CN110809362A - High-heat-dissipation printed circuit board and manufacturing method thereof - Google Patents

Abstract

The invention discloses a high heat dissipation printed circuit board, which comprises a circuit substrate, a conductive layer is arranged on the top of the circuit substrate, a heat conduction pad is arranged at the bottom of the circuit substrate, a heat dissipation plate is arranged at the bottom of the heat conduction pad, and a plurality of heat dissipation blocks are arranged at the bottom of the heat dissipation plate , and both the heat dissipation plate and the heat dissipation block are arranged in the heat dissipation box, the two side walls of the heat dissipation box are provided with a plurality of first heat dissipation through holes, the outer sides of both ends of the heat dissipation box are connected with horizontally arranged connecting posts, and the bottom of the circuit substrate is Both ends are provided with mounting blocks, and the mounting blocks are provided with a mounting groove that matches one end of the connecting column. A cooling fan is symmetrically arranged in the cooling box, and the cooling fan is arranged on the support frame, and the bottom end of the support frame is connected to the cooling box. On the bottom plate, the heat generated by the electronic components on the circuit board is conducted to the heat dissipation box in time through the thermal pad, heat dissipation plate and heat dissipation block arranged at the bottom of the circuit substrate, and dissipated through the heat dissipation through holes to reduce the heat on the circuit board.

Description

A high heat dissipation printed circuit board and its manufacturing method

technical field

The invention relates to the technical field of circuit boards, in particular to a high heat dissipation printed circuit board and a manufacturing method thereof.

Background technique

Printed circuit boards are the provider of electrical connections for electronic components. Its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is to greatly reduce wiring and assembly errors, and improve the automation level and production labor rate. When the circuit board is in use, many electronic components will be added to the surface. When the heat generated by the electronic components is too high, the heat dissipation speed of the circuit board will be too slow, which will affect the use of electronic components.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a high heat dissipation printed circuit board and a manufacturing method thereof, so as to solve the problems raised in the above-mentioned background art.

In order to achieve the above purpose, the present invention provides the following technical solutions: a high heat dissipation printed circuit board, comprising a circuit substrate, a conductive layer is arranged on the top of the circuit substrate, a thermal pad is arranged at the bottom of the circuit substrate, and a heat dissipation plate is arranged at the bottom of the thermal pad to dissipate heat. A plurality of heat dissipation blocks are arranged at the bottom of the plate, and the heat dissipation plate and the heat dissipation block are both arranged in the heat dissipation box, the two side walls of the heat dissipation box are provided with a plurality of first heat dissipation through holes, and the outer sides of both ends of the heat dissipation box are connected with horizontal The connecting column is provided with mounting blocks at both ends of the bottom of the circuit substrate, and the mounting block is provided with a mounting slot matched with one end of the connecting column, the cooling fan is symmetrically arranged in the cooling box, the cooling fan is arranged on the support frame, and the support frame The bottom end of the cooling box is connected to the bottom plate of the cooling box, and the cooling fan is connected to the external power supply through the connecting wire.

Preferably, the conductive layer includes a heat-conducting layer, an adhesive layer and a copper foil layer, and the heat-conducting layer, the adhesive layer and the copper foil layer are stacked in sequence from bottom to top, and the heat-conducting layer is made of a ceramic heat-conducting adhesive structure.

Preferably, both the mounting block and the connecting column are provided with screw holes for threaded connection with the connecting bolts, and the depth of the mounting groove on the mounting block is smaller than the thickness of the mounting block.

Preferably, the support frame is provided with an installation through hole, the cooling fan is installed in the installation through hole, and the upper and lower inner walls of the installation through hole are provided with a plurality of elastic columns, and the elastic columns are of rubber material structure.

Preferably, a plurality of second heat dissipation through holes are evenly distributed on the front and rear side walls of the heat dissipation box, and the connecting posts are arranged on tops of the first heat dissipation through holes at both ends of the heat dissipation box.

Preferably, four corners of the circuit substrate are provided with mounting holes.

A manufacturing method of a high heat dissipation printed circuit board, comprising the following steps:

S1. First, on the circuit substrate, lay a conductive layer consisting of a thermal conductive layer, an adhesive layer and a copper foil layer on top of the circuit substrate, then use drilling equipment to process mounting holes, and then lay a thermal pad on the bottom of the circuit substrate;

S2. Install the cooling fan into the installation through hole of the support frame, the cooling fan squeezes the elastic column, and the elasticity of the elastic column clamps the cooling fan, and then symmetrically arranges the support frame with the cooling fan installed in the cooling box. The heat dissipation plate and the heat dissipation block are arranged in the top opening of the heat dissipation box;

S3. Insert the assembled heat sink into the installation slot of the installation block through the connecting posts at both ends, and then use the combination of the connecting bolts and the screw holes to lock the heat sink, and install the heat sink on the bottom of the thermal pad;

S4 , respectively setting a first heat dissipation through hole and a second heat dissipation through hole on the left and right and the front and the rear of the heat dissipation box.

Compared with the prior art, the beneficial effect of the present invention is that the heat generated by the electronic components on the circuit board can be conducted to the heat dissipation box in time through the heat conduction pad, the heat dissipation plate and the heat dissipation block arranged at the bottom of the circuit substrate, and the heat generated by the electronic components on the circuit board can be transferred to the heat dissipation box through the heat dissipation through holes. Dissipate, reduce the heat on the circuit board, protect the components on the circuit board from damage, and prolong the service life of the circuit board. Effect.

Description of drawings

Fig. 1 is the overall structure schematic diagram of the present invention;

Fig. 2 is the enlarged schematic diagram of A in Fig. 1;

3 is a cross-sectional view of a conductive layer of the present invention;

Fig. 4 is the front view of the present invention;

5 is a schematic diagram of the structure of the circuit substrate and the conductive layer of the present invention;

6 is a schematic structural diagram of a mounting block of the present invention;

FIG. 7 is a schematic diagram of the structure of the support frame of the present invention.

In the figure: 1. Circuit substrate; 2. Conductive layer; 21. Thermal conductive layer; 22. Adhesive layer; 23. Copper foil layer; 3. Thermal conductive pad; 4. Heat dissipation plate; 61. Second heat dissipation through hole; 7. Mounting hole; 8. First heat dissipation through hole; 9. Mounting block; 91. Mounting slot; 92. Screw hole; 10. Connecting post; 11. Connecting bolt; ; 13, the support frame; 131, the installation through holes; 132, the elastic column.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "vertical", "upper", "lower", "horizontal", etc. are based on the orientations or positional relationships shown in the drawings, only In order to facilitate the description of the present invention and simplify the description, it is not indicated or implied that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise expressly specified and limited, the terms "arranged", "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

1-7, the present invention provides a technical solution: a high heat dissipation printed circuit board, comprising a circuit substrate 1, a conductive layer 2 is arranged on the top of the circuit substrate 1, a thermal pad 3 is arranged at the bottom of the circuit substrate 1, and the thermal conductivity is The bottom of the pad 3 is provided with a heat dissipation plate 4, and the bottom of the heat dissipation plate 4 is provided with a plurality of heat dissipation blocks 5, and the heat dissipation plate 4 and the heat dissipation block 5 are both arranged in the heat dissipation box 6, and two side walls of the heat dissipation box 6 are provided with a plurality of heat dissipation blocks 5. The first heat dissipation through hole 8, the outer sides of both ends of the heat dissipation box 6 are connected with horizontally arranged connection posts 10, and both ends of the bottom of the circuit substrate 1 are provided with mounting blocks 9, and the mounting blocks 9 are provided with one end of the connection post 10. The cooling fan 12 is symmetrically arranged in the cooling box 6, the cooling fan 12 is arranged on the support frame 13, the bottom end of the support frame 13 is connected to the bottom plate of the cooling box 6, and the cooling fan 12 is connected to an external power supply through a connecting line .

The conductive layer 2 includes a thermal conductive layer 21 , an adhesive layer 22 and a copper foil layer 23 , and the thermal conductive layer 21 , the adhesive layer 22 and the copper foil layer 23 are stacked in order from bottom to top, and the thermal conductive layer 21 is made of a ceramic thermal conductive adhesive structure.

The mounting block 9 and the connecting column 10 are provided with screw holes 92 threaded with the connecting bolt 11 , the depth of the mounting groove 91 on the mounting block 9 is less than the thickness of the mounting block 9 , and the connecting column 10 is inserted into the mounting groove 91 .

The support frame 13 is provided with an installation through hole 131, the cooling fan 12 is installed in the installation through hole 131, and a plurality of elastic columns 132 are arranged on the upper and lower inner walls of the installation through hole 131, and the elastic column 132 is a rubber material structure. 12 is inserted into the installation through hole 131, and is clamped by the elastic force of the elastic column 132.

A plurality of second heat dissipation through holes 61 are evenly distributed on the front and rear side walls of the heat dissipation box 6, and the connecting posts 10 are arranged on top of the first heat dissipation through holes 8 at both ends of the heat dissipation box 6, and pass through the first heat dissipation through holes 8 and the first heat dissipation through holes 8. Two heat-dissipating through holes 61 facilitate heat dissipation in the heat-dissipating box 6 .

Four corners of the circuit substrate 1 are provided with mounting holes 7 , so that the printed circuit board can be easily installed through the mounting holes 7 .

A manufacturing method of a high heat dissipation printed circuit board, comprising the following steps:

S1. First, on the circuit substrate 1, lay the conductive layer 2 composed of the thermally conductive layer 21, the adhesive layer 22 and the copper foil layer 23 in sequence on the top of the circuit substrate 1, and then use the drilling equipment to process the mounting hole 7, and then route the circuit. A thermal pad 3 is laid on the bottom of the substrate 1;

S2. Install the cooling fan 12 into the mounting through hole 131 of the support frame 13, the cooling fan 12 squeezes the elastic column 132, the elasticity of the elastic column 132 clamps the cooling fan 12, and then installs the support frame with the cooling fan 12 13 is symmetrically arranged in the heat dissipation box 6, and the heat dissipation plate 4 and the heat dissipation block 5 are arranged in the top opening of the heat dissipation box 6;

S3. Insert the assembled heat dissipation box 6 into the installation slot 91 of the installation block 9 through the connecting posts 10 at both ends, and then use the connection bolts 11 and the screw holes 92 to lock them, and install the heat dissipation box 6 on the thermal pad 3. bottom;

S4. The first heat dissipation through holes 8 and the second heat dissipation through holes 61 are respectively provided on the left and right and front and rear of the heat dissipation box 6 .

Working principle: When in use, the heat generated by the printed circuit board is transferred to the heat dissipation plate 4 through the thermal pad 3, and the heat dissipation block 5 conducts heat dissipation through the first heat dissipation through holes 8 and the second heat dissipation through holes 61 on the heat dissipation box 6. After the heat is dissipated, the heat dissipation fan 12 is energized through the connecting wire, and the heat dissipation fan 12 starts to work, blowing away the heat in the heat dissipation box 6, and turning on the effect of rapid heat dissipation.

The heat generated by the electronic components on the circuit board is conducted to the heat dissipation box in time through the thermal pads, heat dissipation plates and heat dissipation blocks arranged at the bottom of the circuit substrate, and dissipated through the heat dissipation through holes to reduce the heat on the circuit board and protect the circuit board. The components are not damaged, the service life of the circuit board is prolonged, and the heat dissipation fan set in the heat dissipation box accelerates the dissipation of the heat in the heat dissipation box, and improves the heat dissipation effect of the circuit board.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, and substitutions can be made in these embodiments without departing from the principle and spirit of the invention and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (7)

1. A printed circuit board with high heat dissipation, comprising a circuit substrate (1), characterized in that: a conductive layer (2) is provided at the top of the circuit substrate (1), and a thermal pad (3) is provided at the bottom of the circuit substrate (1), A heat dissipation plate (4) is arranged at the bottom of the heat conduction pad (3), a plurality of heat dissipation blocks (5) are disposed at the bottom of the heat dissipation plate (4), and both the heat dissipation plate (4) and the heat dissipation block (5) are arranged in the heat dissipation box (6) Inside, the two side walls of the heat dissipation box (6) are provided with a plurality of first heat dissipation through holes (8), the outer sides of both ends of the heat dissipation box (6) are connected with horizontally arranged connecting posts (10), and the circuit substrate ( 1) Both ends of the bottom are provided with mounting blocks (9), and the mounting blocks (9) are provided with mounting grooves (91) matched with one end of the connecting column (10). 12), the cooling fan (12) is arranged on the support frame (13), the bottom end of the support frame (13) is connected to the bottom plate of the cooling box (6), and the cooling fan (12) is connected to an external power supply through a connecting wire. 2. A printed circuit board with high heat dissipation according to claim 1, characterized in that: the conductive layer (2) comprises a thermal conductive layer (21), an adhesive layer (22) and a copper foil layer (23), and the conductive layer (2) is thermally conductive. The layer (21), the adhesive layer (22) and the copper foil layer (23) are stacked and arranged in sequence from bottom to top, and the heat-conducting layer (21) is made of a ceramic heat-conducting adhesive structure. 3. A high heat dissipation printed circuit board according to claim 1, wherein the mounting block (9) and the connecting column (10) are provided with screw holes (92) threadedly connected with the connecting bolts (11). ), and the depth of the mounting groove (91) on the mounting block (9) is smaller than the thickness of the mounting block (9). 4. A printed circuit board with high heat dissipation according to claim 1, characterized in that: the support frame (13) is provided with a mounting through hole (131), and the cooling fan (12) is mounted in the mounting through hole (131) Inside, and the upper and lower inner walls of the installation through hole (131) are provided with a plurality of elastic columns (132), and the elastic columns (132) are of rubber material structure. 5. A high heat dissipation printed circuit board according to claim 1, characterized in that: a plurality of second heat dissipation through holes (61) are evenly distributed on the front and rear two side walls of the heat dissipation box (6), and the connecting posts (10) The tops of the first heat dissipation through holes (8) are arranged at both ends of the heat dissipation box (6). 6 . The high heat dissipation printed circuit board according to claim 1 , wherein the four corners of the circuit substrate ( 1 ) are provided with mounting holes ( 7 ). 7 . 7. The manufacturing method of a high heat dissipation printed circuit board according to any one of claims 1-6, characterized in that: comprising the following steps: S1. First, on the circuit substrate (1), a conductive layer (2) consisting of a thermally conductive layer (21), an adhesive layer (22) and a copper foil layer (23) is sequentially stacked on top of the circuit substrate (1), and then Drilling equipment is used to machine out the mounting holes (7), and then a thermal pad (3) is laid on the bottom of the circuit substrate (1); S2. Install the cooling fan (12) into the mounting through hole (131) of the support frame (13), the cooling fan (12) squeezes the elastic column (132), and the elasticity of the elastic column (132) pushes the cooling fan (12) After clamping, the support frame (13) on which the cooling fan (12) is installed is symmetrically arranged in the cooling box (6), and the cooling plate (4) and the cooling block (5) are arranged on the top of the cooling box (6). inside the opening; S3. Insert the assembled radiator box (6) into the mounting groove (91) of the mounting block (9) through the connecting posts (10) at both ends, and then use the combination of the connecting bolt (11) and the screw hole (92) to lock the Install the heat dissipation box (6) on the bottom of the thermal pad (3); S4. A first heat dissipation through hole (8) and a second heat dissipation through hole (61) are respectively provided on the left and right and front and rear of the heat dissipation box (6).

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