CN103402333A - Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof - Google Patents
Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof Download PDFInfo
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- CN103402333A CN103402333A CN2013103181470A CN201310318147A CN103402333A CN 103402333 A CN103402333 A CN 103402333A CN 2013103181470 A CN2013103181470 A CN 2013103181470A CN 201310318147 A CN201310318147 A CN 201310318147A CN 103402333 A CN103402333 A CN 103402333A
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Abstract
The invention provides a printed circuit board (PCB) with a high-density interconnection design (HDI) and a heat radiation structure, and a manufacturing method of the PCB. The manufacturing method comprises the steps of step 1, providing a core board, a prepreg, a copper foil and heat conduction material, making a conducting connection area on the surface of the core board, and respectively punching a through hole in the core board, the prepreg and the copper foil; step 2, overlapping the core board, the prepreg and the copper foil in sequence by a way of pin alignment, then enabling the through holes in the core board, the prepreg and the copper foil to be correspondingly laminated to form a communicating hole, and putting the heat conduction material into the communicating hole; step 3, pressing the copper foil, the prepreg and the core board together by high temperature and high pressure to prepare a press plate; step 4, carrying out aftertreatment on the press plate, preparing an outer layer blind hole and a circuit figure, and enabling the outer layer blind hole to extend to the conducting connection area. The high-density interconnection PCB is manufactured by the method of embedding the heat conduction material by one-time pressing; the method is simple in technology; efficient heat dissipation and high-density interconnection design can be realized.
Description
Technical field
The present invention relates to the manufacture method of circuit board, particularly a kind of manufacture method that possesses the pcb board of high density interconnect designs and radiator structure.
Background technology
Along with the raising of the rate of information throughput and the increase of information conveying capacity, the electronic product volume is more and more less, and the distribution density of integrated unit is increasing, promotes the future development of PCB to high density, high integrated, miniaturization and multiple stratification.How making the PCB of composite high-density interconnection (HDI) design and radiator structure, is the difficult problem of current PCB manufacturing.
For the PCB that comprises high density interconnect (HDI) design, existing advanced Cooling Solution is to adopt and imbed Heat Conduction Material design (CN101790290A) in the PCB position of need dispelling the heat, but the iterative structure that it requires to adopt central layer+prepreg+central layer, can't be applied to comprise on the pcb board of outer blind hole design; Existing realize that the method for high density interconnect generally need to make at twice: at first make daughter board, outer making of daughter board, connect district and be used for outer blind hole and be connected connection with internal layer circuit; Then pressing for the second time,, connecting copper foil surface making blind hole corresponding to district, realize the outer connection of being connected with internal layer circuit.The conventional manufacture method of this kind is through repeatedly pressing, and manufacturing cost is high, and technique is comparatively complicated, and because pressing repeatedly causes pcb board interlayer alignment difficulty, rate of finished products low.
Summary of the invention
In view of the above, the present invention be necessary to provide that a kind of manufacture craft is simple, the manufacture method of good heat resistance, the pcb board that possesses high density interconnect designs and radiator structure that rate of finished products is high.
A kind of manufacture method that possesses the pcb board of high density interconnect designs and radiator structure comprises the following steps:
Step 1: central layer, prepreg, Copper Foil and Heat Conduction Material are provided, on the central layer surface, are manufactured with and connect district, and central layer, prepreg and Copper Foil are opened hole;
Step 2: adopt the pin alignment mode, central layer, prepreg, Copper Foil are superimposed together according to the order of sequence, make Copper Foil be in skin, prepreg connects central layer and Copper Foil, and the corresponding stacked formation intercommunicating pore of the through hole on superimposed rear central layer, prepreg and Copper Foil, insert Heat Conduction Material in described intercommunicating pore;
Step 3: the HTHP pressing presses together Copper Foil, prepreg and central layer, makes force fit plate;
Step 4: force fit plate is carried out reprocessing produce outer blind hole and line pattern, outer blind hole extends to the district that connects on described central layer surface.
In step 1, central layer is one or more as required.The described district that connects is arranged on predeterminated position, can form by etching, connects district corresponding with the bottom position of outer blind hole on the pcb board that is made into.Connect district's size than the large 0.10mm-0.20mm of blind hole size, connect district and directly tie or indirect joint with line pattern and outer plated-through-hole in PCB.
In step 2, the edge of central layer, prepreg, Copper Foil can offer tooling hole, for pin, passes.Before superimposed, can further comprise the step of central layer and Heat Conduction Material being done surface oxidation treatment,, with the grease of removing central layer and Heat Conduction Material surface, dust etc., strengthen the adhesion on central layer surface.Copper Foil is superimposed on surface or two surfaces of central layer, and by prepreg, connects.Central layer can be multiple, is provided with prepreg between adjacent two central layers.Described Heat Conduction Material can be selected copper billet.The thickness of the pcb board that the length correspondence of Heat Conduction Material is made.After pressing, the end face of Heat Conduction Material is concordant with the outer surface of pcb board.
In step 4, to the reprocessing of the force fit plate made comprise to force fit plate carry out nog plate, laser ablation is removed its surperficial cull; And to its hole, copper facing, consent, plating and make outer graphics.By the connect district of drilling blind hole to outside central layer, copper facing on its hole wall, fill up resin in hole, and the appearance plating, makes pcb board outer graphics, the central layer of adjacent lateral side and top layer circuit turn-on on top layer.When making outer blind hole, get through Copper Foil by first machinery boring, form the blind hole mouth, then the dielectric layer that forms after solidifying by the laser ablation prepreg is to the described district that connects, form described outer blind hole, by mechanical milling surface Copper Foil, laser ablation is to connecting further ablation downwards while distinguishing, so, can realize control to the blind hole hole depth.
So, make the pcb board that possesses high density interconnect designs and radiator structure.
In addition, the pcb board that provides a kind of described method to make is provided in the present invention.
A kind of pcb board that possesses high density interconnect designs and radiator structure, comprise central layer, prepreg, Copper Foil and Heat Conduction Material, offer through hole on described central layer, prepreg and Copper Foil, described central layer, prepreg and Copper Foil are stacked, Copper Foil is positioned at outermost layer, prepreg is connected between central layer and central layer and between central layer and Copper Foil, lead to the hole site correspondence on described central layer, prepreg and Copper Foil is built up intercommunicating pore, described Heat Conduction Material is arranged in intercommunicating pore, copper layer and the outer copper foil on conducting central layer surface.
Compared to prior art, the present invention is by offering through hole at central layer, prepreg and Copper Foil, then central layer, prepreg, Copper Foil is stacked, and insert Heat Conduction Material in intercommunicating pore, one step press is made required pcb board, and first make and connect district before the central layer pressing, be convenient to the making of outer blind hole by laser, technique is simple; The outer field Copper Foil of pcb board is by Heat Conduction Material conducting, good heat dissipation effect.
Description of drawings
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to be illustrated more clearly in technical scheme of the present invention, below will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described, accompanying drawing in description is only corresponding to specific embodiments of the invention, to those skilled in the art, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing in needs.
Fig. 1 is the schematic cross-section that the present invention possesses the pcb board of high density interconnect designs and radiator structure;
Fig. 2 is the schematic flow sheet that the present invention prepares the pcb board that possesses high density interconnect designs and radiator structure.
Embodiment
Reach the predetermined technique purpose and the technical scheme taked in order to elaborate the present invention, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only part embodiment of the present invention, rather than whole embodiment, and, under the prerequisite of not paying creative work, technological means in embodiments of the invention or technical characterictic can be replaced, and describe below with reference to the accompanying drawings and in conjunction with the embodiments the present invention in detail.
See also Fig. 1, the pcb board that possesses high density interconnect designs and radiator structure 100 shown in preferred embodiment of the present invention, comprise central layer 10, prepreg 20 and Copper Foil 30.Described central layer 10 is several, and central layer 10, prepreg 20 and Copper Foil 30 are superimposed, and Copper Foil 30 is positioned at skin, and prepreg 20 is arranged in twos 30 of 10 of central layers or central layer 10 and Copper Foils.In the present embodiment, Copper Foil 30 is two, is positioned at the extexine up and down of pcb board 100, and central layer 10 is three, and central layer 10 is between two Copper Foils 30, and 10 of central layers are provided with prepreg 20 in twos, perhaps are connected with prepreg 20 between central layer 10 and Copper Foil 30.Also be formed with thermal hole 101 on described pcb board 100.Be provided with Heat Conduction Material 40 in thermal hole 101.In the present embodiment, Heat Conduction Material 40 is chosen as copper billet, and the end face of copper billet is concordant with the both side surface of pcb board 100, and described daughter board 10, prepreg 20 and Copper Foil 30 are superimposed together by the pin (not shown).Offer outer blind hole 102 on the outer surface up and down of pcb board 100, the bottom of outer blind hole 102 extends to the surface with the central layer 10 of adjacent lateral side, with the corresponding district 103 that connects that arranges on the surface of described adjacent lateral side central layer 10, connects.Pcb board 100 also offers pilot hole 104, connects two surfaces of pcb board 100, is used for assembling, electrically conducts or thermolysis, can form coating on pilot hole 104 inwalls and through hole can be filled.
Please in conjunction with consulting Fig. 2, the manufacturing process of the above-mentioned pcb board 100 that possesses high density interconnect designs and radiator structure is as follows:
Step 1: central layer 10, prepreg 20, Copper Foil 30 and Heat Conduction Material 40 are provided, central layer 10, prepreg 20 and Copper Foil 30 are opened hole; And wherein two central layers 10 are chosen to be outer central layer, on outer central layer surface, make and connect district 103.Then central layer 10 is done surface oxidation treatment.Described Heat Conduction Material 40 adopts copper billet.
Step 2: adopt the pin alignment mode, central layer 10, prepreg 20, Copper Foil 30 are superimposed together according to the order of sequence, make Copper Foil 30 be in skin, prepreg 20 connects central layer 10 and Copper Foil 30, and two skins are respectively adjacent to upper lower outside outer the setting, make and have the plate that connects district 103 side facing to connection copper foil 30 adjacent thereto.The corresponding stacked formation intercommunicating pore (corresponding above-mentioned thermal hole 101) of through hole on superimposed rear central layer 10, prepreg 20 and Copper Foil 30, insert Heat Conduction Material 40 in described intercommunicating pore;
Step 3: the HTHP pressing presses together Copper Foil 30, prepreg 20 and central layer 10, makes force fit plate;
Step 4: force fit plate is carried out reprocessing produce outer blind hole 102 and line pattern, outer blind hole 102 extends to described connecting and distinguishes 103, thereby makes the described pcb board that possesses high density interconnect designs and radiator structure.
To force fit plate carry out reprocessing comprise to force fit plate carry out nog plate, laser ablation is removed its surperficial cull; And it is carried out machine drilling and the laser drill district that connects to outside central layer, copper facing on the hole wall of blind hole, fill up resin with blind hole, and appearance electroplates, and makes pcb board outer graphics, the central layer of adjacent lateral side and top layer circuit turn-on on top layer.
To sum up, the present invention possesses the pcb board 100 of high density interconnect designs and radiator structure by at central layer, prepreg and Copper Foil, offering through hole, then central layer, prepreg, Copper Foil is stacked, and insert Heat Conduction Material in intercommunicating pore, one step press is made required pcb board, and make in advance before the central layer pressing than blind hole diameter slightly large connect district, be convenient to outer blind hole and add the man-hour blind hole and aim at connecting district, blind hole can be passed through CO
2The mode of laser pulse is made, and technique is simple; The outer field Copper Foil of pcb board is by Heat Conduction Material conducting, good heat dissipation effect.
the above, it is only preferred embodiment of the present invention, not the present invention is done any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet not in order to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention, within the spirit and principles in the present invention, the any simple modification that above embodiment is done, be equal to replacement and improvement etc., within all still belonging to the protection range of technical solution of the present invention.
Claims (10)
1. manufacture method that possesses the pcb board of high density interconnect designs and radiator structure, its manufacture method is as follows:
Step 1: central layer, prepreg, Copper Foil and Heat Conduction Material are provided, on the central layer surface, are manufactured with and connect district, and central layer, prepreg and Copper Foil are opened hole;
Step 2: adopt the pin alignment mode, central layer, prepreg, Copper Foil are superimposed together according to the order of sequence, make Copper Foil be in skin, prepreg connects central layer and Copper Foil, and the corresponding stacked formation intercommunicating pore of the through hole on superimposed rear central layer, prepreg and Copper Foil, insert Heat Conduction Material in described intercommunicating pore;
Step 3: the HTHP pressing presses together Copper Foil, prepreg and central layer, makes force fit plate;
Step 4: force fit plate is carried out reprocessing produce outer blind hole and line pattern, outer blind hole extends to the described district that connects.
2. the manufacture method of pcb board according to claim 1 is characterized in that: in step 1, described Heat Conduction Material is selected copper billet.
3. the manufacture method of pcb board according to claim 1 is characterized in that: in step 2, before superimposed, further comprise the step of central layer and Heat Conduction Material being done surface oxidation treatment.
4. the manufacture method of pcb board according to claim 1, it is characterized in that: in step 2, central layer is multiple, and multiple central layers arrange stackedly, is provided with prepreg between two adjacent central layers.
5. the manufacture method of pcb board according to claim 1 is characterized in that: in step 4, the reprocessing of force fit plate comprise to its carry out nog plate, laser ablation is removed its surperficial cull; And it is carried out machine drilling, copper facing, consent, plating and makes outer graphics.
6. the manufacture method of pcb board according to claim 1 is characterized in that: in step 4, while making outer blind hole, by first machinery boring, get through Copper Foil, form the blind hole mouth, then by the laser ablation prepreg to the described district that connects.
7. the manufacture method of pcb board according to claim 1, it is characterized in that: the described district that connects is arranged on central layer surface programming position, form by etching, the bottom of the outer blind hole of offering on the pcb board after connecting district and making is corresponding, connect district's size than the large 0.10mm-0.20mm of outer blind hole size, connect district and directly tie or indirect joint with line pattern and outer plated-through-hole in PCB.
8. pcb board that possesses high density interconnect designs and radiator structure, comprise central layer, prepreg, Copper Foil and Heat Conduction Material, it is characterized in that: described central layer, offer through hole on prepreg and Copper Foil, described central layer, prepreg and Copper Foil are stacked, Copper Foil is positioned at outermost layer, prepreg is connected between central layer and central layer and between central layer and Copper Foil, described central layer, lead to the hole site correspondence on prepreg and Copper Foil is built up intercommunicating pore, described Heat Conduction Material is arranged on copper layer and the outer copper foil on conducting central layer surface in intercommunicating pore, described pcb board is made by the manufacture method of the described pcb board of claim 1 to 7 any one.
9. pcb board according to claim 8, it is characterized in that: offer outer blind hole on the outer surface up and down of described pcb board, the bottom of outer blind hole extends to the surface with the central layer of adjacent lateral side, and with the surface of described adjacent lateral side central layer on corresponding connecting to distinguish and connecting of arranging.
10. pcb board according to claim 8, it is characterized in that: described pcb board offers pilot hole, connects the apparent surface of pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103181470A CN103402333A (en) | 2013-07-25 | 2013-07-25 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103181470A CN103402333A (en) | 2013-07-25 | 2013-07-25 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
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| CN103402333A true CN103402333A (en) | 2013-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013103181470A Pending CN103402333A (en) | 2013-07-25 | 2013-07-25 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105357A (en) * | 2014-07-31 | 2014-10-15 | 开平依利安达电子第三有限公司 | Method of pressing copper block into PCB (Printed Circuit Board) and application thereof |
| CN104684276A (en) * | 2013-11-28 | 2015-06-03 | 深圳崇达多层线路板有限公司 | Printed wiring board and processing method thereof |
| CN105764236A (en) * | 2015-04-29 | 2016-07-13 | 东莞生益电子有限公司 | Processing method of PCB, and PCB |
| CN106550558A (en) * | 2016-12-06 | 2017-03-29 | 深圳市深联电路有限公司 | A kind of pressing preparation method of embedding ceramic pcb board |
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| US20080250377A1 (en) * | 2007-04-04 | 2008-10-09 | Bird Steven C | Conductive dome probes for measuring system level multi-ghz signals |
| CN101745744A (en) * | 2008-12-18 | 2010-06-23 | 北大方正集团有限公司 | Direct laser pore-forming method |
| CN102307429A (en) * | 2011-09-02 | 2012-01-04 | 东莞生益电子有限公司 | Embedded high-thermal conductive PCB and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080250377A1 (en) * | 2007-04-04 | 2008-10-09 | Bird Steven C | Conductive dome probes for measuring system level multi-ghz signals |
| CN101745744A (en) * | 2008-12-18 | 2010-06-23 | 北大方正集团有限公司 | Direct laser pore-forming method |
| CN102307429A (en) * | 2011-09-02 | 2012-01-04 | 东莞生益电子有限公司 | Embedded high-thermal conductive PCB and manufacturing method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684276A (en) * | 2013-11-28 | 2015-06-03 | 深圳崇达多层线路板有限公司 | Printed wiring board and processing method thereof |
| CN104105357A (en) * | 2014-07-31 | 2014-10-15 | 开平依利安达电子第三有限公司 | Method of pressing copper block into PCB (Printed Circuit Board) and application thereof |
| CN105764236A (en) * | 2015-04-29 | 2016-07-13 | 东莞生益电子有限公司 | Processing method of PCB, and PCB |
| CN105764236B (en) * | 2015-04-29 | 2019-03-05 | 生益电子股份有限公司 | A kind of processing method and PCB of PCB |
| CN106550558A (en) * | 2016-12-06 | 2017-03-29 | 深圳市深联电路有限公司 | A kind of pressing preparation method of embedding ceramic pcb board |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Applicant after: Shengyi electronic Limited by Share Ltd Address before: 523039, Guangdong, Dongcheng District province (the same sand) science and Technology Industrial Park, No. 33, vibration road, Dongguan Applicant before: Dongguan Shengyi Electronics Ltd. |
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Application publication date: 20131120 |
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