CN105744724A - Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of electronic device - Google Patents
Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of electronic device Download PDFInfo
- Publication number
- CN105744724A CN105744724A CN201610154715.1A CN201610154715A CN105744724A CN 105744724 A CN105744724 A CN 105744724A CN 201610154715 A CN201610154715 A CN 201610154715A CN 105744724 A CN105744724 A CN 105744724A
- Authority
- CN
- China
- Prior art keywords
- electronic device
- heat
- radome
- circuit board
- heat conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 11
- 230000000694 effects Effects 0.000 abstract description 15
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 9
- 230000005855 radiation Effects 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Abstract
The invention is suitable for the technical field of heat dissipation of electronic devices, and discloses a heat dissipation structure of an electronic device, wearable electronic equipment and a heat dissipation method of the electronic device. The heat dissipation structure of the electronic device comprises a circuit board and the electronic device, wherein the electronic device is connected to the circuit board; a conductive circuit layer is arranged on the surface, connected with the electronic device, of the circuit board; a heat-conducting solder resist ink layer is arranged on the surface of the conductive circuit layer; a heat-conducting underfill adhesive is arranged between the bottom part or/and the side surface of the electronic device and the heat-conducting solder resist ink layer; a shielding cover covers the electronic device and is connected to the circuit board; and the wearable electronic equipment has the heat dissipation structure of the electronic device. According to the heat dissipation structure of the electronic device, the wearable electronic equipment and the heat dissipation method of the electronic device, the heat conduction effect and the heat dissipation effect are improved, so that the condition that the electronic device can reliably and stably work is ensured; and the reliability of a product is good.
Description
Technical field
The invention belongs to Cooling Technology of Electronic Device field, particularly relate to the radiator structure of a kind of electronic device, Wearable electronic equipment and heat dissipating method thereof.
Background technology
Current electronic equipment, for instance Wearable electronic equipment, for intelligent watch, its structure space is little, and area of dissipation is little, causes that caloric value is big, and complete machine temperature is high；If adopting conventional graphite radiating film to be attached to IC surface, limited efficiency；If adopting the metal material such as Copper Foil to increase area of dissipation, cost can rise and cannot reduce the thickness of product.
Summary of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, it is provided that the radiator structure of a kind of electronic device, Wearable electronic equipment and heat dissipating method thereof, its good heat dissipation effect, of good reliability.
The technical scheme is that the radiator structure of a kind of electronic device, including circuit board and the electronic device being connected to described circuit board, described circuit board is connected to the surface configuration of described electronic device conductive circuit layer, the surface configuration of described conductive circuit layer has heat conduction solder mask layer, the bottom of described electronic device is or/and be provided with heat conductivity underfill between side and described heat conduction solder mask layer, described electronic device is covered with radome, and described radome is connected to described circuit board.
Alternatively, described bottom heat conductivity filling glue connects with the inner side of described electronic device, heat conduction solder mask layer and radome respectively.
Alternatively, it is provided with heat conductivity top between upper end and the described radome of described electronic device and fills glue.
Alternatively, filling glue in described heat conductivity top contacts with described bottom heat conductivity filling glue.
Alternatively, the top of described radome or/and lateral wall has been sticked heat dissipation film material.
Present invention also offers a kind of Wearable electronic equipment, described Wearable electronic equipment has the radiator structure of above-mentioned electronic device.
Alternatively, described Wearable electronic equipment is intelligent watch.
Present invention also offers the heat dissipating method of electronic device in a kind of Wearable electronic equipment, circuit board surface in Wearable electronic equipment arranges heat conduction solder mask layer, electronic device is welded in described circuit board, and between described electronic device and described heat conduction solder mask layer, fill heat conductivity underfill, buckling radome outside described electronic device and described radome is connected to described circuit board, the partial heat produced during the work of described electronic device is by heat conductivity underfill conduction to circuit board and radome.
Alternatively, before buckling radome, being provided with the heat conductivity top filling glue that the inner side with described radome contacts in the upper end of described electronic device, the partial heat produced during the work of described electronic device is filled glue by heat conductivity top and is conducted to radome.
Alternatively, the end face in described radome is sticked heat dissipation film material, and the partial heat of described radome passes through heat dissipation film material, is radiated in external environment condition.
The radiator structure of electronic device provided by the present invention, Wearable electronic equipment and heat dissipating method thereof, heat conductivity underfill can reduce thermal resistance, when making electronic device work produce heat can in time, be conducted efficiently to outside, heat conduction, good heat dissipation effect, and, it is not necessary to adopting Copper Foil etc. to increase area of dissipation, application cost is low, and the thickness of product, the demand lightening to meet product can be effectively reduced.Heat conductivity top is filled glue and is not only contacted with electronic device, radome, also contacts with heat conductivity underfill simultaneously, further increases the effect of heat conduction and heat radiation, and to ensure that electronic device can reliably, stably work, product reliability is good.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme in the embodiment of the present invention, the accompanying drawing used required in embodiment will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the floor map of the radiator structure of the electronic device that the embodiment of the present invention provides.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention.
It should be noted that be referred to as " being fixed on " or " being arranged at " another element when element, it can directly on another element or may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can be directly to another element or may be simultaneously present centering elements.
Also, it should be noted the orientation term such as left and right, upper and lower in the embodiment of the present invention, be only relative concept or with the normal operating condition of product for reference each other, and should not be regarded as have restrictive.
As it is shown in figure 1, the radiator structure of a kind of electronic device of embodiment of the present invention offer, including circuit board 1 and the electronic device (IC) 2 being connected to described circuit board 1, circuit board 1 can be multilayer circuit board.Described circuit board 1 is connected to the surface configuration of described electronic device 2 conductive circuit layer 11, and conductive circuit layer 11 can be copper foil layer.The surface configuration of described conductive circuit layer 11 has heat conduction solder mask layer 3, and heat conduction solder mask layer 3, except the function with welding resistance, also has the function of heat conduction.The bottom of described electronic device 2 is or/and be provided with heat conductivity underfill 4 between side and described heat conduction solder mask layer 3, described electronic device 2 is covered with radome 7, described radome 7 is connected to described circuit board 1, heat conductivity underfill 4 can reduce thermal resistance, the heat produced when making electronic device 2 work can be timely, it is conducted efficiently to outside, heat conduction, good heat dissipation effect, in figure, arrow is heat dissipation path signal, and electronic device 2 can be made more firm, not easily get loose, to ensure that electronic device 2 can be reliable, stably work, product reliability is good, and, without adopting Copper Foil etc. to increase area of dissipation, application cost is low, and the thickness of product can be effectively reduced, the demand lightening to meet product.
In concrete application, described bottom heat conductivity is filled glue and is connected with the inner side of described electronic device 2, heat conduction solder mask layer 3 and radome 7 respectively, and heat-conducting effect is good.
Specifically, it is provided with heat conductivity top between upper end and the described radome 7 of described electronic device 2 and fills glue 5, to improve the effect of heat conduction and heat radiation further.In concrete application, heat conductivity top fill glue 5 heat conductivity can more than heat conductivity underfill 4 so that heat-conducting effect is more preferably.Bottom heat conductivity fills glue and heat conductivity top is filled glue 5 and is respectively provided with the characteristic of high heat conduction, high temperature resistant, insulation and bonding.
Specifically, described heat conductivity top is filled glue 5 and is contacted with described bottom heat conductivity filling glue, namely filling glue 5 in heat conductivity top not only contacts with electronic device 2, radome 7, also contacts with heat conductivity underfill 4 simultaneously, further increases the effect of heat conduction and heat radiation.
Specifically, the top of described radome 7 is heat dissipation film material 6 or/and lateral wall has been sticked, further to improve the heat-sinking capability of product.
In concrete application, the heat conductivity of heat conduction solder mask layer 3 can more than or equal to 1.0W/m.K, and the heat conductivity of heat conductivity underfill 4 can more than or equal to 1.0W/m.K, and the heat conductivity of glue 5 is filled at heat conductivity top can more than or equal to 2.0W/m.K.
nullThe embodiment of the present invention additionally provides a kind of Wearable electronic equipment，Described Wearable electronic equipment has the radiator structure of above-mentioned electronic device 2，It is provided with circuit board 1 in Wearable electronic equipment and is connected to the electronic device 2 of described circuit board 1，The bottom of described electronic device 2 is or/and be provided with heat conductivity underfill 4 between side and described heat conduction solder mask layer 3，Described electronic device 2 is covered with radome 7，Described radome 7 is connected to described circuit board 1，Heat conductivity underfill 4 can be filled in bottom electronic device 2 and about，And heat conductivity underfill 4 can also contact with the inner side of radome 7，Heat conductivity underfill 4 can reduce thermal resistance，The heat produced when making electronic device 2 work can be timely、It is conducted efficiently to outside，Heat conduction、Good heat dissipation effect，And electronic device 2 can be made more firm，Not easily get loose，To ensure that electronic device 2 can be reliable、Stably work，Product reliability is good，And，Without adopting Copper Foil etc. to increase area of dissipation，Application cost is low，And the thickness of product can be effectively reduced，The demand lightening to meet product.
Specifically, described Wearable electronic equipment can be intelligent watch etc., and its product is frivolous.
nullThe embodiment of the present invention additionally provides the heat dissipating method of electronic device 2 in a kind of Wearable electronic equipment，Circuit board 1 surface configuration heat conduction solder mask layer 3 in Wearable electronic equipment，Electronic device 2 is welded in described circuit board 1，And between described electronic device 2 and described heat conduction solder mask layer 3, fill heat conductivity underfill 4，Outside described electronic device 2, buckle radome 7 and described radome 7 is connected to described circuit board 1，The partial heat produced when described electronic device 2 works is conducted to circuit board 1 and radome 7 by heat conductivity underfill 4，Heat conductivity underfill 4 can reduce thermal resistance，The heat produced when making electronic device 2 work can be timely、It is conducted efficiently to outside，Heat conduction、Good heat dissipation effect，And electronic device 2 can be made more firm，Not easily get loose，To ensure that electronic device 2 can be reliable、Stably work，Product reliability is good，And，Without adopting Copper Foil etc. to increase area of dissipation，Application cost is low，And the thickness of product can be effectively reduced，The demand lightening to meet product.
Specifically, before buckling radome 7, the heat conductivity top filling glue 5 that the inner side with described radome 7 contacts it is provided with in the upper end of described electronic device 2, the partial heat produced when described electronic device 2 works is filled glue 5 by heat conductivity top and is conducted to radome 7, described heat conductivity top is filled glue 5 and is contacted with described bottom heat conductivity filling glue, namely filling glue 5 in heat conductivity top not only contacts with electronic device 2, radome 7, also contact with heat conductivity underfill 4 simultaneously, further increase the effect of heat conduction and heat radiation.
Specifically, the end face in described radome 7 is sticked heat dissipation film material 6, and the partial heat of described radome 7 passes through heat dissipation film material 6, is radiated in external environment condition, further to improve the heat-sinking capability of product.
In concrete application, after the outermost layer Copper Foil of circuit board 1 (PCB multilayer board) etches, make one layer of heat conduction solder mask layer 3 (heat conductivity: >=1.0W/m.K) possessing heat conduction；After electronic device 2 has been pasted in Reflow Soldering, heat conductivity underfill 4 (heat conductivity: >=1.0W/m.K) is set in the bottom of electronic device 2 and glue 5 (heat conductivity: >=2.0W/m.K) is filled at heat conductivity top, then buckle radome 7；When assembling complete machine, radome 7 pastes heat dissipation film material 6 again, conducts heat on other radomes 7 and hardware；Finally realize high-efficiency heat conduction and the heat radiation of PCB body, metallic shield 7 achieves high-efficiency heat conduction and thermal diffusivity, to ensure that electronic device 2 and product entirety can reliably, stably work, product reliability is good, and, it is not necessary to adopting Copper Foil etc. to increase area of dissipation, application cost is low, and the thickness of product, the demand lightening to meet product can be effectively reduced.In concrete application, it is also possible to cancel heat conductivity top and fill in glue 5 and heat dissipation film material 6 any one or two kinds.
The radiator structure of the electronic device 2 that the embodiment of the present invention provides, Wearable electronic equipment and heat dissipating method thereof, heat conductivity underfill 4 can reduce thermal resistance, the heat produced when making electronic device 2 work can be timely, it is conducted efficiently to outside, heat conduction, good heat dissipation effect, and electronic device 2 can be made more firm, not easily get loose, to ensure that electronic device 2 can be reliable, stably work, product reliability is good, and, without adopting Copper Foil etc. to increase area of dissipation, application cost is low, and the thickness of product can be effectively reduced, the demand lightening to meet product.Heat conductivity top is filled glue 5 and is contacted with described bottom heat conductivity filling glue, and namely filling glue 5 in heat conductivity top not only contacts with electronic device 2, radome 7, also contacts with heat conductivity underfill 4 simultaneously, further increases the effect of heat conduction and heat radiation.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all any amendment, equivalent replacement or improvement etc. made within the spirit and principles in the present invention, should be included within protection scope of the present invention.
Claims (10)
1. the radiator structure of an electronic device, including circuit board and the electronic device being connected to described circuit board, described circuit board is connected to the surface configuration of described electronic device conductive circuit layer, it is characterized in that, the surface configuration of described conductive circuit layer has heat conduction solder mask layer, the bottom of described electronic device is or/and be provided with heat conductivity underfill between side and described heat conduction solder mask layer, and described electronic device is covered with radome, and described radome is connected to described circuit board.
2. the radiator structure of electronic device as claimed in claim 1, it is characterised in that described bottom heat conductivity is filled glue and connected with the inner side of described electronic device, heat conduction solder mask layer and radome respectively.
3. the radiator structure of electronic device as claimed in claim 2, it is characterised in that be provided with heat conductivity top between upper end and the described radome of described electronic device and fill glue.
4. the radiator structure of electronic device as claimed in claim 3, it is characterised in that described heat conductivity top is filled glue and contacted with described bottom heat conductivity filling glue.
5. the radiator structure of the electronic device as according to any one of Claims 1-4, it is characterised in that the top of described radome is heat dissipation film material or/and lateral wall has been sticked.
6. a Wearable electronic equipment, it is characterised in that described Wearable electronic equipment has the radiator structure of the electronic device as according to any one of claim 1 to 5.
7. Wearable electronic equipment as claimed in claim 6, it is characterised in that described Wearable electronic equipment is intelligent watch.
8. the heat dissipating method of electronic device in a Wearable electronic equipment, it is characterized in that, circuit board surface in Wearable electronic equipment arranges heat conduction solder mask layer, electronic device is welded in described circuit board, and between described electronic device and described heat conduction solder mask layer, fill heat conductivity underfill, buckling radome outside described electronic device and described radome is connected to described circuit board, the partial heat produced during the work of described electronic device is by heat conductivity underfill conduction to circuit board and radome.
9. the heat dissipating method of electronic device in Wearable electronic equipment as claimed in claim 8, it is characterized in that, before buckling radome, be provided with the heat conductivity top filling glue that the inner side with described radome contacts in the upper end of described electronic device, the partial heat produced during the work of described electronic device is filled glue by heat conductivity top and is conducted to radome.
10. the as claimed in claim 8 or 9 heat dissipating method of electronic device in Wearable electronic equipment, it is characterised in that the end face in described radome is sticked heat dissipation film material, and the partial heat of described radome passes through heat dissipation film material, is radiated in external environment condition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610154715.1A CN105744724B (en) | 2016-03-17 | 2016-03-17 | Radiator structure, wearable electronic equipment and its heat dissipating method of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610154715.1A CN105744724B (en) | 2016-03-17 | 2016-03-17 | Radiator structure, wearable electronic equipment and its heat dissipating method of electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105744724A true CN105744724A (en) | 2016-07-06 |
| CN105744724B CN105744724B (en) | 2018-09-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610154715.1A Expired - Fee Related CN105744724B (en) | 2016-03-17 | 2016-03-17 | Radiator structure, wearable electronic equipment and its heat dissipating method of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105744724B (en) |
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| CN108111718A (en) * | 2016-11-25 | 2018-06-01 | 三星电机株式会社 | Vehicle-mounted pick-up head module |
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| CN106211553A (en) * | 2016-07-28 | 2016-12-07 | 广东欧珀移动通信有限公司 | Pcb board assembly and there is its mobile terminal |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105744724B (en) | 2018-09-21 |
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