CN109587968A - One kind preventing consent or the undesirable PCB production method of plated hole - Google Patents
One kind preventing consent or the undesirable PCB production method of plated hole Download PDFInfo
- Publication number
- CN109587968A CN109587968A CN201811511976.XA CN201811511976A CN109587968A CN 109587968 A CN109587968 A CN 109587968A CN 201811511976 A CN201811511976 A CN 201811511976A CN 109587968 A CN109587968 A CN 109587968A
- Authority
- CN
- China
- Prior art keywords
- consent
- plate
- hole
- link
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Abstract
The present invention relates to board production technical field, specially one kind prevents consent or the undesirable PCB production method of plated hole.The present invention washes the technological parameter of link by nog plate in optimization heavy copper plate electric process, the foreign matters such as dust or the resin in hole can effectively be cleaned, it has been obviously improved the cleaning effect to production plate, to solve the problems, such as the foreign matters consent such as dust, make hole metallization for subsequent heavy copper and plating, form good metal layer in hole wall and provide necessary guarantee, because hole wall cleannes are high, it is beneficial to prevent hole wall and heavy gassing of copper occurs, to obtain preferable plated hole effect.The technological parameter of the electro-coppering link in link and outer graphics electroplating work procedure is electroplated by the whole plate in optimization heavy copper plate electric process, further ensures plated hole effect.The problem of timely and effectively siphoning away the dust that drilling generates using the dust exhaust apparatus of certain pressure simultaneously in the boring procedure of outer layer drilling operating, can reduce dust consent makes nog plate washing link be easier to clean up in hole.
Description
Technical field
The present invention relates to board production technical fields more particularly to one kind to prevent consent or the undesirable PCB of plated hole
Production method.
Background technique
During the manufacturing of assist side (PCB), it is frequently present of dust or the non-metallic hole of other foreign matters from being blocked
Situation, after this will lead to these non-metallic metallized processing in hole, being formed by plated through-hole has that plated hole is bad,
Even there is partial hole whole Kong Wutong occur, so as to cause scrapping, the bad problem of plated hole causes very big quality hidden danger to product.
The especially hole of small size (small-bore), because the problem that dust or other foreign matter consents cause plated hole bad is even more serious, even if
It first is also difficult to rinse well foreign matter in small hole size through the washing of nog plate twice before the heavy copper ring section of heavy copper process, it is difficult to ensure
The electroplating effect of small hole size.Common consent and plated hole is bad to be had dust consent, dry film consent, copper sheet plug-hole, heavy copper occurs
Bubble and local hole wall are without copper.
Summary of the invention
The present invention leads to the electroplating effect for being difficult to ensure hole there are dust/foreign matter consent for the production method of existing PCB
The problem of, provide it is a kind of ensure plated hole effect by optimization technological process prevent consent or the undesirable PCB of plated hole
Production method.
To achieve the above object, the present invention uses following technical scheme.
One kind preventing consent or the undesirable PCB production method of plated hole, including the following production work successively successively carried out
Sequence: sawing sheet, internal layer circuit production, pressing, outer layer drilling, heavy copper plate electric, outer graphics, outer graphics plating, outer layer etching, resistance
Layer production, surface treatment, molding；
The heavy copper plate electric process includes the nog plate washing successively carried out, de-smear, board-washing, deposition copper, whole plate plating ring
Section；
The outer graphics electroplating work procedure includes the copper facing pretreatment, electro-coppering, tin plating pretreatment, electrotinning successively carried out
Link；
Nog plate in the heavy copper plate electric process washes link, and the control of technological parameter is as follows: washing pressure is 1.5-
2.3Kg/cm2, ultrasonic power 1.8KW, temperature is 25-35 DEG C.The control point for washing pressure is 2.0Kg/cm2。
Preferably, link is electroplated in the whole plate in the heavy copper plate electric process, and the process parameter control of whole plate electroplating liquid medicine is such as
Under: CuSO4Concentration be 55-75g/L, H2SO4Concentration be 110-140mL/L-1, Cl-1Concentration be 50-70ppm.Control point
Are as follows: CuSO4Concentration be 65g/L, H2SO4Concentration be 125mL/L-1, Cl-1Concentration be 60ppm.
It is furthermore preferred that the whole plate electroplating liquid medicine every three months replacement is primary.
Preferably, cleaning is primary weekly for water washing cylinder used in the heavy copper plate electric process, and to the washing after cleaning
Water and bacteria remover are added in cylinder, the concentration of the bacteria remover is 0.2mL/L.Preferably, the fungicide is dimethyl
Base benzyl ammonium chloride.
Preferably, the electro-coppering link in the outer graphics electroplating work procedure, the process parameter control of electro-coppering liquid medicine is such as
Under: CuSO4Concentration be 55-75g/L, H2SO4Concentration be 110-140mL/L-1, Cl-1Concentration be 50-70ppm.Control point
Are as follows: CuSO4Concentration be 65g/L, H2SO4Concentration be 125mL/L-1, Cl-1Concentration be 60ppm.
It is furthermore preferred that the electroplating liquid medicine every three months replacement is primary.
Preferably, the water washing cylinder that the copper facing pretreatment in the outer graphics electroplating work procedure and tin plating pretreatment link use
Cleaning is primary weekly, and water and bacteria remover are added into the water washing cylinder after cleaning, and the concentration of the bacteria remover is 0.2mL/L.
Preferably, the fungicide is dodecyl benzyl dimethyl ammonium chloride.
Preferably, in the outer layer drilling operating, the dust exhaust apparatus pair for the use of negative pressure being 1.8PSI or more while drilling
Produce the plate face dust suction of plate.
It is furthermore preferred that the cleaning frequency of the dust exhaust apparatus is 4 times a day.
Compared with prior art, the beneficial effects of the present invention are:
The present invention washes the technological parameter of link by nog plate in optimization heavy copper plate electric process, can effectively clean the powder in hole
The foreign matters such as dirt or resin, be obviously improved to production plate cleaning effect be to solve the problems, such as the foreign matters consent such as dust
Subsequent heavy copper and plating make hole metallization, form good metal layer in hole wall and provide necessary guarantee, because hole wall cleannes are high,
It is beneficial to prevent hole wall and heavy gassing of copper occurs, to obtain preferable plated hole effect.By whole in optimization heavy copper plate electric process
The technological parameter of link and the electro-coppering link in outer graphics electroplating work procedure is electroplated in plate, further ensures plated hole effect.Outside
The dust that drilling generates timely and effectively is siphoned away using the dust exhaust apparatus of certain pressure simultaneously in the boring procedure of layer drilling operating,
The problem of can reduce dust consent, thus advantageously reduce nog plate washing link difficulty, make nog plate washing link be easier to by
Hole cleans up.
The present invention solves the problems, such as dust or other foreign matter consents by optimization technological process, and is effectively reduced because of plating
It is scrapped caused by hole is bad, reduces production cost, and there is product quality and preferably ensure.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention
It is described further and illustrates.
Embodiment
The present embodiment provides one kind to prevent consent or the undesirable PCB production method of plated hole, PCB manufactured in the present embodiment
On plated through-hole, minimum-value aperture 0.35mm, aspect ratio 4.2:1.
(1) sawing sheet: core material is outputed by the jigsaw size of design requirement.
(2) it makes internal layer circuit: internal layer circuit being made on core material using negative film technique, obtains internal layer circuit plate.
Wherein, inner figure: dry/wet film processing procedure wet film, downside PP quantity are 2, downside residual copper ratio is 85%, downside PP type is
1080H, upside residual copper ratio are 69%；Internal layer etching: common line width tolerance+20%, l4s finished product minimum feature 0.203mm, l5s
Finished product minimum clearance 0.16mm, l4s finished product minimum clearance 0.16mm.After internal layer circuit is made in etching on core material, by normal
Rule process successively carries out POE punching and internal layer AOI.
(3) it presses: stacking core material, prepreg PP, housing copper foil to form pre- stack structure in advance, then basis
Plate Tg selects lamination appropriate to be press-fitted together as one pre- stack structure, forms multilayer and produces plate.Wherein, press plate-laying jigsaw
1PNL/ layers, riveted sky staple height 1.62mm, control after pressing plus tolerance 0.127mm, lamination pre-treatment, pressing plate thickness 1.47mm,
PP broadwise length 518mm, copper foil plate-laying number 2, target position hole coordinate (X-axis) 317mm, riveted thickness degree 1.07mm, the plate-laying number of plies 9,
Laminating parameters H-TG041, rivet selection height 2.5mm, molten riveted mode select riveted.
(4) outer layer drills: being drilled, is bored on multilayer production plate using the mode of machine drilling according to borehole data
This some holes following process is at plated through-hole, for interlayer route to be connected.Wherein, minimum using folder PIN drilling, the drilling of outer layer through-hole
It is folded to bore nozzle 0.35mm, drilling radius-thickness ratio 4.2577, internal layer PTH to line minimum range 0.18mm, the folded number 2PNL/ of drilling brill plate.
Plate face dust suction while drilling using the dust exhaust apparatus that negative pressure is 1.8PSI or more to production plate, and dust exhaust apparatus
Cleaning frequency be 4 times a day.In order to further ensure effect, it further provides that every work shift is both needed to cleaning dust suction dress in production
It sets, it is ensured that dust can be sucked away, and every first plate that bores need to clean table top.
(5) heavy copper plate electric: heavy copper plate electric process includes the nog plate washing successively carried out, de-smear, board-washing, deposits copper, is whole
Link is electroplated in plate.
Nog plate washes link, and the control of technological parameter is as follows: washing pressure is 1.5-2.3Kg/cm2(control point is
2.0Kg/cm2), ultrasonic power 1.8KW, temperature is 25-35 DEG C.It is in production it further provides that every in order to further ensure effect
Work shift needs to change washing, it is ensured that high-pressure washing pressure；And air knife is cleaned when maintaining weekly, it is dried with 75 ± 5 DEG C.
De-smear link, chemical degumming are primary.
Copper ring section is deposited, one layer of thin copper is deposited by way of chemical reaction on all hole walls of multilayer production plate, is
Subsequent electric plating of whole board provides basis, and backlight tests 10 grades, and the heavy copper thickness in hole is 0.5 μm.
Link is electroplated in whole plate, according to the mechanism of electrochemical reaction, upper one layer of copper is electroplated on the basis of heavy copper, to thicken copper
Layer.By heavy copper and electric plating of whole board process, edges of boards slot is made to metallize, forms metallization edges of boards slot.Wherein, area is electroplated in whole plate
33.5176dm2, hole copper average thickness control 25Microns, table copper minimum thickness control 70Microns, hole copper single-point it is minimum thick
Degree control 20Microns.The process parameter control of whole plate electroplating liquid medicine is as follows: CuSO4Concentration be 55-75g/L, H2SO4It is dense
Degree is 110-140mL/L-1, Cl-1Concentration be 50-70ppm.Control point are as follows: CuSO4Concentration be 65g/L, H2SO4Concentration
For 125mL/L-1, Cl-1Concentration be 60ppm；And the replacement of whole plate electroplating liquid medicine every three months is primary, whole plate electroplating liquid medicine uses
The filtering of efficient carbon core, recycles.
Cleaning is primary weekly for water washing cylinder used in heavy copper plate electric process, and be added into the water washing cylinder after cleaning water and
Bacteria remover, the concentration of the bacteria remover (dodecyl benzyl dimethyl ammonium chloride) are 0.2mL/L.
(6) make outer-layer circuit: making outer-layer circuit using positive blade technolgy, be successively: production is outer on multilayer production plate
Sandwich circuit figure then carries out outer graphics plating, and multilayer of then decorporating produces the outer-layer circuit figure on plate, then to multilayer
Production plate is successively etched, moves back tin processing, and outer-layer circuit is made on multilayer production plate.Including the outer layer successively carried out
Figure, outer graphics plating, outer layer etching work procedure.
6.1 outer graphics: by film, exposure, development, outer graphics are formed on the surface of multilayer production plate.
6.2 outer graphics plating: by way of plating, according to outer graphics, in the copper face not covered by outer graphics
On successively copper electroplating layer and plating tin layers.Outer graphics electroplating work procedure includes the copper facing pretreatment successively carried out, electro-coppering, tin plating
Pretreatment, electrotinning link.
The process parameter control of electro-coppering link, electro-coppering liquid medicine is as follows: CuSO4Concentration be 55-75g/L, H2SO4's
Concentration is 110-140mL/L-1, Cl-1Concentration be 50-70ppm.Control point are as follows: CuSO4Concentration be 65g/L, H2SO4It is dense
Degree is 125mL/L-1, Cl-1Concentration be 60ppm.The replacement of electroplating liquid medicine every three months is primary, and electro-coppering liquid medicine uses efficient carbon
Core filtering, recycles.
Cleaning is primary weekly for copper facing pretreatment and the tin plating water washing cylinder that uses of pretreatment link, and to the washing after cleaning
Water and bacteria remover are added in cylinder, the concentration of the bacteria remover (dodecyl benzyl dimethyl ammonium chloride) is 0.2mL/L.
The etching of 6.3 outer layers: the outer graphics of multilayer production plate surface are washed off into the layers of copper for making to be covered originally by outer graphics
It exposes, is then etched away exposed layers of copper with etching solution, multilayer is then produced into the tin layers on plate and is removed, is completed outer
The production of sandwich circuit.
(7) outer layer AOI: using automatic optical detecting system, by the comparison with CAM data, whether detects outer-layer circuit
There is the defects of open circuit, notch, not clean, short-circuit etching.
(8) green oil layer and silk-screen character, green oil thickness welding resistance, silk-screen character: are made by producing plate outer layer in multilayer are as follows:
10-50 μm, so as to so that multilayer production plate can reduce influence of the environmental change to it in the subsequent use process.
(9) surface treatment (heavy nickel gold): principle is learned in pad copper face Tonghua of welding resistance windowing position, and uniform deposition centainly requires thickness
The nickel layer and layer gold of degree, nickel layer thickness are as follows: 3-5 μm；Layer gold thickness are as follows: 0.05-0.1 μm.
(10) it forms: according to the prior art and pressing design requirement gong shape, PCB is made in the +/- 0.05mm of external form tolerance.
(11) electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(12) FQC: appearance, hole wall copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of production board etc. are checked whether
Meet the requirement of client.
(13) it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to production board, and put
Desiccant and humidity card, then shipment.
With process flow described in the present embodiment and process parameter control board making process, it is existing not occur the plated hole such as dust consent
As the slice analysis after, heavy copper plate electric and outer graphics plating show that plated hole works well, the problem of imperforate wall scarce copper, also not
There is the problem of heavy gassing of copper.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (9)
1. one kind prevents consent or the undesirable PCB production method of plated hole, including the following production process successively successively carried out:
Sawing sheet, internal layer circuit production, pressing, outer layer drilling, heavy copper plate electric, outer graphics, outer graphics plating, outer layer etching, welding resistance
Layer production, surface treatment, molding；The heavy copper plate electric process includes the nog plate washing successively carried out, de-smear, board-washing, deposition
Link is electroplated in copper, whole plate；The outer graphics electroplating work procedure includes the copper facing pretreatment successively carried out, electro-coppering, tin plating pre- place
Reason, electrotinning link；It is characterized in that,
Nog plate in the heavy copper plate electric process washes link, and the control of technological parameter is as follows: washing pressure is 1.5-2.3Kg/
cm2, ultrasonic power 1.8KW, temperature is 25-35 DEG C.
2. according to claim 1 prevent consent or the undesirable PCB production method of plated hole, which is characterized in that described
Link is electroplated in whole plate in heavy copper plate electric process, and the process parameter control of whole plate electroplating liquid medicine is as follows: CuSO4Concentration be 55-
75g/L, H2SO4Concentration be 110-140mL/L-1, Cl-1Concentration be 50-70ppm.
3. according to claim 2 prevent consent or the undesirable PCB production method of plated hole, which is characterized in that described
The replacement of whole plate electroplating liquid medicine every three months is primary.
4. according to claim 2 prevent consent or the undesirable PCB production method of plated hole, which is characterized in that described
Cleaning is primary weekly for water washing cylinder used in heavy copper plate electric process, and water and bacteria remover are added into the water washing cylinder after cleaning,
The concentration of the bacteria remover is 0.2mL/L.
5. according to claim 1 prevent consent or the undesirable PCB production method of plated hole, which is characterized in that described
Electro-coppering link in outer graphics electroplating work procedure, the process parameter control of electro-coppering liquid medicine are as follows: CuSO4Concentration be 55-
75g/L, H2SO4Concentration be 110-140mL/L-1, Cl-1Concentration be 50-70ppm.
6. according to claim 5 prevent consent or the undesirable PCB production method of plated hole, which is characterized in that described
The replacement of electroplating liquid medicine every three months is primary.
7. according to claim 6 prevent consent or the undesirable PCB production method of plated hole, which is characterized in that described
Cleaning is primary weekly for the water washing cylinder that copper facing pretreatment and tin plating pretreatment link in outer graphics electroplating work procedure use, and to
Water and bacteria remover are added in water washing cylinder after cleaning, the concentration of the bacteria remover is 0.2mL/L.
8. according to claim 1 prevent consent or the undesirable PCB production method of plated hole, which is characterized in that described
Plate face dust suction in outer layer drilling operating, while drilling using the dust exhaust apparatus that negative pressure is 1.8PSI or more to production plate.
9. according to claim 8 prevent consent or the undesirable PCB production method of plated hole, which is characterized in that described
The cleaning frequency of dust exhaust apparatus is 4 times a day.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811511976.XA CN109587968A (en) | 2018-12-11 | 2018-12-11 | One kind preventing consent or the undesirable PCB production method of plated hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811511976.XA CN109587968A (en) | 2018-12-11 | 2018-12-11 | One kind preventing consent or the undesirable PCB production method of plated hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109587968A true CN109587968A (en) | 2019-04-05 |
Family
ID=65929688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811511976.XA Pending CN109587968A (en) | 2018-12-11 | 2018-12-11 | One kind preventing consent or the undesirable PCB production method of plated hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109587968A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110167285A (en) * | 2019-04-18 | 2019-08-23 | 奥士康精密电路（惠州）有限公司 | A kind of management-control method reducing route inner cord open circuit, notch |
| CN110996566A (en) * | 2019-12-27 | 2020-04-10 | 大连崇达电路有限公司 | Manufacturing method of high-precision multilayer circuit board |
| CN112118678A (en) * | 2020-08-31 | 2020-12-22 | 珠海智锐科技有限公司 | Manufacturing method of packaging substrate |
| CN114828451A (en) * | 2022-04-29 | 2022-07-29 | 奥士康精密电路（惠州）有限公司 | Method for reducing copper-free scrap of acid etching electroplating hole |
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