CN112118678A - Manufacturing method of packaging substrate - Google Patents
Manufacturing method of packaging substrate Download PDFInfo
- Publication number
- CN112118678A CN112118678A CN202010894925.0A CN202010894925A CN112118678A CN 112118678 A CN112118678 A CN 112118678A CN 202010894925 A CN202010894925 A CN 202010894925A CN 112118678 A CN112118678 A CN 112118678A
- Authority
- CN
- China
- Prior art keywords
- copper
- double
- clad plate
- sided copper
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Abstract
The invention discloses a manufacturing method of a packaging substrate, which comprises the following steps: preparing a double-sided copper-clad plate with the thickness of 0.05mm to 0.1 mm; drilling a through hole on the double-sided copper-clad plate, wherein the aperture of the through hole is 0.1mm to 0.15 mm; copper is deposited, and a copper layer is deposited on the inner wall of the through hole, so that two copper layers of the double-sided copper-clad plate are conducted; etching, namely etching a circuit on two copper layers of the double-sided copper-clad plate, wherein the width of the circuit is d, and d is more than or equal to 1mil and less than or equal to 2 mil; printing oil, namely covering green solder resist ink on one surface of the double-sided copper-clad plate connected with the electronic element, and covering black solder resist ink on the other surface; and (3) manufacturing a bonding pad, wherein the double-sided copper-clad plate is provided with the bonding pad and a gold finger, the surface of the bonding pad is plated with gold, and the surface of the gold finger is sequentially plated with nickel and gold. In the circuit board manufacturing process, the green solder resist ink covers the side, connected with the electronic element, of the double-sided copper-clad plate, and compared with the black solder resist ink, the green solder resist ink is clearer, so that the circuit of the side, connected with the electronic element, of the double-sided copper-clad plate can be observed conveniently.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a manufacturing method of a packaging substrate.
Background
Solder resist ink is required to be printed on the circuit board, and the solder resist ink is used for protecting the circuit.
In the prior packaging substrate, the printing ink is printed on two surfaces of the packaging substrate, and the black printing ink is not easy to clearly see the circuit when the circuit is checked, so that the packaging substrate is inconvenient.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a manufacturing method of a packaging substrate, which can conveniently check the circuit on the produced circuit board.
According to a first aspect of the present invention, a method for manufacturing a package substrate includes the following steps:
preparing a double-sided copper-clad plate with the thickness of 0.05mm to 0.1 mm;
drilling a through hole on the double-sided copper-clad plate, wherein the aperture of the through hole is 0.1mm to 0.15 mm;
copper is deposited, and a copper layer is deposited on the inner wall of the through hole to conduct the two copper layers of the double-sided copper-clad plate;
etching, namely etching a circuit on two copper layers of the double-sided copper-clad plate, wherein the width of the circuit is d, and d is more than or equal to 1mil and less than or equal to 2 mil;
printing oil, namely covering green solder resist ink on one surface of the double-sided copper-clad plate connected with the electronic element, and covering black solder resist ink on the other surface;
and manufacturing a bonding pad, wherein the double-sided copper-clad plate is provided with the bonding pad and a gold finger, the surface of the bonding pad is plated with gold, and the surface of the gold finger is sequentially plated with nickel and gold.
The manufacturing method of the packaging substrate according to the embodiment of the invention at least has the following beneficial effects: in the circuit board manufacturing process, in the step of printing the oil, one side of the double-sided copper-clad plate, which is connected with the electronic component, is covered with green solder resist ink, and the green solder resist ink is clearer than black solder resist ink, so that the circuit of the side of the double-sided copper-clad plate, which is connected with the electronic component, can be observed conveniently; in the etching step, the width of the circuit etched by the two copper layers of the double-sided copper-clad plate is controlled to be 1-2 mil, so that the circuit is simplified, and more circuits are conveniently distributed; in the pad manufacturing step, nickel and gold are sequentially plated on the surface of the gold finger, so that the gold finger is prevented from being oxidized to increase resistance and influence conduction, the hardness of the gold finger can be increased, and external connection and plugging are facilitated.
According to some embodiments of the invention, the method further comprises a cutting step, wherein the cutting step is to cut the double-sided copper-clad plate to a preset size, so that the method is suitable for production and prevents the waste of the double-sided copper-clad plate.
According to some embodiments of the present invention, in the drilling step, dust generated during drilling is sucked away by using a dust collector, so that the dust generated during drilling is prevented from blocking the drilling hole and being sucked by people.
According to some embodiments of the invention, the method further comprises a film pressing step, wherein the film pressing step is arranged after copper deposition, corresponding dry films are covered on two surfaces of the double-sided copper-clad plate after hole drilling, and the dry films are arranged to facilitate circuit development.
According to some embodiments of the invention, the method further comprises an exposure step, wherein in the exposure step, a film and the double-sided copper-clad plate pressed with the dry film are aligned, a circuit on the film is transferred to the dry film by using an exposure machine, and the exposure is carried out to transfer the drawn circuit to the dry film.
According to some embodiments of the invention, the method further comprises a developing step, wherein in the developing step, the dry film on the circuit is removed by using a developing solution so as to leak out the copper foil layer of the double-sided copper-clad plate, so that the circuit on the double-sided copper-clad plate can be seen clearly.
According to some embodiments of the invention, the method further comprises a copper plating step, wherein in the copper plating step, the developed double-sided copper-clad plate is plated with copper, and the copper-plated part of the dry film, which leaks copper, is filled with copper, so that a circuit can be conveniently formed on the double-sided copper-clad plate through the copper plating filling.
According to some embodiments of the invention, the method further comprises a tinning step of covering a tin layer on the copper-plated wire, wherein the tinning step prevents the etching solution from etching the copper wire to break or thin the wire.
According to some embodiments of the present invention, an etching step is provided after the copper plating step, wherein the dry film is removed and the copper foil layer is etched away to leave the copper wiring plated in the copper plating step.
According to some embodiments of the present invention, characters and indicia are printed on the circuit board finished with the ink.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a package substrate according to an embodiment of the invention.
The double-sided copper-clad plate comprises a double-sided copper-clad plate 100, a through hole 110, a dry film 200, a copper foil layer 120 and a tin layer 300.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and more than, less than, more than, etc. are understood as excluding the present number, and more than, less than, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, a method for manufacturing a package substrate includes the following steps:
preparing a double-sided copper-clad plate 100 with the thickness of 0.05mm to 0.1 mm;
drilling a through hole 110 on the double-sided copper-clad plate 100, wherein the aperture of the through hole 110 is 0.1mm to 0.15 mm;
copper deposition, namely depositing a copper layer on the inner wall of the through hole 110 to conduct two copper layers of the double-sided copper-clad plate 100;
etching, namely etching a circuit on two copper layers of the double-sided copper-clad plate 100, wherein the width of the circuit is d, and d is more than or equal to 1mil and less than or equal to 2 mil;
printing oil, namely covering green solder resist ink on one surface of the double-sided copper-clad plate 100 connected with the electronic element, and covering black solder resist ink on the other surface;
and (3) manufacturing a bonding pad, wherein the double-sided copper-clad plate 100 is provided with the bonding pad and a gold finger, the surface of the bonding pad is plated with gold, and the surface of the gold finger is sequentially plated with nickel and gold.
In the circuit board manufacturing process, in the step of printing the oil, the side, connected with the electronic component, of the double-sided copper-clad plate 100 is covered with green solder resist ink, and the green solder resist ink is clearer than black solder resist ink, so that the circuit on the side, connected with the electronic component, of the double-sided copper-clad plate 100 can be observed conveniently; in the etching step, the width of the circuit etched by the two copper layers of the double-sided copper-clad plate 100 is controlled to be 1mil to 2 mils, so that the circuit is simplified, and more circuits are conveniently distributed; in the pad manufacturing step, nickel and gold are sequentially plated on the surface of the gold finger, so that the gold finger is prevented from being oxidized to increase resistance and influence conduction, the hardness of the gold finger can be increased, and external connection and plugging are facilitated. It can be understood that covering the green solder resist ink on the side of the double-sided copper-clad plate 100 connected to the electronic components can also reduce eye fatigue of production or maintenance personnel, and the black solder resist ink on the other side of the double-sided copper-clad plate 100 is provided to facilitate shielding the other side of the double-sided copper-clad plate 100, so that the other side of the double-sided copper-clad plate 100 is simpler. It can be understood that, in order to prevent the external electromagnetic wave from interfering the signal in the line, a shielding net is embedded on the green solder resist ink and the black solder resist ink, and the shielding net is made of a copper net or a tin net. It can be understood that, since the package substrate is commonly used in the memory card, and the trend of the current memory card is toward light weight and miniaturization, the thickness of the package substrate needs to be reduced, and the thickness of the package substrate can be reduced by using the double-sided copper clad laminate 100 with the thickness of 0.05mm to 0.1mm, so that a smaller memory card can be manufactured. Note that 1mil equals 0.0254 mm. It can be understood that, in the soldering process, the molten tin metal easily drips into the through hole 110 on the double-sided copper-clad plate 100, easily cause the short circuit of the line, the aperture of the through hole 110 is set to be 0.1mm to 0.15mm, the through hole 110 is more easily plugged by the solder resist ink, when the aperture of the through hole 110 is less than 0.1mm, the solder resist ink is not easy to enter, when the aperture of the through hole 110 is greater than 0.15mm, the arrangement space of the line can be extruded, therefore, the aperture of the through hole 110 is set to be 0.1mm to 0.15 mm.
In some embodiments, the method further comprises a cutting step, wherein the cutting step is to cut the double-sided copper-clad plate 100 to a preset size, so that the production is adapted, and the waste of the double-sided copper-clad plate 100 is prevented. In the cutting step, a cutting machine or a plate shearing machine is used for cutting the double-sided copper-clad plate 100, so that the length and width of the double-sided copper-clad plate 100 reach the preset size.
In some embodiments, in the drilling step, dust generated during drilling is sucked away by using a dust collector, so that the drilling is prevented from being blocked by the dust generated during drilling, and the dust is also prevented from being sucked by people. It will be appreciated that the cleaner may be mounted on the drill bit to draw dust from the drill hole whilst drilling; the dust collector is common equipment, and in the drilling step, the dust collector includes negative pressure fan and the straw of intercommunication negative pressure fan, is connected with the suction nozzle on the straw, and during drilling, negative pressure fan starts, and the dust that the suction nozzle produced will drill away.
In some embodiments, the method further comprises a film pressing step, wherein the film pressing step is arranged after copper deposition, corresponding dry films 200 are covered on two surfaces of the drilled double-sided copper-clad plate 100, and the dry films 200 are arranged to facilitate development of the circuit.
In some embodiments, the method further comprises an exposure step, in the exposure step, the film and the double-sided copper-clad plate 100 pressed with the dry film 200 are aligned, the circuit on the film is transferred to the dry film 200 by using an exposure machine, and the exposure is performed to transfer the drawn circuit to the dry film 200. It can be understood that the dry film has the local line pattern of circuit to hide, not by the exposure, the place that does not have the circuit then is exposed, the exposure makes the dry film glue on the face of two-sided copper-clad plate 100, and the circuit part that does not have by the exposure can expose the copper layer, the state of two-sided copper-clad plate 100 this moment is, there is the part of circuit to form the circuit recess, can fill up the recess when the copper electroplating, dry film with on the two-sided copper-clad plate 100 again at this moment washs, only leaves the copper circuit.
In some embodiments, the method further comprises a developing step, wherein the dry film 200 on the circuit is removed by using a developing solution to leak the copper foil layer 120 of the double-sided copper-clad plate 100, so that the circuit on the double-sided copper-clad plate 100 can be seen clearly.
In some embodiments, the method further comprises a copper plating step, wherein in the copper plating step, the developed double-sided copper-clad plate 100 is plated with copper, and the copper-plated part of the dry film 200, which leaks copper, is filled with copper, so that a circuit can be conveniently formed on the double-sided copper-clad plate 100 through the copper plating filling.
In some embodiments, a tin plating step is also included, in which a tin layer 300 is coated on the copper-plated wires, and the tin plating prevents the etching solution from etching the copper wires, causing the wires to be broken or thinned. It is understood that the tin layer 300 may be an aluminum layer, a zinc layer, or the like.
In some embodiments, an etching step is provided after the copper plating step, wherein the dry film 200 is removed and the copper foil layer 120 is etched away to leave the copper traces plated in the copper plating step.
In some embodiments, the printed circuit board is printed with characters and indicia. It should be noted that, in order to facilitate the subsequent installation of the electronic component, characters and marks are printed at corresponding positions on the circuit board.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. A manufacturing method of a package substrate is characterized by comprising the following steps:
preparing a double-sided copper-clad plate (100) with the thickness of 0.05mm to 0.1 mm;
drilling a through hole (110) on the double-sided copper-clad plate (100), wherein the aperture of the through hole (110) is 0.1mm to 0.15 mm;
copper is deposited, a copper layer is deposited on the inner wall of the through hole (110), and two copper layers of the double-sided copper-clad plate (100) are conducted;
etching, namely etching a circuit on two copper layers of the double-sided copper-clad plate (100), wherein the width of the circuit is d, and d is more than or equal to 1mil and less than or equal to 2 mil;
printing oil, wherein one surface of the double-sided copper-clad plate (100) connected with the electronic element is covered with green solder resist ink, and the other surface is covered with black solder resist ink;
and (2) manufacturing a bonding pad, wherein the double-sided copper-clad plate (100) is provided with the bonding pad and a gold finger, the surface of the bonding pad is plated with gold, and the surface of the gold finger is sequentially plated with nickel and gold.
2. The method of claim 1, wherein: the method also comprises a cutting step, wherein the cutting step is to cut the double-sided copper-clad plate (100) to a preset size.
3. The method of claim 1, wherein: in the drilling step, dust generated during drilling is sucked away by using a dust collector.
4. The method of claim 1, wherein: the method further comprises a film pressing step, wherein the film pressing step is arranged after copper deposition, and corresponding dry films (200) are covered on two surfaces of the double-sided copper-clad plate (100) after hole drilling.
5. The method of claim 4, wherein: the method comprises the following steps of aligning a film and the double-sided copper-clad plate (100) pressed with the dry film (200) and transferring a line on the film to the dry film (200) by using an exposure machine.
6. The method of claim 5, wherein: the method further comprises a developing step, wherein in the developing step, the dry film (200) on the circuit is removed by utilizing a developing solution so as to leak out the copper foil layer (120) of the double-sided copper-clad plate (100).
7. The method of claim 6, wherein: the method also comprises a copper plating step, wherein in the copper plating step, the developed double-sided copper-clad plate (100) is plated with copper, and the part of the dry film (200) which leaks copper is plated with copper and filled.
8. The method of claim 7, wherein: also includes a tin plating step in which a tin layer (300) is coated on the copper-plated wiring.
9. The method of claim 8, wherein: the etching step is arranged after the copper plating step, in the etching step, the dry film (200) is removed firstly, then the copper foil layer (120) is etched away, and a copper circuit plated in the copper plating step is reserved.
10. The method of claim 1, wherein: and printing characters and marks on the circuit board which is finished by the printing oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010894925.0A CN112118678A (en) | 2020-08-31 | 2020-08-31 | Manufacturing method of packaging substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010894925.0A CN112118678A (en) | 2020-08-31 | 2020-08-31 | Manufacturing method of packaging substrate |
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| CN112118678A true CN112118678A (en) | 2020-12-22 |
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| CN202010894925.0A Pending CN112118678A (en) | 2020-08-31 | 2020-08-31 | Manufacturing method of packaging substrate |
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| CN111050482A (en) * | 2019-12-31 | 2020-04-21 | 南京奥亚美电子科技有限公司 | PCB board trompil device for electron processing |
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Application publication date: 20201222 |