CN109257873B - Forming process of wireless charging circuit board and wireless charging circuit board - Google Patents
Forming process of wireless charging circuit board and wireless charging circuit board Download PDFInfo
- Publication number
- CN109257873B CN109257873B CN201811346679.4A CN201811346679A CN109257873B CN 109257873 B CN109257873 B CN 109257873B CN 201811346679 A CN201811346679 A CN 201811346679A CN 109257873 B CN109257873 B CN 109257873B
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- CN
- China
- Prior art keywords
- circuit board
- wireless charging
- charging circuit
- charging coil
- cover film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention belongs to the technical field of circuit boards, and discloses a wireless charging circuit board and a forming process thereof. The forming process of the wireless charging circuit board comprises the following steps: forming a charging coil on a substrate; safety glue is adhered to the two extending parts of the charging coil; laying a covering film on the charging coil; the substrate and the cover film that are equipped with the charging coil are pressed on to the clamp for safe gluey shutoff cavity between two protrusions. The wireless charging circuit board is prepared by the forming process of the wireless charging circuit board. According to the invention, the safety glue is arranged to reliably seal the cavity between the two extending parts, so that liquid medicine can be effectively prevented from entering the circuit part from the space between the two extending parts during electroplating, and the safety glue is arranged on the extending parts, so that the thickness of the circuit part is not additionally increased, the magnetic induction intensity of the circuit part during power-on can be ensured, and the charging effect of the wireless charging circuit board is not influenced.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a wireless charging circuit board and a forming process thereof.
Background
Along with the use of electronic products such as smart mobile phones is more and more popular, lead to the battery to consume too fast, need frequent use charging wire to charge to the electronic product plug, influence user's use and experience. Put the wireless charging technology that fills promptly and need not frequent plug charging wire because of its convenience, is an effective technological means who solves this problem.
In the existing wireless charging device, the wireless charging circuit board generally includes a cover film, a base material, and a charging coil sandwiched between the cover film and the base material. Wherein, charging coil is including being the circuit portion that the annular coiled and connecting respectively in two protrusions of circuit portion, and circuit portion links to each other with external circuit through two protrusions. When the wireless charging circuit board is formed, the charging coil is formed on the base material, then the covering film with the adhesive is laid on the charging coil for pressing, and after the pressing, the whole body is subjected to electroplating treatment. Because the end of two juts need be connected with external circuit, consequently set up the window on covering the membrane for after the pressfitting is accomplished, the end of two juts can expose. Because the viscose layer on the cover film is thinner for after the pressfitting, form the cavity between two extension portions, thereby make when electroplating process, the liquid medicine of electroplating gets into the circuit portion of charging coil along this cavity, finally influences wireless charging circuit board shaping quality.
Disclosure of Invention
The invention aims to provide a forming process of a wireless charging circuit board and the wireless charging circuit board, which can effectively prevent liquid medicine from entering a circuit part between two extending parts during electroplating.
In order to achieve the purpose, the invention adopts the following technical scheme:
a molding process of a wireless charging circuit board comprises the following steps:
forming a charging coil on a substrate;
safety glue is adhered to the two extending parts of the charging coil;
laying a covering film on the charging coil;
the substrate and the cover film that are equipped with the charging coil are pressed on to the clamp for safe gluey shutoff cavity between two protrusions.
Preferably, the safety glue is positioned on one side of the window of the covering film close to the circuit part of the charging coil.
Preferably, the security adhesive is arranged against the window of the cover film.
Preferably, after the pressing, the adhesive layer on the inner side of the cover film is bonded with the safety adhesive.
Preferably, after the pressing is completed, the adjacent two coils in the line part of the charging coil are arranged in a hollow mode.
Preferably, the cover film is a polyimide film.
Preferably, after the pressing, the base material and the cover film with the charging coil sandwiched therebetween are subjected to electroplating.
A wireless charging circuit board is prepared by the forming process of the wireless charging circuit board.
The invention has the beneficial effects that:
set up the safety glue and carry out the shutoff reliably to the cavity between two extensions, can effectively avoid liquid medicine to get into circuit portion between two extensions when electroplating to because the safety glue sets up on the extension, do not additionally increase the thickness of circuit portion, thereby can guarantee the magnetic induction intensity when circuit portion circular telegram, do not influence wireless charging circuit board charging effect.
Drawings
Fig. 1 is a schematic structural diagram of a wireless charging circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of the wireless charging circuit board according to the embodiment of the present invention, in which a cover film is omitted;
fig. 3 is a schematic cross-sectional view of the safety glue of fig. 1 in place.
In the figure:
1. a substrate;
2. a charging coil; 21. a protruding portion; 22. a circuit section;
3. covering the film; 31. a window; 32. an adhesive layer;
100. and (4) safety glue.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
As shown in fig. 1 to 3, the present invention provides a molding process of a wireless charging circuit board, comprising the following steps:
step one, forming a charging coil 2 on a substrate 1.
And step two, adhering safety glue 100 on two extending parts 21 of the charging coil 2.
And step three, laying a covering film 3 on the charging coil 2.
And step four, laminating the substrate 1 and the cover film 3 which are provided with the charging coils 2 in a clamping manner, so that the safety glue 100 blocks the cavity between the two extending parts 21.
And fifthly, electroplating the substrate 1 and the cover film 3 which are provided with the charging coil 2.
In the invention, the safety glue 100 is arranged to reliably seal the cavity between the two extending parts 21, so that liquid medicine can be effectively prevented from entering the circuit part 22 from the space between the two extending parts 21 during electroplating, and the safety glue 100 is arranged on the extending parts 21, so that the thickness of the circuit part 22 is not additionally increased, the magnetic induction intensity of the circuit part 22 during electrification can be ensured, and the charging effect of the wireless charging circuit board is not influenced.
In the present exemplary embodiment, the security adhesive 100 is located on the side of the window 31 of the cover film 3 which is adjacent to the line portion 22 of the charging coil 2, in particular, the security adhesive 100 is arranged adjacent to the window 31 of the cover film 3 (as shown in dashed lines in fig. 1). Above-mentioned setting, on the basis of guaranteeing to reliably shutoff the cavity between two extensions 21, further reduced the influence of safety glue 100 to charging coil 2.
Specifically, after the pressing, the adhesive layer 32 on the inner side of the cover film 3 is bonded to the security adhesive 100. With the arrangement, after the pressing process, the safety adhesive 100 bonded with the base material 1 is bonded with the cover film 3 through the adhesive layer 32, so that the cavity between the two extending parts 21 is more reliably sealed.
More specifically, after the caulking is completed, the adjacent two coils in the wire part 22 of the charging coil 2 are arranged with a space therebetween.
In the embodiment, the cover film 3 is a polyimide film, has outstanding high temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation performance, and can meet the process requirements of pressing and electroplating.
The invention also provides a wireless charging circuit board which is prepared by the forming process of the wireless charging circuit board.
In the wireless charging circuit board, the safety glue 100 is arranged to reliably seal the cavity between the two extending parts 21, so that liquid medicine can be effectively prevented from entering the circuit part 22 from the space between the two extending parts 21 during electroplating, and the safety glue 100 is arranged on the extending parts 21, so that the thickness of the circuit part 22 is not additionally increased, the magnetic induction strength of the circuit part 22 during electrifying can be ensured, and the charging effect of the wireless charging circuit board is not influenced.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (7)
1. A molding process of a wireless charging circuit board is characterized by comprising the following steps:
forming a charging coil (2) on a substrate (1);
a safety glue (100) is adhered to the two extending parts (21) of the charging coil (2);
a covering film (3) is laid on the charging coil (2);
pressing the base material (1) and the cover film (3) which are provided with the charging coils (2) in a clamped mode, so that the safety glue (100) blocks a cavity between the two extending portions (21);
the safety glue (100) is positioned on one side, close to the circuit part (22) of the charging coil (2), of the window (31) of the covering film (3).
2. The molding process of the wireless charging circuit board according to claim 1, wherein the safety glue (100) is disposed against the window (31) of the cover film (3).
3. The molding process of the wireless charging circuit board according to claim 1, wherein the adhesive layer (32) on the inner side of the cover film (3) is adhered to the safety adhesive (100) after the pressing process is completed.
4. The molding process of the wireless charging circuit board according to claim 1, wherein after the pressing is completed, two adjacent coils in the circuit part (22) of the charging coil (2) are arranged in a hollow manner.
5. The molding process of the wireless charging circuit board according to claim 1, wherein the cover film (3) is a polyimide film.
6. The molding process of the wireless charging circuit board according to any one of claims 1 to 5, wherein after the pressing, the substrate (1) and the cover film (3) sandwiching the charging coil (2) are subjected to electroplating.
7. A wireless charging circuit board, which is prepared by the molding process of the wireless charging circuit board as claimed in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811346679.4A CN109257873B (en) | 2018-11-13 | 2018-11-13 | Forming process of wireless charging circuit board and wireless charging circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811346679.4A CN109257873B (en) | 2018-11-13 | 2018-11-13 | Forming process of wireless charging circuit board and wireless charging circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109257873A CN109257873A (en) | 2019-01-22 |
| CN109257873B true CN109257873B (en) | 2021-04-16 |
Family
ID=65043638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811346679.4A Active CN109257873B (en) | 2018-11-13 | 2018-11-13 | Forming process of wireless charging circuit board and wireless charging circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109257873B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3686599A (en) * | 1970-04-08 | 1972-08-22 | Magnetics Inc | Magnetic core with electrical insulation |
| CN1317761C (en) * | 2003-06-18 | 2007-05-23 | 财团法人工业技术研究院 | Flip chip packaging joint structure and method for manufacturing same |
| AU2008251143B2 (en) * | 2007-05-10 | 2011-12-22 | Auckland Uniservices Limited | Multi power sourced electric vehicle |
| CN103746181B (en) * | 2013-12-31 | 2017-06-13 | 瑞声科技(沭阳)有限公司 | NFC antenna and preparation method thereof |
| CN104202904B (en) * | 2014-08-29 | 2017-07-11 | 广州美维电子有限公司 | The pressing structure of the circuit board with lateral grooves and the preparation method of circuit board |
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2018
- 2018-11-13 CN CN201811346679.4A patent/CN109257873B/en active Active
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| Publication number | Publication date |
|---|---|
| CN109257873A (en) | 2019-01-22 |
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 519170 No. 1 Fushan Second Road, Fushan Industrial Park, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province Applicant after: Zhuhai Jingwang Flexible Circuit Co., Ltd. Address before: 519180 No.3 Workshop of Xinqing Science and Technology Industrial Park, Doumen District, Zhuhai City, Guangdong Province Applicant before: Zhuhai All-Winner FPC Co.,Ltd. |
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| GR01 | Patent grant |