CN108401384A - A kind of production method and PCB of the stepped groove of PCB - Google Patents
A kind of production method and PCB of the stepped groove of PCB Download PDFInfo
- Publication number
- CN108401384A CN108401384A CN201810180420.0A CN201810180420A CN108401384A CN 108401384 A CN108401384 A CN 108401384A CN 201810180420 A CN201810180420 A CN 201810180420A CN 108401384 A CN108401384 A CN 108401384A
- Authority
- CN
- China
- Prior art keywords
- gasket
- stepped groove
- production method
- core plate
- slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Gasket Seals (AREA)
Abstract
The present invention relates to PCB technical fields, disclose a kind of production method and PCB of the stepped groove of PCB.The production method includes：After being respectively completed the inner figure making of each core plate, open a window in the corresponding position of the first specified core plate and the stepped groove to be formed of specified prepreg；Each core plate and each prepreg are stacked according to predetermined order, and embedment or joint sheet in slot are formed by the described first specified core plate and specified prepreg, while the gasket being positioned in slot；The gasket is taken out after being pressed, and forms stepped groove.The embodiment of the present invention prevents gasket from generating displacement in lamination process, to effectively avoid the occurrence of lamination cavitation, improves the reliability of PCB product when using filling or being embedded to gasket production method by carrying out localization process to gasket.
Description
Technical field
The present invention relates to PCB (Printed Circuit Board, printed wiring board) technical fields, more particularly to one kind
The production method and PCB of the stepped groove of PCB.
Background technology
With the development of science and technology electronic product indispensable articles for daily use in having become for people's lives, and PCB is electronics
The important component of product, people are more and more to the functional requirement of electronic product in recent years, thus also proposed more to PCB
High requirement.In general, for the ease of the device for installing the device of specific function on PCB or needs sink, it is often necessary to
Stepped groove is set on PCB, and stepped groove is also the pith for realizing product high-power heat-dissipation, is in industry widely used.
There are mainly two types of the production methods of current general stepped groove：
One kind is controlled depth milling production method.It is bigger that this production method not only controls deep difficulty, it is difficult to which controlled depth milling is to specified line
Road floor leads to not meet design requirement；And figure can not be made in slot bottom.
Another kind is filling or embedment gasket production method.This production method is susceptible to lamination cavitation.This be by
The partial air in stepped groove can be squeezed out to generate certain extruding force in lamination process light plate, gasket is caused to shift
It pierces between the core plate of trough rim and prepreg, forms cavity after taking out gasket.What this cavitation can reduce PCB can
By property so that outside the metallic circuit of cavity position is exposed to, and be easy leafing in stress.
Invention content
The purpose of the present invention is to provide a kind of production methods and PCB of the stepped groove of PCB, overcome conventional filling or bury
It is existing because gasket easily shifts the defect for leading to generate lamination cavitation to enter gasket production method.
For this purpose, the present invention uses following technical scheme：
A kind of production method of the stepped groove of PCB, the production method include：
Be respectively completed each core plate inner figure make after, be intended to be formed in the first specified core plate and specified prepreg
The corresponding position of stepped groove opens a window；
Each core plate and each prepreg are stacked according to predetermined order, and in the described first specified core plate and referred to
Determine prepreg and be formed by embedment or joint sheet in slot, while the gasket being positioned in slot；
The gasket is taken out after being pressed, and forms stepped groove.
Optionally, in the production method, by pin positioning method, the gasket is positioned in slot.
Optionally, include by the method that the gasket is positioned in slot by pin positioning method：
Before being stacked each core plate and each prepreg according to predetermined order, in the pre- of the second specified core plate
If position opens up the first pin hole, the second pin hole corresponding with first pin hole site is opened up on the gasket；
The second specified core plate is located at the slot bottom of the stepped groove, and the predeterminated position is the non-predetermined graphics field of the slot bottom；
After the described first specified core plate and specified prepreg are formed by slot embedment or joint sheet, described the
One pin hole and the second pin hole are implanted into pin, and the gasket is positioned in slot by the pin.
Optionally, in the production method, according to joint sheet mode, then after pressing and before taking out gasket,
It further include step：Carry out milling plate side operation, while pin described in mill off.
Optionally, in the production method, according to embedment gasket mode, then after pressing and before taking out gasket,
It further include step：Pin described in first mill off, then uncap.
Optionally, in the production method, by pasting positioning method, the gasket is positioned in slot.
Optionally, include by the method that the gasket is positioned in slot by pasting positioning method：
Before being stacked each core plate and each prepreg according to predetermined order, in the pre- of the second specified core plate
If position opens up storage tank, and pure glue is arranged in the storage tank；The second specified core plate is located at the slot of the stepped groove
Bottom, the predeterminated position are the non-predetermined graphics field of the slot bottom；
After the described first specified core plate and specified prepreg are formed by slot embedment or joint sheet, by described
The gasket is positioned in slot by pure glue.
Optionally, the thickness of the gasket is consistent with the depth of the stepped groove.
Optionally, the production method includes：Each core plate and each prepreg are stacked according to predetermined order
Before, the pre-production predetermined pattern on the second specified core plate of the slot bottom positioned at the stepped groove；
Alternatively, after forming stepped groove, predetermined pattern is made in the slot bottom of the stepped groove.
A kind of PCB, including stepped groove made of production method as described above.
Compared with prior art, beneficial effects of the present invention are：
The embodiment of the present invention is prevented when using filling or being embedded to gasket production method by carrying out localization process to gasket
Only gasket generates displacement in lamination process, to effectively avoid the occurrence of lamination cavitation, improves the reliability of PCB product.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the production method of the stepped groove of PCB provided in an embodiment of the present invention；
Fig. 2 is the knot of the second specified core plate provided in an embodiment of the present invention that the first pin hole is offered in its predeterminated position
Structure view；
Fig. 3 is the topology view of the gasket provided in an embodiment of the present invention for offering the second pin hole；
Fig. 4 is the topology view provided in an embodiment of the present invention being positioned at gasket by pin in stepped groove.
Specific implementation mode
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
All other embodiment that those of ordinary skill is obtained without making creative work, belongs to protection of the present invention
Range.
Core of the invention thought is：When using filling or being embedded to gasket production method, by being positioned to gasket
It handles to prevent gasket from generating displacement in lamination process, to effectively avoid the occurrence of lamination cavitation, improves PCB product
Reliability.
Referring to Fig. 1, present embodiments providing a kind of production method of the stepped groove of PCB, including step：
After step 101, the inner figure for being respectively completed each core plate make, in the first specified core plate and specified prepreg
On the corresponding position of stepped groove to be formed open a window.
Step 102 stacks each core plate and each prepreg according to predetermined order, and in the first specified core plate
It is formed by embedment or joint sheet in slot with specified prepreg, while gasket being positioned in slot；
To ensure that effective control of gummosis amount, embedment or the thickness of joint sheet and the thickness for the stepped groove to be formed are kept
Unanimously.
Step 103 takes out gasket after being pressed, form stepped groove.
In addition, further include the steps that making predetermined pattern in slot bottom, it can be before walkthrough pressing positioned at stepped groove bottom
The second specified core plate corresponding position pre-production predetermined pattern, also can be after forming stepped groove, in the second specified core plate
Corresponding position make predetermined pattern, do not limit specifically.
In the above-mentioned methods, include by the method that gasket is positioned in slot：Pin positioning method, or paste localization method
Deng.
Specifically, pin positioning method includes：
1) before being stacked each core plate and each prepreg according to predetermined order, in the second specified core plate
Predeterminated position opens up the first pin hole 1 (as shown in Figure 2), and opens up on gasket corresponding with the position of the first pin hole 1
Second pin hole 2 (as shown in Figure 3).
Wherein, the second specified core plate is the core plate of stepped groove slot bottom to be stacked in, and predeterminated position is the non-predetermined figure of slot bottom
Shape region, without wires design in the non-predetermined graphics field.
In this step, laser ablation or CCD machine dimensions drills can be used to open up pin hole.
2) after the first specified core plate and specified prepreg are formed by slot embedment or joint sheet, in the first pin
Hole 1 and the second pin hole 2 are implanted into pin 3, the gasket are positioned in slot by pin 3, as shown in Figure 4.
In the pin positioning method, the quantity of the first pin hole 1 and the second pin hole 2 is unlimited, can be one or
Gasket can be positioned exactly on rank by more than one by being implanted into the pin 3 of the first pin hole 1 and the second pin hole 2 simultaneously
In terraced slot, the gasket in bonding processes is prevented to be displaced to because of extruding force between core plate and prepreg, to can effectively avoid
The generation of cavitation.
Certainly, it after pressing and before taking out gasket, needs to take out pin 3.If in a step 102 using filling
Gasket mode, then can while carrying out milling plate side after pressing mill off pin 3.If in a step 102 using embedment gasket side
Formula, then after pressing, first mill off pin 3 uncap again (i.e. will be positioned at core plate part mill off of gasket upper area) take out pad
Piece, can avoid milling cutter during uncapping in this way because generating collision with pin 3 leads to that breaking phenomenon occurs.
Specifically, pasting localization method includes：
1) before being stacked each core plate and each prepreg according to predetermined order, in the second specified core plate
Predeterminated position opens up storage tank, and pure glue is arranged in the storage tank；
Wherein, the second specified core plate is located at the slot bottom of stepped groove, and predeterminated position is the non-predetermined graphics field of the slot bottom.
2) after the first specified core plate and specified prepreg are formed by slot embedment or joint sheet, passing through pure glue will
Gasket is positioned in slot.
In the stickup localization method, using opening up storage tank in the non-graphic region of slot bottom and be arranged in the storage tank
The mode of pure glue, and the mode of pure glue is arranged in the indirect surface in the non-graphic region of slot bottom, it can be to avoid with certain thickness
The pure glue of degree occupies the confined space of stepped groove, prevents the spacer thickness filled or be embedded in stepped groove from can not meet default want
It asks, ensures the reliable control of gummosis amount, it is ensured that PCB mass is good.
In addition, the present embodiment additionally provides a kind of PCB comprising stepped groove, the stepped groove use above-mentioned production method system
At.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Stating embodiment, invention is explained in detail, it will be understood by those of ordinary skill in the art that：It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
Modification or replacement, the spirit and scope for various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of production method of the stepped groove of PCB, which is characterized in that the production method includes：
After being respectively completed the inner figure making of each core plate, in the ladder to be formed of the first specified core plate and specified prepreg
The corresponding position of slot opens a window；
Each core plate and each prepreg are stacked according to predetermined order, and in the described first specified core plate and specified half
Cured sheets are formed by embedment or joint sheet in slot, while the gasket being positioned in slot；
The gasket is taken out after being pressed, and forms stepped groove.
2. the production method of the stepped groove of PCB according to claim 1, which is characterized in that in the production method, lead to
Pin positioning method is crossed, the gasket is positioned in slot.
3. the production method of the stepped groove of PCB according to claim 2, which is characterized in that will by pin positioning method
The method that the gasket is positioned in slot includes：
Before being stacked each core plate and each prepreg according to predetermined order, in the default position of the second specified core plate
It sets and opens up the first pin hole, the second pin hole corresponding with first pin hole site is opened up on the gasket；It is described
Second specified core plate is located at the slot bottom of the stepped groove, and the predeterminated position is the non-predetermined graphics field of the slot bottom；
After the described first specified core plate and specified prepreg are formed by slot embedment or joint sheet, in first pin
Nail hole and the second pin hole are implanted into pin, and the gasket is positioned in slot by the pin.
4. the production method of the stepped groove of PCB according to claim 3, which is characterized in that in the production method, if adopting
Then further include step after pressing and before taking out gasket with joint sheet mode：Carry out milling plate side operation, while mill off
The pin.
5. the production method of the stepped groove of PCB according to claim 3, which is characterized in that in the production method, if adopting
Further include step then after pressing and before taking out gasket with embedment gasket mode：Pin described in first mill off, then uncap.
6. the production method of the stepped groove of PCB according to claim 1, which is characterized in that in the production method, lead to
Stickup positioning method is crossed, the gasket is positioned in slot.
7. the production method of the stepped groove of PCB according to claim 6, which is characterized in that will by pasting positioning method
The method that the gasket is positioned in slot includes：
Before being stacked each core plate and each prepreg according to predetermined order, in the default position of the second specified core plate
It sets and opens up storage tank, and pure glue is set in the storage tank；The second specified core plate is located at the slot bottom of the stepped groove, institute
State the non-predetermined graphics field that predeterminated position is the slot bottom；
After the described first specified core plate and specified prepreg are formed by slot embedment or joint sheet, pass through the pure glue
The gasket is positioned in slot.
8. the production method of the stepped groove of PCB according to claim 1, which is characterized in that the thickness of the gasket and institute
The depth for stating stepped groove is consistent.
9. the production method of the stepped groove of PCB according to claim 1, which is characterized in that the production method includes：It will
Before each core plate and each prepreg are stacked according to predetermined order, second in the slot bottom positioned at the stepped groove refers to
Determine pre-production predetermined pattern on core plate；
Alternatively, after forming stepped groove, predetermined pattern is made in the slot bottom of the stepped groove.
10. a kind of PCB, which is characterized in that the PCB includes according to rank made of any production method of claim 1 to 9
Terraced slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810180420.0A CN108401384A (en) | 2018-03-05 | 2018-03-05 | A kind of production method and PCB of the stepped groove of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810180420.0A CN108401384A (en) | 2018-03-05 | 2018-03-05 | A kind of production method and PCB of the stepped groove of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108401384A true CN108401384A (en) | 2018-08-14 |
Family
ID=63092353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810180420.0A Pending CN108401384A (en) | 2018-03-05 | 2018-03-05 | A kind of production method and PCB of the stepped groove of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108401384A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523688A (en) * | 2011-12-06 | 2012-06-27 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
| CN202652706U (en) * | 2012-07-16 | 2013-01-02 | 北大方正集团有限公司 | Printed circuit board in process |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
| CN103327756A (en) * | 2013-06-03 | 2013-09-25 | 东莞生益电子有限公司 | Multilayer circuit board with partial mixed structure and manufacturing method thereof |
| CN203618240U (en) * | 2013-11-18 | 2014-05-28 | 广州兴森快捷电路科技有限公司 | Gasket for pressing stepped printed circuit board |
| CN106973526A (en) * | 2017-05-09 | 2017-07-21 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
-
2018
- 2018-03-05 CN CN201810180420.0A patent/CN108401384A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523688A (en) * | 2011-12-06 | 2012-06-27 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
| CN202652706U (en) * | 2012-07-16 | 2013-01-02 | 北大方正集团有限公司 | Printed circuit board in process |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
| CN103327756A (en) * | 2013-06-03 | 2013-09-25 | 东莞生益电子有限公司 | Multilayer circuit board with partial mixed structure and manufacturing method thereof |
| CN203618240U (en) * | 2013-11-18 | 2014-05-28 | 广州兴森快捷电路科技有限公司 | Gasket for pressing stepped printed circuit board |
| CN106973526A (en) * | 2017-05-09 | 2017-07-21 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE102010060855A1 (en) | Electronic component, method for its production and printed circuit board with electronic component | |
| CN106961809A (en) | A kind of preparation method of Rigid Flex | |
| CN104168711B (en) | The compression method of cavity circuit plate and its preparation method of pressing structure | |
| JP2014236029A (en) | Printed wiring board and method of manufacturing printed wiring board | |
| TWI295912B (en) | Method for manufacturing a substrate embedded with an electronic component and device from the same | |
| CN104206038A (en) | Multilayer wiring substrate and manufacturing method therefor | |
| CN107613642A (en) | The preparation method of the burying capacitance circuit board containing step trough | |
| CN103929899A (en) | Manufacturing method for circuit board blind hole | |
| CN103874346B (en) | Manufacturing method of circuit board | |
| TW310520B (en) | ||
| CN105792527B (en) | A kind of production method of etchback printed circuit board | |
| CN105047630B (en) | Active embedment encapsulating structure and its production technology are assembled after chip | |
| CN107613674A (en) | The preparation method of one stepped PCB board | |
| CN106793564A (en) | A kind of plug-in method of multi-layer PCB blind hole | |
| CN104427762A (en) | Buried resistance printed board and manufacturing method thereof | |
| CN115484758A (en) | Manufacturing method of extra-thick copper PCB of new energy charging bus | |
| CN104602463B (en) | A kind of preparation method for the mechanical blind hole for being embedded in part | |
| CN110809358A (en) | Heat dissipation PCB and manufacturing method thereof | |
| CN107529292A (en) | A kind of random layer interconnection PCB preparation method | |
| CN104202904B (en) | The pressing structure of the circuit board with lateral grooves and the preparation method of circuit board | |
| EP2418925B1 (en) | Flex film contacting | |
| CN103402333A (en) | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof | |
| CN108401384A (en) | A kind of production method and PCB of the stepped groove of PCB | |
| CN103889147A (en) | Machining method of PCB stepped plate and PCB stepped plate | |
| CN107635353A (en) | A kind of double-faced flexible wiring board and its laser preparation method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180814 |
|
| RJ01 | Rejection of invention patent application after publication |