong district copper is thick the Bao Tong district figure film.
5. the copper-plated PCB production method of a kind of ladder according to claim 1, is characterized in that: also need in described step (E) to plate thick copper to pcb board periphery design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410708380.4A CN104470234A (en) | 2014-11-28 | 2014-11-28 | Method for producing step copper-plated PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410708380.4A CN104470234A (en) | 2014-11-28 | 2014-11-28 | Method for producing step copper-plated PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104470234A true CN104470234A (en) | 2015-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410708380.4A Pending CN104470234A (en) | 2014-11-28 | 2014-11-28 | Method for producing step copper-plated PCB |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110225660A (en) * | 2019-03-25 | 2019-09-10 | 珠海崇达电路技术有限公司 | A kind of production method of high thermal conductivity thickness copper base |
| CN111010812A (en) * | 2019-12-25 | 2020-04-14 | 珠海杰赛科技有限公司 | Manufacturing method of circuit board with dot plating pattern |
| US10888002B2 (en) | 2019-03-28 | 2021-01-05 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with embedded tracks protruding up to different heights |
| CN112739037A (en) * | 2020-11-07 | 2021-04-30 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with three copper thicknesses |
| CN113260163A (en) * | 2021-05-07 | 2021-08-13 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing circuit board fine line |
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| US20040150080A1 (en) * | 2002-12-30 | 2004-08-05 | Jong-Jin Lee | Package substrate for electrolytic leadless plating and manufacturing method thereof |
| CN101616549A (en) * | 2009-07-21 | 2009-12-30 | 东莞康源电子有限公司 | The method of manufacturing single-side thick copper stepped plate by electroplating addition |
| CN102651946A (en) * | 2012-04-05 | 2012-08-29 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
| CN103731997A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | PCB containing stepped copper thickness patterns and manufacturing method thereof |
| CN104080275A (en) * | 2014-03-12 | 2014-10-01 | 博敏电子股份有限公司 | Method for manufacturing stepped circuit board |
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2014
- 2014-11-28 CN CN201410708380.4A patent/CN104470234A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040150080A1 (en) * | 2002-12-30 | 2004-08-05 | Jong-Jin Lee | Package substrate for electrolytic leadless plating and manufacturing method thereof |
| CN101616549A (en) * | 2009-07-21 | 2009-12-30 | 东莞康源电子有限公司 | The method of manufacturing single-side thick copper stepped plate by electroplating addition |
| CN102651946A (en) * | 2012-04-05 | 2012-08-29 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
| CN103731997A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | PCB containing stepped copper thickness patterns and manufacturing method thereof |
| CN104080275A (en) * | 2014-03-12 | 2014-10-01 | 博敏电子股份有限公司 | Method for manufacturing stepped circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110225660A (en) * | 2019-03-25 | 2019-09-10 | 珠海崇达电路技术有限公司 | A kind of production method of high thermal conductivity thickness copper base |
| US10888002B2 (en) | 2019-03-28 | 2021-01-05 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with embedded tracks protruding up to different heights |
| CN111010812A (en) * | 2019-12-25 | 2020-04-14 | 珠海杰赛科技有限公司 | Manufacturing method of circuit board with dot plating pattern |
| CN111010812B (en) * | 2019-12-25 | 2021-05-11 | 珠海杰赛科技有限公司 | Manufacturing method of circuit board with dot plating pattern |
| CN112739037A (en) * | 2020-11-07 | 2021-04-30 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with three copper thicknesses |
| CN112739037B (en) * | 2020-11-07 | 2022-08-09 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with three copper thicknesses |
| CN113260163A (en) * | 2021-05-07 | 2021-08-13 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing circuit board fine line |
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Application publication date: 20150325 |