CN108882558A - The gold plating method and golden finger circuit board of golden finger - Google Patents
The gold plating method and golden finger circuit board of golden finger Download PDFInfo
- Publication number
- CN108882558A CN108882558A CN201710339389.6A CN201710339389A CN108882558A CN 108882558 A CN108882558 A CN 108882558A CN 201710339389 A CN201710339389 A CN 201710339389A CN 108882558 A CN108882558 A CN 108882558A
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- Prior art keywords
- golden finger
- circuit plate
- outer layer
- blind hole
- gold
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides the gold plating method and golden finger circuit board of a kind of golden finger, by golden finger projected position each on the correspondence outer circuit plate on secondary outer circuit plate, time outer layer pad is set, it outer layer pad will be electrically connected each time using electroplate lead wire, the first blind hole is opened up on each golden finger, and the first blind hole is filled and led up in filling perforation plating, each golden finger is connected with corresponding secondary outer layer pad, it is gold-plated that golden finger is connected to power supply into progress again, the electroplate lead wire for connecting outer layer pad each time is disconnected finally by control gun drilling, so as to be open circuit between each golden finger, realize the production of the golden finger of surface electroless plating lead.Gold plated lead is arranged in secondary outer circuit plate, outer circuit plate surface does not design electroplate lead wire, reduce the scratch probability of golden finger production process, promote product quality, reduce Material Cost, it avoids copper face plating golden, reduces dependence of the production process to manual repair, avoid defect caused by outer circuit plate electroplate lead wire in the prior art.
Description
Technical field
The present invention relates to field of circuit boards more particularly to the gold plating methods and golden finger circuit board of a kind of golden finger.
Background technique
In order to meet the diversification of electronic product function, the demand for development of portability, not only there is high hole in printed circuit board
Than the high-accuracy feature of, fine-line, the high density circuit board for having also appeared golden finger etc. applied to high speed communication designs diameter.?
In electronic product functional application, in order to reduce the loss of signal transmission, high speed storing product is typically necessary using the golden hand of band
Refer to the circuit board of design as support plate.Golden finger is made of the conductive contact blade of numerous golden yellow, and surface is coated with inoxidizability, passes
The extremely strong gold of the property led and conductive contact blade arrangement such as finger-shaped, so being known as " golden finger ".
It is usually to design to have electroplate lead wire in commonly used golden finger, circuit board edge is extended to by golden finger.It is existing
In some electroplating gold production procedures, circuit board was normally produced into outer graphics according to the process of high-density interconnected circuit board before this
Afterwards, then by press mold, exposure, developing process by non-gold-plated region overlay get up, expose golden finger and its electroplate lead wire part
Copper face connects power supply by electroplate lead wire, then does electroplating gold processing to the golden finger of exposing.And electroplate lead wire is completed in plating
After be no longer used, the mode for generalling use cutting removes.
In the prior art, due to electroplate lead wire width very little, it is easy plating when doing craft of gilding, electroplate lead wire bottom easily goes out
Now connected situation, causes short circuit, and later period repairing is difficult；And golden finger is densely distributed with electroplate lead wire, molding in edges of boards
It easily scratches in the process, production difficulty is high, and quality risk is big.There is the golden finger board production technique emphasis of electroplate lead wire
It is more to manage processing procedure, especially in golden finger and electroplate lead wire junction, golden finger close quarters and electroplate lead wire molding etc.
Part, while there is also following limitations：
(1) height is required to pattern transfer aligning accuracy, gold finger galvanizing lead bottom easily occurs and seeps gold and can not go completely
It removes；
(2) done after gold-plated it is anti-welding, change gold, gold-plated golden finger is completed and easily scratches, influences appearance yield；
(3) doing gold after gold-plated, dry film have the bad of demoulding in changing golden processing procedure, gold finger galvanizing lead upper gold again,
It will cause the rising of Material Cost；
(4) gold finger galvanizing lead is due to extending into edges of boards, and when molding is easy bottom copper sheet pull-up causing golden face
All burrs cause product to scratch each other when carrying if not removing, and go flash removed more to produce together using alkali etching
Process.
Summary of the invention
The present invention provides the gold plating method and golden finger circuit board of a kind of golden finger, to provide a kind of surface electroless plating lead
Golden finger circuit board, may be implemented to avoid a system caused by electroplate lead wire to the optimization of existing gold finger galvanizing lead
Column defects.
It is an aspect of the invention to provide a kind of gold plating methods of golden finger, including：
In non-gold-plated region overlay dry film on outer layer circuit board, keep the gold-plated region of golden finger exposed；
Time outer layer pad is arranged in each golden finger projected position on the correspondence outer circuit plate on secondary outer circuit plate, and
Electroplate lead wire is arranged to be electrically connected each secondary outer layer pad；
The outer circuit plate and the secondary outer circuit plate are pressed；
The first blind hole is opened up on each golden finger, and is carried out filling perforation plating and filled and led up first blind hole, it will
Each golden finger is connected with the corresponding secondary outer layer pad；
The golden finger is connected to power supply, the gold-plated region of the golden finger is carried out gold-plated；
The second blind hole is opened up by controlling gun drilling by the outer circuit plate, the institute of each secondary outer layer pad will be connected
State electroplate lead wire disconnection, wherein the route on the position of second blind hole and the outer circuit plate is without interference.
Another aspect of the present invention is to provide a kind of golden finger circuit board, includes at least：Outer circuit plate and time outer layer
Circuit board.
The outer circuit plate includes：Multiple golden fingers；
Secondary outer circuit plate includes：Each golden finger projected position setting is secondary outer on the corresponding outer circuit plate
Layer pad, is all connected with electroplate lead wire in each secondary outer layer pad, the plating between the two neighboring secondary outer layer pad is drawn
Line disconnects；
The first blind hole is offered on each golden finger, the bottom of first blind hole is opened up to outside corresponding described time
Layer pad, first blind hole is interior to be filled with electro-coppering, so that each golden finger is led with the corresponding secondary outer layer pad
It is logical；
Second is offered at the position that the electroplate lead wire disconnects, by the outer circuit plate to the secondary outer circuit plate
Blind hole.
The gold plating method and golden finger circuit board of golden finger provided by the invention, pass through the correspondence on secondary outer circuit plate
Time outer layer pad is arranged in each golden finger projected position on outer circuit plate, using electroplate lead wire by each secondary outer layer pad
Electrical connection, and by opening up the first blind hole on each golden finger, and carry out filling perforation plating and fill and lead up first blind hole, with
Each golden finger is connected with the corresponding secondary outer layer pad, then connects to power supply golden finger, it can be to golden hand
The gold-plated region progress referred to is gold-plated, and the electroplate lead wire for connecting outer layer pad each time is broken by control gun drilling after gold-plated
It opens, so as to be open circuit between each golden finger, to realize the production of the golden finger of surface electroless plating lead.The golden hand of the present embodiment
Gold plated lead is arranged on secondary outer circuit plate the gold plating method of finger, and outer circuit plate surface does not redesign electroplate lead wire, from
And reduce the scratch probability in golden finger production process, product quality is promoted, meanwhile, lead does not do gold-plated processing and can reduce
The investment of Material Cost avoids the possibility of copper face plating gold, quality risk greatly reduces, also reduces production process pair
The dependence of manual repair, while production difficulty and production cost are also reduced, avoid outer circuit plate in the prior art
A series of defects caused by electroplate lead wire.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 is the gold plating method flow chart of golden finger provided in an embodiment of the present invention；
Fig. 2 is that the structure of outer circuit plate is shown before pressing in the gold plating method of golden finger provided in an embodiment of the present invention
It is intended to；
Fig. 3 is in the gold plating method of golden finger provided in an embodiment of the present invention in the structure of the previous outer circuit plate of pressing
Schematic diagram；
Fig. 4 be golden finger provided in an embodiment of the present invention gold plating method in led in golden finger with corresponding secondary outer layer pad
The schematic cross-section of golden finger circuit board after logical；
Fig. 5 is the golden finger electricity in the gold plating method of golden finger provided in an embodiment of the present invention after electroplate lead wire disconnection
The schematic cross-section of road plate；
Fig. 6 is the secondary outer layer electricity in the gold plating method of golden finger provided in an embodiment of the present invention after electroplate lead wire disconnection
The structural schematic diagram of road plate；
Fig. 7 is the outer circuit in the gold plating method of golden finger provided in an embodiment of the present invention after electroplate lead wire disconnection
The structural schematic diagram of plate.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1 is the gold plating method flow chart of golden finger provided in an embodiment of the present invention.As shown in Figure 1, the present embodiment needle mentions
A kind of gold plating method of golden finger is supplied, specific step is as follows for this method：
S101, on outer layer circuit board 100 in non-gold-plated region overlay dry film, keep the gold-plated region of golden finger 110 exposed.
As shown in Fig. 2, being covered the electroless coating region of outer circuit plate 100 by dry film in the present embodiment, avoid
When carrying out gold-plated to the gold-plated region of golden finger 110, it is plated on electroless coating region, leads to line short, material waste.
Wherein dry film is a kind of photosensitive material, is common material in board production, and the transfer for circuit board pattern makes, also extensively
In general, plating gold process golden for selectivityization.Specifically, the manufacturing process of dry film includes：Dry film pressing is covered in outer layer
On the surface of circuit board 100；The dry film of non-gold-plated region overlay is exposed；Using developer solution to the gold-plated of golden finger 110
Region, unexposed dry film carry out developing reaction, to keep the gold-plated region of golden finger 110 exposed.
S102, each 110 projected position of golden finger is set on the correspondence outer circuit plate 100 on secondary outer circuit plate 200
Time outer layer pad 210 is set, and electroplate lead wire 220 is set and is electrically connected each secondary outer layer pad 210.
As shown in figure 3, in the present embodiment on secondary outer circuit plate 200, the projected position of each golden finger 110 setting one
A secondary outer layer pad 210 (PAD), and electroplate lead wire 220 is set on secondary outer circuit plate 200, by each secondary 210 electricity of outer layer pad
Connection, specifically, adjacent secondary outer layer pad 210 can be connected by electroplate lead wire 220, it can also be by each secondary outer layer pad
210 are connected in the bus of same root electroplate lead wire, other existing connection modes can also be used certainly.
S103, the outer circuit plate 100 and the secondary outer circuit plate 200 are pressed.
In the present embodiment, pressing mode in the prior art can be used, i.e., make prepreg is heated to melt using high temperature and pressure
Change, and make its flowing, then be changed into cured sheets, so that secondary outer circuit plate 200 and outer circuit plate 100 and copper foil be bonded
At one block of multi-layer board, details are not described herein again for detailed process.
S104, the first blind hole 120 is opened up on each golden finger 110, and it is blind by described first to carry out filling perforation plating
Hole 120 is filled and led up, and each golden finger 110 is connected with the corresponding secondary outer layer pad 210.
As shown in figure 4, by opening up the first blind hole 120, the bottom of the first blind hole 120 on golden finger 110 in the present embodiment
Portion is opened up to corresponding secondary outer layer pad 210, and carries out filling perforation plating to the first blind hole 120, thus the golden finger 110 made and outer
Layer pad 140 is connected.
Specifically, laser drilling process can be used opens up the first blind hole 120 on each golden finger 110, described
The bottom of one blind hole 120 is opened up to the corresponding secondary outer layer pad 210.Laser drill can control the brill of the first blind hole 120
Hole depth is to secondary 210 surface of outer layer pad, and laser drill speed is fast, efficiency is higher, and boring aperture can be with very little, filling perforation plating
Consumed material is less, saves time and cost.The first blind hole 120 is filled and led up in addition, being electroplated in the present embodiment by filling perforation,
It ensure that the flatness on 110 surface of golden finger.Can also be used in certain the present embodiment it is in the prior art other being capable of outer layer electricity
The structure that road plate is connected with time outer circuit plate.
S105, the golden finger 110 is connected to power supply, the gold-plated region of the golden finger 110 is carried out gold-plated.
In the present embodiment, since each golden finger 110 is connected with corresponding secondary outer layer pad 210, and pass through plating
Lead 220 outer layer pad 210 will be electrically connected each time, and any golden finger 110 is connected to power supply can be by each golden finger 110
It is connected on power supply.Gold plating method in the present embodiment is identical as existing plating gold process, and details are not described herein again.It needs to illustrate
, golden finger 110, which is connected to power supply, can use the following two kinds scheme：
As shown in Fig. 2, if be provided with big copper face 130 on outer circuit plate 100, and at least one golden finger 110 and big copper
Face 130 is electrically connected, then described to connect to power supply the golden finger 110 specifically, the big copper face 130 is connected with the power supply
It connects；Alternatively, if be provided with outer layer pad 140 on outer circuit plate 100, and 140 electricity of at least one golden finger 110 and outer layer pad
Connection, then it is described to connect to power supply the golden finger 110 specifically, the outer layer pad 140 is connect with the power supply.
I.e. in above scheme, by the component being electrically connected with golden finger 110, at least one golden finger 110 can be connected
Onto power supply, since each golden finger 110 passes through the secondary outer layer pad 210 and electroplate lead wire 220 on time outer circuit plate 200
Be connected with each other so that each golden finger 110 is all connected on power supply, and then carry out to the gold-plated region of golden finger 110 into
Row is gold-plated.Wherein big copper face is the component shielded in circuit board to signal.Gold plating process in the present embodiment is using existing
Some plating gold process, details are not described herein again.
In above two scheme, power supply is connected according to big copper face 130, then in non-gold-plated area on outer layer circuit board 100
Domain covers dry film：Big copper is set on the outer circuit plate 100
Face 130, at least one described golden finger 110 are electrically connected with the big copper face 130；Power supply is connected according to outer layer pad 140, then
Further include before keeping the gold-plated region of golden finger 110 exposed in non-gold-plated region overlay dry film on outer layer circuit board 100：?
Outer layer pad 140 is set on the outer circuit plate 100, at least one described golden finger 110 is electrically connected with the outer layer pad 140
It connects.Specific manufacture craft is the technique of the prior art, and details are not described herein again.Certainly, the present embodiment is not limited in above-mentioned two
The scheme that kind connects to power supply, also can be used other connection types.For example, electroplate lead wire 220 is led to plate in secondary outer layer
Side is directly connected to power supply by electroplate lead wire 220, after the completion of gold-plated, by edges of boards carry out cutting make electroplate lead wire 220 with
Electric power disconnection.
S106, the second blind hole 150 is opened up by controlling gun drilling by the outer circuit plate 100, will connected each described time
The electroplate lead wire 220 of outer layer pad 210 disconnects, wherein the position of second blind hole 150 and the outer circuit plate
Route on 100 is without interference.
In the present embodiment, after the completion of golden finger 110 is gold-plated, need the open circuit of electroplate lead wire 220, otherwise golden finger 110
The short circuit of circuit will be caused when in use.Specifically, using mechanical drilling process, by the outer circuit plate 100, with connect
The corresponding position of the electroplate lead wire 220 of each secondary outer layer pad 210 carries out drilling through second blind hole 150, described
Second blind hole, 150 depth is greater than the distance that the electroplate lead wire 220 arrives the outer circuit plate 100, and second blind hole 150
Diameter is greater than the width of the electroplate lead wire 220, as illustrated in figs. 5-7.
It should be noted that the position of the second blind hole 150 drilling needs to be avoided with the route of outer circuit plate 100,
Avoid the route of the external layer circuit board 100 when controlling gun drilling that damage is caused to lead to open circuit, it certainly also will be to secondary outer layer except plating
The All other routes of lead 220 are avoided.Therefore in the present embodiment, electroplate lead wire 220 is carried out on to secondary outer circuit plate 200
The bore position that the second blind hole 150 is considered when design, designs suitable 220 position of electroplate lead wire so that electroplate lead wire
Route of the bore position as far as possible far from outer circuit plate 100 on 220.It certainly, if can not be far from the line of outer circuit plate 100
Road then can drill through the second blind hole and avoid the route on outer circuit plate 100 by slanting.
The gold plating method of golden finger provided in this embodiment, by the correspondence outer circuit plate on secondary outer circuit plate
Time outer layer pad is arranged in each golden finger projected position, is electrically connected each secondary outer layer pad using electroplate lead wire, and lead to
It crosses on each golden finger and opens up the first blind hole, and carry out filling perforation plating and fill and lead up first blind hole, it will be each described
Golden finger is connected with the corresponding secondary outer layer pad, then connects to power supply golden finger, can be to the gold-plated area of golden finger
Domain progress is gold-plated, is disconnected after gold-plated by the electroplate lead wire that control gun drilling will connect outer layer pad each time, so that each
It is open circuit between golden finger, to realize the production of the golden finger of surface electroless plating lead.The gold-plated side of the golden finger of the present embodiment
Gold plated lead is arranged on secondary outer circuit plate method, and outer circuit plate surface does not redesign electroplate lead wire, to reduce gold
Scratch probability in finger production process promotes product quality, meanwhile, lead, which does not do gold-plated processing, can reduce Material Cost
Investment, avoids the possibility of copper face plating gold, quality risk greatly reduces, also reduce production process to manual repair
It relies on, while also reducing production difficulty and production cost, avoid outer circuit plate electroplate lead wire in the prior art and lead
A series of defects caused.
Further, on the basis of the above embodiments, after step S106, may also include：Using insulating materials to institute
The second blind hole 150 is stated to be filled.
The present embodiment by carrying out the filling of insulating materials to the second blind hole 150, holding circuit plate it is smooth, and avoid
In subsequent circuit board making process, breaking electroplate lead wire 220 is connected, short circuit is caused.
Another embodiment of the present invention provides a kind of golden finger circuit board, the gold plating method using above-mentioned golden finger is produced
Golden finger circuit board, can refer to Fig. 5-7, and the golden finger circuit board of the present embodiment includes at least：Outer circuit plate 100 and time outer layer
Circuit board 200.
The outer circuit plate 100 includes：Multiple golden fingers 110；
Secondary outer circuit plate 200 includes：Each 110 projected position of golden finger on the corresponding outer circuit plate 100
The secondary outer layer pad 210 being arranged is all connected with electroplate lead wire 220 in each secondary outer layer pad 210, and two neighboring described time outer
Electroplate lead wire 220 between layer pad 210 disconnects；
The first blind hole 120 is offered on each golden finger 110, the bottom of first blind hole 120 is opened up to correspondence
The secondary outer layer pad 210, be filled with electro-coppering in first blind hole 120 so that each golden finger 110 with it is corresponding
The secondary outer layer pad 210 be connected；
At the position that the electroplate lead wire 220 disconnects, by the outer circuit plate 100 to the secondary outer circuit plate 200
Offer the second blind hole 150.
Further, the outer circuit plate 100 further includes：
Big copper face 130, is electrically connected with golden finger 110 described at least one, for when the golden finger 110 is gold-plated and electric
Source connection；Or
Outer layer pad 140 is electrically connected with golden finger 110 described at least one, for when the golden finger 110 is gold-plated with
Power supply connection.
Further, 150 depth of the second blind hole is greater than the electroplate lead wire 220 to the outer circuit plate 100
Distance, and 150 diameter of the second blind hole is greater than the width of the electroplate lead wire 220.
Further, insulating materials is filled in second blind hole 150.
Golden finger circuit board in the present embodiment is the gold plating method golden finger circuit produced using above-mentioned golden finger
Plate, details are not described herein again for specific function.
The golden finger circuit board of the present embodiment passes through gold hand each on the correspondence outer circuit plate on secondary outer circuit plate
Refer to that time outer layer pad is arranged in projected position, is electrically connected each secondary outer layer pad using electroplate lead wire, and pass through each institute
State and open up the first blind hole on golden finger, and carry out filling perforation plating first blind hole is filled and led up, will each golden finger and
The corresponding secondary outer layer pad conducting, then golden finger is connected to power supply, can plate to the gold-plated region of golden finger
Gold is disconnected the electroplate lead wire for connecting outer layer pad each time by control gun drilling after gold-plated, so that between each golden finger
For open circuit, to realize the production of the golden finger of surface electroless plating lead.The golden finger circuit board of the present embodiment, by gold plated lead
It is arranged on secondary outer circuit plate, outer circuit plate surface does not redesign electroplate lead wire, to reduce golden finger production process
In scratch probability, promoted product quality, meanwhile, lead, which does not do gold-plated processing, can reduce the investment of Material Cost, avoid
The possibility of copper face plating gold, greatly reduces quality risk, also reduces dependence of the production process to manual repair, while
Production difficulty and production cost are reduced, a series of caused by outer circuit plate electroplate lead wire in the prior art lack is avoided
It falls into.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, those skilled in the art should understand that：Its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of gold plating method of golden finger, which is characterized in that including：
In non-gold-plated region overlay dry film on outer layer circuit board, keep the gold-plated region of golden finger exposed；
Time outer layer pad is arranged in each golden finger projected position on the correspondence outer circuit plate on secondary outer circuit plate, and is arranged
Each secondary outer layer pad is electrically connected by electroplate lead wire；
The outer circuit plate and the secondary outer circuit plate are pressed；
The first blind hole is opened up on each golden finger, and is carried out filling perforation plating and filled and led up first blind hole, it will be each
The golden finger is connected with the corresponding secondary outer layer pad；
The golden finger is connected to power supply, the gold-plated region of the golden finger is carried out gold-plated；
The second blind hole is opened up by controlling gun drilling by the outer circuit plate, the electricity of each secondary outer layer pad will be connected
It plates lead to disconnect, wherein the route on the position of second blind hole and the outer circuit plate is without interference.
2. the method according to claim 1, wherein described dry in non-gold-plated region overlay on outer layer circuit board
Film further includes before keeping the gold-plated region of golden finger exposed：
Big copper face is set on the outer circuit plate, at least one described golden finger is electrically connected with the big copper face；
It is described to connect to power supply the golden finger specially：
The big copper face is connect with the power supply.
3. the method according to claim 1, wherein described dry in non-gold-plated region overlay on outer layer circuit board
Film further includes before keeping the gold-plated region of golden finger exposed：
Outer layer pad is set on the outer circuit plate, at least one described golden finger is electrically connected with the outer layer pad；
It is described to connect to power supply the golden finger specially：
The outer layer pad is connect with the power supply.
4. method according to any one of claim 1-3, which is characterized in that described to be opened up on each golden finger
First blind hole, specifically includes：
First blind hole is opened up on each golden finger using laser drilling process, the bottom of first blind hole is opened up to right
The secondary outer layer pad answered.
5. method according to any one of claim 1-3, which is characterized in that described to pass through control by the outer circuit plate
Gun drilling opens up the second blind hole, the electroplate lead wire for connecting each secondary outer layer pad is disconnected, specially：
Using mechanical drilling process, by drawing on the outer circuit plate, with the plating for connecting each secondary outer layer pad
The corresponding position of line carries out drilling through second blind hole, and second blind hole depth is greater than the electroplate lead wire to the outer layer electricity
The distance of road plate, and second blind hole diameter is greater than the width of the electroplate lead wire.
6. the method according to claim 1, wherein described opened up by the outer circuit plate by controlling gun drilling
Second blind hole, by connect each secondary outer layer pad the electroplate lead wire disconnect after, further include：
Second blind hole is filled using insulating materials.
7. a kind of golden finger circuit board, which is characterized in that include at least：Outer circuit plate and time outer circuit plate；
The outer circuit plate includes：Multiple golden fingers；
Secondary outer circuit plate includes：The secondary outer layer weldering of each golden finger projected position setting on the corresponding outer circuit plate
Disk is all connected with electroplate lead wire in each secondary outer layer pad, and the electroplate lead wire between the two neighboring secondary outer layer pad is disconnected
It opens；
The first blind hole is offered on each golden finger, the bottom of first blind hole is opened up to the corresponding secondary outer layer weldering
Disk, first blind hole is interior to be filled with electro-coppering, so that each golden finger is connected with the corresponding secondary outer layer pad；
It is blind that second is offered at the position that the electroplate lead wire disconnects, by the outer circuit plate to the secondary outer circuit plate
Hole.
8. golden finger circuit board according to claim 7, which is characterized in that the outer circuit plate further includes：
Big copper face, is electrically connected with golden finger described at least one, for connecting to power supply when the golden finger is gold-plated；Or
Outer layer pad is electrically connected with golden finger described at least one, for connecting to power supply when the golden finger is gold-plated.
9. golden finger circuit board according to claim 7, which is characterized in that
Second blind hole depth is greater than the electroplate lead wire to the distance of the outer circuit plate, and second blind hole diameter
Greater than the width of the electroplate lead wire.
10. golden finger circuit board according to claim 7, which is characterized in that be filled with insulation material in second blind hole
Material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710339389.6A CN108882558A (en) | 2017-05-15 | 2017-05-15 | The gold plating method and golden finger circuit board of golden finger |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710339389.6A CN108882558A (en) | 2017-05-15 | 2017-05-15 | The gold plating method and golden finger circuit board of golden finger |
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| CN108882558A true CN108882558A (en) | 2018-11-23 |
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| CN201710339389.6A Pending CN108882558A (en) | 2017-05-15 | 2017-05-15 | The gold plating method and golden finger circuit board of golden finger |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519926A (en) * | 2019-08-01 | 2019-11-29 | 苏州浪潮智能科技有限公司 | A kind of PCB containing golden finger and its wiring method of adjustment and equipment |
| CN110572949A (en) * | 2019-08-23 | 2019-12-13 | 鹤山市中富兴业电路有限公司 | Gold plating process method and printed circuit board |
| CN110719694A (en) * | 2019-09-17 | 2020-01-21 | 沪士电子股份有限公司 | Chemical nickel gold surface treatment method for polyphenylene ether-containing printed circuit board |
| CN112822872A (en) * | 2021-01-31 | 2021-05-18 | 惠州中京电子科技有限公司 | Manufacturing method of lead-free residual golden finger |
| CN116669323A (en) * | 2023-07-26 | 2023-08-29 | 北京万龙精益科技有限公司 | PCBA open circuit processing method |
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| CN202587597U (en) * | 2011-12-05 | 2012-12-05 | 深圳市五株科技股份有限公司 | Golden finger circuit board |
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| CN101795543A (en) * | 2010-03-25 | 2010-08-04 | 淳华科技(昆山)有限公司 | Method for manufacturing gold finger |
| CN102271465A (en) * | 2011-06-28 | 2011-12-07 | 深圳市博敏电子有限公司 | Method for manufacturing PCB (printed circuit board) with hot-pluggable golden fingers |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519926A (en) * | 2019-08-01 | 2019-11-29 | 苏州浪潮智能科技有限公司 | A kind of PCB containing golden finger and its wiring method of adjustment and equipment |
| CN110572949A (en) * | 2019-08-23 | 2019-12-13 | 鹤山市中富兴业电路有限公司 | Gold plating process method and printed circuit board |
| CN110719694A (en) * | 2019-09-17 | 2020-01-21 | 沪士电子股份有限公司 | Chemical nickel gold surface treatment method for polyphenylene ether-containing printed circuit board |
| CN110719694B (en) * | 2019-09-17 | 2021-07-02 | 沪士电子股份有限公司 | Chemical nickel gold surface treatment method for polyphenylene ether-containing printed circuit board |
| CN112822872A (en) * | 2021-01-31 | 2021-05-18 | 惠州中京电子科技有限公司 | Manufacturing method of lead-free residual golden finger |
| CN116669323A (en) * | 2023-07-26 | 2023-08-29 | 北京万龙精益科技有限公司 | PCBA open circuit processing method |
| CN116669323B (en) * | 2023-07-26 | 2023-09-26 | 北京万龙精益科技有限公司 | PCBA open circuit processing method |
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