CN105744724B - Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of wearable electronic equipment - Google Patents
Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of wearable electronic equipment Download PDFInfo
- Publication number
- CN105744724B CN105744724B CN201610154715.1A CN201610154715A CN105744724B CN 105744724 B CN105744724 B CN 105744724B CN 201610154715 A CN201610154715 A CN 201610154715A CN 105744724 B CN105744724 B CN 105744724B
- Authority
- CN
- China
- Prior art keywords
- electronic device
- thermal conductivity
- shielding case
- heat dissipation
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 11
- 239000012528 membrane Substances 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 15
- 238000003466 welding Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 9
- 230000005611 electricity Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention is suitable for the technical field of heat dissipation of electronic devices, and discloses a heat dissipation structure of an electronic device, wearable electronic equipment and a heat dissipation method of the wearable electronic equipment. The heat dissipation structure of the electronic device comprises a circuit board and the electronic device connected to the circuit board, wherein the circuit board is connected with a conductive circuit layer is arranged on the surface of the electronic device, a heat conduction resistance welding ink layer is arranged on the surface of the conductive circuit layer, heat conduction bottom filling glue is arranged between the bottom or/and the side surface of the electronic device and the heat conduction resistance welding ink layer, a shielding cover is arranged on the electronic device cover, and the shielding cover is connected to the circuit board. The wearable electronic equipment is provided with the heat dissipation structure of the electronic device. The heat dissipation structure of the electronic device, the wearable electronic equipment and the heat dissipation method thereof improve the heat conduction and heat dissipation effects, so that the electronic device can reliably and stably work, and the product reliability is good.
Description
Technical field
The invention belongs to Cooling Technology of Electronic Device field more particularly to a kind of radiator structures of electronic device, wearable
Electronic equipment and its heat dissipating method.
Background technology
Current electronic equipment, such as wearable electronic equipment, by taking smartwatch as an example, structure space is small, radiating surface
Product is small, causes calorific value big, and complete machine temperature is high；If being attached to the surfaces IC using common graphite radiating film, effect is limited；Such as
Fruit uses the metal materials such as copper foil to increase heat dissipation area, and cost can rise and can not reduce the thickness of product.
Invention content
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, provide a kind of radiator structure of electronic device,
Wearable electronic equipment and its heat dissipating method, good heat dissipation effect are of good reliability.
The technical scheme is that：A kind of radiator structure of electronic device, including circuit board and it is connected to the circuit
The electronic device of plate, the surface that the circuit board is connected with the electronic device are provided with conductive circuit layer, the conducting wire
The surface of layer is provided with heat conduction solder mask layer, the bottom or/and side of the electronic device and the heat conduction solder mask layer
Between be provided with thermal conductivity underfill, the electronic device is covered with shielding case, and the shielding case is connected to the circuit
Plate.
Optionally, bottom thermal conductivity filling glue respectively with the electronic device, heat conduction solder mask layer and shielding case
Inside connect.
Optionally, it is provided between the upper end of the electronic device and the shielding case at the top of thermal conductivity and fills glue.
Optionally, filling glue is in contact with bottom thermal conductivity filling glue at the top of the thermal conductivity.
Optionally, the top of the shielding case or/and lateral wall, which are sticked, heat dissipation membrane material.
The present invention also provides a kind of wearable electronic equipment, the wearable electronic equipment has above-mentioned electronic device
Radiator structure.
Optionally, the wearable electronic equipment is smartwatch.
The present invention also provides a kind of heat dissipating methods of electronic device in wearable electronic equipment, in wearable electronic equipment
In circuit board surface be arranged heat conduction solder mask layer, electronic device is welded in the circuit board, and in the electronic device
Thermal conductivity underfill is filled between the heat conduction solder mask layer, and shielding case is buckled outside the electronic device and is incited somebody to action
The shielding case is connected to the circuit board, and the partial heat that the electronic device generates when working passes through thermal conductivity underfill
Glue is conducted to circuit board and shielding case.
Optionally, before buckling shielding case, the upper end of the electronic device is provided with the inside with the shielding case
Glue is filled at the top of the thermal conductivity being in contact, the partial heat that the electronic device generates when working, which passes through, fills glue at the top of thermal conductivity
It conducts to shielding case.
Optionally, it is sticked heat dissipation membrane material in the top surface of the shielding case, the partial heat of the shielding case passes through heat dissipation film
Material is radiated in external environment.
Radiator structure, wearable electronic equipment and its heat dissipating method of electronic device provided by the present invention, thermal conductivity bottom
Portion's filling glue can reduce thermal resistance, and the heat generated when electronic device being allow to work is timely, is conducted efficiently to outside, leads
Heat, good heat dissipation effect, moreover, increasing heat dissipation area without copper foil etc., application cost is low, and can effectively reduce product
Thickness, to meet the needs of product is lightening.Filling glue is not only in contact with electronic device, shielding case at the top of thermal conductivity, simultaneously
It is also in contact with thermal conductivity underfill, further improves the effect of heat conduction and heat dissipation, to ensure that electronic device can
It leans on, steadily work, product reliability is good.
Description of the drawings
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the floor map of the radiator structure of electronic device provided in an embodiment of the present invention.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that when element is referred to as " being fixed on " or " being set to " another element, it can be directly another
On one element or it may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can
To be directly to another element or may be simultaneously present centering elements.
Only it is relative concept each other it should also be noted that, the orientation term such as left and right, upper and lower in the embodiment of the present invention
Or with the normal operating condition of product be reference, and it should not be regarded as restrictive.
As shown in Figure 1, a kind of radiator structure of electronic device provided in an embodiment of the present invention, including circuit board 1 and connection
In the electronic device (IC) 2 of the circuit board 1, circuit board 1 can be multilayer circuit board.The circuit board 1 is connected with the electronics
The surface of device 2 is provided with conductive circuit layer 11, and conductive circuit layer 11 can be copper foil layer.The surface of the conductive circuit layer 11 is set
It is equipped with heat conduction solder mask layer 3, heat conduction solder mask layer 3 also has the function of heat conduction in addition to having the function of welding resistance.The electricity
It is provided with thermal conductivity underfill 4, the electricity between the bottom or/and side of sub- device 2 and the heat conduction solder mask layer 3
Sub- device 2 is covered with shielding case 7, and the shielding case 7 is connected to the circuit board 1, and thermal conductivity underfill 4 can reduce heat
Resistance, the heat generated when electronic device 2 being allow to work is timely, is conducted efficiently to outside, heat conduction, good heat dissipation effect, in figure
Arrow is heat dissipation path signal, and electronic device 2 can be made more firm, be not easy to loosen, to ensure that electronic device 2 can
It leans on, steadily work, product reliability is good, moreover, increasing heat dissipation area without copper foil etc., application cost is low, and can be with
The thickness for effectively reducing product, to meet the needs of product is lightening.
In concrete application, bottom thermal conductivity filling glue respectively with the electronic device 2, heat conduction solder mask layer 3 and
The inside of shielding case 7 connects, and heat-conducting effect is good.
Specifically, it is provided between the upper end of the electronic device 2 and the shielding case 7 at the top of thermal conductivity and fills glue 5, with
Further increase the effect of heat conduction and heat dissipation.In concrete application, the thermal coefficient of filling glue 5 can be more than heat conduction at the top of thermal conductivity
Property underfill 4, so that heat-conducting effect is more preferably.Filling glue 5 all has height and leads at the top of bottom thermal conductivity filling glue and thermal conductivity
Heat, high temperature resistant, the characteristic of insulation and bonding.
Specifically, filling glue 5 is in contact with bottom thermal conductivity filling glue at the top of the thermal conductivity, i.e., at the top of thermal conductivity
Filling glue 5 is not only in contact with electronic device 2, shielding case 7, while being also in contact with thermal conductivity underfill 4, further carries
The high effect of heat conduction and heat dissipation.
Specifically, the top of the shielding case 7 or/and lateral wall, which are sticked, heat dissipation membrane material 6, further to improve production
The heat-sinking capability of product.
In concrete application, the thermal coefficient of heat conduction solder mask layer 3 can be greater than or equal to 1.0W/m.K, and thermal conductivity bottom is filled out
1.0W/m.K can be greater than or equal to by filling the thermal coefficient of glue 4, and the thermal coefficient of glue 5 is filled at the top of thermal conductivity to be greater than or equal to
2.0W/m.K。
The embodiment of the present invention additionally provides a kind of wearable electronic equipment, and the wearable electronic equipment has above-mentioned electricity
The radiator structure of sub- device 2 is provided with circuit board 1 in wearable electronic equipment and is connected to the electronic device of the circuit board 1
2, it is provided with thermal conductivity underfill between the bottom or/and side of the electronic device 2 and the heat conduction solder mask layer 3
4, the electronic device 2 is covered with shielding case 7, and the shielding case 7 is connected to the circuit board 1, and thermal conductivity underfill 4 can
To be filled in 2 bottom of electronic device and its surrounding, and thermal conductivity underfill 4 can also be in contact with the inside of shielding case 7,
Thermal conductivity underfill 4 can reduce thermal resistance, and the heat generated when electronic device 2 being allow to work in time, efficiently conducts
To outside, heat conduction, good heat dissipation effect, and electronic device 2 can be made more firm, be not easy to loosen, to ensure that electronic device 2 can be with
Reliably, it steadily works, product reliability is good, moreover, increasing heat dissipation area without copper foil etc., application cost is low, and can
To effectively reduce the thickness of product, to meet the needs of product is lightening.
Specifically, the wearable electronic equipment can be smartwatch etc., and product is frivolous.
The embodiment of the present invention additionally provides a kind of heat dissipating method of electronic device 2 in wearable electronic equipment, in wearable
Electronic device 2 is welded in the circuit board 1 by 1 surface of the circuit board setting heat conduction solder mask layer 3 in electronic equipment, and in
Thermal conductivity underfill 4 is filled between the electronic device 2 and the heat conduction solder mask layer 3, then at the electronic device 2
It is outer to buckle shielding case 7 and the shielding case 7 is connected to the circuit board 1, the part heat that the electronic device 2 generates when working
Amount is conducted by thermal conductivity underfill 4 to circuit board 1 and shielding case 7, and thermal conductivity underfill 4 can reduce thermal resistance,
When electronic device 2 being allow to work the heat that generates in time, be conducted efficiently to outside, heat conduction, good heat dissipation effect, and can be with
Keep electronic device 2 more firm, is not easy to loosen, to ensure that electronic device 2 can reliably, steadily work, product reliability is good, and
And increasing heat dissipation area without copper foil etc., application cost is low, and can effectively reduce the thickness of product, to meet product
Lightening demand.
Specifically, before buckling shielding case 7, the upper end of the electronic device 2 be provided with in the shielding case 7
Glue 5 is filled at the top of the thermal conductivity that side is in contact, the partial heat that the electronic device 2 generates when working at the top of thermal conductivity by filling out
The conduction of glue 5 is filled to shielding case 7, and thermal conductivity top filling glue 5 is in contact with bottom thermal conductivity filling glue, i.e. thermal conductivity
Top filling glue 5 is not only in contact with electronic device 2, shielding case 7, while being also in contact with thermal conductivity underfill 4, into one
Step improves the effect of heat conduction and heat dissipation.
Specifically, it is sticked heat dissipation membrane material 6 in the top surface of the shielding case 7, the partial heat of the shielding case 7 passes through heat dissipation
Membrane material 6, is radiated in external environment, further to improve the heat-sinking capability of product.
In concrete application, after the outermost layer copper foil etching of circuit board 1 (PCB multilayer board), makes one layer and have heat conduction
3 (thermal coefficient of heat conduction solder mask layer：≥1.0W/m.K)；After electronic device 2 has been pasted in Reflow Soldering, in the bottom of electronic device 2
4 (thermal coefficient of thermal conductivity underfill is set：>=1.0W/m.K) and thermal conductivity top filling 5 (thermal coefficient of glue：≥
2.0W/m.K), shielding case 7 is then buckled；When assembling complete machine, pastes heat dissipation membrane material 6 again on shielding case 7, heat is conducted
Onto other shielding cases 7 and hardware；It is final to realize that the high-efficiency heat conduction of PCB ontologies and heat dissipation, metallic shield 7 realize
High-efficiency heat conduction and thermal diffusivity, to ensure that electronic device 2 and product integrally can reliably, steadily work, product reliability is good, and
And increasing heat dissipation area without copper foil etc., application cost is low, and can effectively reduce the thickness of product, to meet product
Lightening demand.In concrete application, filling glue 5 and any one in heat dissipation membrane material 6 or two at the top of thermal conductivity can also be cancelled
Kind.
Radiator structure, wearable electronic equipment and its heat dissipating method for the electronic device 2 that the embodiment of the present invention is provided, lead
Hot underfill 4 can reduce thermal resistance, and the heat generated when electronic device 2 being allow to work is timely, is conducted efficiently to
Outside, heat conduction, good heat dissipation effect, and electronic device 2 can be made more firm are not easy to loosen, to ensure that electronic device 2 can
It leans on, steadily work, product reliability is good, moreover, increasing heat dissipation area without copper foil etc., application cost is low, and can be with
The thickness for effectively reducing product, to meet the needs of product is lightening.Filling glue 5 is filled out with the bottom thermal conductivity at the top of thermal conductivity
Glue is filled to be in contact, i.e., filling glue 5 is not only in contact with electronic device 2, shielding case 7 at the top of thermal conductivity, while also with thermal conductivity bottom
Portion's filling glue 4 is in contact, and further improves the effect of heat conduction and heat dissipation.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modification, equivalent replacement or improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (9)
1. a kind of radiator structure of electronic device, including circuit board and the electronic device for being connected to the circuit board, the circuit
The surface that plate is connected with the electronic device is provided with conductive circuit layer, which is characterized in that the surface of the conductive circuit layer is set
It is equipped with heat conduction solder mask layer, heat conduction is provided between the bottom and side of the electronic device and the heat conduction solder mask layer
Property underfill, the electronic device are covered with shielding case, and the shielding case is connected to the circuit board；The electronic device
Upper end and the shielding case between be provided at the top of thermal conductivity and fill glue, and at the top of the thermal conductivity filling glue thermal coefficient
More than the thermal coefficient of the thermal conductivity underfill.
2. the radiator structure of electronic device as described in claim 1, which is characterized in that the bottom thermal conductivity filling glue difference
Connect on the inside of the electronic device, heat conduction solder mask layer and shielding case.
3. the radiator structure of electronic device as described in claim 1, which is characterized in that filling glue and institute at the top of the thermal conductivity
Bottom thermal conductivity filling glue is stated to be in contact.
4. the radiator structure of electronic device as claimed any one in claims 1 to 3, which is characterized in that the shielding case
Top or/and lateral wall, which are sticked, heat dissipation membrane material.
5. a kind of wearable electronic equipment, which is characterized in that the wearable electronic equipment has as appointed in Claims 1-4
The radiator structure of electronic device described in one.
6. wearable electronic equipment as claimed in claim 5, which is characterized in that the wearable electronic equipment is intelligent hand
Table.
7. the heat dissipating method of electronic device in a kind of wearable electronic equipment, which is characterized in that in wearable electronic equipment
Heat conduction solder mask layer is arranged in circuit board surface, electronic device is welded in the circuit board, and in the electronic device and institute
It states and fills thermal conductivity underfill between heat conduction solder mask layer, thermal conductivity underfill is set to the electronic device
Between bottom or/and side and the heat conduction solder mask layer, shielding case is buckled outside the electronic device and by the screen
It covers cover and is connected to the circuit board, the partial heat that the electronic device generates when working is conducted by thermal conductivity underfill
To circuit board and shielding case.
8. the heat dissipating method of electronic device in wearable electronic equipment as claimed in claim 7, which is characterized in that shield in buckling
Before covering cover, it is provided at the top of the thermal conductivity being in contact on the inside of the shielding case and fills in the upper end of the electronic device
Glue, the partial heat that the electronic device generates when working are conducted by filling glue at the top of thermal conductivity to shielding case.
9. the heat dissipating method of electronic device in wearable electronic equipment as claimed in claim 7 or 8, which is characterized in that in institute
The top surface for stating shielding case is sticked heat dissipation membrane material, and the partial heat of the shielding case is radiated to by the membrane material that radiates in external environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610154715.1A CN105744724B (en) | 2016-03-17 | 2016-03-17 | Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of wearable electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610154715.1A CN105744724B (en) | 2016-03-17 | 2016-03-17 | Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of wearable electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105744724A CN105744724A (en) | 2016-07-06 |
| CN105744724B true CN105744724B (en) | 2018-09-21 |
Family
ID=56250784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610154715.1A Expired - Fee Related CN105744724B (en) | 2016-03-17 | 2016-03-17 | Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of wearable electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105744724B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211553B (en) * | 2016-07-28 | 2019-04-19 | Oppo广东移动通信有限公司 | Pcb board component and mobile terminal with it |
| KR102620540B1 (en) * | 2016-11-25 | 2024-01-03 | 삼성전기주식회사 | Camera module for vehicle |
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| CN203596971U (en) * | 2013-10-12 | 2014-05-14 | 上海斐讯数据通信技术有限公司 | Circuit board having heat dissipation function |
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| CN104031600A (en) * | 2013-03-04 | 2014-09-10 | 中国科学院理化技术研究所 | Insulated heat-conducting metal adhesive and manufacturing method thereof |
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| CN105324012A (en) * | 2014-07-31 | 2016-02-10 | 株式会社电装 | Electronic device, drive apparatus having the electronic device and manufacturing method of the electronic device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104716113B (en) * | 2013-12-13 | 2017-10-10 | 华为技术有限公司 | Radiator and cooling system |
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2016
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Patent Citations (8)
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|---|---|---|---|---|
| TWI477205B (en) * | 2011-07-20 | 2015-03-11 | Lite On Electronics Guangzhou | Circuit board device and manufacturing method thereof and power supply having the circuit board device |
| CN104350814A (en) * | 2012-06-15 | 2015-02-11 | 株式会社钟化 | Heat dissipation structure |
| CN104031600A (en) * | 2013-03-04 | 2014-09-10 | 中国科学院理化技术研究所 | Insulated heat-conducting metal adhesive and manufacturing method thereof |
| CN203136420U (en) * | 2013-03-06 | 2013-08-14 | 惠州Tcl移动通信有限公司 | Terminal and shield with heat radiation structure |
| CN203691834U (en) * | 2013-09-23 | 2014-07-02 | 联想(北京)有限公司 | Electronic device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105744724A (en) | 2016-07-06 |
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