CN105338754A - Production method of local-thick copper PCB - Google Patents
Production method of local-thick copper PCB Download PDFInfo
- Publication number
- CN105338754A CN105338754A CN201510808004.7A CN201510808004A CN105338754A CN 105338754 A CN105338754 A CN 105338754A CN 201510808004 A CN201510808004 A CN 201510808004A CN 105338754 A CN105338754 A CN 105338754A
- Authority
- CN
- China
- Prior art keywords
- copper
- dry film
- thick copper
- local
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to technical field of PCBs and particularly relates to a production method of a local-thick copper PCB. The production method comprises the following steps of A, drilling, namely drilling on a circuit board; B, primary copper plating; C, secondary copper plating, namely pasting a primary dry film, exposing, developing, and then, carrying out secondary copper plating treatment on the circuit board; D, local thick copper plating, namely pasting a secondary dry film, exposing, developing, and then, carrying out thick copper plating treatment on the circuit board; E, secondary dry film deplating; F, tin plating; and G, primary dry film deplating, etching and tin deplating treatment. According to the production method, secondary copper plating is carried out through covering a region to be etched by using the primary dry film, and then, the region except for the regions where thick copper is needed to be plated are covered by the secondary dry film, so that the process is continuous, local thick copper plating can be realized favorably through only selecting the dry films with proper thicknesses and controlling proper film deplating parameters, and the process flow is simplified; the films can be pasted on a plane every time, so that the films are firmly pasted, the rate of good products is increased, and the quality of the local-thick copper PCB is improved.
Description
Technical field:
The present invention relates to pcb board technical field, particularly relate to the manufacture method of the thick copper PCB in local.
Background technology:
Design, the application of existing wiring board more and more become to becoming privileged development, the place on line table copper of some wiring board requires inconsistent, the copper plate at some position requires thicker than other position, but production technology of the prior art is that can only to control whole copper unanimously thick, is difficult to meet the requirement of local location special list copper.At present, for making local thick copper PCB, the particularly difference of height PCB more than 2oz (ounce), ripe simple technique is not almost had.The main making defect of such PCB is: 1. the method technological process making the thick PCB of difference of height copper is long, thick in order to reach other place of Local Copper thickness rate, repeatedly need electroplate, pad pasting, move back the flow process such as film, etching, flow process is complicated, easy generation defect is scrapped, and yields is low.2. secondary pad pasting is easily caused loosely in difference of height region.
Summary of the invention:
Object of the present invention be exactly the deficiency that exists for prior art and provide a kind of can simple flow, the manufacture method of the thick copper PCB in local that improves working (machining) efficiency, improve yields.
To achieve these goals, the technical solution used in the present invention is:
The manufacture method of the thick copper PCB in local, comprises the following steps:
A, drill process: position of holing in the circuit board;
B, a copper coating step: carry out heavy copper, plating in the circuit board, make wiring board upper and lower surface and position, hole hole wall plate one deck copper plate;
C, secondary copper coating step: do not need the copper-plated region of secondary to paste a dry film in the circuit board and expose, develop, then secondary copper plating treatment being carried out to wiring board, make wiring board need the copper-plated region of secondary and position, hole hole wall to plate one deck secondary copper plate;
Thick copper step is plated in D, local: the region not needing to plate thick copper is in the circuit board pasted secondary dry film and exposes, develop, then plates thick Copper treatment to wiring board, makes wiring board need the region of plating thick copper to plate one deck and locally plates thick copper layer;
E, move back secondary dry film step: returned by secondary dry film;
F, zinc-plated step: the region of exposing copper in the circuit board plates one deck tin layers;
G, carry out moving back dry film, etch, move back tin process.
Described wiring board is two-sided or multilayer circuit board.
In described step C, the thickness of secondary copper plate is less than or equal to the thickness of a dry film.
In described step D, the surface of local plating thick copper layer is concordant with the surface of secondary dry film or lower than the surface of secondary dry film.
Beneficial effect of the present invention is: the present invention includes following steps: A, drill process: position of holing in the circuit board; B, a copper coating step; C, secondary copper coating step: paste a dry film and expose, develop, then secondary copper plating treatment being carried out to wiring board; Thick copper step is plated in D, local: paste secondary dry film and expose, develop, then plating thick Copper treatment to wiring board; E, move back secondary dry film step; F, zinc-plated step; G, carry out moving back dry film, etch, move back tin process, the region that the present invention utilizes dry film to etch covers carries out secondary copper facing, then the region utilizing secondary dry film to cover except need plating thick copper is carried out, flow process is continuous, only need select the dry film of suitable thickness and control suitable move back film parameters and just can realize well locally plating thick copper, simplification of flowsheet, and each pad pasting can ensure to carry out in the plane, pad pasting is firm, improves yields, improves product quality.
Accompanying drawing illustrates:
Fig. 1 is manufacture method flow chart of the present invention.
Fig. 2 is the structural representation after drilling holes on circuit board of the present invention.
Fig. 3 is the structural representation after a wiring board of the present invention copper facing.
Fig. 4 is the structural representation after wiring board secondary of the present invention copper facing.
Fig. 5 is the structural representation after thick copper is plated in wiring board of the present invention local.
Fig. 6 is the structural representation after wiring board of the present invention moves back secondary dry film.
Fig. 7 be wiring board of the present invention zinc-plated after structural representation.
Fig. 8 is the structural representation of wiring board of the present invention.
Embodiment:
Below in conjunction with accompanying drawing and preferred embodiment, the invention will be further described, sees shown in Fig. 1 ~ 8, and the manufacture method of the thick copper PCB in local, comprises the following steps:
One, drill process: position 11 of holing on wiring board 1; Wiring board 1 is two-sided or multilayer circuit board; Position, hole 11 is via or location hole;
Two, a copper coating step: carry out heavy copper, plating on wiring board 1, makes wiring board 1 upper and lower surface and position, hole 11 hole wall plate one deck copper plate 2;
Three, secondary copper coating step: do not need the copper-plated region of secondary to paste a dry film 3 on wiring board 1 and expose, develop, then secondary copper plating treatment is carried out to wiring board 1, wiring board 1 is made to need the copper-plated region of secondary and position, hole 11 hole wall to plate one deck secondary copper plate 4, be plated to by the copper of position, hole 11 and meet the requirements, a copper facing is not zinc-plated; The thickness of secondary copper plate 4 is less than the thickness of a dry film 3, makes dry film 3 surface exceed secondary copper plate 4 surface, and convenient at a dry film 3 surface subsides secondary dry film 5, the thickness of certain secondary copper plate 4 also can equal the thickness of a dry film 3;
Four, thick copper step is plated in local: the region not needing to plate thick copper on wiring board 1 is pasted secondary dry film 5 and exposed, develops, secondary dry film 5 is attached to a dry film 3 on the surface, only expose the region needing to plate thick copper, then thick Copper treatment is plated to wiring board 1, make wiring board 1 need the region of plating thick copper to plate one deck local plating thick copper layer 6, reach the thick requirement of Hou Tong district copper; The surface of local plating thick copper layer 6 is concordant with the surface of secondary dry film 5 or a little less than the surface of secondary dry film 5;
Five, move back secondary dry film 5 step: move back film, control to move back film parameters, only secondary dry film 5 is returned;
Six, zinc-plated step: all regions of exposing copper plate one deck tin layers 7 on wiring board 1;
Seven, the outer flow process of regular link plate 1 is carried out: carry out moving back dry film 3, etch, move back tin process, form the thick copper PCB in local.
The region that the present invention utilizes dry film to etch covers carries out secondary copper facing, then the region utilizing secondary dry film to cover except need plating thick copper is carried out, flow process is continuous, only need select the dry film of suitable thickness and control suitable move back film parameters and just can realize well locally plating thick copper, simplification of flowsheet, and each pad pasting can ensure to carry out in the plane, and pad pasting is firm, improve yields, improve product quality.
Certainly, the above is only preferred embodiment of the present invention, therefore all equivalences done according to structure, feature and the principle described in patent claim of the present invention change or modify, and are included in patent claim of the present invention.
Claims (4)
1. the manufacture method of the thick copper PCB in local, is characterized in that, comprise the following steps:
A, drill process: position of holing in the circuit board;
B, a copper coating step: carry out heavy copper, plating in the circuit board, make wiring board upper and lower surface and position, hole hole wall plate one deck copper plate;
C, secondary copper coating step: do not need the copper-plated region of secondary to paste a dry film in the circuit board and expose, develop, then secondary copper plating treatment being carried out to wiring board, make wiring board need the copper-plated region of secondary and position, hole hole wall to plate one deck secondary copper plate;
Thick copper step is plated in D, local: the region not needing to plate thick copper is in the circuit board pasted secondary dry film and exposes, develop, then plates thick Copper treatment to wiring board, makes wiring board need the region of plating thick copper to plate one deck and locally plates thick copper layer;
E, move back secondary dry film step: returned by secondary dry film;
F, zinc-plated step: the region of exposing copper in the circuit board plates one deck tin layers;
G, carry out moving back dry film, etch, move back tin process.
2. the manufacture method of the thick copper PCB in local according to claim 1, is characterized in that: described wiring board is two-sided or multilayer circuit board.
3. the manufacture method of the thick copper PCB in local according to claim 1, is characterized in that: in described step C, the thickness of secondary copper plate is less than or equal to the thickness of a dry film.
4. the manufacture method of the thick copper PCB in local according to claim 1, is characterized in that: in described step D, the surface of local plating thick copper layer is concordant with the surface of secondary dry film or lower than the surface of secondary dry film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510808004.7A CN105338754A (en) | 2015-11-19 | 2015-11-19 | Production method of local-thick copper PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510808004.7A CN105338754A (en) | 2015-11-19 | 2015-11-19 | Production method of local-thick copper PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105338754A true CN105338754A (en) | 2016-02-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510808004.7A Pending CN105338754A (en) | 2015-11-19 | 2015-11-19 | Production method of local-thick copper PCB |
Country Status (1)
| Country | Link |
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| CN (1) | CN105338754A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611745A (en) * | 2016-03-04 | 2016-05-25 | 广德英菲特电子有限公司 | Local thick copper plating method for PCB production process |
| CN106061127A (en) * | 2016-08-09 | 2016-10-26 | 安徽广德威正光电科技有限公司 | PCB plate-surface single-area local thickening copper plating production technology |
| CN106993377A (en) * | 2017-03-21 | 2017-07-28 | 昆山沪利微电有限公司 | A kind of printed circuit board (PCB) locally thickeies the thick preparation method of copper |
| CN107148153A (en) * | 2017-06-29 | 2017-09-08 | 珠海杰赛科技有限公司 | The preparation method and device of a kind of printed circuit board |
| CN107493658A (en) * | 2017-06-29 | 2017-12-19 | 珠海杰赛科技有限公司 | A kind of preparation method and equipment of copper thickness printed circuit board |
| CN109714907A (en) * | 2018-12-18 | 2019-05-03 | 安徽四创电子股份有限公司 | A kind of production method of the multi-layer PCB for 5G communication |
| CN110430677A (en) * | 2019-07-11 | 2019-11-08 | 珠海崇达电路技术有限公司 | It is a kind of to improve back drill hole burr and crimp hole PCB preparation method less than normal |
| CN110996540A (en) * | 2019-12-31 | 2020-04-10 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN111458328A (en) * | 2020-04-26 | 2020-07-28 | 电子科技大学 | Method for detecting distribution of residual copper layer of printed circuit board |
| CN111491464A (en) * | 2019-01-29 | 2020-08-04 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB with convex welding plate |
| CN111787708A (en) * | 2020-06-24 | 2020-10-16 | 西安金百泽电路科技有限公司 | Manufacturing method of high-low copper PAD circuit board |
| CN111954383A (en) * | 2020-09-10 | 2020-11-17 | 星河电路（福建）有限公司 | Manufacturing method of local convex copper circuit board |
| CN113473738A (en) * | 2021-07-02 | 2021-10-01 | 深圳市新宇腾跃电子有限公司 | Local copper plating method for FPC (flexible printed circuit) with power line |
| CN113939099A (en) * | 2020-06-29 | 2022-01-14 | 宏启胜精密电子(秦皇岛)有限公司 | Manufacturing method of local thick copper circuit board and local thick copper circuit board |
| CN114222434A (en) * | 2021-11-09 | 2022-03-22 | 深圳市景旺电子股份有限公司 | Manufacturing method of step circuit and circuit board |
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| CN101626664A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |
| CN102523689A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Method for manufacturing circuit board with high copper thickness |
| WO2013160652A1 (en) * | 2012-04-27 | 2013-10-31 | Electra Polymers Limited | A method for photoimaging a substrate |
-
2015
- 2015-11-19 CN CN201510808004.7A patent/CN105338754A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101626664A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |
| CN102523689A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Method for manufacturing circuit board with high copper thickness |
| WO2013160652A1 (en) * | 2012-04-27 | 2013-10-31 | Electra Polymers Limited | A method for photoimaging a substrate |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611745A (en) * | 2016-03-04 | 2016-05-25 | 广德英菲特电子有限公司 | Local thick copper plating method for PCB production process |
| CN106061127A (en) * | 2016-08-09 | 2016-10-26 | 安徽广德威正光电科技有限公司 | PCB plate-surface single-area local thickening copper plating production technology |
| CN106993377A (en) * | 2017-03-21 | 2017-07-28 | 昆山沪利微电有限公司 | A kind of printed circuit board (PCB) locally thickeies the thick preparation method of copper |
| CN107148153A (en) * | 2017-06-29 | 2017-09-08 | 珠海杰赛科技有限公司 | The preparation method and device of a kind of printed circuit board |
| CN107493658A (en) * | 2017-06-29 | 2017-12-19 | 珠海杰赛科技有限公司 | A kind of preparation method and equipment of copper thickness printed circuit board |
| CN109714907A (en) * | 2018-12-18 | 2019-05-03 | 安徽四创电子股份有限公司 | A kind of production method of the multi-layer PCB for 5G communication |
| CN111491464A (en) * | 2019-01-29 | 2020-08-04 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB with convex welding plate |
| CN110430677A (en) * | 2019-07-11 | 2019-11-08 | 珠海崇达电路技术有限公司 | It is a kind of to improve back drill hole burr and crimp hole PCB preparation method less than normal |
| CN110996540A (en) * | 2019-12-31 | 2020-04-10 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN111458328A (en) * | 2020-04-26 | 2020-07-28 | 电子科技大学 | Method for detecting distribution of residual copper layer of printed circuit board |
| CN111787708A (en) * | 2020-06-24 | 2020-10-16 | 西安金百泽电路科技有限公司 | Manufacturing method of high-low copper PAD circuit board |
| CN113939099A (en) * | 2020-06-29 | 2022-01-14 | 宏启胜精密电子(秦皇岛)有限公司 | Manufacturing method of local thick copper circuit board and local thick copper circuit board |
| CN113939099B (en) * | 2020-06-29 | 2023-08-04 | 宏启胜精密电子(秦皇岛)有限公司 | Manufacturing method of local thick copper circuit board and local thick copper circuit board |
| CN111954383A (en) * | 2020-09-10 | 2020-11-17 | 星河电路（福建）有限公司 | Manufacturing method of local convex copper circuit board |
| CN113473738A (en) * | 2021-07-02 | 2021-10-01 | 深圳市新宇腾跃电子有限公司 | Local copper plating method for FPC (flexible printed circuit) with power line |
| CN114222434A (en) * | 2021-11-09 | 2022-03-22 | 深圳市景旺电子股份有限公司 | Manufacturing method of step circuit and circuit board |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160217 |
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| RJ01 | Rejection of invention patent application after publication |