CN207053866U - A kind of round LED wiring board - Google Patents
A kind of round LED wiring board Download PDFInfo
- Publication number
- CN207053866U CN207053866U CN201720637634.7U CN201720637634U CN207053866U CN 207053866 U CN207053866 U CN 207053866U CN 201720637634 U CN201720637634 U CN 201720637634U CN 207053866 U CN207053866 U CN 207053866U
- Authority
- CN
- China
- Prior art keywords
- substrate
- heat
- cooling piece
- wiring board
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of round LED wiring board, belongs to circuit board technology field, including substrate, it is characterized in that：The structure of the substrate is circle, the inside of the substrate is provided with some radiating mesh being evenly distributed, the inside of the radiating mesh is filled with radiating filler, the outside of the substrate is provided with four fixed vias being evenly distributed, control chip is provided among the top of the substrate, the outside of the control chip is provided with welding resistance isolation strip, the outside of the welding resistance isolation strip is provided with some equally distributed LED lamp bead pads, the surface coating of the LED lamp bead pad helps welding coat, the bottom of the substrate is provided with cooling piece, heat-conducting layer is provided between the substrate and cooling piece.The utility model has the advantages that it is simple in construction, it is reasonable in design, the radiating efficiency of wiring board can be greatly improved, improves the electrical equipment stability of component.
Description
Technical field
The utility model discloses a kind of round LED wiring board, belongs to circuit board technology field.
Background technology
With the development of electronics industry technology, production and technology that wiring board makes also make constant progress, one
Generate heat larger electronic applications a bit, usually using substrate of the aluminium base as circuit, the heat conduction of aluminium base, perfect heat-dissipating, energy
The temperature of component is substantially reduced, ensures that circuit runs well.But the aluminum substrate structure that prior art provides is excessively simple, only
Heat loss through radiation is carried out by aluminium base itself, area of dissipation is small, and radiating efficiency is low, exceedes in the element heating of installation a certain amount of
When, it is impossible to radiating in time, circuit normal work is have impact on, which greatly limits the application of aluminium base.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide for a kind of round LED wiring board, with
Solve the problems, such as to propose in above-mentioned background technology.
To achieve the above object, the utility model provides following technical scheme to realize：
A kind of round LED wiring board, including substrate, it is characterized in that：The structure of the substrate for circle, the substrate it is interior
Portion is provided with some radiating mesh being evenly distributed, the inside of the radiating mesh filled with radiating filler, the substrate it is outer
Side is provided with four fixed vias being evenly distributed, and is provided with control chip among the top of the substrate, the control chip outside
Side is provided with welding resistance isolation strip, and the outside of the welding resistance isolation strip is provided with some equally distributed LED lamp bead pads, the LED
The surface coating of bead weld disk helps welding coat, and the bottom of the substrate is provided with cooling piece, is provided between the substrate and cooling piece
Heat-conducting layer, the material of the heat-conducting layer are heat-conducting silicone grease, and the inside of the heat-conducting layer is provided with heat conducting fiber, the cooling piece it is interior
Portion is provided with some components, and the top of the cooling piece is provided with heat-sink shell, and the bottom of the cooling piece is provided with heat dissipating layer, described to dissipate
The bottom of thermosphere is provided with some fin being evenly distributed.
As preferred：The material of the substrate is aluminium alloy.
As preferred：The top of the substrate is coated with anti-static coating.
As preferred：The material of the heat conducting fiber is heat conduction carbon fiber.
The beneficial effects of the utility model：
1. being provided with cooling piece among the bottom of substrate, cooling piece refrigeration performance is good, and thermal inertia is very small, high cooling efficiency,
The heat dispersion of wiring board can be greatly promoted.
2. being provided with heat-conducting layer between substrate and cooling piece, the material of heat-conducting layer is heat-conducting silicone grease, and heat-conducting silicone grease is led with height
Heating rate, good electrical insulating property, relatively low denseness, the gap between substrate and cooling piece can be filled, increase substrate and cooling piece
Between contact area, improve heat transfer efficiency.
3. the material of substrate is aluminium alloy, aluminium alloy has good thermal conductivity and machining property, with traditional circuit
Plate material is compared, and can carry higher electric current, substantially increases the reliability of wiring board.
Brief description of the drawings
Fig. 1 is a kind of round LED circuit board structure schematic diagram one of the utility model；
Fig. 2 is a kind of round LED circuit board structure schematic diagram two of the utility model.
Reference：1st, substrate；2nd, radiate mesh；3rd, control chip；4th, welding resistance isolation strip；5th, LED lamp bead pad；6th, it is solid
Determine through hole；7th, heat-conducting layer；8th, heat conducting fiber；9th, heat-sink shell；10th, cooling piece；11st, component；12nd, heat dissipating layer；13rd, fin.
Embodiment
A kind of round LED wiring board of the utility model is described further referring to Figures 1 and 2.
A kind of round LED wiring board, including substrate 1, it is characterized in that：The structure of the substrate 1 is circular, the substrate 1
Inside be provided with some radiating mesh 2 being evenly distributed, the inside of the radiating mesh 2 is filled with radiating filler, the base
The outside of plate 1 is provided with four fixed vias 6 being evenly distributed, and control chip 3, the control are provided among the top of the substrate 1
The outside of coremaking piece 3 is provided with welding resistance isolation strip 4, and the outside of the welding resistance isolation strip 4 is provided with some equally distributed LED bead welds
Disk 5, the surface coating of the LED lamp bead pad 5 help welding coat, and the bottom of the substrate 1 is provided with cooling piece 10, the substrate
Heat-conducting layer 7 is provided between 1 and cooling piece 10, the material of the heat-conducting layer 7 is heat-conducting silicone grease, and the inside of the heat-conducting layer 7 is provided with
Heat conducting fiber 8, the inside of the cooling piece 10 are provided with some components 11, and the top of the cooling piece 10 is provided with heat-sink shell 9, institute
The bottom for stating cooling piece 10 is provided with heat dissipating layer 12, and the bottom of the heat dissipating layer 12 is provided with some fin 13 being evenly distributed, institute
The material for stating substrate 1 is aluminium alloy, and the top of the substrate 1 is coated with anti-static coating, and the material of the heat conducting fiber 8 is to lead
Hot carbon fiber.
Cooling piece 10 is provided among the bottom of substrate 1, the refrigeration performance of cooling piece 10 is good, and thermal inertia is very small, refrigerating efficiency
Height, the heat dispersion of wiring board can be greatly promoted.
Heat-conducting layer 7 is provided between substrate 1 and cooling piece 10, the material of heat-conducting layer 7 is heat-conducting silicone grease, and heat-conducting silicone grease has height
Thermal conductivity, good electrical insulating property, relatively low denseness can fill the gap between substrate 1 and cooling piece 10, increase substrate 1 with
Contact area between cooling piece 10, improve heat transfer efficiency.
The material of substrate 1 is aluminium alloy, and aluminium alloy has good thermal conductivity and machining property, with traditional circuit plate
Material is compared, and can carry higher electric current, substantially increases the reliability of wiring board.
Described above is only preferred embodiment of the present utility model, and the scope of protection of the utility model is not limited merely to
Above-described embodiment, all technical schemes belonged under the utility model thinking belong to the scope of protection of the utility model.It should refer to
Go out, for those skilled in the art, some improvement under the premise of the utility model principle is not departed from and
Retouching, these improvements and modifications also should be regarded as the scope of protection of the utility model.
Claims (4)
1. a kind of round LED wiring board, including substrate, it is characterized in that：The structure of the substrate is circular, the inside of the substrate
Provided with some radiating mesh being evenly distributed, the inside of the radiating mesh is filled with radiating filler, the outside of the substrate
Provided with four fixed vias being evenly distributed, control chip, the outside of the control chip are provided among the top of the substrate
Provided with welding resistance isolation strip, the outside of the welding resistance isolation strip is provided with some equally distributed LED lamp bead pads, the LED lamp bead
The surface coating of pad helps welding coat, and the bottom of the substrate is provided with cooling piece, is provided with and leads between the substrate and cooling piece
Thermosphere, the material of the heat-conducting layer is heat-conducting silicone grease, and the inside of the heat-conducting layer is provided with heat conducting fiber, the inside of the cooling piece
Provided with some components, the top of the cooling piece is provided with heat-sink shell, and the bottom of the cooling piece is provided with heat dissipating layer, the radiating
The bottom of layer is provided with some fin being evenly distributed.
2. a kind of round LED wiring board according to claim 1, it is characterized in that：The material of the substrate is aluminium alloy.
3. a kind of round LED wiring board according to claim 1, it is characterized in that：The top of the substrate is coated with anti-quiet
Electrocoat.
4. a kind of round LED wiring board according to claim 1, it is characterized in that：The material of the heat conducting fiber is heat conduction
Carbon fiber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720637634.7U CN207053866U (en) | 2017-06-05 | 2017-06-05 | A kind of round LED wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720637634.7U CN207053866U (en) | 2017-06-05 | 2017-06-05 | A kind of round LED wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207053866U true CN207053866U (en) | 2018-02-27 |
Family
ID=61492106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720637634.7U Expired - Fee Related CN207053866U (en) | 2017-06-05 | 2017-06-05 | A kind of round LED wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207053866U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074178A (en) * | 2020-09-29 | 2020-12-11 | 绍兴上虞锴达电子有限公司 | Durable type heat dissipation circuit board |
-
2017
- 2017-06-05 CN CN201720637634.7U patent/CN207053866U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074178A (en) * | 2020-09-29 | 2020-12-11 | 绍兴上虞锴达电子有限公司 | Durable type heat dissipation circuit board |
| CN112074178B (en) * | 2020-09-29 | 2022-07-12 | 绍兴上虞锴达电子有限公司 | Durable type heat dissipation circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205082059U (en) | heat dissipation circuit board | |
| CN105333407A (en) | Heat dissipation structure and manufacturing method | |
| CN107734839A (en) | A kind of PCB | |
| CN201853747U (en) | Heat-conducting and heat-dissipating structure of LED | |
| CN207053869U (en) | A kind of layer-stepping wiring board | |
| CN207053866U (en) | A kind of round LED wiring board | |
| CN208848885U (en) | A kind of New IGBT module copper soleplate structure | |
| CN206558540U (en) | A kind of flexible COB light source of the good upside-down mounting of thermal diffusivity | |
| CN208317104U (en) | The two-sided PCB circuit board radiator structure of multi-layered high-density | |
| CN209488905U (en) | One kind being based on consent type aluminum substrate | |
| CN207053864U (en) | A kind of flange-cooled aluminium base | |
| CN217064199U (en) | Heat radiation structure of motor controller | |
| CN105744724B (en) | Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of wearable electronic equipment | |
| CN207884962U (en) | A kind of high heat conduction printed circuit board | |
| CN106922081A (en) | A kind of single-clad board | |
| CN108135075A (en) | A kind of high heat conduction printed circuit board | |
| CN207880785U (en) | LED worklight wiring board | |
| CN207049634U (en) | A kind of duplex spread-blade aluminium base | |
| CN219068468U (en) | High TG heat-resisting circuit board | |
| CN105764239B (en) | A kind of great-power electronic component lines plate of high heat dispersion and preparation method thereof | |
| CN205179511U (en) | Power electronic component circuit board of high heat dissipating ability | |
| CN210670721U (en) | Electric control board with heat dissipation structure | |
| CN215933574U (en) | Packaging chip beneficial to heat dissipation | |
| CN207993857U (en) | A kind of microelectronic component radiator | |
| CN202025797U (en) | Copper-clad and carbon-based graphite heat-dissipating panel used in high-power LED |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180227 |