CN203596971U - Circuit board having heat dissipation function - Google Patents

Circuit board having heat dissipation function Download PDF

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Publication number
CN203596971U
CN203596971U CN201320629716.9U CN201320629716U CN203596971U CN 203596971 U CN203596971 U CN 203596971U CN 201320629716 U CN201320629716 U CN 201320629716U CN 203596971 U CN203596971 U CN 203596971U
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CN
China
Prior art keywords
heat
circuit board
circuit substrate
generating components
heat dissipation
Prior art date
Application number
CN201320629716.9U
Other languages
Chinese (zh)
Inventor
别文涛
Original Assignee
上海斐讯数据通信技术有限公司
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Filing date
Publication date
Application filed by 上海斐讯数据通信技术有限公司 filed Critical 上海斐讯数据通信技术有限公司
Priority to CN201320629716.9U priority Critical patent/CN203596971U/en
Application granted granted Critical
Publication of CN203596971U publication Critical patent/CN203596971U/en

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Abstract

The utility model provides a circuit board having a heat dissipation function comprising a circuit substrate having a first surface and a second surface; a heating part, which is disposed on the first front surface of the circuit substrate by welding spots; a shielding cover, which is connected with the first surface of the circuit substrate, and is disposed above the heating part; heat dissipation through holes, which penetrate the circuit substrate, are corresponding to the position of the heating part, and are used to conduct the heat energy dissipated by the heating part to the second surface of the circuit substrate; a heat conduction path disposed on the second surface of the circuit substrate. The heat dissipation through holes are disposed right under or around the heating part, and the diameter of each of the heat dissipation through holes is in a range from 0.2mm to 0.3mm, and in addition, the sizes of the heat dissipation through holes can be the same or different. The circuit board is advantageous in that the problems of the circuit boards of the prior art such as large heating value and weak heat dissipation function can be solved, and the heat dissipation effect of the circuit boards of the cell phones and other smart terminals can be greatly improved.

Description

A kind of circuit board with heat sinking function
Technical field
The utility model relates to intelligent terminal technical field, particularly relates to the circuit board technology field in intelligent terminal, is specially a kind of circuit board with heat sinking function.
Background technology
In the past few years, double-core, four cores, 4G, flat board, Android4.0, Tegra3/4 chip, cloud storage, these vocabulary become the focus that people pay close attention in succession, also become the core technology of star's product of all big enterprises in the industry simultaneously.
Along with the development of industry, mobile phone will be more intelligent, configure highlyer, and arithmetic speed is faster, and CPU frequency will be more and more higher.For multi-functional, the smart mobile phone of multitask, if long-play large software or game, CPU, the temperature of the devices such as LCM can uprise, and performance can sharply reduce, the same with all electrical type devices, only, in suitable temperature range, just can guarantee the working properly and lasting of device.So heat radiation is in order to guarantee that these devices are not burned on the one hand, be to guarantee that they are workable quite good on the other hand.Meanwhile, radio communication device, because will transmit and receive signal, is equally also to produce along with transmitting and receiving of useful signal a large amount of heats; work as excess Temperature; mobile phone will start self-protective mechanism, and auto-breaking so also can affect the normal use of mobile phone.The 4G communication LTE technology (abbreviation of Long Term Evolution-Long Term Evolution) of a new generation, will greatly strengthen the transmitting of radio frequency and accept the ability of data, more than LTE estimates the highest downloading rate 100Mbps and uploads 50Mbps, data, when interior of mobile phone is processed more and more rapidly, have also proposed new challenge to the heating problem that is about to the smart mobile phone occurring.
The processing of current each categorles cell phone manufacturer on heat dissipation problem, the similar mode of basic employing, main principle be exactly by heat from hot spot region by the mode of outside material etc. other regions of leading, and then again heat is derived to mobile phone, the more method of current application mainly contain following some:
1, screening cover material all adopts the foreign copper-nickel alloy that heat conductivility is better;
2, screening cover surface and LCM below steel disc are paved with graphite heat radiation fin;
3, between screening cover and euthermic chip, fill with heat conductive silica gel;
Due to the space structure restriction of mobile phone, be not suitable for adopting the traditional heat-dissipating modes such as air-cooled and water-cooled, graphite and heat conductive silica gel become most suitable mobile phone heat sink material at present.
To sum up, existing smart mobile phone heat dissipation technology is all that the starting point is placed on to outer handset, by Heat Conduction Material, heat is exported to outside from inside, then, by being attached to the Heat Conduction Material on mobile phone surface, realizes heat-conducting effect.These heat dissipation technologys are just considered the method for heat radiation outside circuit board of mobile phone, and have ignored the heat conduction of printed circuit board (pcb) inside.A circuit board has the concentrated region of heating conventionally, if good heat conduction measure is not done in the PCB design phase in this region, will badly influence so outside heat-conducting effect, finally can make the radiating effect of mobile phone have a greatly reduced quality.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of circuit board with heat sinking function, and for solving, prior art circuit board heating amount is large, the problem of poor heat radiation.
For achieving the above object and other relevant objects, the utility model provides a kind of circuit board with heat sinking function, and described circuit board comprises: the circuit substrate with first surface and second surface; Be arranged on the heat generating components on described circuit substrate the first front by solder joint; Join with the first surface of described circuit substrate and be arranged on the radome of described heat generating components top; Run through described circuit substrate the heat radiation through hole with the corresponding second surface that is transmitted to described circuit substrate for the heat that described heat generating components is distributed in described heat generating components position.
In a kind of circuit board with heat sinking function of the present utility model, described heat radiation through hole be positioned at described heat generating components under or/and around.
In a kind of circuit board with heat sinking function of the present utility model, the diameter of described heat radiation through hole is 0.2mm~0.3mm.
In a kind of circuit board with heat sinking function of the present utility model, the equal and opposite in direction of some described heat radiation through holes.
In a kind of circuit board with heat sinking function of the present utility model, the equal and opposite in direction of the some described heat radiation through holes of part.
In a kind of circuit board with heat sinking function of the present utility model, some described heat radiation through holes under described heat generating components or/and around evenly distributed.
In a kind of circuit board with heat sinking function of the present utility model, some described heat radiation through holes under described heat generating components or/and around irregular distribution.
In a kind of circuit board with heat sinking function of the present utility model, described heat generating components is chip.
In a kind of circuit board with heat sinking function of the present utility model, the second surface of described circuit substrate is provided with the thermally conductive pathways for conducting heat.
As mentioned above, a kind of circuit board with heat sinking function of the present utility model, has following beneficial effect:
1, the utility model is by adding the through hole of a certain amount of thermolysis at thermal source concentrated area (heat generating components), the heat that allows this region produce can be transmitted to by these through holes the back side of circuit board, retain heat dissipation region and circulation of air path at back of circuit board, heat is imported to the good region of heat radiation simultaneously.Thereby the utility model can allow radiating effect on the circuit board plate of the intelligent terminals such as mobile phone greatly promote, so the utility model solves the problem of the potential safety hazard that intelligent terminal in prior art brings due to heating.
2, the utility model heat dissipating method on the housing of the intelligent terminals such as the outer and mobile phone of circuit board plate in prior art of arranging in pairs or groups so again, the object that finally reaches the heat dissipation problem that solves the intelligent terminals such as mobile phone, is well solved the heat dissipation problem of the intelligent terminals such as mobile phone.
3, the utility model practicality and economy are very high, have use value widely.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of a kind of circuit board with heat sinking function of the present utility model.
Fig. 2 is shown as the arrangement schematic diagram of the through hole that dispels the heat in a kind of circuit board with heat sinking function of the present utility model.
Element numbers explanation
1 circuit substrate
2 heat generating components
3 radomes
4 heat radiation through holes
5 solder joints
Embodiment
By specific instantiation, execution mode of the present utility model is described below, those skilled in the art can understand other advantages of the present utility model and effect easily by the disclosed content of this specification.The utility model can also be implemented or be applied by other different embodiment, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications or change not deviating under spirit of the present utility model.
The purpose of this utility model is to provide a kind of circuit board with heat sinking function, and for solving, prior art circuit board heating amount is large, the problem of poor heat radiation.The utility model can be applied in the intelligent terminals such as mobile phone, and for solving the intelligent terminals such as mobile phone, in use caloric value is large, the problem that heat dispersion is not good.
The utility model is for dispelling the heat on circuit board plate, add the design of dispelling the heat on entering plate in Printed Circuit Board Design (PCB LAYOUT) stage, the heat that adds the through hole of a certain amount of thermolysis to allow this region produce in thermal source concentrated area can be transmitted to by these through holes the back side of circuit board, retain heat dissipation region at back of circuit board simultaneously, heat conduction technology beyond circulation of air path on coupled circuit plate and PCB again, imports the good region of heat radiation by heat.
To elaborate principle and the execution mode of a kind of circuit board with heat sinking function of the present utility model below, make those skilled in the art not need creative work can understand a kind of circuit board with heat sinking function of the present utility model.
Refer to Fig. 1, be shown as the structural representation of a kind of circuit board with heat sinking function of the present utility model.As shown in Figure 1, described a kind of circuit board with heat sinking function comprises: circuit substrate 1, heat generating components 2, radome 3 and heat radiation through hole 4.
Described circuit substrate 1 has first surface (front) and second surface (reverse side).Described circuit substrate 1 is made up of the resin circuit board that forms wiring pattern and ground connection figure at internal layer.Generally, the materials'use thermal conductivity of described circuit substrate 1 and the good ceramic substrate of electric property.
It is positive upper that described heat generating components 2 is arranged on described circuit substrate 1 first by solder joint 5, and described heat generating components 2 is generally high power device, and particularly, in the present embodiment, described heat generating components 2 is chip.Chip, in the time of the operation of the intelligent terminals such as mobile phone, produces amount of heat, makes mobile phone hot, brings potential safety hazard.
Described radome 3 joins and is arranged on described heat generating components 2 tops with the first surface of described circuit substrate 1.Described radome 3 gets up heat generating components 2 and corresponding electronic devices and components cover as required, makes heat generating components 2 and corresponding electronic devices and components and other element shielding isolation.Described radome 3 can adopt the material that heat conductivility is better to make simultaneously, for example foreign copper-nickel alloy.
Described heat radiation through hole 4 runs through described circuit substrate 1 second surface that for heat that described heat generating components 2 distributed be transmitted to described circuit substrate 1 corresponding with described heat generating components 2 positions.
Described heat radiation through hole 4 is distributed in heat source region, and namely the residing position of heat generating components 2, dispels the heat with the heat that heat generating components 2 is distributed.
Particularly, in the present embodiment, as shown in Figure 2, described heat radiation through hole 4 be positioned at described heat generating components 2 under or/and around.For improving radiating effect, around chip, the heat radiation through hole 4 that arranges as much as possible of the place of internal voids.
Generally, the diameter range of described heat radiation through hole 4 is 0.2mm~0.3mm.The size of some described heat radiation through holes 4 can all equate.Due to narrow and small at local possible spaces such as internal voids, the meeting that may arrange of heat radiation through hole 4 is relatively less, so in the utility model, equal and opposite in direction that also can the some described heat radiation through holes 4 of part, allows the different heat radiation through hole 4 in some apertures of existence.
As shown in Figure 2, some described heat radiation through holes 4 under described heat generating components 2 or/and around can be evenly distributed, simultaneously, some described heat radiation through holes 4 under described heat generating components 2 or/and around also can irregularly distribute, as long as in the situation that guaranteeing that circuit board basic function and other element are not affected, be intended to described heat generating components 2 under or/and the position of described heat radiation through hole 4 is around set.
Heat at chip is transmitted to after the second surface of described circuit substrate 1 by heat radiation through hole 4, can be provided for conducting at the second surface of described circuit substrate 1 thermally conductive pathways of heat.
Particularly, in the second surface of described circuit substrate 1 region that leaves some space as much as possible, be convenient to heat and be transmitted to from chip the second surface of described circuit substrate 1, then spread heat comes.
According to above explanation, the heat sending when this chip operation will have the second surface back side that can be transmitted to by heat radiation through hole 4 greatly circuit substrate 1, then be transmitted to shell via the thermally conductive pathways at the back side, after spread heat, can obviously reduce the feel temperature at this place.
The utility model had made up in the past and just the starting point had been placed on to housing for current mobile phone heat radiation, or on radome 3, add the outside heat-conducting method of heat conducting film, set about from the heat conduction of mobile phone circuit intralamellar part with brand-new eye, work out the method for heat radiation in circuit kit plate, the intelligent terminals such as mobile phone only have and have carried the design in the utility model, could be at PCB(printed circuit board) design phase accomplishes the heat of circuit board high-temperature area fully to disperse, the technology of outside heat conduction is followed the heat dispersing of outer handset like this, just can have better effect.
In sum, a kind of circuit board with heat sinking function of the present utility model, reach following beneficial effect: the utility model is by adding the through hole of a certain amount of thermolysis at thermal source concentrated area (heat generating components), the heat that allows this region produce can be transmitted to by these through holes the back side of circuit board, retain heat dissipation region and circulation of air path at back of circuit board, heat is imported to the good region of heat radiation simultaneously.Thereby the utility model can allow radiating effect on the circuit board plate of the intelligent terminals such as mobile phone greatly promote, so the utility model solves the problem of the potential safety hazard that intelligent terminal in prior art brings due to heating; The utility model heat dissipating method on the housing of the intelligent terminals such as the outer and mobile phone of circuit board plate in prior art of arranging in pairs or groups so again, the object that finally reaches the heat dissipation problem that solves the intelligent terminals such as mobile phone, is well solved the heat dissipation problem of the intelligent terminals such as mobile phone; The utility model practicality and economy are very high, have use value widely.So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.

Claims (9)

1. a circuit board with heat sinking function, is characterized in that, described circuit board comprises:
There is the circuit substrate of first surface and second surface;
Be arranged on the heat generating components on described circuit substrate the first front by solder joint;
Join with the first surface of described circuit substrate and be arranged on the radome of described heat generating components top;
Run through described circuit substrate the heat radiation through hole with the corresponding second surface that is transmitted to described circuit substrate for the heat that described heat generating components is distributed in described heat generating components position.
2. the circuit board with heat sinking function according to claim 1, is characterized in that, described heat radiation through hole be positioned at described heat generating components under or/and around.
3. the circuit board with heat sinking function according to claim 2, is characterized in that, the diameter of described heat radiation through hole is 0.2mm~0.3mm.
4. the circuit board with heat sinking function according to claim 1, is characterized in that, the equal and opposite in direction of some described heat radiation through holes.
5. the circuit board with heat sinking function according to claim 1, is characterized in that, the equal and opposite in direction of the some described heat radiation through holes of part.
6. the circuit board with heat sinking function according to claim 2, is characterized in that, some described heat radiation through holes under described heat generating components or/and around evenly distributed.
7. the circuit board with heat sinking function according to claim 2, is characterized in that, some described heat radiation through holes under described heat generating components or/and around irregular distribution.
8. the circuit board with heat sinking function according to claim 1, is characterized in that, described heat generating components is chip.
9. the circuit board with heat sinking function according to claim 1, is characterized in that, the second surface of described circuit substrate is provided with the thermally conductive pathways for conducting heat.
CN201320629716.9U 2013-10-12 2013-10-12 Circuit board having heat dissipation function CN203596971U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320629716.9U CN203596971U (en) 2013-10-12 2013-10-12 Circuit board having heat dissipation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320629716.9U CN203596971U (en) 2013-10-12 2013-10-12 Circuit board having heat dissipation function

Publications (1)

Publication Number Publication Date
CN203596971U true CN203596971U (en) 2014-05-14

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105636344A (en) * 2015-12-31 2016-06-01 福建睿能科技股份有限公司 Electronic device
CN105744724A (en) * 2016-03-17 2016-07-06 广东小天才科技有限公司 Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of electronic device
CN106130575A (en) * 2016-07-14 2016-11-16 孙海华 The radiator structure of transmitter
CN106338799A (en) * 2016-03-25 2017-01-18 武汉电信器件有限公司 Light emitting assembly
CN106604613A (en) * 2016-12-30 2017-04-26 中科同德(北京)生态科技有限公司 Heat radiation structure and intelligent gateway
CN108513515A (en) * 2018-06-11 2018-09-07 Oppo广东移动通信有限公司 Housing unit and electronic device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105636344A (en) * 2015-12-31 2016-06-01 福建睿能科技股份有限公司 Electronic device
CN105744724A (en) * 2016-03-17 2016-07-06 广东小天才科技有限公司 Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of electronic device
CN105744724B (en) * 2016-03-17 2018-09-21 广东小天才科技有限公司 Radiator structure, wearable electronic equipment and its heat dissipating method of electronic device
CN106338799A (en) * 2016-03-25 2017-01-18 武汉电信器件有限公司 Light emitting assembly
CN106130575A (en) * 2016-07-14 2016-11-16 孙海华 The radiator structure of transmitter
CN106604613A (en) * 2016-12-30 2017-04-26 中科同德(北京)生态科技有限公司 Heat radiation structure and intelligent gateway
CN108513515A (en) * 2018-06-11 2018-09-07 Oppo广东移动通信有限公司 Housing unit and electronic device
CN108513515B (en) * 2018-06-11 2020-10-02 Oppo广东移动通信有限公司 Shell assembly and electronic device

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140514

Termination date: 20181012