CN104684276A - Printed wiring board and processing method thereof - Google Patents
Printed wiring board and processing method thereof Download PDFInfo
- Publication number
- CN104684276A CN104684276A CN201310627709.XA CN201310627709A CN104684276A CN 104684276 A CN104684276 A CN 104684276A CN 201310627709 A CN201310627709 A CN 201310627709A CN 104684276 A CN104684276 A CN 104684276A
- Authority
- CN
- China
- Prior art keywords
- lamina rara
- rara externa
- hole
- printed wiring
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention is applicable to the technical field of a printed wiring board, provides a processing method of a printed wiring board and the printed wiring board obtained by utilizing the processing method, and aims at solving the problem that the printed wiring board with the ultra-small hole pitch is difficult to process in the prior art. The processing method of the printed wiring board comprises the following steps of substrate providing: a substrate comprises a first outer layer board, a second outer layer board and at least one inner layer board; buried hole processing: laser is utilized for processing buried holes in the inner layer board; pressing: the inner layer board, the first outer layer board and the second outer layer board are arranged in a stacked way, and in addition, the pressing processing is carried out; blind hole processing: the laser is utilized for respectively processing blind holes in the first outer layer board and the second outer layer board, and the blind holes and the buried holes are in mutual butt joint and form through holes. The method has the advantages that a laser hole stacking processing mode is utilized, the requirement of ultra-small hole pitch is favorably met, in addition, the hole edge distance can be effectively enabled to be the safe distance.
Description
Technical field
The invention belongs to the processing technique field of printed wiring board, the processing method particularly relating to a kind of printed wiring board and the printed wiring board utilizing this processing method to obtain.
Background technology
Along with electronic product, as mobile phone, Digital Video, notebook computer, auto-navigation system and IC encapsulation, continue and the trend of Rapid miniaturization, lighting, multifunction, the development of highdensity mounting technique, industry is more and more had higher requirement, so that it can become the field of electronic components increasing substantially packaging density with high density, high accuracy, high reliability for as the carrier of original paper and connector printed wiring board.Therefore, the high density interconnect (High Density Interconnection, HDI) of printed wiring board technology is widely used in various electronic product, and the range of application of HDI plate technique is more and more wider.
In addition, function due to electronic product strengthen and the microminiaturization of electronic product, highly integrated degree more and more higher, the distance of hole pitch designs more and more less, and traditional machine drilling mode is difficult to the processing request that the hole pitch met between heterogeneous networks is less than 0.4mm.At present, the most bradawl that industry machine drilling is conventional is chewed as 0.15mm, when the hole pitch between heterogeneous networks is less than 0.4mm, for ensureing the safe distance on Bian Daokong limit, hole, the via being less than 0.15mm need be bored, and use the brill of 0.1mm to chew, difficulty of processing significantly promotes, and the cost expended is also high.
Summary of the invention
The object of the present invention is to provide the processing method in hole on a kind of printed wiring board, adopt the mode in laser stacking hole, be intended to solve the problem being difficult to the extra small printed wiring board of machining hole pitch in prior art.
The embodiment of the present invention is achieved in that a kind of processing method of printed wiring board comprises the following steps:
There is provided base material, described base material comprises the first lamina rara externa, the second lamina rara externa and at least one inner plating;
Buried via hole is processed, and utilizes laser to process buried via hole on described inner plating, carries out heavy Copper treatment respectively and with electroplating copper plughole, to the plate face electro copper foil respectively of each inner plating, and arrange internal layer circuit to the hole wall of each described buried via hole;
Pressing, by described inner plating, described first lamina rara externa and the stacked setting of described second lamina rara externa, described first lamina rara externa and described second lamina rara externa is made to be arranged at facing two of described inner plating respectively on the surface, pressing process is carried out to stacked described first lamina rara externa, described inner plating and described second lamina rara externa set, forms multilayer printed wiring board; And
Blind hole is processed, utilize laser difference processing blind hole on described first lamina rara externa and described second lamina rara externa, described blind hole is mutually docked with described buried via hole and is formed through hole, respectively heavy Copper treatment is carried out to the hole wall of each described blind hole and use electroplating copper plughole, electro copper foil is distinguished to the plate face of described first lamina rara externa and described second lamina rara externa.
Further, described inner plating comprise internal insulating layer and at least one be arranged at described internal insulating layer surface and with described first lamina rara externa or the facing internal copper layer of the second lamina rara externa; Process in the step of mutually through buried via hole utilizing laser respectively on each described inner plating, comprise: in described internal copper layer, determine the position needing to process buried via hole, determined buried via hole Working position carries out window process to form windowing in described internal copper layer; Utilize windowing described in described laser alignment and boring process is carried out to described internal insulating layer.
Further, windowing in process, by needing the position of windowing to carry out etch processes, removing described internal copper layer and exposing described internal insulating layer.
Further, in the step utilizing laser difference processing blind hole on described first lamina rara externa and described second lamina rara externa, comprising:
Determine the position needing to process described blind hole on the layers of copper surface of described first lamina rara externa, determined blind hole Working position carries out window process to form first window on described first lamina rara externa; Utilize first window described in described laser alignment and boring process is carried out to the internal layer of described first lamina rara externa; And
Determine the position needing to process described blind hole on the layers of copper surface of described second lamina rara externa, determined blind hole Working position carries out window process to form Second Window on described second lamina rara externa; Utilize Second Window described in described laser alignment and boring process is carried out to the internal layer of described second lamina rara externa.
Further, described laser is carbon dioxide laser and/or Nd:YAG laser.
Further, during described electroplating copper plughole, electro-coppering is utilized to fill up described buried via hole or described blind hole.
Present invention also offers a kind of printed wiring board utilizing the processing method of above-mentioned printed wiring board to obtain.
The processing method of printed wiring board provided by the invention, laser is utilized to carry out buried via hole processing to each inner plating, and utilize laser to carry out blind hole processing to the first lamina rara externa and the second lamina rara externa, make each buried via hole and corresponding blind hole mutually through, this requirement utilizing the processing mode in laser stacking hole to be conducive to meeting extra small hole pitch, and effectively can ensure that hole back gauge is safe distance, is conducive to the high density interconnect realizing printed wiring board.
Accompanying drawing explanation
Fig. 1 is the flow chart of the processing method of the printed wiring board that the embodiment of the present invention provides.
Fig. 2 is the schematic diagram of the buried via hole processing that the embodiment of the present invention provides.
Fig. 3 is another schematic diagram of the buried via hole processing that the embodiment of the present invention provides.
Fig. 4 is the schematic diagram of the blind hole processing that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Please refer to Fig. 1 to Fig. 4, the processing method embodiments providing a kind of printed wiring board comprises the following steps:
S1: base material is provided, described base material comprises the first lamina rara externa 11, second lamina rara externa 12 and at least one inner plating 13; Understandably, described base material is provided to be carried out before being pressed into multilayer printed wiring board, so that follow-up, buried via hole processing is carried out to inner plating 13, in the course of processing, described first lamina rara externa 11, described second lamina rara externa 12 and each described inner plating 13 arrange machining benchmark point (not shown) respectively, when described first lamina rara externa 11, described second lamina rara externa 12 and each described inner plating 13 is stacked arrange time, described machining benchmark point overlaps in the height direction.
S2: buried via hole 131 is processed, utilizes laser 2 to process buried via hole 131 on described inner plating 13, carries out heavy Copper treatment and with electroplating copper plughole, to the plate face electro copper foil respectively of each inner plating 13, and arrange internal layer circuit to the hole wall of described buried via hole 131; Understandably, utilize laser 2 to carry out buried via hole 131 along the machining benchmark point on described inner plating 13 to described inner plating 13 to process, when the quantity of described inner plating 13 is more than 2 or 2, after each inner plating 13 is stacked, on each inner plating 13, the buried via hole 131 of relevant position is mutually through; The hole wall of mode to each described buried via hole 131 of heavy Copper treatment is adopted to carry out heavy copper operation, to form a copper foil layer at the hole wall of described buried via hole 131, and utilize electro-coppering to fill up each described buried via hole 131, electro copper foil is carried out to be connected with the copper foil layer of described buried via hole 131 hole wall to the plate face of each inner plating 13, like this, the internal layer circuit realizing the plate face of inner plating 13 is connected with buried via hole 131, thus realizes the connection of circuit on each internal layer circuit plate.
S3: pressing, by described inner plating 13, described first lamina rara externa 11 and the stacked setting of described second lamina rara externa 12, described first lamina rara externa 11 and described second lamina rara externa 12 is made to lay respectively on two facing surfaces of described inner plating 13, pressing process is carried out to stacked described first lamina rara externa 11, described inner plating 13 and described second lamina rara externa 12 set, forms multilayer printed wiring board; Understandably, by the stacked setting of each described inner plating 13 to make the buried via hole 131 on each layer described internal layer circuit plate mutually through, and described first lamina rara externa 11 and described second lamina rara externa 12 are arranged at respectively two apparent surfaces of stacked described inner plating 13, described machining benchmark point is overlapped on stack height direction, and pressing is carried out to described first lamina rara externa 11 of stacked setting, each described inner plating 13 and described second lamina rara externa 12, obtain multilayer circuit board.
S4: blind hole 111,121 is processed, utilize laser 2 difference processing blind hole 111,121 on described first lamina rara externa 11 and described second lamina rara externa 12, described blind hole 111,121 is mutually docked with described buried via hole 131 and forms through hole, respectively heavy Copper treatment is carried out to the hole wall of each described blind hole 111,121 and use electroplating copper plughole, electro copper foil is distinguished to the plate face of described first lamina rara externa 11 and described second lamina rara externa 12.Understandably, utilize described laser 2 along described machining benchmark point processing blind hole 111 on described first lamina rara externa 11 and described second lamina rara externa 12 respectively, 121, described blind hole 111, 121 is mutually through with described buried via hole 131 and formed and be communicated with described first lamina rara externa 11, the via of each described inner plating 13 and described second lamina rara externa 12, similarly, adopt the mode of heavy Copper treatment to each described blind hole 111, the hole wall of 121 carries out heavy copper operation, with in described blind hole 111, the hole wall of 121 forms copper foil layer, and utilize electro-coppering to fill up each described blind hole 111, 121, to the outer surface of described first lamina rara externa 11 and described second lamina rara externa 12 carry out electro copper foil with described blind hole 111, the copper foil layer of 121 hole walls is connected, like this, by identical through blind hole 111, 121 and buried via hole 131 realize the first lamina rara externa 11 and the connection between described second lamina rara externa 12 and described inner plating 13, namely the circuit realized on multilayer circuit board between each layer is communicated with.
The processing method of the printed wiring board that the embodiment of the present invention provides, laser 2 is utilized to carry out buried via hole processing to each inner plating 13, and utilize laser 2 to carry out blind hole processing to the first lamina rara externa 11 and the second lamina rara externa 12, make each buried via hole 131 mutually through with corresponding blind hole 111,121, this processing mode utilizing laser 2 to fold hole is conducive to the requirement meeting extra small hole pitch, and effectively can ensure that hole back gauge is safe distance, is conducive to the high density interconnect realizing printed wiring board.Understandably, hole pitch refer to the center in a hole to another hole center between distance, hole back gauge refer to a hole wall to another hole hole wall between distance.Alternatively, utilize the through hole that the processing method of printed wiring board provided by the invention makes, the aperture of described via can be less than 0.15mm, and this is that common machine drilling mode cannot realize.In addition, the hole pitch of each via is 0.3mm, and hole back gauge is 0.2mm.
Please refer to Fig. 2 to Fig. 3, further, described inner plating 13 comprise internal insulating layer 132 and at least one be arranged at described internal insulating layer 132 surface and with described first lamina rara externa 11 or the facing internal copper layer 133 of the second lamina rara externa 12; Process in the step of mutually through buried via hole 131 utilizing laser 2 respectively on each described inner plating 13, comprise: in described internal copper layer 133, determine the position needing to process buried via hole 131, determined buried via hole 131 Working position carries out window process to form windowing 134 in described internal copper layer 133; Utilize described laser 2 to aim at described windowing 134 and boring process is carried out to described internal insulating layer 132.Understandably, microetch process is carried out to described internal copper layer 133, to need the position processing buried via hole 131 to form windowing 134, described windowing 134 can be the opening running through described internal copper layer 133, namely the bottom of described windowing 134 is just internal insulating layer 132, or to make remaining internal copper layer 133 thickness can be punctured by laser 2 after the described internal copper layer of removal part 133, laser 2 is utilized directly to carry out ablation processes to remaining internal copper layer 133 and to described internal insulating layer 132, form described buried via hole 131, and on inner plating 13, loci need be got out by machinery before laser drill, to determine bore position during laser drill, in the process, can by regulating the pulsewidth of laser 2 and energy or regulating the mode of described laser 2 beam diameter size, control pore size and the working depth of described buried via hole 131, alternatively, also described buried via hole 131 can be processed by multiple described laser 2.
Please refer to Fig. 2, preferably, windowing in process, by needing the position of windowing to carry out etch processes, removing described internal copper layer 133 and exposing described internal insulating layer 132.Understandably, the mode of acid etching or alkali etching can be adopted during etch processes to realize, acidic etching liquid is adopted to etch described internal copper layer 133 in acidic etching processes, such as, hydrochloric acid-ferric trichloride, hydrochloric acid-chlorine, hydrochloric acid-hydrogen peroxide, hydrochloric acid-sodium chloride or acid copper chloride etching liquid; Alkaline etching liquid is adopted to etch described internal copper layer 133 in alkali etching process, such as, sal-ammoniac copper etchant solution.
Please refer to Fig. 4, further, in the step utilizing laser 2 difference processing blind hole 111,121 on described first lamina rara externa 11 and described second lamina rara externa 12, comprise: determine the position needing to process described blind hole 111 on layers of copper 112 surface of described first lamina rara externa 11, determined blind hole 111 Working position carries out window process to form first window 114 on described first lamina rara externa 11; Utilize described laser 2 to aim at described first window 114 and boring process is carried out to the internal layer 113 of described first lamina rara externa 11; And the position that needs to process described blind hole 121 is determined on layers of copper 122 surface of described second lamina rara externa 12, determined blind hole Working position carries out window process to form Second Window 124 on described second lamina rara externa 12; Utilize described laser 2 to aim at described Second Window 124 and boring process is carried out to the internal layer 123 of described second lamina rara externa 12.Understandably, similar to processing buried via hole 131 mode on inner plating 13, to the layers of copper 112 on described first lamina rara externa 11 and described second lamina rara externa 12 surface, 122 carry out microetch process respectively, with at needs processing blind hole 111, the position of 121 forms first window 114 and Second Window 124 respectively, described first window 114 and described Second Window 124 can be run through described layers of copper 112, the opening of 122, namely the bottom of described first window 114 and described Second Window 124 is all just internal layer 113, 123 surfaces, or remove part layers of copper 112, the opening formed after 122 can be punctured by described laser 2 to make remaining copper layer thickness, namely the bottom of described first window 114 and described Second Window 124 is still positioned at described layers of copper 112, on 122, then by the loci determination laser blind hole position in internal copper layer 133, directly ablation processes is carried out to remaining layers of copper 112,122 and described internal layer 113,123, form the blind hole 111,121 mutually through with described buried via hole 131, and before laser drill, need the loci of design in internal copper layer 133 to use laser ablation to go out, to determine bore position during laser drill.Similarly, in the process, by regulating the pulsewidth of laser 2 and energy or regulating the mode of described laser 2 beam diameter size, pore size and the working depth of described blind hole 111,121 can be controlled, alternatively, also described blind hole 111,121 can be processed by multiple described laser 2.
Please refer to Fig. 4, further, described laser 2 is carbon dioxide laser and/or Nd:YAG laser.Understandably, process in the process of described buried via hole 131 and described blind hole 111,121 at laser 2, the laser medium adopted can be carbon dioxide or Nd:YAG laser, also can be the combination of carbon dioxide laser and Nd:YAG laser, and, the hole depth of described buried via hole 131 and described blind hole 111,121 is controlled by the pulsewidth and energy controlling described laser 2, and the aperture by regulating the position of described laser 2 to control described buried via hole 131 and described blind hole 111,121; Or hole depth and the aperture of described buried via hole 131 and described blind hole 111,121 is controlled by the diameter controlling described laser 2.In addition, multiple described laser 2 can be utilized to process described buried via hole 131 and blind hole 111,121 respectively, relatively to control the quality of buried via hole 131 and blind hole 111,121, avoid occurring the defects such as lateral erosion is excessive.
Please refer to Fig. 4, further, during described electroplating copper plughole, utilize electro-coppering to fill up described buried via hole 131 or described blind hole 111,121.The embodiment of the present invention additionally provides a kind of printed wiring board utilizing the processing method of above-mentioned printed wiring board to obtain.Concrete processing method is identical with above-mentioned each processing method, does not repeat herein.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a processing method for printed wiring board, is characterized in that, comprises the following steps:
There is provided base material, described base material comprises the first lamina rara externa, the second lamina rara externa and at least one inner plating;
Buried via hole is processed, and utilizes laser to process buried via hole on described inner plating, carries out heavy Copper treatment respectively and with electroplating copper plughole, to the plate face electro copper foil respectively of each inner plating, and arrange internal layer circuit to the hole wall of each described buried via hole;
Pressing, by described inner plating, described first lamina rara externa and the stacked setting of described second lamina rara externa, described first lamina rara externa and described second lamina rara externa is made to be arranged at facing two of described inner plating respectively on the surface, pressing process is carried out to stacked described first lamina rara externa, described inner plating and described second lamina rara externa set, forms multilayer printed wiring board; And
Blind hole is processed, utilize laser difference processing blind hole on described first lamina rara externa and described second lamina rara externa, described blind hole is mutually docked with described buried via hole and is formed through hole, respectively heavy Copper treatment is carried out to the hole wall of each described blind hole and use electroplating copper plughole, electro copper foil is distinguished to the plate face of described first lamina rara externa and described second lamina rara externa.
2. the processing method in hole on printed wiring board as claimed in claim 1, it is characterized in that, described inner plating comprise internal insulating layer and at least one be arranged at described internal insulating layer surface and with described first lamina rara externa or the facing internal copper layer of the second lamina rara externa; Process in the step of mutually through buried via hole utilizing laser respectively on each described inner plating, comprise: in described internal copper layer, determine the position needing to process buried via hole, determined buried via hole Working position carries out window process to form windowing in described internal copper layer; Utilize windowing described in described laser alignment and boring process is carried out to described internal insulating layer.
3. the processing method of printed wiring board as claimed in claim 2, is characterized in that, is windowing in process, by needing the position of windowing to carry out etch processes, removing described internal copper layer and exposing described internal insulating layer.
4. the processing method of printed wiring board as claimed in claim 1, is characterized in that, in the step utilizing laser difference processing blind hole on described first lamina rara externa and described second lamina rara externa, comprising:
Determine the position needing to process described blind hole on the layers of copper surface of described first lamina rara externa, determined blind hole Working position carries out window process to form first window on described first lamina rara externa; Utilize first window described in described laser alignment and boring process is carried out to the internal layer of described first lamina rara externa; And
Determine the position needing to process described blind hole on the layers of copper surface of described second lamina rara externa, determined blind hole Working position carries out window process to form Second Window on described second lamina rara externa; Utilize Second Window described in described laser alignment and boring process is carried out to the internal layer of described second lamina rara externa.
5. the processing method of the printed wiring board as described in Claims 1-4 any one, is characterized in that, described laser is carbon dioxide laser and/or Nd:YAG laser.
6. the processing method of the printed wiring board as described in Claims 1-4 any one, is characterized in that, during described electroplating copper plughole, utilizes electro-coppering to fill up described buried via hole or described blind hole.
7. the printed wiring board utilizing the processing method of the printed wiring board as described in claim 1 to 6 any one to obtain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310627709.XA CN104684276A (en) | 2013-11-28 | 2013-11-28 | Printed wiring board and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310627709.XA CN104684276A (en) | 2013-11-28 | 2013-11-28 | Printed wiring board and processing method thereof |
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| Publication Number | Publication Date |
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| CN104684276A true CN104684276A (en) | 2015-06-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201310627709.XA Pending CN104684276A (en) | 2013-11-28 | 2013-11-28 | Printed wiring board and processing method thereof |
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| CN (1) | CN104684276A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105246270A (en) * | 2015-10-22 | 2016-01-13 | 深圳崇达多层线路板有限公司 | Preparation process of plug-in type blind hole HDI board |
| CN105530767A (en) * | 2016-01-26 | 2016-04-27 | 江苏博敏电子有限公司 | Streamline production process for HDI board |
| CN111542170A (en) * | 2020-04-16 | 2020-08-14 | 江苏普诺威电子股份有限公司 | Method for processing sound hole of MEMS carrier plate |
| CN112291951A (en) * | 2020-11-10 | 2021-01-29 | 深圳市昶东鑫线路板有限公司 | Blind buried hole circuit board processing technology |
| WO2021017980A1 (en) * | 2019-08-01 | 2021-02-04 | 中兴通讯股份有限公司 | Via stacked-up structure and heat dissipation structure of printed circuit board, and manufacturing method |
| CN112888199A (en) * | 2021-01-15 | 2021-06-01 | 浪潮电子信息产业股份有限公司 | Method for forming pin jack of multilayer PCB |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102415228A (en) * | 2010-04-30 | 2012-04-11 | 日本梅克特隆株式会社 | Build-up multilayer printed wiring board and production method therefor |
| CN102625604A (en) * | 2012-03-20 | 2012-08-01 | 柏承科技(昆山)股份有限公司 | Manufacturing method for high-density interconnection printed board |
| US20130240259A1 (en) * | 2012-03-16 | 2013-09-19 | Fujitsu Limited | Method of manufacturing wiring board, wiring board, and via structure |
| CN103379751A (en) * | 2012-04-27 | 2013-10-30 | 北大方正集团有限公司 | Manufacturing method of combined printed-circuit board, printed-circuit board and manufacturing method thereof |
| CN103402331A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
| CN103402333A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
-
2013
- 2013-11-28 CN CN201310627709.XA patent/CN104684276A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102415228A (en) * | 2010-04-30 | 2012-04-11 | 日本梅克特隆株式会社 | Build-up multilayer printed wiring board and production method therefor |
| US20130240259A1 (en) * | 2012-03-16 | 2013-09-19 | Fujitsu Limited | Method of manufacturing wiring board, wiring board, and via structure |
| CN102625604A (en) * | 2012-03-20 | 2012-08-01 | 柏承科技(昆山)股份有限公司 | Manufacturing method for high-density interconnection printed board |
| CN103379751A (en) * | 2012-04-27 | 2013-10-30 | 北大方正集团有限公司 | Manufacturing method of combined printed-circuit board, printed-circuit board and manufacturing method thereof |
| CN103402331A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
| CN103402333A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105246270A (en) * | 2015-10-22 | 2016-01-13 | 深圳崇达多层线路板有限公司 | Preparation process of plug-in type blind hole HDI board |
| CN105246270B (en) * | 2015-10-22 | 2018-09-04 | 深圳崇达多层线路板有限公司 | A kind of preparation process of plug-in type blind hole HDI plates |
| CN105530767A (en) * | 2016-01-26 | 2016-04-27 | 江苏博敏电子有限公司 | Streamline production process for HDI board |
| WO2021017980A1 (en) * | 2019-08-01 | 2021-02-04 | 中兴通讯股份有限公司 | Via stacked-up structure and heat dissipation structure of printed circuit board, and manufacturing method |
| CN111542170A (en) * | 2020-04-16 | 2020-08-14 | 江苏普诺威电子股份有限公司 | Method for processing sound hole of MEMS carrier plate |
| CN112291951A (en) * | 2020-11-10 | 2021-01-29 | 深圳市昶东鑫线路板有限公司 | Blind buried hole circuit board processing technology |
| CN112888199A (en) * | 2021-01-15 | 2021-06-01 | 浪潮电子信息产业股份有限公司 | Method for forming pin jack of multilayer PCB |
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Application publication date: 20150603 |