CN209930601U - Printed circuit board with blind hole buried hole - Google Patents
Printed circuit board with blind hole buried hole Download PDFInfo
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- CN209930601U CN209930601U CN201821970498.4U CN201821970498U CN209930601U CN 209930601 U CN209930601 U CN 209930601U CN 201821970498 U CN201821970498 U CN 201821970498U CN 209930601 U CN209930601 U CN 209930601U
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- fixed frame
- circuit board
- hole
- layer
- printed circuit
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Abstract
The utility model discloses a take blind hole to bury printed circuit board in hole, including copper foil layer, mounting surface and fixed frame, evenly install the copper foil layer on the both sides inner wall of fixed frame, and all be provided with the core between the fixed frame both sides inner wall of copper foil layer below, be provided with the through-hole between the fixed frame both ends inner wall, bury the inside intermediate position department of hole one side fixed frame and be provided with the second blind hole, the inboard of fixed frame is provided with the dust screen, and the inboard of dust screen is provided with the heat-conducting plate, the circuit board is installed to the inboard of heat-conducting plate, evenly be provided with the louvre on the inner wall of fixed frame. The utility model discloses an inboard at fixed frame is provided with the dust screen, has realized preventing that the dust from getting into the function of circuit board to the life of extension circuit board easily uses widely.
Description
Technical Field
The utility model relates to a printed circuit board technical field specifically is a take printed circuit board of blind hole buried via hole.
Background
Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. Printed circuit board is the basic condition that present electronic product used, but some have blind holes and buried via's printed circuit board when using, inconvenient firm and heat dissipation, consequently reduced electronic product's life, some printed circuit boards in addition have the dust to enter into when using easily and adsorb on the circuit board, consequently reduced the heat dissipation of circuit board for electronic component high efficiency generates heat for a long time and damages, and then can not guarantee electronic product life-span.
And the existing printed circuit board with the blind hole and the buried hole does not have the functions of good heat dissipation effect, strong stability and good insulating property.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a take blind hole to bury printed circuit board in hole to the current printed circuit board of taking blind hole to bury hole that proposes in solving above-mentioned background does not have the functional problem that the radiating effect is good, stability is strong and insulating properties is good.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a take blind hole to bury printed circuit board in hole, includes copper foil layer, mounting surface and fixed frame, evenly install the copper foil layer on the both sides inner wall of fixed frame, and all be provided with the core between the fixed frame both sides inner wall of copper foil layer below, be provided with the through-hole between the fixed frame both ends inner wall, and the inside bottom of the fixed frame of through-hole one side is provided with the hole of burying, the inside intermediate position department of the fixed frame in hole one side is provided with the second blind hole, and the inside signal circuit layer that is provided with of the fixed frame of second blind hole one side, the inboard of fixed frame is provided with the dust screen, and the inboard of dust screen is provided with the heat-conducting plate, the circuit board is installed to the inboard of heat.
Preferably, a conducting layer is arranged between the inner walls of the two sides of the fixed frame at the top end of the core plate, and an insulating layer is arranged between the inner walls of the two sides of the fixed frame at the top end of the conducting layer.
Preferably, a signal layer reserved groove is formed in the fixed frame on one side of the signal circuit layer, and a first blind hole is formed in the fixed frame above the signal layer reserved groove.
Preferably, the top end of the circuit board is provided with a mounting surface, and one side of the top end of the mounting surface is provided with a circuit pattern layer.
Preferably, a through hole is formed between the two ends of the circuit board, and a mounting hole is formed in the top end of the circuit board.
Preferably, the top end of the mounting surface on one side of the circuit pattern layer is uniformly provided with blind hole welding pins, and the top end of the mounting surface on one side of the blind hole welding pins is uniformly provided with mounting holes.
Compared with the prior art, the beneficial effects of the utility model are that: the printed circuit board with blind hole buried holes realizes the function of enhancing the service performance of the circuit board by evenly installing copper foil layers on the inner walls of two sides of a fixed frame at the top end of a core board, realizes the function of stabilizing electric transmission by arranging a conductive layer between the inner walls of two sides of the fixed frame at the top end of the conductive layer, realizes the function of insulation by arranging an insulating layer between the inner walls of two sides of the fixed frame at the top end of the conductive layer, realizes the function of ensuring the stability of received signals by arranging a signal circuit layer in the fixed frame at one side of a second blind hole, realizes the function of preventing dust from entering the circuit board by arranging a dust screen at the inner side of the fixed frame, realizes the function of leading out heat on the circuit board by arranging a heat conducting plate at the inner side of the dust screen, realizes the function of radiating the circuit board by evenly arranging radiating holes on the inner wall of a, thereby prolonging the service life of the circuit board.
Drawings
FIG. 1 is a schematic sectional view of the present invention;
FIG. 2 is a schematic view of the fixed frame structure of the present invention;
fig. 3 is a schematic front structural view of the present invention;
fig. 4 is an enlarged schematic view of the structure at a of the present invention;
in the figure: 1. a core board; 2. a copper foil layer; 3. a first blind hole; 4. fixing the frame; 5. a through hole; 6. an insulating layer; 7. a conductive layer; 8. burying a hole; 9. a second blind hole; 10. a signal circuit layer; 11. reserving a groove in a signal layer; 12. a heat conducting plate; 13. a dust screen; 14. a circuit board; 15. heat dissipation holes; 16. a circuit pattern layer; 17. a mounting surface; 18. welding pins through blind holes; 19. and (7) installing holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: a printed circuit board with blind hole buried holes comprises a copper foil layer 2, a mounting surface 17 and a fixed frame 4, wherein the inner walls of two sides of the fixed frame 4 are uniformly provided with the copper foil layer 2, a core plate 1 is arranged between the inner walls of two sides of the fixed frame 4 below the copper foil layer 2, a conducting layer 7 is arranged between the inner walls of two sides of the fixed frame 4 at the top end of the core plate 1, an insulating layer 6 is arranged between the inner walls of two sides of the fixed frame 4 at the top end of the conducting layer 7, a through hole 5 is arranged between the inner walls of two ends of the fixed frame 4, a buried hole 8 is arranged at the bottom end in the fixed frame 4 at one side of the through hole 5, a second blind hole 9 is arranged at the middle position in the fixed frame 4 at one side of the buried hole 8, a signal circuit layer 10 is arranged in the fixed frame 4 at one side of the second blind hole 9, a signal layer reserved groove 11 is arranged in the fixed frame, the inboard of fixed frame 4 is provided with dust screen 13, and the inboard of dust screen 13 is provided with heat-conducting plate 12, circuit board 14 is installed to the inboard of heat-conducting plate 12, evenly be provided with louvre 15 on the inner wall of fixed frame 4, the top of circuit board 14 is provided with mounting surface 17, and one side on mounting surface 17's top is provided with circuit pattern layer 16, the mounting surface 17 top of circuit pattern layer 16 one side evenly is provided with blind hole welding pin 18, and the mounting surface 17 top of blind hole welding pin 18 one side evenly is provided with mounting hole 19.
The working principle is as follows: during the use, install and use through evenly being provided with blind hole welding pin 18 and mounting hole 19 on mounting surface 17, rethread fixed frame 4 outside is equipped with the installation mounting, be convenient for circuit board 14 to install and use, give heat-conducting plate 12 through circuit board 14 again the heat transmission and dispel the heat, fixed frame 4 frame middle part is equipped with a plurality of louvres 15, can carry out the heat dissipation and handle, and be provided with dust screen 13 and prevent that the dust from entering into in circuit board 14, and service life is prolonged, the top of rethread conducting layer 7 all is provided with insulating layer 6, realize circuit board 14's insulating nature, the top of core 1 all is provided with conducting layer 7, can strengthen circuit board 14's performance, and the precision is improved.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a take printed circuit board of blind hole buried via hole, includes copper foil layer (2), mounting surface (17) and fixed frame (4), its characterized in that: copper foil layers (2) are uniformly arranged on the inner walls of the two sides of the fixed frame (4), and a core plate (1) is arranged between the inner walls of the two sides of a fixed frame (4) below the copper foil layer (2), a through hole (5) is arranged between the inner walls of the two ends of the fixed frame (4), and the bottom end inside the fixed frame (4) at one side of the through hole (5) is provided with a buried hole (8), a second blind hole (9) is arranged in the middle position inside the fixed frame (4) at one side of the buried hole (8), a signal circuit layer (10) is arranged in the fixed frame (4) at one side of the second blind hole (9), a dust screen (13) is arranged at the inner side of the fixed frame (4), and the inner side of the dustproof net (13) is provided with a heat conducting plate (12), the inner side of the heat conducting plate (12) is provided with a circuit board (14), the inner wall of the fixed frame (4) is uniformly provided with heat dissipation holes (15).
2. The printed circuit board with blind buried vias of claim 1, wherein: the conductive layer (7) is arranged between the inner walls of the two sides of the fixed frame (4) at the top end of the core plate (1), and the insulating layer (6) is arranged between the inner walls of the two sides of the fixed frame (4) at the top end of the conductive layer (7).
3. The printed circuit board with blind buried vias of claim 1, wherein: a signal layer reserved groove (11) is formed in the fixed frame (4) on one side of the signal circuit layer (10), and a first blind hole (3) is formed in the fixed frame (4) above the signal layer reserved groove (11).
4. The printed circuit board with blind buried vias of claim 1, wherein: the top end of the circuit board (14) is provided with a mounting surface (17), and one side of the top end of the mounting surface (17) is provided with a circuit pattern layer (16).
5. The printed circuit board with blind buried vias of claim 1, wherein: a through hole (5) is formed between the two ends of the circuit board (14), and a mounting hole (19) is formed in the top end of the circuit board (14).
6. The printed circuit board with blind buried vias of claim 4, wherein: the top end of the mounting surface (17) on one side of the circuit pattern layer (16) is uniformly provided with blind hole welding pins (18), and the top end of the mounting surface (17) on one side of the blind hole welding pins (18) is uniformly provided with mounting holes (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821970498.4U CN209930601U (en) | 2018-11-28 | 2018-11-28 | Printed circuit board with blind hole buried hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821970498.4U CN209930601U (en) | 2018-11-28 | 2018-11-28 | Printed circuit board with blind hole buried hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209930601U true CN209930601U (en) | 2020-01-10 |
Family
ID=69064306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821970498.4U Active CN209930601U (en) | 2018-11-28 | 2018-11-28 | Printed circuit board with blind hole buried hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209930601U (en) |
-
2018
- 2018-11-28 CN CN201821970498.4U patent/CN209930601U/en active Active
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