CN202025797U - Copper-clad and carbon-based graphite heat-dissipating panel used in high-power LED - Google Patents
Copper-clad and carbon-based graphite heat-dissipating panel used in high-power LED Download PDFInfo
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- CN202025797U CN202025797U CN201120069739XU CN201120069739U CN202025797U CN 202025797 U CN202025797 U CN 202025797U CN 201120069739X U CN201120069739X U CN 201120069739XU CN 201120069739 U CN201120069739 U CN 201120069739U CN 202025797 U CN202025797 U CN 202025797U
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Abstract
The utility model relates to the technical field of LEDs, in particular to a copper and carbon-based graphite heat-dissipating panel used in a high-power LED. The copper and carbon-based graphite heat-dissipating panel is characterized in that a conductive lead bonding pad or conductive lead bonding pads of a high-power LED or more high-power LEDs (1.1) is or are mounted on a paper-made or epoxy PCB (Printed Circuit Board) via adopting a surface mounting technology, wherein a copper and carbon-based graphite component is formed by integrally welding an LED heat-dissipating bonding pad (1.5), a copper and carbon-based graphite heat-dissipating intermediate sheet (1.7) and a copper and carbon-based graphite heat-dissipating sheet (1.8) both in a heat conduction hole (1.6) in the PCB; and the copper and carbon-based graphite component is connected with a heat-dissipating main body (1.9). Compared with a traditional structure that the LED is mounted on CMPCB via adopting the surface mounting technology, the heat-dissipating structure that the LED is mounted on a copper heat conduction substrate in the utility model, the heat dissipating effect is improved, the weight of a heat-dissipating component is lightened, and the manufacturing cost is lowered, thereby having favorable economic base and practicability in popularizing an LED illumination technology.
Description
[technical field]
The utility model relates to LED led technology field, is a kind of multiple copper carbon back graphite radiating plate that is used for the great power LED light-emitting diode.
[background technology]
The luminescent diode of great power LED is popularized rapidly as energy-saving illumination, and that commercial LED has is pollution-free, life-span length, vibration resistance, shock proof distinguishing feature.The LED Lighting Industry is the new industry of having an optimistic view of.The electrical power that LED imports in luminescence process has only 20% electric energy to be converted to luminous energy, and remaining about 80% energy all be converted into can not be luminous heat energy.If do not consider thermal diffusion and heat conduction in the luminescence process, these heats are enough to defective chip, badly influence the reliability and stability of LED.
For led chip is operated in the normal semiconductor junction temperature scope, single present great power LED product all is provided with a heat dissipation environment.For the ease of the LED element radiating, it all is mounted on (CMPCB) aluminium base with the SMD packing forms, this class heat-conducting substrate specification requirement height, and quality is heavier, and thermal coefficient of expansion is big, and version is single, and price is higher.
[summary of the invention]
The purpose of this utility model is to overcome the deficiencies in the prior art, a kind of heat dissipation technology and the version of multiple copper carbon back graphite radiating plate in the great power LED light-emitting diode is used of high thermoconductivity is provided, the multiple copper carbon back graphite radiating plate of selecting for use has the high-quality heat radiation thin plate of controlled heat dissipation direction, by with the textural association of common pcb board, created a heat dissipation environment for effectively the LED luminescent diode.
Design a kind of multiple copper carbon back graphite radiating plate that is used for the great power LED light-emitting diode for achieving the above object, comprise great power LED light-emitting diode (1.1), thermal hole (1.6), pcb board (1.4), the LED pad (1.5) that dispels the heat, the conductive lead wire pad that it is characterized in that one or more great power LED light-emitting diodes (1.1) is mounted on the pcb board of papery or epoxy, described pcb board is provided with several thermal holes (1.6), described pcb board bottom connects LED heat radiation pad (1.5), great power LED light-emitting diode (1.1) bottom connects multiple copper carbon back graphite radiating intermediate (1.7), multiple copper carbon back graphite radiating intermediate (1.7) in described LED heat radiation pad (1.5) and the pcb board in the thermal hole (1.6) and multiple copper carbon back graphite radiating sheet (1.8) are welded into one and constitute copper carbon back graphite components again, and multiple copper carbon back graphite components connects heat radiation main body (1.9).
Described pcb board adopts the multiple copper printed board of single face.
Described multiple copper carbon back graphite radiating plate conductivity reaches 380w/mk.
Single power of described great power LED light-emitting diode is 1-5w.
The LED that the utility model provides is installed in the radiator structure form of multiple copper heat-conducting substrate and compares with the structure that traditional LED is mounted on (CMPCB), improved radiating effect, alleviated the weight of radiating subassembly, reduce production cost, in promoting the LED lighting technology, had good economic base and practicality.
[description of drawings]
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the utility model pcb board structural representation;
Appointment Fig. 1 is a Figure of abstract
In the accompanying drawing, 1.1 is the great power LED light-emitting diode, and 1.2 is power pins, 1.3 be Reflow Soldering, 1.4 is pcb board, 1.5 are LED heat radiation pad, 1.6 be thermal hole, 1.7 are multiple copper carbon back graphite radiating intermediate, 1.8 are multiple copper carbon back graphite radiating sheet, 1.9 be the heat radiation main body, 1.10 is thermal conductive surface, 1.11 great power LED cooling pad heat conduction directions, 2.1 printed board PCB, 2.2 be LED power pins pad, 2.3 is thermal hole, 2.4 are the lead-in wire in the PCB printing
[embodiment]
To further specifying below the utility model work, this manufacturing technology is very clearly to one skilled in the art below in conjunction with last figure.
Referring to figure one, great power LED light-emitting diode (1.1) power pins (1.2) is welded in the LED element on the single face pcb board (1.4) by Reflow Soldering (1.3) among the figure.Multiple copper carbon back graphite radiating intermediate (1.7) in LED heat radiation pad (1.5) and the pcb board in the thermal hole (1.6) is welded into one with multiple copper carbon back graphite radiating sheet (1.8), LED light-emitting diode and multiple copper carbon back graphite components are bonded on the heat radiation main body (1.9), and make bonding thermal conductive surface (1.10) heat conduction operating mode good.(1.11) be great power LED cooling pad heat conduction direction.
Referring to figure two, the making form of printed board PCB (2.1).LED power pins pad (2.2), the thermal hole (2.3) of LED heat radiation pad, the lead-in wire in the PCB printing (2.4).
The graphite thin plate (conductivity reaches 380w/mk) of the described multiple compound controlled heat dissipation direction of the board-like a kind of carbon back of copper carbon back graphite
Single power of described great power LED light-emitting diode is (1-5w)
Described great power LED light-emitting diode all has one group of power supply lead wire leg and heat radiation pad.
It is the copper foil printed circuit plate of papery bakelite chemical combination epoxy substrate that described pcb board is selected for use.
The heat radiation pad of described great power LED light-emitting diode should weld (or bonding) on multiple copper heat-conducting substrate, and the power supply lead wire pad should be welded on the Copper Foil of pcb board
During the actual use of described LED luminescent device should be an assembly.Form, and should closely form one between them by LED light-emitting diode, multiple copper carbon back graphite heat conducting substrate, PCB galley, heat radiation matrix.
Described carbon-based composite heat dissipation material adopts domestic patent 201010187223.5 disclosed a kind of carbon-based composite heat dissipation materials and its production and use, carbon-based material and metallic constitute carbon-based composite heat dissipation material, described formulation weight percentage: the carbon-based material of phosphorus content more than 82%, the metallic copper below 18%, aluminium, gold, silver or tin.
Claims (4)
1. multiple copper carbon back graphite radiating plate that is used for the great power LED light-emitting diode, comprise great power LED light-emitting diode (1.1), thermal hole (1.6), pcb board (1.4), the LED pad (1.5) that dispels the heat, the conductive lead wire pad that it is characterized in that one or more great power LED light-emitting diodes (1.1) is mounted on the pcb board of papery or epoxy, described pcb board is provided with several thermal holes (1.6), described pcb board bottom connects LED heat radiation pad (1.5), great power LED light-emitting diode (1.1) bottom connects multiple copper carbon back graphite radiating intermediate (1.7), multiple copper carbon back graphite radiating intermediate (1.7) in described LED heat radiation pad (1.5) and the pcb board in the thermal hole (1.6) and multiple copper carbon back graphite radiating sheet (1.8) are welded into one and constitute copper carbon back graphite components again, and multiple copper carbon back graphite components connects heat radiation main body (1.9).
2. a kind of multiple copper carbon back graphite radiating plate that is used for the great power LED light-emitting diode as claimed in claim 1 is characterized in that described pcb board adopts the multiple copper printed board of single face.
3. a kind of multiple copper carbon back graphite radiating plate that is used for the great power LED light-emitting diode as claimed in claim 1 is characterized in that described multiple copper carbon back graphite radiating plate conductivity reaches 380w/mk.
4. a kind of multiple copper carbon back graphite radiating plate that is used for the great power LED light-emitting diode as claimed in claim 1 is characterized in that single power of described great power LED light-emitting diode is 1-5w.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120069739XU CN202025797U (en) | 2011-03-16 | 2011-03-16 | Copper-clad and carbon-based graphite heat-dissipating panel used in high-power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120069739XU CN202025797U (en) | 2011-03-16 | 2011-03-16 | Copper-clad and carbon-based graphite heat-dissipating panel used in high-power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202025797U true CN202025797U (en) | 2011-11-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120069739XU Expired - Fee Related CN202025797U (en) | 2011-03-16 | 2011-03-16 | Copper-clad and carbon-based graphite heat-dissipating panel used in high-power LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202025797U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610737A (en) * | 2012-03-21 | 2012-07-25 | 广州市鸿利光电股份有限公司 | Heat-radiating device of high-power LED (Light Emitting Diode) |
-
2011
- 2011-03-16 CN CN201120069739XU patent/CN202025797U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610737A (en) * | 2012-03-21 | 2012-07-25 | 广州市鸿利光电股份有限公司 | Heat-radiating device of high-power LED (Light Emitting Diode) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111102 Termination date: 20130316 |