CN106973526A - A kind of PCB preparation method and PCB - Google Patents
A kind of PCB preparation method and PCB Download PDFInfo
- Publication number
- CN106973526A CN106973526A CN201710321575.7A CN201710321575A CN106973526A CN 106973526 A CN106973526 A CN 106973526A CN 201710321575 A CN201710321575 A CN 201710321575A CN 106973526 A CN106973526 A CN 106973526A
- Authority
- CN
- China
- Prior art keywords
- core plate
- pcb
- step trough
- layer
- preparation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses the preparation method of PCB a kind of and PCB, applied to board production technical field, PCB therein preparation method includes step：The multi-layer PCB with step trough is made by prepreg pressing in each layer core plate；Each layer core plate includes outer layer core plate and core material, and outer layer core plate includes being located at the top layer core plate at the top of step trough, the bottom core plate positioned at ladder trench bottom；On the bottom core plate, metal line figure is made in its position for corresponding to step trough.Bottom land metal line figure, the method for making step trough again are first made different from what prior art was used, the present invention is using the method for first making step trough, making bottom land metal line figure again, bonding processes can be not only avoided to overflow the harmful effect that resin is produced to metal line figure, simplify manufacture craft, improve graphic making precision；And with versatility, be conducive to the popularization and application of step trough PCB product.
Description
Technical field
The present invention relates to the preparation method and PCB of board production technical field, more particularly to a kind of PCB.
Background technology
As electronic system product is towards multifunction, miniaturization and light-weighted trend development, electronic system is to PCB
Performance requirement more and more higher, especially for realizing multifunction, it is desirable to which multi-layer PCB is fused into one piece of PCB, and in PCB
Centre opens up step trough, to realize miniaturization, multifunction and the light of electronic system product.
Generally, the side wall of step trough can metallize, can also be non-metallic.And it is current, it is non-metallic with side wall
The general preparation method of the multi-layer PCB of step trough is：It is pointed to the bottom core plate pre-production metallic circuit figure of ladder trench bottom
Shape, while being slotted to core material and prepreg；Then pad is embedded in groove, each layer core plate is folded with prepreg
Put, step trough is milled out using power auger after pressing processing, untill the gasket surface in by groove exposes；Take out pad, you can
Complete the making of multilayer circuit board.
In above-mentioned general preparation method, the metallic circuit figure for employing pre-production bottom core plate makes step trough again
, there is following defect in mode：
1st, in the manufacturing process of step trough, the easy melted by heat of material of prepreg and the bottom for overflowing to step trough
Portion, causes residual excessive glue and not easy-clear；Therefore, it is generally necessary to the metal line figure of pre-production on bottom core plate
Protected by diaphragm, but one side complex operation, on the one hand it is difficult to obtain good protecting effect.Simultaneously as,
Slot area pre-preg materials overflow after, the core plate in this region is easily recessed so that the core plate of groove perisporium with
Dielectric is lost between core plate so that both directly contact with each other conducting, leverage the quality of wiring board.
2nd, because the metallic circuit figure that pre-production is specified makes step trough again, this preparation method is needing to make not
With not having versatility under the production requirement of metallic circuit figure, it is impossible to produce in batches, raw inefficiency constrains step trough
PCB popularization and application.
Thus, a kind of effective solution is needed badly at present, to overcome disadvantages described above.
The content of the invention
It is an object of the invention to provide the preparation method of PCB a kind of and PCB, step trough present in prior art is overcome
The defects such as the metal line figure at bottom is easily contaminated, poor universality.
For up to this purpose, the present invention uses following technical scheme：
A kind of PCB preparation method, including step：
The multi-layer PCB with step trough is made by prepreg pressing in each layer core plate；Each layer core plate includes outer
Layer core plate and core material, outer layer core plate include being located at the top layer core plate at the top of step trough, the bottom core positioned at ladder trench bottom
Plate；
On the bottom core plate, metal line figure is made in its position for corresponding to step trough.
Optionally, it is described by each layer core plate by prepreg pressing the multi-layer PCB with step trough is made the step of enter
One step includes：
The core material and prepreg are slotted in advance；
Each layer core plate and prepreg in the vertical direction are alternated into setting, and packing material, shape are set in groove
Into pre- folded multi-layer PCB；
Pressing processing is carried out to pre- folded multi-layer PCB, PCB force fit plates are formed；
After pressing processing, the outer layer core plate is electroplated；
The pasting protective film on the outer layer core plate, and needing metallized area to carry out tin plating protection, form tin protective layer；
Controlled depth milling is carried out to the top layer core plate to form the packing material inside step trough notch, taking-up, formation has
The multi-layer PCB of step trough.
Optionally, it is described to further comprise on the bottom core plate the step of making metal line figure：
According to metal line figure to be produced, ink-jet is carried out to the metallized area of step trough bottom land；
Remove the diaphragm on outer layer core plate and tin processing is moved back in progress, circuit etching is carried out in step trough bottom land；
The ink of step trough bottom land is removed, until bottom land line conductor forms metal line figure after exposing.
Optionally, it is described on the bottom core plate make metal line figure the step of in, by laser ablation side
Method removes the ink of the step trough bottom land.
Optionally, the packing material is specially high temperature high voltage resistant resistance glue material.
Optionally, the diaphragm is specially dry film.
Optionally, if the bottom of the bottom core plate is also bonded with dried layer core plate by prepreg.
Optionally, it is described by each layer core plate by prepreg pressing the multi-layer PCB with step trough is made the step of
In, in addition to：Via hole is formed to drilling on each layer core plate, to the conducting while being electroplated to the outer layer core plate
Electroplated in hole.
Present invention also offers a kind of PCB, it is made according to as above any preparation method, including each layer core plate is passed through
The multi-layer PCB with step trough that prepreg pressing is made；And it is located at the bottom core of step trough bottom in the multi-layer PCB
On plate, there is metal line figure corresponding to the position making of step trough.
Beneficial effects of the present invention：
Bottom land metal line figure, the method that step trough is made again, this hair are first made different from what prior art was used
It is bright to use the method for first making step trough, making bottom land metal line figure again, it can not only avoid bonding processes from overflowing resin
The harmful effect produced to metal line figure, simplifies manufacture craft, improves graphic making precision；And with versatility,
Be conducive to the popularization and application of step trough PCB product.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is PCB provided in an embodiment of the present invention preparation method flow chart；
Fig. 2 is the original state figure of core plate provided in an embodiment of the present invention and prepreg；
Fig. 3 is the structural representation after inner core plates provided in an embodiment of the present invention and prepreg fluting；
Fig. 4 is put into pre- folded PCB construction schematic diagram after packing material to be provided in an embodiment of the present invention；
Fig. 5 is the structural representation of PCB after pressing provided in an embodiment of the present invention is handled；
Fig. 6 is the structural representation of PCB after outer layer core plate pasting protective film provided in an embodiment of the present invention and tin plating processing；
Fig. 7 be step trough provided in an embodiment of the present invention uncap processing after PCB structural representation；
Fig. 8 is the structural representation of PCB after ladder trench bottom ink-jet provided in an embodiment of the present invention；
Fig. 9 is the structural representation of PCB after circuit etching provided in an embodiment of the present invention；
Figure 10 is the structural representation of PCB after laser ablation ink provided in an embodiment of the present invention.
Illustrate：Top layer core plate 1, core material 2, bottom core plate 3, prepreg 4, packing material 5, diaphragm 6, tin
Protective layer 7, ink 8, line conductor 9.
Embodiment
To enable goal of the invention, feature, the advantage of the present invention more obvious and understandable, below in conjunction with the present invention
Accompanying drawing in embodiment, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of embodiment of the invention, and not all embodiment.Based on the embodiment in the present invention, this area
All other embodiment that those of ordinary skill is obtained under the premise of creative work is not made, belongs to protection of the present invention
Scope.
The preparation method for the PCB with step trough that the present invention is provided is：First, each layer core plate is pressed by prepreg
Multi-layer PCB is formed, and top is formed with step trough；2nd, on the core plate positioned at step trough bottom, default metallized thread is made
Road figure.
Bottom land metal line figure, the method that step trough is made again, this hair are first made different from what prior art was used
It is bright to use the method for first making step trough, making bottom land metal line figure again, it can not only avoid step trough manufacturing process pair
Metal line figure produces harmful effect, and can realize versatility.
In the present embodiment, PCB is made up of 3 layers of core plate and 2 layers of prepreg 4, and the ladder groove depth that its top is formed is equal to
Two layers of core plate and the thickness of two layers of prepreg 4 positioned at upper strata.
For convenience of description, core plate is divided into externally-located outer layer core plate and internally positioned core material 2, outer layer core plate
It is included in the top layer core plate 1 positioned at top, the bottom core plate 3 positioned at bottom again.
Referring to Fig. 1, the preparation method that Fig. 1 show PCB in the present embodiment comprises the following steps：
Step S101, under original state as shown in Figure 2, core material 2 and prepreg 4 are slotted in advance, fluting
It is as shown in Figure 3 afterwards.
Slotting position and size are determined according to the design requirement of step trough.
It is preferred that, can be marked on core material 2 and prepreg 4 needs slot area, then carries out grooving operations,
It can so avoid processing by mistake, improve processing efficiency.
Step S102, core plate and the in the vertical direction of prepreg 4 alternate to setting, and in core material 2 and half
Packing material 5 is put into the groove formed between cured sheets 4, pre- folded multi-layer PCB is formed, as shown in Figure 4.
In the present embodiment, packing material 5 is specially high temperature high voltage resistant resistance glue material (such as silicon rubber, PTFE etc.), its size
It is adapted with the fluting size of core material 2 and prepreg 4, for preventing in bonding processes because resin is spilled over to step trough
Bottom and to bottom land produce pollution.
Step S103, pressing processing is carried out to pre- folded multi-layer PCB, form force fit plate, as shown in Figure 5.The step can be pressed
More solito process for pressing carries out stitching operation.
Step S104, pressing processing after, outer layer core plate is electroplated.
If step trough PCB has the design requirement of some via holes, also need to carry out Drilling operation, got out on core plate
Required via hole, and outer layer core plate and via hole are electroplated simultaneously in this step.
Step S105, the pasting protective film 6 on outer layer core plate, and needing metallized area to carry out tin plating protection, form tin
Protective layer 7.
In the present embodiment, diaphragm 6 is specially dry film, and other types can be also used certainly, this is not limited to.
Step S106, carry out step trough and uncap processing, packing material 5 therein is taken out after uncapping, as shown in Figure 6.
In this step, it can be processed by high-precise numerically controlled milling machine, it is straight to carry out controlled depth milling in the middle section of top layer core plate 1
To internally positioned packing material 5 is manifested, take out after packing material 5, bottom manifests bottom copper, so far complete the system of step trough
Make.
Step S107, according to metal line figure to be produced, the bottom land metallized area of step trough is sprayed
Ink 8, after ink-jet as shown in Figure 7.
Step S108, after bottom land ink-jet, tear diaphragm 6, tin processing, row line of going forward side by side etching, after etching are moved back in progress
As shown in Figure 8.
In this step, circuit etching use alkaline etch mode, for remove the bottom land non-metallized regions of step trough with
And on outer layer core plate non-metallized regions layers of copper.
Step S109, the ink 8 by laser ablation step trough bottom land, so as to remove ink 8, manifest line conductor 9,
As shown in figure 9, so far completing metal line graphic making.
To sum up, the step trough PCB preparation methods that the present embodiment is provided have following characteristics：
Step trough is first made, the rear metal line figure for making bottom land, metal line figure will not be pressed
The pollution of resin is overflowed in journey；And with versatility, different metal line figures can be made after step trough is formed.
In Fig. 2 to Fig. 9 institutes diagram, PCB is made up of 3 layers of core plate and 2 layers of prepreg 4, the step trough that its top is formed
Depth is equal to the thickness of two layers of the core plate and two layers of prepreg 4 positioned at upper strata.And in other application, PCB can only include two
Layer or more than 3 layers core plates, but preparation method and the above-mentioned part of the metal line figure of specific step trough and trench bottom
Identical, here is omitted.
Described above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Embodiment is stated the present invention is described in detail, it will be understood by those within the art that：It still can be to preceding
State the technical scheme described in each embodiment to modify, or equivalent substitution is carried out to which part technical characteristic；And these
Modification is replaced, and the essence of appropriate technical solution is departed from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (9)
1. a kind of PCB preparation method, it is characterised in that the method comprising the steps of：
The multi-layer PCB with step trough is made by prepreg pressing in each layer core plate；Each layer core plate includes outer layer core
Plate and core material, outer layer core plate include being located at the top layer core plate at the top of step trough, the bottom core plate positioned at ladder trench bottom；
On the bottom core plate, metal line figure is made in its position for corresponding to step trough.
2. PCB according to claim 1 preparation method, it is characterised in that described that each layer core plate is passed through into prepreg
The step of multi-layer PCB with step trough is made in pressing further comprises：
The core material and prepreg are slotted in advance；
Each layer core plate and prepreg in the vertical direction are alternated into setting, and packing material is set in groove, forms pre-
Folded multi-layer PCB；
Pressing processing is carried out to pre- folded multi-layer PCB, force fit plate is formed；
After pressing processing, the outer layer core plate is electroplated；
The pasting protective film on the outer layer core plate, and needing metallized area to carry out tin plating protection, form tin protective layer；
Controlled depth milling is carried out to the top layer core plate to form the packing material inside step trough notch, taking-up, being formed has ladder
The multi-layer PCB of groove.
3. PCB according to claim 2 preparation method, it is characterised in that described that gold is made on the bottom core plate
The step of categoryization line pattern, further comprises：
According to metal line figure to be produced, ink-jet is carried out to the metallized area of step trough bottom land；
Remove the diaphragm on outer layer core plate and tin processing is moved back in progress, circuit etching is carried out in step trough bottom land；
The ink of step trough bottom land is removed, until bottom land line conductor forms metal line figure after exposing.
4. PCB according to claim 3 preparation method, it is characterised in that described that gold is made on the bottom core plate
In the step of categoryization line pattern, the ink of the step trough bottom land is removed by laser ablation methods.
5. PCB according to claim 2 preparation method, it is characterised in that the packing material is specially that high temperature resistant is high
Pressure drag glue material.
6. PCB according to claim 2 preparation method, it is characterised in that the diaphragm is specially dry film.
7. PCB according to claim 1 preparation method, it is characterised in that the bottom of the bottom core plate also passes through half
If cured sheets are bonded with dried layer core plate.
8. PCB according to claim 1 preparation method, it is characterised in that each layer core plate is passed through into semi-solid preparation described
In the step of multi-layer PCB with step trough is made in piece pressing, in addition to：Via hole is formed to drilling on each layer core plate, right
The outer layer core plate is electroplated while plating to the via hole.
9. a kind of PCB, it is characterised in that the PCB is made according to any preparation method of claim 1 to 8, including will be each
Layer core plate presses the multi-layer PCB with step trough being made by prepreg；And it is located at step trough bottom in the multi-layer PCB
On the bottom core plate in portion, there is metal line figure corresponding to the position making of step trough.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710321575.7A CN106973526A (en) | 2017-05-09 | 2017-05-09 | A kind of PCB preparation method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710321575.7A CN106973526A (en) | 2017-05-09 | 2017-05-09 | A kind of PCB preparation method and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106973526A true CN106973526A (en) | 2017-07-21 |
Family
ID=59330757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710321575.7A Pending CN106973526A (en) | 2017-05-09 | 2017-05-09 | A kind of PCB preparation method and PCB |
Country Status (1)
| Country | Link |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484361A (en) * | 2017-09-25 | 2017-12-15 | 生益电子股份有限公司 | The preparation method and High-Speed PCB of a kind of High-Speed PCB |
| CN108112175A (en) * | 2018-02-02 | 2018-06-01 | 生益电子股份有限公司 | A kind of production method and PCB of ladder groove bottom graphical PCB |
| CN108401384A (en) * | 2018-03-05 | 2018-08-14 | 生益电子股份有限公司 | A kind of production method and PCB of the stepped groove of PCB |
| CN109041459A (en) * | 2018-08-31 | 2018-12-18 | 生益电子股份有限公司 | A kind of production method and PCB of slot bottom figure stepped groove |
| CN113038692A (en) * | 2021-02-09 | 2021-06-25 | 景旺电子科技(珠海)有限公司 | Circuit board and manufacturing method thereof |
| CN114885526A (en) * | 2022-03-31 | 2022-08-09 | 生益电子股份有限公司 | Method for manufacturing PCB with embedded circuit and PCB with embedded circuit |
| CN114916146A (en) * | 2022-05-05 | 2022-08-16 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
| CN114928961A (en) * | 2022-05-20 | 2022-08-19 | 重庆方正高密电子有限公司 | Preparation method of PCB and PCB |
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| CN101351078A (en) * | 2008-08-15 | 2009-01-21 | 东莞生益电子有限公司 | Method for processing step ladder PCB plate |
| CN101699937A (en) * | 2009-11-04 | 2010-04-28 | 上海美维电子有限公司 | Method for producing stepped PCB board |
| CN106255349A (en) * | 2016-08-16 | 2016-12-21 | 生益电子股份有限公司 | The manufacture method of a kind of PCB and PCB |
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2017
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| CN101351078A (en) * | 2008-08-15 | 2009-01-21 | 东莞生益电子有限公司 | Method for processing step ladder PCB plate |
| CN101699937A (en) * | 2009-11-04 | 2010-04-28 | 上海美维电子有限公司 | Method for producing stepped PCB board |
| CN106255349A (en) * | 2016-08-16 | 2016-12-21 | 生益电子股份有限公司 | The manufacture method of a kind of PCB and PCB |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484361A (en) * | 2017-09-25 | 2017-12-15 | 生益电子股份有限公司 | The preparation method and High-Speed PCB of a kind of High-Speed PCB |
| CN108112175A (en) * | 2018-02-02 | 2018-06-01 | 生益电子股份有限公司 | A kind of production method and PCB of ladder groove bottom graphical PCB |
| CN108401384A (en) * | 2018-03-05 | 2018-08-14 | 生益电子股份有限公司 | A kind of production method and PCB of the stepped groove of PCB |
| CN109041459A (en) * | 2018-08-31 | 2018-12-18 | 生益电子股份有限公司 | A kind of production method and PCB of slot bottom figure stepped groove |
| CN113038692A (en) * | 2021-02-09 | 2021-06-25 | 景旺电子科技(珠海)有限公司 | Circuit board and manufacturing method thereof |
| CN114885526A (en) * | 2022-03-31 | 2022-08-09 | 生益电子股份有限公司 | Method for manufacturing PCB with embedded circuit and PCB with embedded circuit |
| CN114916146A (en) * | 2022-05-05 | 2022-08-16 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
| CN114916146B (en) * | 2022-05-05 | 2024-05-17 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
| CN114928961A (en) * | 2022-05-20 | 2022-08-19 | 重庆方正高密电子有限公司 | Preparation method of PCB and PCB |
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Application publication date: 20170721 |