CN104202904B - The pressing structure of the circuit board with lateral grooves and the preparation method of circuit board - Google Patents
The pressing structure of the circuit board with lateral grooves and the preparation method of circuit board Download PDFInfo
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- CN104202904B CN104202904B CN201410437206.0A CN201410437206A CN104202904B CN 104202904 B CN104202904 B CN 104202904B CN 201410437206 A CN201410437206 A CN 201410437206A CN 104202904 B CN104202904 B CN 104202904B
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- copper foil
- foil layer
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- insulating barrier
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Abstract
The present invention relates to the preparation method of the pressing structure and circuit board of the circuit board with lateral grooves.The pressing structure of the circuit board includes the first copper foil layer, the first centrifugation film layer, the first aluminium flake layer, the first core plate, a NF PP, the second core plate, the 2nd NF PP, the 3rd core plate, the second aluminium flake, the second centrifugation film and the second copper foil layer that from top to bottom press；At least one groove for running through a NF PP, the second core plate and the 2nd NF PP is also formed with the pressing structure of the circuit board, and the side of the groove is in communication with the outside.The present invention uses the composite bed of Copper Foil+centrifugation film+aluminium flake, both it ensure that material stiffness, steel plate can be replaced to solve concave defect under big cavity, there is the comfort cushioning performance of the material such as pressing pad or pressing pad+accessory plate again, when cavity plate is connected up, NF PP can be made to be well combined with circuit, it is to avoid the defect such as filler deficiency.Likewise, when groove inner wall needs copper facing, the uniform method of groove inner wall copper facing is made disclosure sets forth one kind.
Description
Technical field
The present invention relates to circuit board technology field.
Background technology
Electronic manufacturing industry has multi-direction development in terms of space availability ratio：Light, the thinning of material, wiring density collection
Middleization, become more meticulous, the microminiaturization of via, densification, and assembling mode variation.It is special in terms of assembling mode variation
PCB and extraordinary component are planted when assembling splicing is carried out with motherboard PCB, is taken up room to reduce, be no longer satisfied with traditional
Welding, attachment process, and be changed to make certain functional modules on PCB motherboards, embedded or half embedded motherboard.For example：Bury unit
Device, bury copper billet, bury daughter board design, buried capacitor, resistive arrangement, stepped plate design, cavity plate design, and lateral grooves
(cavity) plate design etc..
Lateral grooves plate technique, it is recessed inside one or more recessed circuit board to be that a kind of side in electroplate makes
Groove, it is other for the various ways assembling such as inserting, welding by the combination with the functional module such as other vias, non-conduction hole
The technique of electronic component.
Lateral grooves plate has the practical difficulties of the following aspects.
1. lateral grooves how problem of implementation.Groove is distributed in the side of plank rather than the top faces of plank or bottom
Face, with modes such as traditional at present drilling and milling or laser ablation, it is impossible to realized on so thin finished circuit board；
2. Preserving problems of lateral grooves three-dimensional shape, especially groove height.How the good solid figure of retaining groove
Shape, preventing that groove is recessed is the problem of needing to solve, and it is conventional filler is used in groove, then there is gong and go out after groove to fill out
Fill the problem of thing can not take out；
3. groove how copper facing problem.In the positive up/down side of groove, Customer design electroplating hole is communicated in groove, and is required
Intercommunicating pore and groove inner wall copper facing.If designed according to old process producing, there is the risk of groove built-in liquid medicine during plating, so that
Cause groove plating leakage, intercommunicating pore junction face copper, hole copper are stung the problems such as losing and cause copper thick not enough by liquid medicine.
The content of the invention
An object of the present invention is to propose a kind of pressing structure of the circuit board with lateral grooves, and it can solve recessed
The recessed problem of groove.
The second object of the present invention is to propose a kind of preparation method of the circuit board with lateral grooves, and it can solve recessed
The problem of line of rabbet joint road surface filler is not enough.
One of in order to achieve the above object, the technical solution adopted in the present invention is as follows：
A kind of pressing structure of the circuit board with lateral grooves, its first copper foil layer for including from top to bottom pressing,
One centrifugation film layer, the first aluminium flake layer, the first core plate, a NF PP, the second core plate, the 2nd NF PP, the 3rd core plate, the second aluminium
Piece, the second centrifugation film and the second copper foil layer；Be also formed with the pressing structure of the circuit board at least one through a NF PP,
The groove of the second core plate and the 2nd NF PP, and the side of the groove is in communication with the outside.
Preferably, first core plate and/or the second core plate are provided with via, and the via is led with the groove
It is logical.Or, the first core plate and the second core plate are all not turned on hole.
Preferably, first core plate includes the one one insulating barrier and positioned at the one one insulating barrier upper surface and following table
One one copper foil layer in face；3rd core plate include the 3rd 1 insulating barrier and positioned at the 3rd 1 insulating barrier upper surface and under
3rd 1 copper foil layer on surface.
It is further preferred that positioned at the one one copper foil layer of the one one insulating barrier lower surface and positioned at the 3rd 1 insulating barrier
3rd 1 copper foil layer of upper surface is each formed with line pattern.
Preferably, second core plate includes the 2nd 1 insulating barrier and positioned at the 2nd 1 insulating barrier upper surface and following table
2nd 1 copper foil layer in face.
In order to achieve the above object two, the technical solution adopted in the present invention is as follows：
A kind of preparation method of the circuit board with lateral grooves, it is comprised the following steps：
Step 1, by being punched turn on window or gong plate turn on window by a NF PP, the second core plate and the 2nd NF PP point
Do not opened a window；
Step 2, by windowing after a NF PP, the second core plate and the 2nd NF PP be from top to bottom built up cavity successively
Plate, wherein, the windowing position of a NF PP, the second core plate and the 2nd NF PP is both turned on forming one through a NF PP, the
The cavity of two core plates and the 2nd NF PP；
Step 3, by the first copper foil layer, first centrifugation film layer, the first aluminium flake layer, the first core plate, cavity plate, the 3rd core plate,
Second aluminium flake, the second centrifugation film and the second copper foil layer from top to bottom overlap and carry out lamination treatment successively；
Step 4, by first copper foil layer, first centrifugation film layer, the first aluminium flake layer, the second aluminium flake, second be centrifuged film and
Second copper foil layer takes down, to obtain rebound；
Step 5, the side wall gong of the cavity of the rebound is fallen using gong plate turn on window, so that the institute of the cavity
Side wall is stated to be in communication with the outside so as to form groove.
Preferably, there are following steps after step 5：Drilling processing is carried out to first core plate and/or the second core plate,
To form via, the via is turned on the groove.
Preferably, first core plate includes the one one insulating barrier and positioned at the one one insulating barrier upper surface and following table
One one copper foil layer in face；3rd core plate include the 3rd 1 insulating barrier and positioned at the 3rd 1 insulating barrier upper surface and under
3rd 1 copper foil layer on surface.
The third object of the present invention is to propose a kind of preparation method of the circuit board with lateral grooves, and it can solve recessed
When line of rabbet joint road surface filler is not enough with copper facing the problem of copper thickness ununiformity.
The preparation method of circuit board with lateral grooves, it comprises the following steps：
Step 1, by being punched turn on window or gong plate turn on window by a NF PP, the second core plate and the 2nd NF PP point
Do not opened a window；
Step 2, the first NF PP, the second core plate and the 2nd NF PP after windowing be from top to bottom built up cavity successively
Plate, wherein, the windowing position of a NF PP, the second core plate and the 2nd NF PP is both turned on forming one through a NF PP, the
The cavity of two core plates and the 2nd NF PP；
Step 3, by the first copper foil layer, first centrifugation film layer, the first aluminium flake layer, the first core plate, cavity plate, the 3rd core plate,
Second aluminium flake, the second centrifugation film and the second copper foil layer are from top to bottom overlapped and carry out lamination treatment successively；The first core plate bag
Include the one one insulating barrier and positioned at the one one insulating barrier upper surface and the one one copper foil layer of lower surface；3rd core plate
Including the 3rd 1 insulating barrier and positioned at the 3rd 1 insulating barrier upper surface and the 3rd 1 copper foil layer of lower surface；
Step 4, by first copper foil layer, first centrifugation film layer, the first aluminium flake layer, the second aluminium flake, second be centrifuged film and
Second copper foil layer takes down, to obtain rebound；
Step 5, drilling treatment is carried out to first core plate and/or the second core plate, to form via, the via
With cavity conducting, and pod apertures through the rebound, the pod apertures and institute are made in the garbage area of rebound
State cavity conducting；
When step 6, plating, copper facing liquid medicine is injected into the via, so that positioned at the of the one one insulating barrier lower surface
Copper foil layer and the 3rd 1 copper foil layer positioned at the 3rd 1 insulating barrier upper surface are respectively formed copper plated area one by one, to form electroplate；
Step 7, the side wall gong of the cavity positioned at garbage area of the electroplate is fallen, so that described the one of the cavity
Side wall is in communication with the outside so as to form groove.
Preferably, second core plate includes the 2nd 1 insulating barrier and positioned at the 2nd 1 insulating barrier upper surface and following table
2nd 1 copper foil layer in face.
The present invention has the advantages that：
For circuit board, using the composite bed of Copper Foil+centrifugation film+aluminium flake, material stiffness is both ensure that, can be replaced
Steel plate solves concave defect under big cavity, and with the comfort cushioning performance of the material such as pressing pad or pressing pad+accessory plate, in sky
When cavity plate is connected up, NF PP (no flow prepreg, illiquidity prepreg) can be made to be well combined with circuit, it is to avoid fill out
The defects such as glue deficiency.
For the preparation method of circuit board, during pressing, using the composite bed of Copper Foil+centrifugation film+aluminium flake, can both protect
The good three-dimensional shape of groove is demonstrate,proved, NF PP can again be well combined with circuit, it is to avoid the not enough defect of filler.When in groove
When wall needs copper facing, also with the uniform effect of groove inner wall copper facing.
Brief description of the drawings
Fig. 1 is the structural representation of the pressing structure of the circuit board with lateral grooves of the embodiment of the present invention one；
Fig. 2 is the structural representation of the electroplate of the preparation method of the circuit board with lateral grooves of the embodiment of the present invention two
Figure.
Specific embodiment
Below, with reference to accompanying drawing and embodiment, the present invention is described further.
Embodiment one
As shown in figure 1, a kind of pressing structure of the circuit board with lateral grooves, it includes from top to bottom press first
The centrifugation of copper foil layer 17, first film layer 13, the 14, first core plate of the first aluminium flake layer, a NF PP 4, the second core plate, the 2nd NF PP
8th, the 3rd core plate, the second aluminium flake 15, second are centrifuged the copper foil layer 18 of film 16 and second.Also formed in the pressing structure of the circuit board
Have one through a NF PP 4, the second core plate and the 2nd NF PP 8 groove 12, and the side of the groove 12 with it is extraneous
Connection.
First core plate is provided with via 19, and the via 19 is turned on the groove 12.First core plate
Including the one one insulating barrier 2 and positioned at the upper surface of the one one insulating barrier 2 and the one one copper foil layer 1,3 of lower surface；It is described
3rd core plate includes the 3rd 1 insulating barrier 10 and positioned at the upper surface of the 3rd 1 insulating barrier 10 and the 3rd 1 Copper Foil of lower surface
Layer 9,11.Second core plate includes the 2nd 1 insulating barrier 6 and positioned at the upper surface of the 2nd 1 insulating barrier 6 and lower surface the
21 copper foil layers 5,7.
Incorporated by reference to shown in Fig. 1, the preparation method of the circuit board with lateral grooves of the present embodiment is as follows：
Step 1, by being punched turn on window or gong plate turn on window by a NF PP 4, the second core plate and the 2nd NF PP
8 are opened a window respectively；
Step 2, by windowing after a NF PP 4, the second core plate and the 2nd NF PP 8 be from top to bottom built up successively
Cavity plate, wherein, the windowing position of a NF PP 4, the second core plate and the 2nd NF PP 8 is both turned on forming one through first
NF PP 4, the second core plate and the 2nd NF PP 8 cavity；
Step 3, the first copper foil layer 17, first is centrifuged film layer 13, the 14, first core plate of the first aluminium flake layer, cavity plate, the 3rd
Core plate, the second aluminium flake 15, second are centrifuged the copper foil layer 18 of film 16 and second and from top to bottom overlap successively and carry out lamination treatment；
Step 4, by first copper foil layer 17, first be centrifuged film layer 13, the first aluminium flake layer the 14, second aluminium flake 15, second
The centrifugation copper foil layer 18 of film 16 and second takes down, to obtain rebound；
Step 5, the side wall gong of the cavity of the rebound is fallen using gong plate turn on window, so that the institute of the cavity
Side wall is stated to be in communication with the outside so as to form groove 12.
Step 6, drilling treatment is carried out to first core plate, to form via 19, the via 19 is recessed with described
Groove 12 is turned on.
Then the circuit board of step 6 gained is normally produced the finishing operations of pcb board, you can obtain what is finally used
Circuit board.
It should be noted that prepregs of the NF PP for illiquidity, the mobility of the prepreg of illiquidity is than general
The poor fluidity of logical prepreg.
In above-described embodiment, the first core plate and the second core plate are all not provided with via, or the first core plate or the second core plate
One of which sets via, or the first core plate and the second core plate all set via.
In above-described embodiment, the quantity of groove can also be multiple.
Embodiment two
Further, it is also possible to the one one copper foil layer positioned at the one one insulating barrier lower surface in the above-described embodiments and position
The 3rd 1 copper foil layer in the 3rd 1 insulating barrier upper surface is respectively formed copper plated area.Now represent that groove inner wall has copper facing requirement, should
First：Adjustment groove design, garbage area is extended to by groove area by sidewall opening end, and is designed in garbage area and drilled, make drilling with
Groove is turned on.
With reference to shown in Fig. 2, specific preparation method is as follows：
Step 1, by being punched turn on window or gong plate turn on window by the first NF PP 4, the second core plate and the 2nd NF PP
8 are opened a window respectively；Second core plate include the 2nd 1 insulating barrier 6 and positioned at the upper surface of the 2nd 1 insulating barrier 6 and under
2nd 1 copper foil layer 5,7 on surface；
Step 2, by windowing after a NF PP 4, the second core plate and the 2nd NF PP 8 be from top to bottom built up successively
Cavity plate, wherein, the first NF PP 4, the second core plate and the 2nd NF PP 8 windowing position are both turned on running through first to form one
The cavity 20 of NF PP 4, the second core plate and the 2nd NF PP 8；
Step 3, by the first copper foil layer, first centrifugation film layer, the first aluminium flake layer, the first core plate, cavity plate, the 3rd core plate,
Second aluminium flake, the second centrifugation film and the second copper foil layer are from top to bottom overlapped and carry out lamination treatment successively；The first core plate bag
Include the one one insulating barrier 2 and positioned at the upper surface of the one one insulating barrier 2 and the one one copper foil layer 1,3 of lower surface；Described
Three core plates include the 3rd 1 insulating barrier 10 and the 3rd 1 copper foil layer 9 positioned at the 3rd 1 insulating barrier upper surface and lower surface,
11；
Step 4, by first copper foil layer, first centrifugation film layer, the first aluminium flake layer, the second aluminium flake, second be centrifuged film and
Second copper foil layer takes down, to obtain rebound；
Step 5, drilling treatment is carried out to first core plate, to form via 19, the via 19 and the sky
Chamber 20 turns on, and makes pod apertures 21 through the rebound, the pod apertures 21 and institute in the garbage area 22 of rebound
Cavity 20 is stated to turn on；
When step 6, plating, copper facing liquid medicine is injected into the via 19, so that positioned at the lower surface of the one one insulating barrier 2
One one copper foil layer 3 and the 3rd 1 copper foil layer 9 positioned at the upper surface of the 3rd 1 insulating barrier 10 are respectively formed copper plated area, to form electricity
Plate plate；
Step 7, the side wall gong of the cavity 20 positioned at garbage area 22 of the electroplate is fallen, so that the cavity 20
The side wall is in communication with the outside so as to form groove.
So, after copper facing liquid medicine enters cavity 20 from via 19, liquid medicine can enter pod apertures 21, thereby may be ensured that
Effective liquid medicine is exchanged, and can so meet the thick requirement of the copper of via 19 and cavity 20, and the plating leakage problem of cavity 20 is avoided that again.
After copper facing is finished, the flaggy gong of the garbage area 22 beyond pod apertures 21 is fallen, just can obtain and extraneous conducting groove, you can keep
Board design originally.
For a person skilled in the art, technical scheme that can be as described above and design, make other each
Plant corresponding change and deform, and all these changes and deforms the protection model that should all belong to the claims in the present invention
Within enclosing.
Claims (5)
1. there is the preparation method of the circuit board of lateral grooves, it is characterised in that comprise the following steps：
Step 1, by being punched turn on window or gong plate turn on window by the first illiquidity prepreg, the second core plate and second
Illiquidity prepreg is opened a window respectively；
Step 2, by windowing after the first illiquidity prepreg, the second core plate and the second illiquidity prepreg by up to
Under be built up cavity plate successively, wherein, the first illiquidity prepreg, the second core plate and the second illiquidity prepreg
Windowing position be both turned on forming one through the first illiquidity prepreg, the second core plate and the second illiquidity semi-solid preparation
The cavity of piece；
Step 3, by the first copper foil layer, the first release film layer, the first aluminium flake layer, the first core plate, cavity plate, the 3rd core plate, second
Aluminium flake, the second mould release membrance and the second copper foil layer are from top to bottom overlapped and carry out lamination treatment successively；
Step 4, by first copper foil layer, the first release film layer, the first aluminium flake layer, the second aluminium flake, the second mould release membrance and second
Copper foil layer takes down, to obtain rebound；
Step 5, the side wall gong of the cavity of the rebound fallen, so that the side of the cavity is in communication with the outside to be formed
Groove.
2. preparation method as claimed in claim 1, it is characterised in that also have following steps after step 5：To first core
Plate and/or the second core plate carry out drilling processing, and to form via, the via is turned on the groove.
3. preparation method as claimed in claim 1, it is characterised in that first core plate includes the one one insulating barrier and is located at
The one one insulating barrier upper surface and the one one copper foil layer of lower surface；3rd core plate includes the 3rd 1 insulating barrier and position
In the 3rd 1 insulating barrier upper surface and the 3rd 1 copper foil layer of lower surface.
4. there is the preparation method of the circuit board of lateral grooves, it is characterised in that comprise the following steps：
Step 1, by being punched turn on window or gong plate turn on window by the first illiquidity prepreg, the second core plate and second
Illiquidity prepreg is opened a window respectively；
Step 2, by windowing after the first illiquidity prepreg, the second core plate and the second illiquidity prepreg by up to
Under be built up cavity plate successively, wherein, the first illiquidity prepreg, the second core plate and the second illiquidity prepreg
Windowing position be both turned on forming one through the first illiquidity prepreg, the second core plate and the second illiquidity semi-solid preparation
The cavity of piece；
Step 3, by the first copper foil layer, the first release film layer, the first aluminium flake layer, the first core plate, cavity plate, the 3rd core plate, second
Aluminium flake, the second mould release membrance and the second copper foil layer are from top to bottom overlapped and carry out lamination treatment successively；First core plate includes the
Insulating barrier and positioned at the one one insulating barrier upper surface and the one one copper foil layer of lower surface one by one；3rd core plate includes
3rd 1 insulating barrier and positioned at the 3rd 1 insulating barrier upper surface and the 3rd 1 copper foil layer of lower surface；
Step 4, by first copper foil layer, the first release film layer, the first aluminium flake layer, the second aluminium flake, the second mould release membrance and second
Copper foil layer takes down, to obtain rebound；
Step 5, drilling treatment is carried out to first core plate and/or the second core plate, to form via, the via and institute
State cavity conducting, and pod apertures through the rebound, the pod apertures and the sky are made in the garbage area of rebound
Chamber is turned on；
When step 6, plating, copper facing liquid medicine is injected into the via, so that positioned at the 1st of the one one insulating barrier lower surface the
Copper foil layer and the 3rd 1 copper foil layer positioned at the 3rd 1 insulating barrier upper surface are respectively formed copper plated area, to form electroplate；
Step 7, the side wall gong of the cavity positioned at garbage area of the electroplate is fallen so that the side of the cavity with it is extraneous
Connection is so as to form groove.
5. the preparation method as described in claim 1 or 4, it is characterised in that second core plate include the 2nd 1 insulating barrier and
Positioned at the 2nd 1 insulating barrier upper surface and the 2nd 1 copper foil layer of lower surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410437206.0A CN104202904B (en) | 2014-08-29 | 2014-08-29 | The pressing structure of the circuit board with lateral grooves and the preparation method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410437206.0A CN104202904B (en) | 2014-08-29 | 2014-08-29 | The pressing structure of the circuit board with lateral grooves and the preparation method of circuit board |
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| CN104202904A CN104202904A (en) | 2014-12-10 |
| CN104202904B true CN104202904B (en) | 2017-07-11 |
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| CN109257873B (en) * | 2018-11-13 | 2021-04-16 | 珠海景旺柔性电路有限公司 | Forming process of wireless charging circuit board and wireless charging circuit board |
| CN114080099B (en) * | 2020-08-19 | 2024-04-02 | 鹏鼎控股(深圳)股份有限公司 | Board-to-board connection structure and preparation method thereof |
| CN113543530B (en) * | 2021-06-02 | 2023-01-03 | 深圳市强达电路股份有限公司 | Manufacturing method of PCB with concave steps on side surfaces |
| CN116614939B (en) * | 2023-07-21 | 2023-10-20 | 淄博芯材集成电路有限责任公司 | Anti-seepage liquid medicine structure for outer frame of core plate of printed circuit board and design method thereof |
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| EP1280392A1 (en) * | 2001-07-26 | 2003-01-29 | Siemens Information and Communication Networks S.p.A. | Printed circuit board and relevant manufacturing method for the installation of microwave chips up to 80 Ghz |
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| CN103477723A (en) * | 2011-04-19 | 2013-12-25 | 日本特殊陶业株式会社 | Ceramic wiring board, multi-pattern ceramic wiring board, and method for producing same |
| CN204180378U (en) * | 2014-08-29 | 2015-02-25 | 广州美维电子有限公司 | There is the pressing structure of the circuit board of lateral grooves |
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| US8735739B2 (en) * | 2011-01-13 | 2014-05-27 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
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| CN1204227A (en) * | 1997-05-12 | 1999-01-06 | 阿尔卑斯电气株式会社 | Printed circuit board |
| EP1280392A1 (en) * | 2001-07-26 | 2003-01-29 | Siemens Information and Communication Networks S.p.A. | Printed circuit board and relevant manufacturing method for the installation of microwave chips up to 80 Ghz |
| CN101699937A (en) * | 2009-11-04 | 2010-04-28 | 上海美维电子有限公司 | Method for producing stepped PCB board |
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| Publication number | Publication date |
|---|---|
| CN104202904A (en) | 2014-12-10 |
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