CN117320264B - Thermoelectric separation structure of metal substrate and manufacturing process thereof - Google Patents
Thermoelectric separation structure of metal substrate and manufacturing process thereof Download PDFInfo
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- CN117320264B CN117320264B CN202311605075.8A CN202311605075A CN117320264B CN 117320264 B CN117320264 B CN 117320264B CN 202311605075 A CN202311605075 A CN 202311605075A CN 117320264 B CN117320264 B CN 117320264B
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 110
- 239000002184 metal Substances 0.000 title claims abstract description 110
- 239000000758 substrate Substances 0.000 title claims abstract description 72
- 238000000926 separation method Methods 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 claims abstract description 165
- 238000005476 soldering Methods 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 230000005855 radiation Effects 0.000 claims description 24
- 239000011889 copper foil Substances 0.000 claims description 21
- 239000004519 grease Substances 0.000 claims description 21
- 229920001296 polysiloxane Polymers 0.000 claims description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 14
- 238000009434 installation Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000005619 thermoelectricity Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of thermoelectric separation of metal substrates, and discloses a thermoelectric separation structure of a metal substrate and a manufacturing process thereof, wherein the thermoelectric separation structure of the metal substrate comprises a metal copper-clad plate, a radiating fin plate and an adjustable radiating assembly, the radiating fin plate is arranged on the bottom wall of the metal radiating substrate, the adjustable radiating assembly comprises a radiating block and an annular baffle plate, an annular mounting groove is arranged on the radiating block, a spring mounting cavity provided with a spring is arranged in the radiating block, the annular baffle plate is arranged in the annular mounting groove, and the lower end of the annular baffle plate is connected with the spring; the annular baffle is filled with a heat dissipation medium for contacting with the electronic element base; the mounting hole is used for mounting the radiating block; the heat dissipation connecting structure is filled among the heat dissipation block, the metal heat dissipation substrate and the heat dissipation fin plate; the upper end of the adjustable heat dissipation assembly is used for being in contact with a heat dissipation base of the electronic element.
Description
Technical Field
The invention belongs to the technical field of thermoelectric separation of metal substrates, and particularly relates to a thermoelectric separation structure of a metal substrate and a manufacturing process thereof.
Background
The metal substrate comprises an aluminum-based copper-clad plate, a copper-based copper-clad plate, an iron-based copper-clad plate and the like, and the base material is a metal material with good heat conductivity, so that the metal substrate has excellent heat dissipation performance, and the heat dissipation effect of the circuit board manufactured by the metal substrate can be effectively improved. The thermoelectric separation structure is arranged on the metal substrate, so that the heat dissipation effect of the main heating electronic element on the circuit board can be further improved.
Among the prior art, the invention patent of application number CN202211182394.8 discloses a metal substrate thermoelectric separation structure and manufacturing process thereof, including thermoelectricity separation heat dissipation carrier plate and insulating layer and the weld layer of setting gradually on thermoelectricity separation heat dissipation carrier plate, be equipped with the thermoelectricity mouth that runs through the heat conduction layer on the weld layer, be provided with on the insulating layer and be used for carrying out the heat conduction layer that is connected with thermoelectricity mouth and thermoelectricity separation heat dissipation carrier plate, step one: coating an insulating layer on the thermoelectric separation heat dissipation carrier plate; step two: attaching a welding layer on the insulating layer; step three: manufacturing the shape of the welding layer by etching; step four: manufacturing a heat radiation opening and a heat conduction groove for accommodating the heat conduction layer by etching or machining; step five: and plating a heat conducting film in the heat conducting groove. When the heat dissipation device is used, heat on the electronic element is mainly transferred to the thermoelectric separation heat dissipation carrier plate through the heat conduction layer, and the thermoelectric separation heat dissipation carrier plate is used for transferring and dispersing the heat, so that the heat dissipation capacity is further improved.
The thermoelectric separation structure of the metal substrate provided by the patent is provided with a heat conduction layer, and heat on the electronic element is transferred to the thermoelectric separation heat dissipation carrier plate through the heat conduction layer. The heat conducting layer needs to be in close contact with the heat radiating base of the electronic element so as to radiate heat well. In the above-mentioned patent scheme, the heat conduction layer is fixed, and its height is also fixed, does not have adjustability, takes place the problem that heat conduction layer and electronic component's heat dissipation base can not good contact easily, and then leads to electronic component to dispel the heat through the heat conduction layer effectually.
Disclosure of Invention
The invention aims to provide a metal substrate thermoelectric separation structure and a manufacturing process thereof, and aims to solve the problems that the height of a heat conduction layer of the existing metal substrate thermoelectric separation structure is not adjustable, and the heat conduction layer is easy to be in poor contact with a heat dissipation base of an electronic element, so that the electronic element cannot effectively dissipate heat through the heat conduction layer.
In order to achieve the above object, according to a first aspect of the present invention, there is provided a thermoelectric separation structure of a metal substrate, including a metal copper-clad plate, the metal copper-clad plate including a copper foil layer, an insulating layer and a metal heat dissipation substrate sequentially disposed from top to bottom, further including:
a heat radiation fin plate disposed on a bottom wall of the metal heat radiation substrate;
the adjustable radiating assembly comprises a radiating block and an annular baffle plate, an annular mounting groove is formed in the upper end face of the radiating block, a spring mounting cavity is formed in the radiating block and located at the lower side of the annular mounting groove, the spring mounting cavity is communicated with the annular mounting groove, a spring is arranged in the spring mounting cavity, the annular baffle plate is arranged in the annular mounting groove, and the lower end of the annular baffle plate is inserted into the spring mounting cavity to be connected with the spring; the radiating block is provided with a through hole which penetrates through the radiating block up and down, and the through hole is positioned in the range wrapped by the annular mounting groove; the annular baffle plate is filled with a heat dissipation medium for contacting with the electronic element base;
the mounting holes are used for mounting the radiating blocks and penetrate through the metal copper-clad plate and the radiating fin plate;
and the heat dissipation connecting structure is filled among the heat dissipation block, the metal heat dissipation substrate and the heat dissipation fin plate.
Further, the mounting hole comprises a first through hole, a second through hole, a third through hole and a fourth through hole which are mutually communicated, and the first through hole, the second through hole, the third through hole and the fourth through hole respectively penetrate through the copper foil layer, the insulating layer, the metal heat dissipation substrate and the heat dissipation fin plate up and down.
Further, the cross section of the radiating block is rectangular, the annular mounting groove is in a shape of a circle or a circular ring, the annular baffle is in a shape of a circle or a circular ring, and the shape and the size of the annular baffle are matched with those of the annular mounting groove; the first through hole, the second through hole, the third through hole and the fourth through hole are rectangular holes, the length and the width of the third through hole and the width of the fourth through hole are the same, and the third through hole and the fourth through hole are aligned vertically; the length and the width of the second through hole are respectively larger than those of the third through hole, and the third through hole is completely positioned in the range of the second through hole; the length and the width of the first through hole are respectively larger than those of the second through hole, and the second through hole is completely located in the range of the first through hole.
Further, the cross section of the radiating block is circular, the annular mounting groove is in a shape of a circle or a circular ring, the annular baffle is in a shape of a circle or a circular ring, and the shape and the size of the annular baffle are matched with those of the annular mounting groove; the first through hole, the second through hole, the third through hole and the fourth through hole are all round holes, the through holes are coaxial, the apertures of the third through hole and the fourth through hole are the same, the aperture of the first through hole is larger than that of the second through hole, and the aperture of the second through hole is larger than that of the third through hole and the fourth through hole.
Further, the heat dissipation connection structure is a tin soldering structure or a heat conduction silicone grease and tin soldering composite structure, the heat dissipation medium is a tin soldering layer or a heat conduction silicone grease, the lower end face of the heat dissipation block is provided with a heat dissipation fin structure, the heat dissipation fin structure comprises a plurality of heat dissipation rib plates which are parallel to each other, and heat dissipation channels are arranged between the adjacent heat dissipation rib plates.
Further, the upper end face of the radiating block is provided with a liquid receiving groove, the liquid receiving groove is of an annular structure, and the annular mounting groove is located in the range wrapped by the liquid receiving groove.
According to a second aspect of the present invention, there is provided a manufacturing process of a metal substrate thermoelectric separation structure for the above-mentioned metal substrate thermoelectric separation structure, comprising the steps of:
s1, manufacturing a metal copper-clad plate: pressing the copper foil layer, the insulating layer and the metal heat dissipation substrate into a metal copper-clad plate in a hot pressing mode;
s2, cutting a metal copper-clad plate: cutting the manufactured metal copper-clad plate into required specifications;
s3, forming a mounting hole: mounting holes are formed in positions, corresponding to the electronic components with large heating values, on the metal copper-clad plate and the radiating fin plate;
s4, manufacturing an adjustable heat dissipation assembly: manufacturing an adjustable heat dissipation assembly according to the large shape and the size of each mounting hole and the size of a corresponding base of the electronic element;
s5, installing an adjustable heat dissipation assembly: the adjustable radiating assembly is installed in the installation hole, and the radiating block, the metal radiating base plate and the radiating fin plate are firmly connected through the radiating connection structure, so that radiating contact is good;
s6: filling a heat radiation medium: and filling the annular baffle with a heat dissipation medium, and enabling the heat dissipation medium to be in contact with the heat dissipation block and the base of the heating electronic element.
Further, the step S3 specifically includes the following steps:
s31, forming a first through hole in the copper foil layer;
s32, forming a second through hole in the insulating layer, wherein the second through hole is completely located in the range of the first through hole;
s33, respectively forming a third through hole and a fourth through hole on the metal radiating substrate and the radiating fin plate, wherein the sizes of the third through hole and the fourth through hole are the same, the positions of the third through hole and the fourth through hole correspond to each other, and the third through hole is completely located in the range of the second through hole.
Further, in step S5, the adjustable heat dissipation assembly is connected to the metal heat dissipation substrate through soldering, and then the metal heat dissipation substrate is connected to the heat dissipation fin plate, the heat dissipation fin plate and the adjustable heat dissipation assembly through a heat dissipation connection structure.
Further, in the step S6, when the heat dissipation medium is heat conduction silicone grease, the annular baffle plate and the through hole are filled with the heat conduction silicone grease, the heat conduction silicone grease is compressed when the annular baffle plate is arranged below the base of the electronic component, the redundant heat conduction silicone grease is discharged from the through hole, then the base of the electronic component and the annular baffle plate are fixed through soldering, and the lower port of the through hole is sealed through soldering; when the heat dissipation medium is a tin soldering layer, an electronic element is installed, the base of the electronic element presses the annular baffle plate and completely covers the annular baffle plate, and a pressure device is used for filling tin liquid into the annular baffle plate through the through hole.
Compared with the prior art, the invention has the following beneficial effects:
1. the upper end of the adjustable radiating component is used for being in contact with the radiating base of the electronic element, and the height of the adjustable radiating component is adjustable, so that the problem that the adjustable radiating component cannot be in good contact with the radiating base of the electronic element is solved, and the heat generated by the electronic element can be effectively radiated out through the adjustable radiating component, so that the radiating effect of the electronic element is effectively ensured.
2. The arrangement of the mounting hole structure ensures that the copper foil layer is not contacted with the metal radiating substrate and the radiating block, so that the copper foil layer is not electrically connected with the metal radiating substrate and the radiating block, and the insulation performance is effectively ensured.
3. The heat radiation connection structure is arranged, and the heat radiation connection structure enables good heat radiation contact among the metal heat radiation substrate, the heat radiation block and the heat radiation fin plate, so that heat transfer can be efficiently carried out among the metal heat radiation substrate, the heat radiation block and the heat radiation fin plate, and the heat radiation effect of the thermoelectric separation structure is effectively ensured.
Drawings
FIG. 1 is a schematic view of a thermoelectric separation structure of a metal substrate according to the present invention;
FIG. 2 is an enlarged view of area A of FIG. 1;
fig. 3 is a schematic structural view of a metal copper-clad plate according to the present invention;
FIG. 4 is a schematic view of a structure in which a first through hole is formed in a copper foil layer of a metal copper-clad plate;
fig. 5 is a schematic structural view of a metal copper-clad plate with a second through hole formed in an insulating layer;
fig. 6 is a schematic structural diagram of a metal heat dissipation substrate with a third through hole formed therein;
FIG. 7 is a schematic view of an adjustable heat sink assembly mounted on a metal copper clad laminate;
FIG. 8 is a schematic diagram of a structure connecting an adjustable heat sink assembly, a metal copper clad laminate and a heat sink fin plate;
FIG. 9 is a schematic view of a thermoelectric separation structure of a metal substrate connected to an electronic component according to the present invention;
FIG. 10 is a schematic view of a heat dissipating fin plate with a fourth through hole;
fig. 11 is a flowchart of a process for manufacturing an insulated metal substrate according to the present invention.
In the figure: 1. a copper foil layer; 2. an insulating layer; 3. a metal heat-dissipating substrate; 4. a heat radiation fin plate; 5. an adjustable heat sink assembly; 51. a heat dissipation block; 52. an annular baffle; 53. a through hole; 54. a heat dissipation medium; 55. a liquid receiving groove; 56. a spring; 6. a heat dissipation connection structure; 7. a first through hole; 8. a second through hole; 9. a third through hole; 10. a fourth through hole; 11. an electronic component.
Detailed Description
The following is further described with reference to the drawings and detailed description:
example 1
The embodiment provides a thermoelectric separation structure of a metal substrate, which comprises a metal copper-clad plate, a radiating fin plate 4 and an adjustable radiating component 5 as shown in fig. 1 and 3. The metal copper-clad plate comprises a copper foil layer 1, an insulating layer 2 and a metal heat dissipation substrate 3 which are sequentially arranged from top to bottom, and the copper foil layer 1, the insulating layer 2 and the metal heat dissipation substrate 3 are manufactured into the metal copper-clad plate in a hot pressing mode. The heat radiation fin plate 4 is provided on the bottom wall of the metal heat radiation substrate 3, and has the function of reinforcing the heat radiation capability of the metal heat radiation substrate 3.
As shown in fig. 4 to 8 and 10, the heat dissipation fin plate 4 and the metal heat dissipation substrate 3 are provided with mounting holes for mounting the adjustable heat dissipation assembly 5, and the mounting holes include a first through hole 7, a second through hole 8, a third through hole 9 and a fourth through hole 10 which are mutually communicated, and the first through hole 7, the second through hole 8, the third through hole 9 and the fourth through hole 10 respectively penetrate the copper foil layer 1, the insulating layer 2, the metal heat dissipation substrate 3 and the heat dissipation fin plate 4 up and down. The mounting holes mainly have two forms, namely rectangular holes and circular holes, which are matched with the structure of the heat dissipation block 51 of the adjustable heat dissipation assembly 5.
As shown in fig. 2 and 7, the adjustable heat dissipation assembly 5 includes a heat dissipation block 51 and an annular baffle 52, and the heat dissipation block 51 mainly has two structural forms of rectangular block and cylindrical. An annular mounting groove is formed in the upper end face of the radiating block 51, the annular mounting groove is in a shape of a circle or a ring, the annular baffle plate 52 is also in a shape of a circle or a ring, the shape and the size of the annular baffle plate 52 are matched with those of the annular mounting groove, and the annular baffle plate 52 is inserted into the annular mounting groove. The inside of the heat dissipation block 51 is provided with a spring installation cavity which is positioned at the lower side of the annular installation groove and is communicated with the annular installation groove, a plurality of springs 56 are arranged in the spring installation cavity, the annular baffle plate 52 is arranged in the annular installation groove, and the lower end of the annular baffle plate 52 is inserted into the spring installation cavity to be connected with the springs 56. A through hole communicating with the spring mounting cavity may be provided in a side wall of the heat dissipating block 51 for mounting the spring 56. The heat dissipation block 51 is provided with a through hole 53 penetrating the heat dissipation block 51 up and down, and the through hole 53 is located in the range wrapped by the annular mounting groove. The annular baffle plate 52 is filled with a heat dissipation medium 54 for contacting with the base of the electronic component 11, wherein the heat dissipation medium 54 is a tin solder layer or heat-conducting silicone grease, and the tin solder layer is formed by cooling tin liquid. As shown in fig. 9, the electronic component 11 mount is brought into good heat-dissipating contact with the heat sink 51 by the heat-dissipating medium 54, i.e., the heat-dissipating medium 54 corresponds to bringing the electronic component mount into direct contact with the heat sink 51.
In some exemplary embodiments, the cross section of the heat dissipation block 51 is rectangular, that is, the heat dissipation block 51 is rectangular block, and at this time, the first through hole 7, the second through hole 8, the third through hole 9 and the fourth through hole 10 are all rectangular holes, and the lengths and widths of the third through hole 9 and the fourth through hole 10 are the same and are aligned up and down. The length and width of the second through hole 8 are respectively larger than those of the third through hole 9, and the third through hole 9 is completely located within the range of the second through hole 8. The length and width of the first through hole 7 are respectively larger than those of the second through hole 8, and the second through hole 8 is completely located within the range of the first through hole 7. Preferably, the first through hole 7, the second through hole 8, the third through hole 9 and the fourth through hole 10 are all arranged in a centered manner, and the center points of the holes are on the same vertical line.
In some exemplary embodiments, the cross section of the heat dissipation block 51 is circular, that is, the heat dissipation block 51 is cylindrical, at this time, the first through hole 7, the second through hole 8, the third through hole 9 and the fourth through hole 10 are all circular holes, and the through holes are concentric with each other, the aperture of the third through hole 9 and the fourth through hole 10 are the same, the aperture of the first through hole 7 is larger than the aperture of the second through hole 8, and the aperture of the second through hole 8 is larger than the aperture of the third through hole 9 and the fourth through hole 10.
By the arrangement of the two mounting hole structures, the copper foil layer 1 is not contacted with the metal heat dissipation substrate 3 and the heat dissipation block 51. So that the copper foil layer 1 is not electrically connected with the metal heat dissipation substrate 3 and the heat dissipation block 51, and the insulation performance is effectively ensured.
As shown in fig. 1, 2 and 8, in order to improve heat transfer between the metal heat dissipating substrate 3, the heat dissipating fin plate 4 and the heat dissipating block 51, the heat dissipating connection structure 6 is filled between the heat dissipating block 51, the metal heat dissipating substrate 3 and the heat dissipating fin plate 4. The heat dissipation connection structure 6 may have various structures, for example, the heat dissipation connection structure 6 may be a soldering structure. If the heat dissipation connection structure 6 can be a heat conduction silicone grease and soldering composite structure, a soldering structure is arranged between the heat dissipation block 51 and the metal heat dissipation substrate 3, a soldering structure is arranged between the heat dissipation block 51 and the heat dissipation fin plate 4, or the heat conduction silicone grease is arranged in the middle of the contact position of the heat dissipation block 51 and the heat dissipation fin plate 4, and the two sides of the upper end are fixedly connected through the soldering structure. The metal radiating base plate 3 and the radiating fin plate 4 are heat conduction silicone grease, and the edges of the metal radiating base plate 3 and the radiating fin plate 4 are fixedly connected through a soldering structure. The metal radiating base plate 3, the radiating fin plate 4 and the radiating block 51 have good radiating contact through the radiating connecting structure 6, and heat can be effectively transferred among the three. Meanwhile, in order to further enhance the heat radiation effect of the heat radiation block 51, a heat radiation fin structure is provided on the lower end surface of the heat radiation block 51. The radiating fin structure comprises a plurality of mutually parallel radiating rib plates, the contact area between the bottom of the reinforced radiating block 51 and air is increased through the arrangement of the radiating rib plates, and radiating channels are arranged between the adjacent radiating rib plates and are convenient for radiating through the radiating rib plates.
As shown in fig. 2, the upper end surface of the heat dissipation block 51 is provided with a liquid receiving groove 55, the liquid receiving groove 55 is in an annular structure, the annular mounting groove is located in a range covered by the liquid receiving groove 55, the liquid receiving groove 55 is used for receiving molten tin dropped when the base of the electronic component 11 is soldered with the upper end of the annular baffle plate 52, or is used for receiving molten tin leaked when the molten tin is filled into the annular baffle plate 52 through the through hole 53, so as to prevent the molten tin from causing the electric connection between the copper foil layer 1 and the metal heat dissipation substrate 3 and the heat dissipation block 51.
Example 2
The present embodiment provides a manufacturing process of a thermoelectric separation structure of a metal substrate, as shown in fig. 11, for manufacturing the thermoelectric separation structure of a metal substrate provided in embodiment 1, the manufacturing process including the steps of:
s1, manufacturing a metal copper-clad plate: the copper foil layer 1, the insulating layer 2 and the metal heat dissipation substrate 3 are pressed into a metal copper-clad plate in a hot pressing mode, as shown in fig. 3. In order to improve the structural stability of the metal copper-clad plate, the surfaces of the copper foil layer 1 and the metal heat dissipation substrate 3 are subjected to roughening treatment.
S2, cutting a metal copper-clad plate: cutting the manufactured metal copper-clad plate into required specifications.
S3, forming a mounting hole: mounting holes are formed in the positions of the metal copper-clad plate and the radiating fin plate 4 corresponding to the electronic components with large heating values. The method for forming the mounting holes comprises the following steps:
s31, a first through hole 7 is formed in the copper foil layer 1, as shown in fig. 4.
S32, a second through hole 8 is formed in the insulating layer 2, and the second through hole 8 is completely located within the range of the first through hole 7, as shown in fig. 5.
S33, third through holes 9 and fourth through holes 10 are respectively formed in the metal heat dissipation substrate 3 and the heat dissipation fin plate 4, the third through holes 9 and the fourth through holes 10 are the same in size and correspond to each other in position, and the third through holes 9 are completely located within the range of the second through holes 8, as shown in fig. 6 and 8.
S4, manufacturing an adjustable heat dissipation assembly 5: the adjustable heat dissipation assembly 5 is manufactured according to the shape and the size of each mounting hole and the size of the corresponding base of the electronic component.
S5, installing an adjustable heat dissipation assembly 5: the adjustable heat dissipation assembly 5 is installed in the installation hole, and the heat dissipation block 51, the metal heat dissipation substrate 3 and the heat dissipation fin plate 4 are firmly connected through the heat dissipation connection structure 6, and good heat dissipation contact refers to good heat dissipation contact between the heat dissipation block 51, the metal heat dissipation substrate 3 and the heat dissipation fin plate 4 through a medium with good heat conductivity, such as a soldering structure, heat conduction silicone grease, a soldering composite structure and the like. In this step, the adjustable heat dissipation assembly 5 is first connected to the metal heat dissipation substrate 3 by soldering, as shown in fig. 7, and then the metal heat dissipation substrate 3 is connected to the heat dissipation fin plate 4, and the adjustable heat dissipation assembly 5 by a heat dissipation connection structure 6, as shown in fig. 8.
S6: filling the heat dissipation medium 54: the annular shutter 52 is filled with the heat dissipation medium 54, and the heat dissipation medium 54 is brought into contact with the heat dissipation block 51 and the base of the heat-generating electronic component 11, as shown in fig. 9. In this step, when the heat dissipation medium 54 is a heat conduction silicone grease, the heat conduction silicone grease is filled in the annular baffle plate 52 and the through hole 53, the heat conduction silicone grease is compressed when the annular baffle plate 52 is arranged under the base of the electronic component, the excessive heat conduction silicone grease is discharged from the through hole 53, then the electronic component base and the annular baffle plate 52 are fixed by soldering, and the lower port of the through hole 53 is sealed by soldering. When the heat dissipation medium 54 is a soldering layer, an electronic component is mounted, the base of the electronic component presses the annular baffle plate 52 and completely covers the annular baffle plate 52, and a pressure device is used to fill the annular baffle plate 52 with molten tin through the through holes 53, and the molten tin is cooled to form a solder layer.
The working principle of the invention is as follows: the adjustable heat dissipation assembly 5 is arranged, the height of the upper end of the adjustable heat dissipation assembly 5 is determined by the annular baffle plate 52, and the height of the annular baffle plate 52 is adjustable because the spring 56 is arranged at the lower end of the annular baffle plate 52, namely the height of the adjustable heat dissipation assembly 5 is adjustable. The upper end of the adjustable heat dissipation assembly 5 is contacted with the heat dissipation base of the electronic element 11, and the adjustable heat dissipation assembly 5 transfers part of heat generated by the electronic element 11 to the metal heat dissipation substrate 3 and the heat dissipation fin plate 4 through the heat dissipation connection structure 6, and then the heat is dissipated into the air, and the other part of heat is directly dissipated into the air.
In the invention, the upper end of the adjustable radiating component 5 is used for contacting with the radiating base of the electronic element 11, and the height of the adjustable radiating component 5 is adjustable, so that the problem that the adjustable radiating component 5 cannot well contact with the radiating base of the electronic element 11 is not easy to occur, the heat generated by the electronic element 11 can be effectively radiated through the adjustable radiating component 5, and the radiating effect of the electronic element 11 is effectively ensured.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a thermoelectric separation structure of metal base plate, includes the metal copper-clad plate, the metal copper-clad plate includes copper foil layer (1), insulating layer (2) and metal radiating substrate (3) that from top to bottom set gradually, its characterized in that: further comprises:
a heat radiation fin plate (4), wherein the heat radiation fin plate (4) is arranged on the bottom wall of the metal heat radiation base plate (3);
the adjustable radiating assembly (5), the adjustable radiating assembly (5) comprises a radiating block (51) and an annular baffle plate (52), an annular mounting groove is formed in the upper end face of the radiating block (51), a spring mounting cavity is formed in the radiating block (51), the spring mounting cavity is located at the lower side of the annular mounting groove and is communicated with the annular mounting groove, a spring (56) is arranged in the spring mounting cavity, the annular baffle plate (52) is arranged in the annular mounting groove, and the lower end of the annular baffle plate is inserted into the spring mounting cavity to be connected with the spring (56); the radiating block (51) is provided with a through hole (53) penetrating through the radiating block (51) up and down, and the through hole (53) is positioned in the range wrapped by the annular mounting groove; the annular baffle plate (52) is filled with a heat dissipation medium (54) for contacting with the electronic element base;
the mounting holes are used for mounting the radiating blocks (51) and penetrate through the metal copper-clad plate and the radiating fin plate (4);
the heat dissipation connecting structure (6), the heat dissipation connecting structure (6) is filled among the heat dissipation block (51), the metal heat dissipation substrate (3) and the heat dissipation fin plate (4);
the mounting holes comprise a first through hole (7), a second through hole (8), a third through hole (9) and a fourth through hole (10) which are communicated with each other, and the first through hole (7), the second through hole (8), the third through hole (9) and the fourth through hole (10) respectively penetrate through the copper foil layer (1), the insulating layer (2), the metal heat dissipation substrate (3) and the heat dissipation fin plate (4) up and down;
the cross section of the radiating block (51) is rectangular, the annular mounting groove is in a shape of a circle or a ring, the annular baffle (52) is in a shape of a circle or a ring, and the shape and the size of the annular baffle (52) are matched with those of the annular mounting groove; the first through hole (7), the second through hole (8), the third through hole (9) and the fourth through hole (10) are rectangular holes, and the lengths and the widths of the third through hole (9) and the fourth through hole (10) are the same and are aligned vertically; the length and the width of the second through hole (8) are respectively larger than those of the third through hole (9), and the third through hole (9) is completely positioned in the range of the second through hole (8); the length and the width of the first through hole (7) are respectively larger than those of the second through hole (8), and the second through hole (8) is completely positioned in the range of the first through hole (7);
the cross section of the radiating block (51) is circular, the annular mounting groove is in a shape of a circle or a circular ring, the annular baffle (52) is in a shape of a circle or a circular ring, and the shape and the size of the annular baffle (52) are matched with those of the annular mounting groove; the first through hole (7), the second through hole (8), the third through hole (9) and the fourth through hole (10) are all round holes, the through holes are coaxial, the diameters of the third through hole (9) and the fourth through hole (10) are the same, the diameter of the first through hole (7) is larger than that of the second through hole (8), and the diameter of the second through hole (8) is larger than that of the third through hole (9) and the fourth through hole (10);
the heat dissipation connecting structure (6) is of a tin soldering structure or a heat conduction silicone grease and tin soldering composite structure, the heat dissipation medium (54) is a tin soldering layer or a heat conduction silicone grease, the lower end face of the heat dissipation block (51) is provided with a heat dissipation fin structure, the heat dissipation fin structure comprises a plurality of heat dissipation rib plates which are parallel to each other, and heat dissipation channels are arranged between the adjacent heat dissipation rib plates.
2. The metal substrate thermoelectric separation structure of claim 1, wherein: the upper end face of the radiating block (51) is provided with a liquid receiving groove (55), the liquid receiving groove (55) is of an annular structure, and the annular mounting groove is located in the range covered by the liquid receiving groove (55).
3. A process for manufacturing a thermoelectric separation structure of a metal substrate, for a thermoelectric separation structure of a metal substrate according to any one of claims 1 to 2, characterized in that: the method comprises the following steps:
s1, manufacturing a metal copper-clad plate: the copper foil layer (1), the insulating layer (2) and the metal heat dissipation substrate (3) are pressed into a metal copper-clad plate in a hot pressing mode;
s2, cutting a metal copper-clad plate: cutting the manufactured metal copper-clad plate into required specifications;
s3, forming a mounting hole: mounting holes are formed in positions, corresponding to the electronic components with large heating values, on the metal copper-clad plate and the radiating fin plate (4);
s4, manufacturing an adjustable heat dissipation assembly (5): manufacturing an adjustable heat dissipation assembly (5) according to the large shape and the size of each mounting hole and the size of a corresponding base of the electronic element;
s5, installing an adjustable heat dissipation assembly (5): the adjustable radiating assembly (5) is installed in the installation hole, and the radiating block (51), the metal radiating base plate (3) and the radiating fin plate (4) are firmly connected through the radiating connecting structure (6) and are in good radiating contact;
s6: filling a heat dissipation medium (54): filling a heat dissipation medium (54) into the annular baffle plate (52), and enabling the heat dissipation medium (54) to be in contact with the heat dissipation block (51) and the base of the heating electronic element;
the step S3 specifically comprises the following steps:
s31, forming a first through hole (7) on the copper foil layer (1);
s32, forming a second through hole (8) in the insulating layer (2), wherein the second through hole (8) is completely positioned in the range of the first through hole (7);
s33, respectively forming a third through hole (9) and a fourth through hole (10) on the metal radiating substrate (3) and the radiating fin plate (4), wherein the third through hole (9) and the fourth through hole (10) are the same in size and correspond to each other in position, and the third through hole (9) is completely located in the range of the second through hole (8).
4. A process for manufacturing a thermoelectric separation structure of a metal substrate according to claim 3, wherein: in the step S5, the adjustable heat dissipation assembly (5) is connected with the metal heat dissipation substrate (3) through soldering, and then the metal heat dissipation substrate (3) is connected with the heat dissipation fin plate (4), the heat dissipation fin plate (4) and the adjustable heat dissipation assembly (5) through the heat dissipation connection structure (6).
5. The process for manufacturing a thermoelectric separation structure of a metal substrate according to claim 4, wherein: in the step S6, when the heat dissipation medium (54) is heat conduction silicone grease, the annular baffle plate (52) and the through hole (53) are filled with the heat conduction silicone grease, the heat conduction silicone grease is compressed when the annular baffle plate (52) is arranged below the base of the electronic component, the redundant heat conduction silicone grease is discharged from the through hole (53), then the base of the electronic component and the annular baffle plate (52) are fixed through soldering, and the lower port of the through hole (53) is sealed through soldering; when the heat dissipation medium (54) is a soldering layer, an electronic component is mounted, a base of the electronic component presses the annular baffle plate (52) and completely covers the annular baffle plate (52), and the annular baffle plate (52) is filled with tin liquid through the through holes (53) by using a pressure device.
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| TWI692846B (en) * | 2019-03-21 | 2020-05-01 | 旭德科技股份有限公司 | Heat dissipation substrate and fabricating method thereof |
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| CN101776248A (en) * | 2009-01-09 | 2010-07-14 | 台达电子工业股份有限公司 | Lamp and illumination device thereof |
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