CN216852500U - Circuit board with better heat dissipation effect - Google Patents
Circuit board with better heat dissipation effect Download PDFInfo
- Publication number
- CN216852500U CN216852500U CN202122999770.XU CN202122999770U CN216852500U CN 216852500 U CN216852500 U CN 216852500U CN 202122999770 U CN202122999770 U CN 202122999770U CN 216852500 U CN216852500 U CN 216852500U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- silica gel
- heat conduction
- heat
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 26
- 230000000694 effects Effects 0.000 title claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000000741 silica gel Substances 0.000 claims abstract description 30
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 30
- 238000002791 soaking Methods 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000003860 storage Methods 0.000 claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 13
- 238000009413 insulation Methods 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 238000007493 shaping process Methods 0.000 claims description 6
- 230000035939 shock Effects 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract 1
- 239000000498 cooling water Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a circuit board with a better heat dissipation effect, which relates to the technical field of circuit boards and comprises a circuit board main body and a heat dissipation mechanism, wherein the circuit board main body comprises two insulation boards, two copper foils and a soaking board, the copper foils are arranged between the two insulation boards in a sealing way, a plurality of heat conduction metal silk threads which are arranged in an array way are fixedly arranged in the soaking board, the heat dissipation mechanism comprises a heat conduction silica gel piece and a vibration motor, a water storage tank is formed in the heat conduction silica gel piece, a water inlet and a water outlet are formed in the left end and the right end of the heat conduction silica gel piece respectively, the water inlet and the water outlet are both communicated with the water storage tank, the vibration motor is fixedly arranged in the middle of the lower side of the heat conduction silica gel piece, the soaking board is pasted and arranged on the upper side of the heat conduction silica gel piece, and cooling liquid is filled in the water storage tank; the beneficial effects are that: can dispel the heat fast, the circuit board main part can not break down because of overheated.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a circuit board with a good heat dissipation effect.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
The circuit board on the market has poor heat dissipation effect, easily leads to the device to lose efficacy because of overheated, breaks down easily when the circuit on the circuit board is overheated, can short circuit burn out when serious, consequently, heat dispersion can directly influence the life of circuit board and electronic equipment.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical scheme capable of solving the problems in order to overcome the defects.
The utility model provides a circuit board of radiating effect preferred, including circuit board main part and heat dissipation mechanism, the circuit board main part includes the insulation board, copper foil and soaking plate, the insulation board is provided with two, the copper foil is sealed to be set up between two insulation boards, fixed mounting has a plurality of heat conduction metal silk thread that the array was arranged in the soaking plate, heat dissipation mechanism is including heat conduction silica gel spare and shock dynamo, the shaping has the catch basin in the heat conduction silica gel spare, both ends shaping respectively has water inlet and delivery port about the heat conduction silica gel spare, water inlet and delivery port all let in the catch basin setting, shock dynamo fixed mounting is at the middle part of heat conduction silica gel spare downside, the upside at heat conduction silica gel spare is installed in the soaking plate pasting, the catch basin intussuseption is filled with the coolant liquid.
As a further scheme of the utility model: a plurality of buffer pieces which are arranged in an array are formed in the water storage tank.
As a further scheme of the utility model: the middle part of the buffer piece is formed with an overflow hole.
As a further scheme of the utility model: the overflow hole is provided with more than one.
As a further scheme of the utility model: the buffer piece is arc-shaped and is vertically arranged.
As a further scheme of the utility model: the upside shaping of heat conduction silica gel spare has several right angle limit, and the symmetry sets up around each other between the several right angle limit, and circuit board main part clearance fit installs between the several right angle limit of both sides around.
As a further scheme of the utility model: a motor groove is formed in the middle of the lower side of the heat-conducting silica gel piece, and the vibration motor is fixedly installed in the motor groove.
As a further scheme of the utility model: the soaking plate is made of heat-conducting silicone grease.
Compared with the prior art, the utility model has the beneficial effects that:
1. the copper foil in the circuit board main body is used for conducting the circuit, the copper foil can generate heat when the circuit is conducted, and the heat can be transferred to the soaking plate;
2. the heat conducting metal wires arranged in an array can uniformly diffuse heat to the soaking plate, so that the heat dissipation effect is enhanced;
3. the heat on the soaking plate can be transferred to the heat-conducting silica gel piece, cooling water is injected into the water inlet and distributed in the water storage tank, the cooling water can take away the heat in the heat-conducting silica gel piece, and the heat dissipation effect is further improved;
4. The vibration motor can drive cooling water to vibrate in the water storage tank when being opened, so that the heat transfer efficiency is improved, the heat dissipation effect is further improved, and the circuit board cannot break down due to overheating.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is an enlarged schematic view of a portion a of fig. 1.
Fig. 3 is an enlarged schematic view of fig. 1 at B.
Fig. 4 is a schematic view of the structure of the soaking plate of the present invention.
FIG. 5 is a schematic view of the construction of a right-angled edge of the present invention.
Shown in the figure: 1. a circuit board main body; 1-1, insulating plates; 1-2, copper foil; 1-3, soaking plates; 2. a heat dissipation mechanism; 2-1, heat-conducting silica gel parts; 2-2, vibrating a motor; 3. a heat conductive metal wire; 4. a water storage tank; 5. a water inlet; 6. a water outlet; 7. cooling liquid; 8. a buffer member; 9. an overflow hole; 10. a right-angle side; 11. a motor slot.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Referring to fig. 1-5, a circuit board with better heat dissipation effect comprises a circuit board main body 1 and a heat dissipation mechanism 2, wherein the circuit board main body 1 comprises two insulation boards 1-1, two copper foils 1-2 and a soaking board 1-3, the two insulation boards 1-1 are arranged, the copper foils 1-2 are hermetically arranged between the two insulation boards 1-1, a plurality of heat conduction metal wires 3 arranged in an array are fixedly arranged in the soaking board 1-3, the heat dissipation mechanism 2 comprises a heat conduction silica gel piece 2-1 and a vibration motor 2-2, a water storage tank 4 is formed in the heat conduction silica gel piece 2-1, a water inlet 5 and a water outlet 6 are respectively formed at the left end and the right end of the heat conduction silica gel piece 2-1, the water inlet 5 and the water outlet 6 are both arranged by being led into the water storage tank 4, the vibration motor 2-2 is fixedly arranged in the middle of the lower side of the heat conduction silica gel piece 2-1, the soaking plate 1-3 is arranged on the upper side of the heat-conducting silica gel piece 2-1 in a sticking way, and the water storage tank 4 is filled with cooling liquid 7;
The principle is as follows: the copper foil 1-2 in the circuit board main body 1 is used for conducting a circuit, the copper foil 1-2 can generate heat when the circuit is conducted, and the heat can be transferred to the soaking plate 1-3; the heat conducting metal wires 3 arranged in an array can uniformly diffuse heat to the soaking plates 1-3, so that the heat dissipation effect is enhanced; the heat on the soaking plate 1-3 can be transferred to the heat-conducting silica gel piece 2-1, cooling water 7 is injected into the water inlet 5, the cooling water 7 is distributed in the water storage tank 4, the cooling water 7 can take away the heat in the heat-conducting silica gel piece 2-1, and the heat dissipation effect is further improved; when the vibration motor 2-2 is started, the cooling water 7 can be driven to vibrate in the water storage tank 4, so that the heat transfer efficiency is improved, and the heat dissipation effect is further improved.
As a further scheme of the utility model: a plurality of buffer members 8 arranged in an array are formed in the water storage tank 4; the vibration generated by the vibration motor 2-2 can be reduced through the plurality of buffer parts 8, and the vibration cannot be transmitted to the circuit board main body 1 and cannot influence the normal work of the circuit board main body 1.
As a further scheme of the utility model: an overflow hole 9 is formed in the middle of the buffer 8; the cooling water 7 can be uniformly distributed in the water storage tank 4 through the overflow holes 9, and the heat dissipation effect is improved.
As a further scheme of the utility model: more than one overflow holes 9 are arranged; the cooling water 7 can be distributed more quickly into the reservoir 4.
As a further scheme of the utility model: the buffer member 8 is in the shape of a circular arc, and the buffer member 8 is vertically arranged.
As a further scheme of the utility model: a plurality of right-angle sides 10 are formed on the upper side of the heat-conducting silica gel piece 2-1, the right-angle sides 10 are symmetrically arranged in the front and back direction, and the circuit board main body 1 is arranged between the right-angle sides 10 on the front side and the back side in a clearance fit manner; the fitting and installation between the circuit board main body 1 and the heat dissipation mechanism 2 are more stable.
As a further scheme of the utility model: a motor groove 11 is formed in the middle of the lower side of the heat-conducting silica gel piece 2-1, and the vibration motor 2-2 is fixedly installed in the motor groove 11; the installation of the vibration motor 2-2 is more stable.
As a further scheme of the utility model: the soaking plates 1-3 are made of heat-conducting silicone grease.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. A circuit board with better heat dissipation effect is characterized in that: including circuit board main part and heat dissipation mechanism, the circuit board main part includes the insulation board, copper foil and soaking board, the insulation board is provided with two, the sealed setting of copper foil is between two insulation boards, fixed mounting has a plurality of heat conduction metal silk thread that the array was arranged in the soaking board, heat dissipation mechanism includes heat conduction silica gel spare and shock dynamo, the shaping has the catch basin in the heat conduction silica gel spare, both ends shaping respectively has water inlet and delivery port about the heat conduction silica gel spare, water inlet and delivery port all let in the catch basin setting, shock dynamo fixed mounting is at the middle part of heat conduction silica gel spare downside, the upside at heat conduction silica gel spare is installed in the soaking board pasting, the catch basin intussuseption is filled with the coolant liquid.
2. The circuit board of claim 1, wherein: a plurality of buffer parts arranged in an array are formed in the water storage tank.
3. The circuit board of claim 2, wherein: the middle part of the buffer piece is formed with an overflow hole.
4. The circuit board with better heat dissipation effect according to claim 3, wherein: the overflow hole is provided with more than one.
5. The circuit board of claim 2, wherein: the bolster is circular arc shape, and the bolster is vertical to be set up.
6. The circuit board of claim 1, wherein: the upside shaping of heat conduction silica gel spare has several right angle limit, and the symmetry sets up around each other between the several right angle limit, and circuit board main part clearance fit installs between the several right angle limit of both sides around.
7. The circuit board of claim 1, wherein: a motor slot position is formed in the middle of the lower side of the heat-conducting silica gel piece, and the vibration motor is fixedly installed in the motor slot position.
8. The circuit board with better heat dissipation effect according to claim 1, wherein: the soaking plate is made of heat-conducting silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122999770.XU CN216852500U (en) | 2021-11-30 | 2021-11-30 | Circuit board with better heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122999770.XU CN216852500U (en) | 2021-11-30 | 2021-11-30 | Circuit board with better heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216852500U true CN216852500U (en) | 2022-06-28 |
Family
ID=82103982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122999770.XU Expired - Fee Related CN216852500U (en) | 2021-11-30 | 2021-11-30 | Circuit board with better heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216852500U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024087553A1 (en) * | 2022-10-27 | 2024-05-02 | 广东畅能达科技发展有限公司 | Linear motor liquid-cooling heat dissipation structure based on ultrathin vapor chamber |
-
2021
- 2021-11-30 CN CN202122999770.XU patent/CN216852500U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024087553A1 (en) * | 2022-10-27 | 2024-05-02 | 广东畅能达科技发展有限公司 | Linear motor liquid-cooling heat dissipation structure based on ultrathin vapor chamber |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220628 |