CN214228724U - Heat radiation structure for circuit board - Google Patents
Heat radiation structure for circuit board Download PDFInfo
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- CN214228724U CN214228724U CN202022928476.5U CN202022928476U CN214228724U CN 214228724 U CN214228724 U CN 214228724U CN 202022928476 U CN202022928476 U CN 202022928476U CN 214228724 U CN214228724 U CN 214228724U
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- circuit board
- heat dissipation
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- board body
- heat
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Abstract
The utility model discloses a heat radiation structure for circuit board, including circuit board body and sealed shell, the circuit board body includes the insulating layer, the top coating of insulating layer has high temperature resistant layer, the top coating on high temperature resistant layer has the heat-conducting layer, the top coating of heat-conducting layer has the heat dissipation layer, the front side and the equal fixedly connected with fixed block in rear side of circuit board body both sides, the fixed block is kept away from the both sides fixed connection of circuit board body one side and sealed shell inner chamber, the both sides of sealed shell just are located fixedly connected with heat dissipation case between two fixed blocks, the inner chamber fixedly connected with cooling fan of heat dissipation case. The utility model discloses a circuit board body, insulating layer, high temperature resistant layer, heat-conducting layer, heat dissipation layer, sealed shell, fixed block, heat dissipation case and cooling fan's cooperation is used, can effectual improvement circuit board body's radiating effect, and the protection circuit board body does not receive the damage, improves circuit board body's life.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a heat radiation structure for circuit board.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminium nitride ceramic circuit board, PCB board, aluminium base board, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed circuit board etc. the circuit board makes the circuit miniaturation, the intuition, plays important role to fixed circuit's batch production and optimization with electrical apparatus overall arrangement, but current circuit board radiating effect is relatively poor, and the high temperature is very easily damaged the circuit board, shortens the life of circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat radiation structure for circuit board possesses the good advantage of radiating effect, and it is relatively poor to have solved current circuit board radiating effect, and high temperature very easily damages the circuit board, shortens the life's of circuit board problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat radiation structure for circuit board, includes circuit board body and sealed shell, the circuit board body includes the insulating layer, the top coating on insulating layer has high temperature resistant layer, the top coating on high temperature resistant layer has the heat-conducting layer, the top coating of heat-conducting layer has the heat dissipation layer, the equal fixedly connected with fixed block in front side and the rear side of circuit board body both sides, the fixed block is kept away from the both sides fixed connection of circuit board body one side and sealed shell inner chamber, the both sides of sealed shell just are located the fixedly connected with heat dissipation case between two fixed blocks, the inner chamber fixedly connected with cooling fan of heat dissipation case.
Preferably, the front side and the rear side of the two sides of the sealing shell are fixedly connected with mounting blocks, and mounting through holes are formed in the surfaces of the mounting blocks.
Preferably, the top and the bottom of the sealing shell are both provided with radiating fins, and one side of each radiating fin penetrates through one side of the sealing shell.
Preferably, through holes are formed in the two sides of the heat dissipation box, and dust screens are arranged in inner cavities of the through holes.
Preferably, the insulating layer is made of ZS-109 high-temperature-resistant insulating paint, and the high-temperature-resistant layer is made of high-temperature-resistant paint.
Preferably, the heat conducting layer is made of high-temperature-resistant heat conducting paint, and the thickness of the heat conducting layer is 50-60 μm.
Preferably, the heat dissipation layer is made of nano heat dissipation coating, and the thickness of the heat dissipation layer is 50-60 μm.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a circuit board body, insulating layer, high temperature resistant layer, heat-conducting layer, heat dissipation layer, sealed shell, fixed block, heat dissipation case and cooling fan's cooperation is used, can effectual improvement circuit board body's radiating effect, and the protection circuit board body does not receive the damage, and the life of improvement circuit board body has solved that current circuit board radiating effect is relatively poor, and the circuit board is very easily damaged to high temperature, shortens the life's of circuit board problem.
2. The utility model discloses a set up installation piece and installation through-hole, can be better fix the installation of sealed shell on other equipment, through setting up the fin, can effectual improvement circuit board body's radiating effect, through setting up the dust screen, can effectually prevent that the dust from getting into in the sealed shell, through setting up the insulating layer, can effectual improvement circuit board body's insulating properties, through setting up high temperature resistant layer, can effectual improvement circuit board body's high temperature resistance, through setting up the heat-conducting layer, can effectual improvement circuit board body's heat conductivility, through setting up the heat dissipation layer, can effectual improvement circuit board body's heat dispersion.
Drawings
FIG. 1 is a schematic view of the internal structure of the present invention;
FIG. 2 is a schematic view of the structure of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 1;
fig. 4 is a schematic view of the structure of the circuit board body of the present invention.
In the figure: 1. a circuit board body; 101. an insulating layer; 102. a high temperature resistant layer; 103. a heat conductive layer; 104. a heat dissipation layer; 2. sealing the shell; 3. a fixed block; 4. a heat dissipation box; 5. a heat radiation fan; 6. mounting blocks; 7. mounting a through hole; 8. a heat sink; 9. a dust screen.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The components of the present invention are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known by the technical manual or by the conventional experimental method.
Referring to fig. 1-4, a heat dissipation structure for a circuit board includes a circuit board body 1 and a sealing case 2, wherein both front and rear sides of the sealing case 2 are fixedly connected with mounting blocks 6, the surface of the mounting block 6 is provided with mounting through holes 7, the sealing case 2 can be better mounted and fixed on other devices by the mounting blocks 6 and the mounting through holes 7, the top and bottom of the sealing case 2 are both provided with heat dissipation fins 8, one side of each heat dissipation fin 8 penetrates to one side of the sealing case 2, the heat dissipation effect of the circuit board body 1 can be effectively improved by the arrangement of the heat dissipation fins 8, the circuit board body 1 includes an insulating layer 101, the insulating layer 101 is made of ZS-1091 high temperature resistant insulating paint, the high temperature resistant layer 102 is made of high temperature resistant paint, the insulating performance of the circuit board body 1 can be effectively improved by the arrangement of the insulating layer 101, by the arrangement of the high temperature resistant layer 102, the heat-resistant performance of the circuit board body 1 can be effectively improved, the top of the insulating layer 101 is coated with the high-temperature-resistant layer 102, the top of the high-temperature-resistant layer 102 is coated with the heat-conducting layer 103, the heat-conducting layer 103 is made of high-temperature-resistant heat-conducting coating, the thickness of the heat-conducting layer 103 is 50-60 mu m, the heat-conducting performance of the circuit board body 1 can be effectively improved by arranging the heat-conducting layer 103, the top of the heat-conducting layer 103 is coated with the heat-radiating layer 104, the heat-radiating layer 104 is made of nano heat-radiating coating, the thickness of the heat-radiating layer 104 is 50-60 mu m, the heat-radiating performance of the circuit board body 1 can be effectively improved by arranging the heat-radiating layer 104, the front side and the rear side of the two sides of the circuit board body 1 are fixedly connected with the fixed blocks 3, one side of the fixed blocks 3, which is far away from the circuit board body 1, is fixedly connected with the two sides of the sealing shell 2, and a heat-radiating box 4 is fixedly connected between the two fixed blocks 3, the through-hole has all been seted up to the both sides of heat dissipation case 4, the inner chamber of through-hole is provided with dust screen 9, through setting up dust screen 9, can effectually prevent that the dust from getting into among the sealed shell 2, the inner chamber fixedly connected with radiator fan 5 of heat dissipation case 4, through circuit board body 1, insulating layer 101, high temperature resistant layer 102, heat-conducting layer 103, heat dissipation layer 104, sealed shell 2, fixed block 3, radiator case 4 and radiator fan 5's cooperation is used, can effectually improve the radiating effect of circuit board body 1, protection circuit board body 1 does not receive the damage, improve the life of circuit board body 1, it is relatively poor to have solved current circuit board radiating effect, the circuit board is very easily damaged to high temperature, shorten the life's of circuit board problem.
During the use, high temperature in the sealed shell 2 is outwards distributed to cooling fan 5 and fin 8, makes and keeps the temperature of relative safety in the sealed shell 2, through insulating layer 101, can effectual improvement circuit board body 1's insulating properties, through high temperature resistant layer 102, can effectual improvement circuit board body 1's high temperature resistant performance, through the heat-conducting layer 103, can effectual improvement circuit board body 1's heat conductivility, through heat dissipation layer 104, can effectual improvement circuit board body 1's heat dispersion.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a heat radiation structure for circuit board, includes circuit board body (1) and sealed shell (2), its characterized in that: the circuit board comprises a circuit board body (1) and is characterized in that the circuit board body (1) comprises an insulating layer (101), a high-temperature-resistant layer (102) is coated on the top of the insulating layer (101), a heat conduction layer (103) is coated on the top of the high-temperature-resistant layer (102), a heat dissipation layer (104) is coated on the top of the heat conduction layer (103), fixed blocks (3) are fixedly connected to the front side and the rear side of the two sides of the circuit board body (1), the fixed blocks (3) are far away from two sides of the inner cavity of the sealing shell (2) and fixedly connected with heat dissipation boxes (4) between the two fixed blocks (3), and heat dissipation fans (5) are fixedly connected to the inner cavity of the heat dissipation boxes (4).
2. The heat dissipation structure for circuit boards according to claim 1, wherein: the front side and the rear side of the two sides of the sealing shell (2) are fixedly connected with mounting blocks (6), and mounting through holes (7) are formed in the surface of the mounting blocks (6).
3. The heat dissipation structure for circuit boards according to claim 1, wherein: the top and the bottom of sealed shell (2) have all been seted up fin (8), one side of fin (8) runs through to one side of sealed shell (2).
4. The heat dissipation structure for circuit boards according to claim 1, wherein: through holes are formed in the two sides of the heat dissipation box (4), and dust screens (9) are arranged in inner cavities of the through holes.
5. The heat dissipation structure for circuit boards according to claim 1, wherein: the insulating layer (101) is made of ZS-1091 high-temperature-resistant insulating paint, and the high-temperature-resistant layer (102) is made of high-temperature-resistant paint.
6. The heat dissipation structure for circuit boards according to claim 1, wherein: the heat conduction layer (103) is made of high-temperature-resistant heat conduction coating, and the thickness of the heat conduction layer (103) is 50-60 mu m.
7. The heat dissipation structure for circuit boards according to claim 1, wherein: the material of the heat dissipation layer (104) is nano heat dissipation coating, and the thickness of the heat dissipation layer (104) is 50-60 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022928476.5U CN214228724U (en) | 2020-12-09 | 2020-12-09 | Heat radiation structure for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022928476.5U CN214228724U (en) | 2020-12-09 | 2020-12-09 | Heat radiation structure for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214228724U true CN214228724U (en) | 2021-09-17 |
Family
ID=77701235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022928476.5U Active CN214228724U (en) | 2020-12-09 | 2020-12-09 | Heat radiation structure for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214228724U (en) |
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2020
- 2020-12-09 CN CN202022928476.5U patent/CN214228724U/en active Active
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