CN211267243U

CN211267243U - Circuit board

Info

Publication number: CN211267243U
Application number: CN201922345502.9U
Authority: CN
Inventors: 任德锟; 刘增标; 张含
Original assignee: Zhuhai Wise Sharp Technologies Ltd
Current assignee: Zhuhai Wise Sharp Technologies Ltd
Priority date: 2019-12-23
Filing date: 2019-12-23
Publication date: 2020-08-14
Anticipated expiration: 2029-12-23

Abstract

The utility model discloses a circuit board, which comprises a solder mask layer which is arranged from top to bottom in sequence; the circuit layer is provided with a plurality of welding pads, and the welding pads protrude from the solder mask layer; the lower end of the base layer is connected with a radiating fin. The heat of circuit board can be absorbed to the fin of basic unit lower extreme connection, reduces the heat on the circuit layer on the circuit board, gives off the heat to the air with the help of the fin simultaneously, sets up the fin can prevent because of the influence that the temperature risees and cause the circuit layer. It can be understood that the circuit layer is generally made of conductive metal, and when the temperature is increased, the resistance of the general conductive metal will be increased, which increases the consumption of electric energy, causes the current to be reduced, and affects the operation of the electrical components. The pads are used for soldering electrical components and the pads protrude from the solder mask to facilitate soldering. The purpose of providing a plurality of pads is to enable connection of a plurality of electrical components. The heat sink is attached to the lower end of the base layer to maintain a large area for absorbing heat from the circuit board and dissipating heat into the air.

Description

Circuit board

Technical Field

The utility model relates to a circuit board technical field, in particular to circuit board.

Background

In some LED lamps, the structure is mainly that a plurality of lamp beads are connected on a circuit board, and the lamp beads are arranged tightly by utilizing the characteristic of a circuit board centralized circuit.

In the field of the conventional LED lamp, the lamp beads are often connected to a hard circuit board, the hard circuit board cannot be rolled and reduced in size, the hard circuit board is inconvenient to carry, and the hard circuit board is easy to break; meanwhile, the lamp bead of the LED lamp is difficult to radiate heat.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a circuit board can make the circuit board heat dissipation.

According to the utility model discloses a circuit board of first aspect embodiment, include from the top to the solder mask that sets gradually down; a circuit layer provided with a plurality of pads protruding from the solder resist layer; the lower end of the base layer is connected with a radiating fin.

According to the utility model discloses a circuit board has following beneficial effect at least: the heat dissipation fin that basic unit's lower extreme is connected can absorb the heat of circuit board, reduces on the circuit board the heat on circuit layer simultaneously with the help of the heat dissipation fin gives off the heat to the air in, sets up the influence that the heat dissipation fin can prevent to cause circuit layer because of the temperature rise.

According to the utility model discloses a some embodiments, the circuit board sets up to the rectangle, four angles of circuit board all are provided with the mounting hole, the mounting hole can easy to assemble the circuit board, simultaneously the mounting hole sets up at the rectangle four angles of circuit board, four promptly the mounting hole is in the installation during the circuit board, can balance the atress, prevents the circuit board is torn.

According to some embodiments of the utility model, the fin lower extreme is provided with the arch, the arch can increase the heat radiating area of fin makes things convenient for the heat dissipation more.

According to the utility model discloses a some embodiments, protruding intercrossing sets up, the cross arrangement protruding when the installation can increase frictional force between circuit board and the installation department.

According to the utility model discloses a some embodiments, be provided with grafting portion on the circuit board, grafting portion covers there is the shielding film, the shielding film is used for shielding electromagnetic signal, prevents external disturbance or prevents the electromagnetic signal that grafting portion gived off disturbs the external world, can insulate simultaneously, prevents grafting portion electric leakage.

According to some embodiments of the utility model, the barrier film includes plastic film and embedding barrier net in the plastic film, through the plastic film is embedded the consumptive material is practiced thrift to the mode of barrier net, simultaneously the plastic film can prevent barrier net oxidation to the barrier film has shielding and insulating function concurrently.

According to some embodiments of the present invention, the base layer is made of polyvinyl chloride soft plastic, and the polyvinyl chloride plastic has low cost, strong oxidation resistance, heat resistance and corrosion resistance.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a left-right direction cross-sectional view of a circuit board according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of the front side of the wiring board shown in FIG. 1;

fig. 3 is a schematic structural view of the back surface of the wiring board shown in fig. 1.

Solder mask layer 100, wiring layer 200, pad 210, base layer 300, heat sink 310, mounting hole 400, bump 311, plug 500, shielding film 510, plastic film 511, and shielding mesh 512.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality means two or more, and the terms greater than, less than, more than, etc. are understood not to include the number.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

Referring to fig. 1 to 3, a circuit board includes a solder resist layer 100 sequentially disposed from top to bottom; a wiring layer 200 provided with a plurality of pads 210, the pads 210 protruding from the solder resist layer 100; the base layer 300 has a heat sink 310 attached to the lower end thereof. The heat sink 310 connected to the lower end of the base layer 300 can absorb heat from the circuit board, reduce heat from the circuit layer 200 on the circuit board, and dissipate heat to the air by means of the heat sink 310, and the heat sink 310 can prevent the circuit layer 200 from being affected by temperature rise. It is understood that the circuit layer 200 is generally made of conductive metal, and when the temperature is increased, the resistance of the generally conductive metal will be increased, which increases the power consumption, causes the current to be reduced, and affects the operation of the electrical components. It is understood that the pads 210 are used for soldering electrical components and that the pads 210 protrude from the solder mask layer 100 to facilitate soldering. Note that the plurality of pads 210 are provided for the purpose of enabling connection of a plurality of electrical components. It will be appreciated that the heat sink 310 is attached to the lower end of the base layer 300 to maintain a large area for absorbing heat from the circuit board and dissipating heat into the air.

In some embodiments, the circuit board is set to be rectangular, the four corners of the circuit board are all provided with the mounting holes 400, the mounting holes 400 can facilitate the installation of the circuit board, and meanwhile, the mounting holes 400 are set at the four corners of the rectangular circuit board, that is, the four mounting holes 400 can balance the stress when the circuit board is installed, so as to prevent the circuit board from being torn. It is noted that the circuit board is only configured to be rectangular in a general case, and in some embodiments, the circuit board may also be configured to be oval, circular or other irregular shapes.

In some embodiments, the lower end of the heat sink 310 is provided with a protrusion 311, the protrusion 311 may increase the heat dissipation area of the heat sink 310, so as to facilitate heat dissipation, it should be noted that the protrusion 311 is provided in plural, and the plurality of protrusions 311 may increase the heat dissipation area of the heat sink 310 more, and in some embodiments, the protrusion 311 may be provided as a sheet structure.

In some embodiments, the protrusions 311 are disposed to cross each other, and the cross protrusions 311 can increase the friction between the circuit board and the mounting portion when mounted, thereby preventing the circuit board from being twisted due to the play of the circuit board and preventing the wires of the circuit layer from being broken.

In some embodiments, the circuit board is provided with a plug portion 500, the plug portion 500 is covered with a shielding film 510, the shielding film 510 is used for shielding electromagnetic signals, preventing external interference or electromagnetic signals emitted by the plug portion 500 from interfering with the external environment, and at the same time, the shielding film can insulate to prevent the plug portion 500 from leaking electricity, and it is understood that the plug portion 500 is used for connecting a power supply or other devices.

In some embodiments, shielding film 510 may also be painted with an insulating paint.

In some embodiments, the shielding film 510 includes a plastic film 511 and a shielding net 512 embedded in the plastic film 511, the plastic film 511 is embedded in the shielding net 512, so that consumables are saved, the plastic film 511 can prevent the shielding net 512 from being oxidized, and the shielding film 510 has both shielding and insulating functions. It is understood that the shielding mesh 512 may be a copper mesh or an iron or aluminum mesh.

In some embodiments, the base layer 300 is made of polyvinyl chloride soft plastic, which has low cost, strong oxidation resistance, heat resistance, and corrosion resistance.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims

1. The utility model provides a circuit board, its characterized in that includes from last to setting gradually down:

a solder resist layer (100);

a wiring layer (200) provided with a plurality of pads (210), the pads (210) protruding from the solder resist layer (100);

the lower end of the base layer (300) is connected with a radiating fin (310).

2. A wiring board according to claim 1, wherein: the circuit board sets up to the rectangle, four angles of circuit board all are provided with mounting hole (400).

3. A wiring board according to claim 1, wherein: the lower end of the radiating fin (310) is provided with a bulge (311).

4. A circuit board according to claim 3, wherein: the projections (311) are arranged to cross each other.

5. A wiring board according to claim 1, wherein: the circuit board is provided with a plug-in part (500), and the plug-in part (500) is covered with a shielding film (510).

6. A circuit board according to claim 5, wherein: the shielding film (510) includes a plastic film (511) and a shielding mesh (512) embedded in the plastic film (511).

7. A wiring board according to claim 1, wherein: the base layer (300) is made of polyvinyl chloride soft plastic.