CN204180378U - There is the pressing structure of the circuit board of lateral grooves - Google Patents
There is the pressing structure of the circuit board of lateral grooves Download PDFInfo
- Publication number
- CN204180378U CN204180378U CN201420497590.9U CN201420497590U CN204180378U CN 204180378 U CN204180378 U CN 204180378U CN 201420497590 U CN201420497590 U CN 201420497590U CN 204180378 U CN204180378 U CN 204180378U
- Authority
- CN
- China
- Prior art keywords
- central layer
- circuit board
- layer
- copper foil
- pressing structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003825 pressing Methods 0.000 title claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000011889 copper foil Substances 0.000 claims abstract description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000004891 communication Methods 0.000 claims abstract description 5
- 230000004888 barrier function Effects 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 4
- 239000000945 filler Substances 0.000 abstract description 4
- 229910000831 Steel Inorganic materials 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract description 2
- 239000010959 steel Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 239000003814 drug Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to the pressing structure of the circuit board with lateral grooves.The pressing structure of this circuit board comprises the first copper foil layer of pressing from top to bottom, the first centrifugal rete, the first aluminium flake layer, the first central layer, a NF PP (illiquidity prepreg), the second central layer, the 2nd NF PP, the 3rd central layer, the second aluminium flake, the second centrifugal film and the second copper foil layer; Also be formed with at least one groove running through a NF PP, the second central layer and the 2nd NFPP in the pressing structure of described circuit board, and the side of described groove is in communication with the outside.The utility model uses the composite bed of Copper Foil+centrifugal film+aluminium flake, both ensure that material stiffness, steel plate can be replaced to solve concave defect under large cavity, there is again the comfort cushioning performance of the material such as pressing pad or pressing pad+accessory plate, when cavity plate connects up, NF PP can be made to be combined well with circuit, to avoid the defects such as filler is not enough.
Description
Technical field
The utility model relates to circuit board technology field.
Background technology
Electronic manufacturing industry, in space availability ratio, has had multi-direction development: light, the thinning of material, wiring density centralization, becomes more meticulous, the microminiaturization of via, densification, and assembling mode variation.In assembling mode variation, extraordinary PCB and extraordinary components and parts with motherboard PCB carry out assembling splice time, in order to reduce to take up room, be no longer satisfied with traditional welding, attachment process, and change into make certain functional modules on PCB motherboard, embed or partly embed motherboard.Such as: bury components and parts, bury copper billet, bury daughter board design, buried capacitor, resistive arrangement, stepped plate designs, cavity plate design, and the design of lateral grooves (cavity) plate etc.
Lateral grooves plate technique, it is the groove that a kind of side at electroplate makes one or more recessed circuit board inside, by the combination with other functional module such as via, non-conduction hole, for inserting, the various ways such as welding assembles the technique of other electronic devices and components.
Lateral grooves plate has the practical difficulties of the following aspects.
1. lateral grooves how problem of implementation.Groove is distributed in the side of plank but not the top face of plank or bottom face, in modes such as brill traditional at present, milling or laser ablations, cannot realize on so thin finished circuit board;
2. lateral grooves three-dimensional shape, the especially Preserving problems of groove height.The how good three-dimensional shape of retaining groove, preventing groove recessed is the problem needing to solve, and routine in groove, use filler, then exist gong go out groove after the problem that cannot take out of filler;
3. groove how copper facing problem.In the positive up/down side of groove, Customer design electroplating hole is communicated in groove, and requires intercommunicating pore and groove inner wall copper facing.If conveniently flow scheme design is produced, there is the risk of the built-in liquid medicine of groove, thus cause groove plating leakage during plating, face, intercommunicating pore junction copper, hole copper are stung erosion by liquid medicine and cause the problems such as the thick deficiency of copper.
Utility model content
The purpose of this utility model is to propose a kind of pressing structure with the circuit board of lateral grooves, and it can solve recessed problem.
In order to achieve the above object, the technical scheme that adopts of the utility model is as follows:
Have a pressing structure for the circuit board of lateral grooves, it comprises the first copper foil layer of pressing from top to bottom, the first centrifugal rete, the first aluminium flake layer, the first central layer, a NF PP, the second central layer, the 2nd NF PP, the 3rd central layer, the second aluminium flake, the second centrifugal film and the second copper foil layer; Also be formed with at least one groove running through a NF PP, the second central layer and the 2nd NF PP in the pressing structure of described circuit board, and the side of described groove is in communication with the outside.
Preferably, described first central layer and/or the second central layer are provided with via, described via and described groove conducting.Or the first central layer and the second central layer all do not have via.
Preferably, described first central layer comprises the one one insulating barrier and is positioned at the one one copper foil layer of described one one insulating barrier upper surface and lower surface; Described 3rd central layer comprises the 31 insulating barrier and is positioned at the 31 copper foil layer of described 31 insulating barrier upper surface and lower surface.
Preferred further, the one one copper foil layer being positioned at the one one insulating barrier lower surface and the 31 copper foil layer being positioned at the 31 insulating barrier upper surface are all formed with copper plated area.
Preferably, described second central layer comprises the 21 insulating barrier and is positioned at the 21 copper foil layer of described 21 insulating barrier upper surface and lower surface.
The utility model has following beneficial effect:
Use the composite bed of Copper Foil+centrifugal film+aluminium flake, both ensure that material stiffness, steel plate can be replaced to solve concave defect under large cavity, there is again the comfort cushioning performance of the material such as pressing pad or pressing pad+accessory plate, when cavity plate connects up, NF PP (no flow prepreg, illiquidity prepreg) can be made to be combined well with circuit, to avoid the defects such as filler is not enough.
Accompanying drawing explanation
Fig. 1 is the structural representation with the pressing structure of the circuit board of lateral grooves of the utility model preferred embodiment.
Embodiment
Below, by reference to the accompanying drawings and embodiment, the utility model is described further.
As shown in Figure 1, have a pressing structure for the circuit board of lateral grooves, it comprises centrifugal rete 13, first aluminium flake layer 14, first central layer of the first copper foil layer 17, first, NF PP 4, second central layer, the 2nd NF PP 8, the 3rd central layer, second aluminium flake 15, second centrifugal film 16 and second copper foil layer 18 of pressing from top to bottom.Also be formed with the groove 12 that runs through NF PP 4, second central layer and the 2nd NF PP 8 in the pressing structure of described circuit board, and the side of described groove 12 is in communication with the outside.
Described first central layer is provided with via 19, described via 19 and the conducting of described groove 12.Described first central layer comprises the one one insulating barrier 2 and is positioned at the one one copper foil layer 1,3 of described one one insulating barrier 2 upper surface and lower surface; Described 3rd central layer comprises the 31 insulating barrier 10 and is positioned at the 31 copper foil layer 9,11 of described 31 insulating barrier 10 upper surface and lower surface.Described second central layer comprises the 21 insulating barrier 6 and is positioned at the 21 copper foil layer 5,7 of described 21 insulating barrier 6 upper surface and lower surface.
Shown in Fig. 1, the manufacture method with the circuit board of lateral grooves of the present embodiment is as follows:
Step 1, by die-cut turn on window or gong plate turn on window, the one NF PP 4, second central layer and the 2nd NF PP 8 to be windowed respectively;
Step 2, NF PP 4, second central layer after windowing and the 2nd NF PP 8 are built up cavity plate from top to bottom successively, wherein, the equal conducting in position of windowing of NF PP 4, second central layer and the 2nd NF PP 8 is to form the cavity that runs through NF PP 4, second central layer and the 2nd NF PP 8;
Step 3, by superimposed successively from top to bottom to centrifugal rete 13, first aluminium flake layer 14, first central layer of the first copper foil layer 17, first, cavity plate, the 3rd central layer, the second centrifugal film 16 of aluminium flake 15, second and the second copper foil layer 18 and carry out lamination treatment;
Step 4, described first copper foil layer 17, the first centrifugal film 16 of centrifugal rete 13, first aluminium flake layer 14, second aluminium flake 15, second and the second copper foil layer 18 to be taken down, to obtain rebound;
One sidewall gong of the cavity of described rebound falls by step 5, employing gong plate turn on window, is in communication with the outside to make a described sidewall of described cavity thus forms groove 12.
Step 6, described first central layer carried out to boring process, to form via 19, described via 19 and the conducting of described groove 12.
Then the circuit board of step 6 gained is normally produced the finishing operations of pcb board, the circuit board of final utilization can be obtained.
It should be noted that, NF PP is the prepreg of illiquidity, and the mobility of the prepreg of illiquidity is than the poor fluidity of common prepreg.
In above-described embodiment, the first central layer and the second central layer do not arrange via, or the first central layer or the second central layer wherein one via is set, or the first central layer and the second central layer all arrange via.
In above-described embodiment, the quantity of groove also can be multiple.
For a person skilled in the art, according to technical scheme described above and design, other various corresponding change and distortion can be made, and all these change and distortion all should belong within the protection range of the utility model claim.
Claims (5)
1. there is the pressing structure of the circuit board of lateral grooves, it is characterized in that, comprise the first copper foil layer of pressing from top to bottom, the first centrifugal rete, the first aluminium flake layer, the first central layer, a NF PP, the second central layer, the 2nd NF PP, the 3rd central layer, the second aluminium flake, the second centrifugal film and the second copper foil layer; Also be formed with at least one groove running through a NF PP, the second central layer and the 2nd NF PP in the pressing structure of described circuit board, and the side of described groove is in communication with the outside.
2. the pressing structure of circuit board as claimed in claim 1, it is characterized in that, described first central layer and/or the second central layer are provided with via, described via and described groove conducting.
3. the pressing structure of circuit board as claimed in claim 1, is characterized in that, described first central layer comprises the one one insulating barrier and is positioned at the one one copper foil layer of described one one insulating barrier upper surface and lower surface; Described 3rd central layer comprises the 31 insulating barrier and is positioned at the 31 copper foil layer of described 31 insulating barrier upper surface and lower surface.
4. the pressing structure of circuit board as claimed in claim 3, it is characterized in that, the one one copper foil layer being positioned at the one one insulating barrier lower surface and the 31 copper foil layer being positioned at the 31 insulating barrier upper surface are all formed with copper plated area.
5. the pressing structure of circuit board as claimed in claim 1, is characterized in that, described second central layer comprises the 21 insulating barrier and is positioned at the 21 copper foil layer of described 21 insulating barrier upper surface and lower surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420497590.9U CN204180378U (en) | 2014-08-29 | 2014-08-29 | There is the pressing structure of the circuit board of lateral grooves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420497590.9U CN204180378U (en) | 2014-08-29 | 2014-08-29 | There is the pressing structure of the circuit board of lateral grooves |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204180378U true CN204180378U (en) | 2015-02-25 |
Family
ID=52569149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420497590.9U Expired - Lifetime CN204180378U (en) | 2014-08-29 | 2014-08-29 | There is the pressing structure of the circuit board of lateral grooves |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204180378U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104202904A (en) * | 2014-08-29 | 2014-12-10 | 广州美维电子有限公司 | Press fit structure of circuit board with side surface groove and manufacturing method of circuit board |
-
2014
- 2014-08-29 CN CN201420497590.9U patent/CN204180378U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104202904A (en) * | 2014-08-29 | 2014-12-10 | 广州美维电子有限公司 | Press fit structure of circuit board with side surface groove and manufacturing method of circuit board |
| CN104202904B (en) * | 2014-08-29 | 2017-07-11 | 广州美维电子有限公司 | The pressing structure of the circuit board with lateral grooves and the preparation method of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150225 |