CN201682690U - Heat dissipation device for printed circuit board - Google Patents
Heat dissipation device for printed circuit board Download PDFInfo
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- CN201682690U CN201682690U CN2010201531128U CN201020153112U CN201682690U CN 201682690 U CN201682690 U CN 201682690U CN 2010201531128 U CN2010201531128 U CN 2010201531128U CN 201020153112 U CN201020153112 U CN 201020153112U CN 201682690 U CN201682690 U CN 201682690U
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- circuit board
- printed circuit
- pcb
- dissipating layer
- heat
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Abstract
The utility model relates to a heat dissipation device for a printed circuit board, which comprises a heat dissipation layer, wherein a plurality of concave-convex structures are arranged on the surface of the heat dissipation layer; the surface area of the inner side walls of the concave-convex structures is larger than the sum of the cross-sectional area of the open ends of the concave-convex structures. As the concave-convex structures increase the heat dissipation area of the heat dissipation device for the printed circuit board and enlarge the air convection, the heat dissipation effect is improved, and the volume of the heat dissipation device for the printed circuit board is reduced.
Description
Technical field
The utility model relates to a kind of heat abstractor, particularly a kind of printed circuit board radiating device that is used for printed circuit board (PCB).
Background technology
Continuous lifting along with electronic installation usefulness, heat abstractor or cooling system have become one of accessory indispensable in the existing electronic installation, if it is, gently then cause the usefulness variation, heavy then can cause burning of electronic installation because the heat energy that electronic installation produced does not suitably discharge in addition.Heat abstractor is important especially for microelectronic element, for example integrated circuit.Because along with the increase of integrated level and the progress of encapsulation technology, make the area of integrated circuit constantly dwindle, the heat that the while unit are is accumulated is also higher relatively, so the heat abstractor of high heat dissipation efficiency is an actively research and development object of electronic industry circle institute always.
A kind of circuit board heat abstractor decomposition texture of prior art as shown in Figure 1, described circuit board heat abstractor 10 is arranged on a printed circuit board (PCB) 1 wherein on the surface by hot pressing mode, and described printed circuit board (PCB) 1 another facing surfaces is provided with a plurality of electronic devices and components (figure does not show).
Described printed circuit board (PCB) 1 integral body is plate-like structure, and it is electrically connected with the mutual of application terminal product such as signal source in order to realize the electronic component of control signal, data, also can be in order to realize other lead function etc.Wherein side surface in described printed circuit board (PCB) 1 is provided with a plurality of electronic devices and components in order to the realization difference in functionality, as: amplifying circuit, electric capacity etc.
Described circuit board heat abstractor 10 comprises an adhesive linkage 11 and a copper coin layer 12.Described adhesive linkage 11 is folded between the surface and described copper coin layer 12 of described printed circuit board (PCB) 1, described copper coin layer 12 and described adhesive linkage 11 superimposed settings, and described adhesive linkage 11 bonding and fixing described copper coin layers 12 are in the surface of described printed circuit board (PCB) 1.
The nonconductive adhesive that the epoxide resin material doping curing agent that described adhesive linkage 11 is a kind of semi-solid preparations, plasticizer etc. form, it is pressed on described printed circuit board (PCB) 1 surface by heat pressing process with described copper coin layer 12.
Described copper coin layer 12 is tabular metallic gaskets, its surfacing, and hide described printed circuit board (PCB) 1 surface, described copper coin layer 12 tool earthed voltage are realized shielding action.
When described printed circuit board (PCB) 1 and described copper coin layer 12 by described adhesive linkage 11 when heat pressing process is pressed on described printed circuit board (PCB) 1 surface with described copper coin layer 12, make described adhesive linkage 11 at interval described printed circuit board (PCB)s 1 and described copper coin layers 12.Thus, when described printed circuit board (PCB) 1 was worked, the heat of its generation conducted to described copper coin layer 12 by adhesive linkage 11, forms a cooling system.
Yet though the part heat can pass through heat exchange pattern release portion heat, still there is following defective in described cooling system:
At first, the material that forms adhesive linkage 11 is an epoxide resin material, it is a kind of epoxy glue of semi-solid preparation, be doped with materials such as curing agent and plasticizer in it, so the heat conductivility of described adhesive linkage 11 reduces greatly, feasible thus not good when described printed circuit board (PCB) 1 internal heat dissipating, occur heat accumulation easily, and then reduce the reliability of described structure.
Secondly, because the rectangular flat material that described copper coin layer 12 is surfacings, so, be not easy to cause thermal convection, so reduce heat leakage efficient greatly when in heat transfer process.
At last,, then need to increase the surface area of copper coin layer 12 in order to obtain big area of dissipation, thus the volume of described printed circuit board (PCB) 1 unavoidably increased, and then cause the electronic installation volume of the described structure of whole use to become big.
The utility model content
The heat abstractor volume reaches the not good problem of radiating effect greatly in the prior art in order to overcome, and the utility model provides that a kind of volume is little, the printed circuit board radiating device of good heat dissipation effect.
A kind of printed circuit board radiating device, it comprises a heat dissipating layer, described heat dissipating layer surface is provided with a plurality of concaveconvex structures, the long-pending end section area sum greater than described concaveconvex structure openend of the interior side-wall surface of described concaveconvex structure.
Further improvement as above-mentioned printed circuit board radiating device: described heat abstractor also comprises a conducting shell, and described heat dissipating layer is arranged on printed circuit board surface by described conducting shell.
Further improvement as above-mentioned printed circuit board radiating device: described concaveconvex structure comprises a plurality of regularly arranged grooves and projection, is provided with projection between the per two adjacent grooves.
Further improvement as above-mentioned printed circuit board radiating device: described concaveconvex structure is a plurality of crisscross grooves.
Further improvement as above-mentioned printed circuit board radiating device: described concaveconvex structure is to be the alveolate texture arrangement by a plurality of ventilation holes to form.
Further improvement as above-mentioned printed circuit board radiating device: described concaveconvex structure is by a plurality of matrix ventilation holes of arranging that are.
Further improvement as above-mentioned printed circuit board radiating device: described heat dissipating layer is made by in copper, copper alloy, the aluminum or aluminum alloy any one.
Further improvement as above-mentioned printed circuit board radiating device: described conducting shell is to be made by low thermal resistance rate material.
Further improvement as above-mentioned printed circuit board radiating device: described heat dissipating layer and described printed circuit board (PCB) are to be processed to form by reflow soldering process.
Compared with prior art, heat abstractor of the present utility model increases heat abstractor and air contact area by a plurality of concaveconvex structures are set on described heat dissipating layer, improve radiating effect; Reduce to use the heat dissipating layer volume by a plurality of concaveconvex structure modes are set simultaneously, and then reduce the volume of entire heat dissipation device.
Description of drawings
Fig. 1 is a kind of perspective exploded view of prior art printed circuit board radiating device.
Fig. 2 is that printed circuit board radiating device that the utility model first execution mode is disclosed is arranged on the solid assembling schematic diagram on the printed circuit board (PCB).
Fig. 3 is the solid assembling schematic diagram of printed circuit board (PCB) shown in Figure 2 and printed circuit board radiating device.
Fig. 4 is the three-dimensional assembling of another angle schematic diagram of printed circuit board (PCB) shown in Figure 2 and printed circuit board radiating device.
Fig. 5 is the processing process figure of printed circuit board radiating device shown in Figure 2.
Fig. 6 is welding process flow figure shown in Figure 5.
Fig. 7 is the printed circuit board radiating device sectional perspective schematic diagram that the utility model second execution mode is disclosed.
Fig. 8 is the printed circuit board radiating device sectional perspective schematic diagram that the utility model the 3rd execution mode is disclosed.
Embodiment
Seeing also Fig. 2, is the printed circuit board radiating device 20 three-dimensional assembling schematic diagrames that the utility model first execution mode is disclosed.Described printed circuit board radiating device 20 is superimposed to be arranged on a printed circuit board (PCB) 2 wherein on the side surface.
Described printed circuit board (PCB) 2 is a rectangle printed circuit board (PCB), in order to realize the electronic component of control signal, data, is electrically connected with the mutual of application terminal product such as signal source, also can be in order to realize other lead function etc.It is provided with a plurality of function electronic devices and components away from described printed circuit board radiating device 20 1 side surfaces.
Described printed circuit board radiating device 20 comprises a conducting shell 21 and a heat dissipating layer 22.Described conducting shell 21 is stacked at described printed circuit board (PCB) 2 surfaces, and described heat dissipating layer 22 is stacked at described conducting shell 21 surfaces, and described conducting shell 21 is located between described heat dissipating layer 22 and the described printed circuit board (PCB) 2.Described printed circuit board (PCB) 2 is adhesively fixed by described conducting shell 21 with described heat dissipating layer 22, and the two realizes the Rapid Thermal exchange by described conducting shell 21.
See also Fig. 3 and Fig. 4 again, wherein Fig. 3 is the perspective exploded view of printed circuit board (PCB) 2 shown in Figure 2 and heat abstractor 20, and Fig. 4 is printed circuit board (PCB) 2 shown in Figure 2 and the three-dimensional schematic diagram of assembling of another angle of heat abstractor 20.
Described printed circuit board (PCB) 2 is one a plurality of circuit structures to be in the circuitized substrate that stratiform is pressed on insulation, in order to carry or to be connected at the device of a plurality of electronic components on its surface, wherein said electronic component such as resistance, electric capacity, diode, semiconductor chip and various functional circuits etc.Described printed circuit board (PCB) 2 comprises two planes that are oppositely arranged (not indicating).On described a plurality of electronic component plane located therein.And also be provided with an annular choking coil (figure does not show) in another neighboring area, plane of described opposite side, described choking coil forms a closed circular structure, it is used for intercepting solder reflow process, after described conducting shell 21 melted by heat leak.
Described heat dissipating layer 22 is metallic gaskets of a tool zero potential, and in the present embodiment, described metallic gasket is to adopt the copper material of tool high thermoconductivity to make.Described heat dissipating layer 22 integral body are a rectangle, and its fringe region is corresponding with the annular retardation coil on described printed circuit board (PCB) 2 surfaces, and its outline institute circle zone is a bit larger tham described annular retardation coil institute area surrounded.Described heat dissipating layer 22 is provided with a plurality of concaveconvex structures 221 away from described conducting shell 21 side surfaces.Described concaveconvex structure 221 is provided with at interval successively with " projection " by a plurality of regularly arranged " grooves " and forms, the surface area of wherein said concaveconvex structure 221 is greater than the frontal projected area of described heat dissipating layer 22, promptly, the area of described concaveconvex structure 221 and air institute contact area is greater than the sectional area sum of described concaveconvex structure 221 openends, that is to say that the whole surface area of described heat dissipating layer 22 increases.
Certain described ground pad 23 can also be to adopt the aluminium base copper product that covers to make.When described heat dissipating layer 22 during, in the time of described heat dissipating layer 22 heat conduction, form a shielding layer and hide described printed circuit board (PCB) 2, to play shielding action with described printed circuit board (PCB) 2 superimposed settings.
Described conducting shell 21 is netted high-temp leadless wldings, and it is to be printed as network structure by a plurality of high-temp leadless soldering paste 210.The composition of described soldering paste 210 mainly is that the powder and the scaling powder of lead-free alloy mixes.Under the condition of being heated, the contact interface atom counterdiffusion mutually of the atom in the wlding of thawing and pad or soldered elements (main component is a copper atom) forms intermetallic compound (IMC), forms the crucial articulamentum of tool weld force.Described conducting shell 21 1 ends are welded in described heat dissipating layer 22, and its other end is welded on the wherein surface of described printed circuit board (PCB) 2.Described conducting shell 21 is to adopt Reflow Soldering (ReflowSoldering) mode to be formed between described heat dissipating layer 22 and the described printed circuit board (PCB) 2.In said embodiment, when adopting reflow soldering process between described heat dissipating layer 22 and described printed circuit board (PCB) 21, to form conducting shell 21, described soldering paste 210 melted by heat, described choking coil is an encapsulated coil, it stops that effectively the soldering paste 210 after the melted by heat that is positioned at fringe region overflows the edge of described heat dissipating layer 22 or described printed circuit board (PCB) 2, the conducting shell 21 that makes described soldering paste 210 cooling backs form is located between described heat dissipating layer 22 and the described printed circuit board (PCB) 2 fully, and connect airtight and touch, realize keeping good thermal conduction effect respectively between described printed circuit board (PCB) 2 and the described conducting shell 21 and between described conducting shell 21 and the described heat dissipating layer 22, guarantee product heat radiation reliability.
In described printed circuit board (PCB) 2 encapsulation processs, intermediate layer 21 is located between described heat dissipating layer 22 and the described printed circuit board (PCB) 2, its two ends are described heat dissipating layer 22 of butt and described printed circuit board (PCB) 2 respectively.When described printed circuit board (PCB) 2 is worked, the corresponding heat that produces of electronic component provided thereon, described part heat conducts to described heat dissipating layer 22 via described conducting shell 21, realize the heat exchange between described printed circuit board (PCB) 2 and the described heat dissipating layer 22 thus, and then dissipate in the air by the surface of described heat dissipating layer 22, avoid heat accumulation to cause harmful effect to described printed circuit board (PCB) 2.
Simultaneously, described heat dissipating layer 22 is metal shielding layers of a tool zero potential, effectively shields the external interference signal to the interference that printed circuit board (PCB) 2 causes, and reduces even avoids signal to disturb.
When making printed circuit board (PCB) packaging structure 2 described in the utility model, its manufacturing process as shown in Figure 4, its main operational steps is as follows:
Step S11 provides described printed circuit board (PCB) 2.In described and on the wherein side surface in the opposite flank a plurality of electronic devices are set, on surface, described another side, a choking coil is set.
Step S12 prints a plurality of soldering paste 210 by steel mesh on the surface of described printed circuit board (PCB) 2.The printing density of described soldering paste 210 and soldering paste 210 particle diameter sizes are set according to needed weld strength is corresponding.
Step S13 provides a copper metal material pad, and a wherein said copper metal material pad wherein side surface is provided with a plurality of concaveconvex structures 221.The outline of described copper metal material pad is corresponding to described choking coil profile.Described concaveconvex structure 221 is to be formed with " projection " is regularly arranged by " groove ", and described " groove " is to be formed by the etching deposition, can also be to form by the Physical Processing form, presss from both sides between per two adjacent " grooves " and establishes " projection ".
Step S14 adopts the Reflow Soldering mode to weld described copper metal material pad in described printed circuit board (PCB) 2 surfaces, obtains the described conducting shell 21 and the described heat dissipating layer 22 of superimposed tight setting.Wherein concrete Reflow Soldering flow process as shown in Figure 5.Step S21 is put into described copper metal material pad subsides on the soldering paste 210 of printed circuit board (PCB) 2 one side surfaces that are printed with soldering paste 210 by automatic placement machine; Step S22 by reflow soldering furnace, heats described soldering paste 210 in reflow soldering gradually, makes described soldering paste 210 melt, and described choking coil stops that the soldering paste 210 after the thawing overflows the periphery of described copper metal material pad or described printed circuit board (PCB) 2; Step 23, cool off described printed circuit board (PCB) 2, make that the soldering paste 210 after the fusing solidifies, form described conducting shell 21 and described heat dissipating layer 22, welded together securely described heat dissipating layer 22 and described printed circuit board (PCB) 2, and have good conductive thermal exchange function between the three.
Certainly, in said embodiment, further distortion as above-mentioned manufacturing process, the manufacturing process of described printed circuit board radiating device 20 can also be at first by the steel mesh printing technology a plurality of soldering paste 210 to be printed in described copper metal material gasket surface, adopt chip mounter to be attached on the soldering paste 210 of described copper metal material gasket surface away from concaveconvex structure 221 1 side surfaces described printed circuit board (PCB) 2 then, next continue reflow soldering process, form described conducting shell 21 and heat dissipating layer 22, described copper metal material and described printed circuit board (PCB) 2 is welded together securely.
Compared to prior art, in described printed circuit board radiating device and manufacturing process, be used in described heat dissipating layer 22 and away from described printed circuit board (PCB) 2 one side surfaces a plurality of concaveconvex structures 221 be set, increase the contact area of entire heat dissipation device and air, accelerated heat is scattered and disappeared.Simultaneously, adopt the Reflow Soldering technology, make the conducting shell 21 with good thermal conductivity function replace epoxy resin layer of the prior art, the accelerated heat conduction further improves heat conduction efficiency.In addition, according to the thermal cycle convective principles, described concaveconvex structure 221 makes that described heat dissipating layer 22 surface local temperature are inconsistent, quickens ambient gas and flows, be beneficial to heat dissipation, improve the production reliability of described printed circuit board (PCB) 2 and the yield in the manufacture course of products greatly.
When described printed circuit board (PCB) 2 is worked, the heat of its generation conducts to the conducting shell 21 of described printed circuit board radiating device 20, described conducting shell 21 by with air contacting surface conduction portion heat to ambient cold air, simultaneously another part thermal energy conduction to described heat dissipating layer 22, described heat dissipating layer 22 same by the surface conductive heat that contacts with air to ambient cold air.
Described printed circuit board radiating device 20 constitutes a cooling system by the surface that described conducting shell 21 and described heat dissipating layer 22 contact with air, and the heat that described printed circuit board (PCB) 2 is produced effectively sheds, and guarantees that electronic devices and components are functional on it.
Compared to prior art, the printed circuit board radiating device 20 that described execution mode disclosed adopts concaveconvex structure 221 is set on heat dissipating layer 22, increases described heat abstractor 2 and air contact area, improves radiating efficiency.Simultaneously, in said embodiment, only use small size heat dissipating layer 22 just can play better heat radiating effect, effectively reduce the overall volume of printed circuit board radiating device 2.
Seeing also Fig. 6 again, is that printed circuit board radiating device 30 that the utility model second execution mode is disclosed is arranged on the schematic perspective view on the printed circuit board (PCB) 3.
In said embodiment, described printed circuit board radiating device 30 materials by low thermal resistance rates such as tin creams are arranged on the described printed circuit board (PCB) 3.Described heat abstractor 30 comprises a conducting shell 31 and a heat dissipating layer 32, concaveconvex structure 321 on the wherein said heat dissipating layer 32 is a plurality of ventilation holes 322, described a plurality of ventilation hole 322 is cellular and is distributed on the described heat dissipating layer 32, and the inner wall area of described ventilation hole 321 is greater than the long-pending sum of its opened end section.Wherein said heat dissipating layer 32 can be made by copper, copper alloy, aluminum or aluminum alloy, and described ventilation hole 322 radiuses are less than described heat dissipating layer 32 thickness.
In this embodiment, described heat dissipating layer 32 directly is provided with a plurality of ventilation holes 322, increases described printed circuit board radiating device 30 and air contacting surface area, guarantee that described heat abstractor has significant radiating effect.Simultaneously, compared to a last execution mode, printed circuit board radiating device 30 volumes have further been reduced.Certainly, the arrangement of described ventilation hole 322 can be regular, also can be irregular.
Seeing also Fig. 7, is that heat abstractor 40 that the utility model the 3rd execution mode is disclosed is arranged on the schematic perspective view on the printed circuit board (PCB) 4.Printed circuit board radiating device 30 differences that the printed circuit board radiating device 40 of wherein said execution mode and second execution mode are disclosed are: the concaveconvex structure 421 that is arranged on described heat dissipating layer 42 surfaces is a plurality of crisscross grooves 422, and described groove 422 is evenly distributed, and the inner wall surface area of described groove 422 and greater than the long-pending sum of its opened end section.
Compared to second execution mode, crisscross groove 422 in described heat dissipating layer 42 surfaces, form the air channel of both direction, with regard to gas with regard to flowing in the described printed circuit board radiating device 40, gas around the described printed circuit board radiating device 40 can flow along the gas flow direction between per two adjacent grooves, forms a combined type multithread to heat dissipation channel.And on the gas flow direction, the hot-air that cold air on every side and printed circuit board radiating device 40 discharge mutual bump on the gas flow direction, thereby release heat better improve radiating efficiency.Accelerated heat is scattered and disappeared, and improves radiating efficiency greatly.
Only be preferred case study on implementation of the present utility model below, be not limited to the utility model, for a person skilled in the art, the utility model can have various changes and variation.All within spirit of the present utility model and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (9)
1. heat abstractor that is used for printed circuit board (PCB), it comprises a heat dissipating layer, it is characterized in that: described heat dissipating layer surface is provided with a plurality of concaveconvex structures, the interior side-wall surface of described concaveconvex structure long-pending greater than described concaveconvex structure openend the end section area and.
2. the heat abstractor that is used for printed circuit board (PCB) as claimed in claim 1 is characterized in that: described heat abstractor also comprises a conducting shell, and described heat dissipating layer is fixed on printed circuit board surface by described conducting shell.
3. the heat abstractor that is used for printed circuit board (PCB) as claimed in claim 2 is characterized in that: described concaveconvex structure comprises a plurality of regularly arranged grooves and projection, is provided with projection between the per two adjacent grooves.
4. the heat abstractor that is used for printed circuit board (PCB) as claimed in claim 2 is characterized in that: described concaveconvex structure is a plurality of crisscross grooves.
5. the heat abstractor that is used for printed circuit board (PCB) as claimed in claim 2 is characterized in that: described concaveconvex structure is to be the alveolate texture arrangement by a plurality of ventilation holes to form.
6. the heat abstractor that is used for printed circuit board (PCB) as claimed in claim 2 is characterized in that: described concaveconvex structure is by a plurality of matrix ventilation holes of arranging that are.
7. the heat abstractor that is used for printed circuit board (PCB) as claimed in claim 2 is characterized in that: described heat dissipating layer is made by in copper, copper alloy, the aluminum or aluminum alloy any one.
8. the heat abstractor that is used for printed circuit board (PCB) as claimed in claim 2 is characterized in that: described conducting shell is to be made by low thermal resistance rate material.
9. the heat abstractor that is used for printed circuit board (PCB) as claimed in claim 2 is characterized in that: described heat dissipating layer and described printed circuit board (PCB) are to be processed to form by reflow soldering process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201531128U CN201682690U (en) | 2010-04-08 | 2010-04-08 | Heat dissipation device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201531128U CN201682690U (en) | 2010-04-08 | 2010-04-08 | Heat dissipation device for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201682690U true CN201682690U (en) | 2010-12-22 |
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ID=43347721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201531128U Expired - Lifetime CN201682690U (en) | 2010-04-08 | 2010-04-08 | Heat dissipation device for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201682690U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104333981A (en) * | 2014-10-16 | 2015-02-04 | 惠州智科实业有限公司 | Manufacturing method of LED heat radiating substrate and LED module with substrate |
| WO2015192425A1 (en) * | 2014-06-18 | 2015-12-23 | 黄欣 | Circuit board capable of dissipating heat from two sides, for light-emitting diode (led) display screen |
| CN104902154B (en) * | 2015-05-27 | 2019-02-12 | 南昌欧菲光电技术有限公司 | Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device |
-
2010
- 2010-04-08 CN CN2010201531128U patent/CN201682690U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015192425A1 (en) * | 2014-06-18 | 2015-12-23 | 黄欣 | Circuit board capable of dissipating heat from two sides, for light-emitting diode (led) display screen |
| CN104333981A (en) * | 2014-10-16 | 2015-02-04 | 惠州智科实业有限公司 | Manufacturing method of LED heat radiating substrate and LED module with substrate |
| CN104902154B (en) * | 2015-05-27 | 2019-02-12 | 南昌欧菲光电技术有限公司 | Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device |
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| C14 | Grant of patent or utility model | ||
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| CX01 | Expiry of patent term |
Granted publication date: 20101222 |
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| CX01 | Expiry of patent term |