CN105246270A - Preparation process of plug-in type blind hole HDI board - Google Patents
Preparation process of plug-in type blind hole HDI board Download PDFInfo
- Publication number
- CN105246270A CN105246270A CN201510690455.5A CN201510690455A CN105246270A CN 105246270 A CN105246270 A CN 105246270A CN 201510690455 A CN201510690455 A CN 201510690455A CN 105246270 A CN105246270 A CN 105246270A
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- hole
- blind hole
- inner plating
- plug
- internal layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention belongs to the circuit board processing field and relates to a preparation process of a plug-in type blind hole HDI board, wherein the plug-in type blind hole HDI board is composed of an outer-layer plate, an inner-layer plate with through holes and a remaining inner-layer plate without blind holes. The preparation process includes the following steps that: the outer-layer plate, the inner-layer plate with the through holes and the remaining inner-layer plate without blind holes are staked to each other sequentially and are laminated; portions of the outer-layer plate, which are corresponding to the through holes of the inner-layer plate, are drilled so as to form blind holes; and outer-layer electroless plating copper, full-board electroplating, outer-layer patterning, pattern electroplating, outer-layer alkaline etching, solder mask screen printing, character screen printing, surface treatment and subsequent processes are carried out. With the preparation process of the invention adopted, technical problems in depth control can be solved, and blind holes will not bring out open-circuiting or short-circuiting due to depth problems assuredly; and a situation that copper does not cover the bottoms of the holes can be avoided; plug-in blind hole manufacture can be completed through ordinary electroplating solutions; and the electroplating solutions are not needed to be injected to the holes to realize blind hole electroplating, and therefore, manufacture difficulties are lowered, and cost can be reduced.
Description
Technical field
The invention belongs to wiring board manufacture field, be specifically related to a kind of preparation technology of plug-in type blind hole HDI plate.
Background technology
At wiring board art, in order to meet on same pcb board, the function more crossed can be realized, just need the components and parts installing different welds types at the positive and negative of same PCB, and the HDI plate with one side large aperture blind hole can well meet the requirement of same pcb board being installed different welds types components and parts.
The method in back drill hole, current making one side large aperture is: after pcb board is completed pressing, blind hole is got out by the method controlling dark back drill hole, then, after through hole sinks copper and filling perforation plating, graphic plating and outer etching, complete the metallization in back drill hole, thus form the HDI plate of plug-in type blind hole.But this kind of process easily causes plug-in type blind hole depth inadequate, thus causes cannot installing by components and parts, and during blind hole metallization, easily cause hole bottom outlet copper too thin, even at the bottom of hole without copper, thus cause plug-in type blind via bottom poor flow.For current technology method Problems existing, this patent devises and a kind ofly makes the new process of plug-in type blind hole HDI plate, can well solve problems.
But prior art mainly exists a lot of problem, such as: adopt the method in the dark back drill hole of control to make blind hole, because the thick degree of medium after pressing exists certain error, easily cause back drill hole depth inadequate, or the degree of depth is excessively dark, thus after causing metallization, blind hole is opened a way, or blind hole short circuit; During due to graphic plating, the blind hole that back drill hole is formed, because liquid medicine can not well exchange, easily produces zinc-plated bad phenomenon at the bottom of hole, thus after causing outer alkali etching, without copper at the bottom of hole, finally causes plug-in type blind hole to be opened a way.
Summary of the invention
For this reason, technical problem to be solved by this invention to be to overcome in prior art the thick degree of medium after pressing and to there is certain error, or easily produce at the bottom of hole and zinc-platedly badly easily cause back drill hole depth not thus after causing metallization, the technical bottleneck of blind hole open circuit or short circuit, thus proposition one can carry out severity control, guarantee that blind hole can not open short circuit, and avoid the preparation technology without copper phenomenon at the bottom of hole.
For solving the problems of the technologies described above, the invention discloses a kind of preparation technology of plug-in type blind hole HDI plate, wherein, described plug-in type blind hole HDI plate by lamina rara externa, have through hole inner plating and do not need to make the remaining inner plating of blind hole and form; Described preparation technology comprises the steps:
By described lamina rara externa, the inner plating with through hole and the remaining inner plating order that do not need to make blind hole is superimposed carries out pressing process; The lead to the hole site boring in lamina rara externa correspondence with the inner plating of through hole forms blind hole; Carry out the heavy copper of skin, electric plating of whole board, outer graphics, graphic plating, outer alkali etching, silk-screen welding resistance, silk-screen character, surface treatment, rear operation again.
The preparation technology of described plug-in type blind hole HDI plate, wherein, described in there is through hole inner plating when being 1 layer, described in there is the inner plating of through hole preparation technology comprise the steps:
S1, sawing sheet is carried out to the described edges of boards with the inner plating of through hole, then carry out subtracting Copper treatment;
S2, the described inner plating with through hole carried out to internal layer boring process;
S3, the described inner plating order with through hole carried out to internal layer and sink copper, inner plating electricity, slice analysis, inner figure, internal layer etching, internal layer inspection, brown, rear operation process.
The preparation technology of described plug-in type blind hole HDI plate, wherein, described in when there is the inner plating > 1 layer of through hole, described in there is the inner plating of through hole preparation technology comprise the steps:
S1, sawing sheet is carried out to the described edges of boards with the inner plating of through hole, then carry out subtracting Copper treatment;
S2, the described inner plating with through hole carried out to inner figure, internal layer etching;
S3, brown process, pressing process are carried out to the described inner plating with through hole;
S4, the inner plating internal layer boring having a through hole to described, internal layer sink copper, inner plating electricity, slice analysis, inner figure, internal layer etching, brown, rear operation.
The preparation technology of described plug-in type blind hole HDI plate, wherein, when remain in described HDI plate do not need to make the remaining inner plating number of plies of blind hole equal 1 layer time, need to be handled as follows the described remaining inner plating order making blind hole that do not need: edges of boards sawing sheet, inner figure process, internal layer etch processes, brown process, rear operation process.
The preparation technology of described plug-in type blind hole HDI plate, wherein, when not needing the remaining inner plating number of plies > 1 making blind hole in described HDI plate, need to be handled as follows the described remaining inner plating order making blind hole that do not need: edges of boards sawing sheet, for the first time inner figure, first time internal layer etching, brown, pressing, second time inner figure, the etching of second time internal layer, brown process, rear operation process.
The preparation technology of described plug-in type blind hole HDI plate, wherein, arbitrary described inner plating electric treatment needs disposable by hole copper, the plating of table copper.
The preparation technology of described plug-in type blind hole HDI plate, wherein, in arbitrary described boring process, aperture is 0.20-5.5mm.
Technique scheme of the present invention has the following advantages compared to existing technology:
1, when technique of the present invention can well solve and use the dark back drill hole of control to make blind hole, the technical problem of severity control, guarantees that blind hole can not cause open circuit or short circuit because of depth problem;
2, after technique of the present invention can well solve back drill hole metallization, owing to scheme at the bottom of electric hole when at the bottom of zinc-plated bad hole of causing without copper phenomenon.
3, technique of the present invention can use common electroplating liquid medicine can complete the making of plug-in unit blind hole, can carry out blind hole plating without filling perforation electroplating liquid medicine, and technique manufacture difficulty reduces.
Embodiment
Embodiment 1 present embodiment discloses a kind of preparation technology of plug-in type blind hole HDI plate, and concrete steps are as follows:
Definition: total number of plies of pcb board is N (N minimum value is 4), the plug-in type blind hole conducting number of plies is n+1 (n gets positive integer, the internal layer that n representative connects, and 1 represents skin), and N > n+1.
Work as N=4, during n=1
The layer with plug-in type blind hole is other: sawing sheet → subtract copper → internal layer boring → internal layer sinks copper → inner plating electricity (disposable by hole copper, the plating of table copper is enough) → slice analysis → inner figure → internal layer etching → internal layer AOI → brown → rear operation;
Do not need the remaining layer making blind hole other: sawing sheet → inner figure → internal layer etching → internal layer AOI → brown → rear operation;
Not the windowing of gummosis PP sheet: the gummosis PP of sawing sheet → not windows → rear operation;
Outer flow process after two daughter boards and not gummosis PP pressing: pressing → skin boring → outer heavy copper → electric plating of whole board → outer graphics → graphic plating → outer alkali etching → outer AOI → silk-screen welding resistance → silk-screen character → surface treatment → electrical testing → shaping → FQC → FQA → packaging;
Described blind hole aperture is 0.20-5.5mm.
Embodiment 2 present embodiment discloses a kind of preparation technology of plug-in type blind hole HDI plate, and concrete steps are as follows:
Work as N=4, during n=2
The layer with plug-in type blind hole is other: sawing sheet → subtract copper → inner figure → internal layer etching → internal layer AOI → brown → pressing → internal layer boring → internal layer sinks copper → inner plating electricity (disposable by hole copper, the plating of table copper is enough) → slice analysis → inner figure → internal layer etching → internal layer AOI → brown → rear operation;
Not the windowing of gummosis PP sheet: the gummosis PP of sawing sheet → not windows → rear operation;
Outer flow process after daughter board and not gummosis PP pressing: pressing → skin hole → and skin sinks copper → electric plating of whole board → outer graphics → graphic plating → outer alkali etching → outer AOI → silk-screen welding resistance → silk-screen character → surface treatment → electrical testing → shaping → FQC → FQA → packaging;
Described blind hole aperture is 0.20-5.5mm.
Embodiment 3 present embodiment discloses a kind of preparation technology of plug-in type blind hole HDI plate, and concrete steps are as follows:
As N > 4, n=1
The layer with plug-in type blind hole is other: sawing sheet → subtract copper → internal layer boring → internal layer sinks copper → inner plating electricity (disposable by hole copper, the plating of table copper is enough) → slice analysis → inner figure → internal layer etching → internal layer AOI → brown → rear operation;
Do not need to make the remaining layer of blind hole other: sawing sheet → first time inner figure → first time internal layer etching → first time internal layer AOI → brown → pressing → second time inner figure → second time internal layer etches → internal layer AOI → brown → rear operation for the second time;
Not the windowing of gummosis PP sheet: sawing sheet → not gummosis PP boring → rear operation;
Outer flow process after two daughter boards and not gummosis PP pressing: pressing → skin boring → outer heavy copper → electric plating of whole board → outer graphics → graphic plating → outer alkali etching → outer AOI → silk-screen welding resistance → silk-screen character → surface treatment → electrical testing → shaping → FQC → FQA → packaging;
Described blind hole aperture is 0.20-5.5mm.
Embodiment 4 present embodiment discloses a kind of preparation technology of plug-in type blind hole HDI plate, and concrete steps are as follows:
As N > 4, n > 1
The layer with plug-in type blind hole is other: sawing sheet → inner figure → internal layer etching → internal layer AOI → brown → pressing → internal layer boring → internal layer sinks copper → inner plating electricity (disposable by hole copper, the plating of table copper is enough) → slice analysis → inner figure → internal layer etching → internal layer AOI → brown → rear operation;
Do not need to make the remaining layer of blind hole other: sawing sheet → first time inner figure → first time internal layer etching → first time internal layer AOI → brown → pressing → second time inner figure → second time internal layer etches → internal layer AOI → brown → rear operation for the second time;
Not the windowing of gummosis PP sheet: sawing sheet → not gummosis PP boring → rear operation;
Outer flow process after two daughter boards and not gummosis PP pressing: pressing → skin boring → outer heavy copper → electric plating of whole board → outer graphics → graphic plating → outer alkali etching → outer AOI → silk-screen welding resistance → silk-screen character → surface treatment → electrical testing → shaping → FQC → FQA → packaging;
Described blind hole aperture is 0.20-5.5mm.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (7)
1. a preparation technology for plug-in type blind hole HDI plate, is characterized in that, described plug-in type blind hole HDI plate by lamina rara externa, have through hole inner plating and do not need to make the remaining inner plating of blind hole and form; Described preparation technology comprises the steps:
By described lamina rara externa, the inner plating with through hole and the remaining inner plating order that do not need to make blind hole is superimposed carries out pressing process; The lead to the hole site boring in lamina rara externa correspondence with the inner plating of through hole forms blind hole; Carry out the heavy copper of skin, electric plating of whole board, outer graphics, graphic plating, outer alkali etching, silk-screen welding resistance, silk-screen character, surface treatment, rear operation again.
2. the preparation technology of plug-in type blind hole HDI plate as claimed in claim 1, is characterized in that, described in there is through hole inner plating when being 1 layer, described in there is the inner plating of through hole preparation technology comprise the steps:
S1, sawing sheet is carried out to the described edges of boards with the inner plating of through hole, then carry out subtracting Copper treatment;
S2, the described inner plating with through hole carried out to internal layer boring process;
S3, the described inner plating order with through hole carried out to internal layer and sink copper, inner plating electricity, slice analysis, inner figure, internal layer etching, internal layer inspection, brown, rear operation process.
3. the preparation technology of plug-in type blind hole HDI plate as claimed in claim 1, is characterized in that, described in when there is the inner plating > 1 layer of through hole, described in there is the inner plating of through hole preparation technology comprise the steps:
S1, sawing sheet is carried out to the described edges of boards with the inner plating of through hole, then carry out subtracting Copper treatment;
S2, the described inner plating with through hole carried out to inner figure, internal layer etching;
S3, brown process, pressing process are carried out to the described inner plating with through hole;
S4, the inner plating internal layer boring having a through hole to described, internal layer sink copper, inner plating electricity, slice analysis, inner figure, internal layer etching, brown, rear operation.
4. the preparation technology of the plug-in type blind hole HDI plate as described in claim 1-3, it is characterized in that, when remain in described HDI plate do not need to make the remaining inner plating number of plies of blind hole equal 1 layer time, need to be handled as follows the described remaining inner plating order making blind hole that do not need: edges of boards sawing sheet, inner figure process, internal layer etch processes, brown process, rear operation process.
5. the preparation technology of the plug-in type blind hole HDI plate as described in claim 1-3, it is characterized in that, when not needing the remaining inner plating number of plies > 1 making blind hole in described HDI plate, need to be handled as follows the described remaining inner plating order making blind hole that do not need: edges of boards sawing sheet, for the first time inner figure, first time internal layer etching, brown, pressing, second time inner figure, the etching of second time internal layer, brown process, rear operation process.
6. the preparation technology of the plug-in type blind hole HDI plate as described in claim 2-3, is characterized in that, arbitrary described inner plating electric treatment needs disposable by hole copper, the plating of table copper.
7. the preparation technology of the plug-in type blind hole HDI plate as described in claim 1-3, is characterized in that, in arbitrary described boring process, aperture is 0.20-5.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510690455.5A CN105246270B (en) | 2015-10-22 | 2015-10-22 | A kind of preparation process of plug-in type blind hole HDI plates |
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| CN201510690455.5A CN105246270B (en) | 2015-10-22 | 2015-10-22 | A kind of preparation process of plug-in type blind hole HDI plates |
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| CN105246270A true CN105246270A (en) | 2016-01-13 |
| CN105246270B CN105246270B (en) | 2018-09-04 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108650808A (en) * | 2018-04-16 | 2018-10-12 | 惠州市纬德电路有限公司 | A kind of production technology of the blind buried-hole structure pcb board of multilayer |
| CN108925042A (en) * | 2018-06-01 | 2018-11-30 | 珠海崇达电路技术有限公司 | A kind of printed circuit board and preparation method thereof replacing back drill hole with blind hole |
| CN109444471A (en) * | 2018-11-22 | 2019-03-08 | 阔智科技（广州）有限公司 | A kind of detection method of blind hole black pad exception |
| CN109982509A (en) * | 2017-12-28 | 2019-07-05 | 北大方正集团有限公司 | The production method and pcb board for having the pcb board of stepped groove |
| CN112888199A (en) * | 2021-01-15 | 2021-06-01 | 浪潮电子信息产业股份有限公司 | Method for forming pin jack of multilayer PCB |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109982509A (en) * | 2017-12-28 | 2019-07-05 | 北大方正集团有限公司 | The production method and pcb board for having the pcb board of stepped groove |
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| CN108925042A (en) * | 2018-06-01 | 2018-11-30 | 珠海崇达电路技术有限公司 | A kind of printed circuit board and preparation method thereof replacing back drill hole with blind hole |
| CN109444471A (en) * | 2018-11-22 | 2019-03-08 | 阔智科技（广州）有限公司 | A kind of detection method of blind hole black pad exception |
| CN112888199A (en) * | 2021-01-15 | 2021-06-01 | 浪潮电子信息产业股份有限公司 | Method for forming pin jack of multilayer PCB |
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