CN215581881U - Printed circuit board with heat radiation structure - Google Patents
Printed circuit board with heat radiation structure Download PDFInfo
- Publication number
- CN215581881U CN215581881U CN202121728816.8U CN202121728816U CN215581881U CN 215581881 U CN215581881 U CN 215581881U CN 202121728816 U CN202121728816 U CN 202121728816U CN 215581881 U CN215581881 U CN 215581881U
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- CN
- China
- Prior art keywords
- circuit board
- protection plate
- heat
- groups
- heat conducting
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 title claims description 4
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 10
- 239000010951 brass Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of circuit boards, and discloses a printed circuit board with a heat dissipation structure, which comprises a circuit board body, a first protection plate, a second protection plate, a heat dissipation sheet and heat conduction wires, wherein a plurality of groups of heat dissipation grids are arranged on the first protection plate, the second protection plate has the same structure as the first protection plate, the first protection plate and the second protection plate are combined to form a protection box, the surfaces of the first protection plate and the second protection plate are respectively plated with a layer of brass, a plurality of groups of lead ports are arranged on the side surface of the protection box formed by combining the first protection plate and the second protection plate, the lead ports are connected with the inside of a cavity of the protection box, and an insulating layer is adhered on the surface of each lead port. The temperature of the circuit board can be quickly reduced, and the circuit board can be protected from being damaged due to overhigh temperature.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a printed circuit board with a heat dissipation structure.
Background
The circuit board is a provider of electrical connection of electronic components, in the global electronic era, various electronic products cannot be separated from the circuit board, the quality of the circuit board influences the service life of the electronic products, and the electronic components can generate a large amount of heat during working, so the heat dissipation capacity of the circuit board is very important.
The existing circuit board is embedded in a machine body, so that heat dissipation is difficult, and the circuit board is easily damaged by heat generated by electronic elements after long-time work.
To this end, we have devised a printed circuit board with a heat dissipation structure.
Disclosure of Invention
In view of the deficiencies of the prior art, the present invention provides a printed circuit board with a heat dissipation structure, which solves the problems of the prior art.
In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides a printed circuit board with heat radiation structure, includes circuit board body, first guard plate, second guard plate, fin and heat conduction silk, seted up a plurality of groups heat dissipation grid on the first guard plate, the second guard plate is the same with first guard plate structure, and first guard plate and the combination of second guard plate form the guard box, and one deck brass has been plated respectively to first guard plate and second guard plate surface.
Furthermore, a plurality of groups of lead ports are formed in the side face of the protection box formed by combining the first protection plate and the second protection plate, the lead ports are connected with the inside of the cavity of the protection box, and an insulating layer is adhered to the surface of each lead port.
Furthermore, the upper surface of the circuit board body is provided with a plurality of groups of heat conducting grooves which are intersected horizontally and vertically.
Furthermore, heat conduction wires are arranged in the heat conduction grooves and are placed in the heat conduction grooves, and the heat conduction wires are made of brass materials.
Further, both sides face is equipped with a plurality of groups of fin respectively around the circuit board body, and the fin surface has plated brass, and the blind hole has been seted up to the fin lower surface, is equipped with L type mounting bracket between fin and the circuit board body, mounting bracket one end and circuit board body fixed connection, and the mounting bracket other end inlays in the fin blind hole.
Furthermore, the side surface of the heat dissipation plate is provided with a fixing hole, a group of heat conducting wires are arranged in the fixing hole, the heat conducting wires penetrate through the plurality of groups of heat dissipation fins around the circuit board body in a circle, and the heat conducting wires in the heat conducting grooves are wound on the heat conducting wires penetrating through the heat dissipation fins.
The utility model has the beneficial effects that: 1. the utility model discloses a, through addding the heat conduction groove, because the heat conduction silk is the metal, not only heat conduction, the electric conductivity is also stronger, puts the heat conduction silk in the heat conduction groove, has effectively solved the circuit board and has often leaded to components and parts on the circuit board and the problem that the short circuit takes place because of increasing the fin at will with the fin contact.
2. The utility model discloses a, seted up the heat dissipation grid on first guard plate and the second guard plate, increase and the area of contact of air, with the back on heat conduction to the guard plate on the circuit board, the heat can be conducted to the air fast, has effectively solved present circuit board because the embedding is inside the organism, the heat dissipation difficulty, the heat that long-time work back electronic component produced is the problem of circuit board damage easily.
Drawings
FIG. 1 is a schematic structural view of the present invention; FIG. 2 is a schematic structural diagram of a circuit board body according to the present invention; FIG. 3 is a schematic structural diagram of the heat sink and the circuit board body according to the present invention.
In the figure: 1. a first guard plate; 2. a second guard plate; 3. a wire leading port; 4. a heat dissipation grid; 5. a heat sink; 6. a heat conducting groove; 7. heat conducting wires; 8. a fixing hole; 9. a mounting frame; 10. the circuit board body.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a printed circuit board with a heat dissipation structure includes a circuit board body 10, a first protection plate 1, a second protection plate 2, a heat sink 5 and heat conducting wires 7, wherein a plurality of groups of heat dissipation grids 4 are disposed on the first protection plate 1, the second protection plate 2 has the same structure as the first protection plate 1, the first protection plate 1 and the second protection plate 2 are combined to form a protection box, and a layer of brass is plated on the surfaces of the first protection plate 1 and the second protection plate 2 respectively.
Wherein, a plurality of groups of lead ports 3 are opened to the side of the protection box that first guard plate 1 and second guard plate 2 make up, inside lead port 3 connected protection box cavity, lead port 3 surface paste has a layer of insulating layer.
Referring to fig. 2, the upper surface of the circuit board body 10 is provided with heat conducting grooves 6, the heat conducting grooves 6 are provided with a plurality of groups, and the groups of heat conducting grooves 6 are intersected horizontally and vertically.
Wherein, be equipped with heat conduction silk 7 in the heat conduction groove 6, heat conduction silk 7 is placed in heat conduction groove 6, and heat conduction silk 7 is made by the brass material.
Referring to fig. 2 and 3, the front side surface and the rear side surface of the circuit board body 10 are respectively provided with a plurality of groups of radiating fins 5, the surfaces of the radiating fins 5 are plated with brass, blind holes are formed in the lower surfaces of the radiating fins 5, an L-shaped mounting frame 9 is arranged between the radiating fins 5 and the circuit board body 10, one end of the mounting frame 9 is fixedly connected with the circuit board body 10, and the other end of the mounting frame 9 is embedded in the blind holes of the radiating fins 5.
Wherein, the fixed orifices 8 have been seted up to the heating panel side, are equipped with a set of heat conduction silk 7 in the fixed orifices 8, and heat conduction silk 7 encircles circuit board body 10 circles and passes a plurality of groups of fin 5, and the heat conduction silk 7 winding in the heat conduction groove 6 is on passing the heat conduction silk 7 in the fin 5.
In summary, when the utility model is used, firstly, the heat sink 5 is installed on the installation frame 9 on the circuit board body 10, the heat sink 5 is fixedly connected with the circuit board body 10, then a long heat conducting wire 7 passes through the fixing hole 8 on the heat sink 5 and winds the circuit board body 10 for a circle, then the heat conducting wires 7 with different lengths are laid in the heat conducting groove 6, the heat conducting wire 7 is placed in the heat conducting groove 6, the heat conducting wire 7 is prevented from contacting with the components on the circuit board to cause short circuit, two ends of the heat conducting wire are respectively wound on the long heat conducting wire 7, not only the heat conducting wire 7 in the heat conducting groove 6 can be fixed in the heat conducting groove 6, but also the heat on the circuit board body 10 can be rapidly conducted to the heat sink 5, after the heat sink 5 and the heat conducting wire 7 are installed, the circuit board is placed between the first protection plate 1 and the second protection plate 2, the inner wall of the first protection plate 1 contacts with the heat sink 5, second guard plate 2 and the contact of circuit board body 10, heat on the circuit board can be quick conduct first guard plate 1 and second guard plate 2 on, because be equipped with a plurality of groups cooling grid 4 on first guard plate 1 and the second guard plate 2, the area of contact of increase and air can strengthen the heat-sinking capability, the wire of connecting on the circuit board from 3 with external tapping connections of lead wire, the insulating layer on the lead wire 3 can prevent that wire and guard plate contact from taking place the short circuit.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (6)
1. The utility model provides a printed circuit board with heat radiation structure, includes circuit board body (10), first guard plate (1), second guard plate (2), fin (5) and heat conduction silk (7), its characterized in that: a plurality of groups of heat dissipation grids (4) are arranged on the first protection plate (1), the second protection plate (2) is identical to the first protection plate (1) in structure, the first protection plate (1) and the second protection plate (2) are combined to form a protection box, and the surfaces of the first protection plate (1) and the second protection plate (2) are plated with a layer of brass respectively.
2. The printed circuit board with a heat dissipation structure of claim 1, wherein: a plurality of groups of lead openings (3) are formed in the side face of a protection box formed by combining the first protection plate (1) and the second protection plate (2), the lead openings (3) are connected with the inside of a cavity of the protection box, and an insulating layer is adhered to the surface of each lead opening (3).
3. The printed circuit board with a heat dissipation structure of claim 1, wherein: the upper surface of the circuit board body (10) is provided with heat conducting grooves (6), the heat conducting grooves (6) are provided with a plurality of groups, and the heat conducting grooves (6) of the plurality of groups are intersected horizontally and vertically.
4. A printed circuit board having a heat dissipating structure according to claim 3, wherein: the heat conduction groove (6) is internally provided with heat conduction wires (7), the heat conduction wires (7) are placed in the heat conduction groove (6), and the heat conduction wires (7) are made of brass materials.
5. The printed circuit board with a heat dissipation structure of claim 1, wherein: the circuit board comprises a circuit board body (10), wherein a plurality of groups of radiating fins (5) are arranged on the front side face and the rear side face of the circuit board body (10) respectively, brass is plated on the surfaces of the radiating fins (5), blind holes are formed in the lower surfaces of the radiating fins (5), an L-shaped mounting frame (9) is arranged between the radiating fins (5) and the circuit board body (10), one end of the mounting frame (9) is fixedly connected with the circuit board body (10), and the other end of the mounting frame (9) is embedded in the blind holes of the radiating fins (5).
6. The printed circuit board with a heat dissipation structure of claim 5, wherein: the radiating fin is characterized in that a fixing hole (8) is formed in the side face of the radiating fin, a group of heat conducting wires (7) are arranged in the fixing hole (8), the heat conducting wires (7) penetrate through a plurality of groups of radiating fins (5) in a circle around a circuit board body (10), and the heat conducting wires (7) in the heat conducting grooves (6) are wound on the heat conducting wires (7) penetrating through the radiating fins (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121728816.8U CN215581881U (en) | 2021-07-28 | 2021-07-28 | Printed circuit board with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121728816.8U CN215581881U (en) | 2021-07-28 | 2021-07-28 | Printed circuit board with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215581881U true CN215581881U (en) | 2022-01-18 |
Family
ID=79829234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121728816.8U Expired - Fee Related CN215581881U (en) | 2021-07-28 | 2021-07-28 | Printed circuit board with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215581881U (en) |
-
2021
- 2021-07-28 CN CN202121728816.8U patent/CN215581881U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220118 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |