CN201853747U - Heat-conducting and heat-dissipating structure of LED - Google Patents
Heat-conducting and heat-dissipating structure of LED Download PDFInfo
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- CN201853747U CN201853747U CN2010205405069U CN201020540506U CN201853747U CN 201853747 U CN201853747 U CN 201853747U CN 2010205405069 U CN2010205405069 U CN 2010205405069U CN 201020540506 U CN201020540506 U CN 201020540506U CN 201853747 U CN201853747 U CN 201853747U
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Abstract
The utility model provides a heat-conducting and heat-dissipating structure of a light-emitting diode (LED). The structure comprises a composite material heat-conducting substrate which is formed through the combination of a plurality of heat-conducting wires or fibers and insulating materials. The heat-conducting wires or the fibers are arranged at intervals and pass through the front surface and the back surface of the composite material heat-conducting substrate. The heat-conducting wires or the fibers are respectively partitioned by the insulating materials. An electrode solder pad is combined on the front surface of the composite material heat-conducting substrate to be electrically connected with an electrode pin of an LED member. A heat-conducting solder pad is also combined on the front surface of the composite material heat-conducting substrate to be subjected to heat-conducting contact with a heat sink part of an LED assembly of the LED member. An insulating layer corresponding to the electrode solder pad is combined on the back surface of the composite material heat-conducting substrate. The heat-conducting and heat-dissipating structure of the LED can achieve the purpose of high heat conduction in the thickness direction and insulation in the plane direction through the simple structure, so as to quickly conduct the heat to a heat-dissipating member. The heat-conducting and heat-dissipating structure of the LED can be used for high-brightness LED lighting products.
Description
Technical field
The utility model relates to heat conduction and the radiator structure of a kind of LED (light-emitting diode); Particularly a kind of thermal conductive wire that adopts metal or material with carbon element or fiber and insulating properties material form the high heat conduction of thickness direction but the high thermal conductive substrate structure of in-plane insulation.
Background technology
In the actual use of LED, the conversion efficiency of its electric energy and luminous energy is still on the low side, can produce heat energy when causing its work, wherein for the high-capacity LED that high brightness uses, the heat that produces is higher, if heat can not be derived, therefore the temperature of LED can raise, and then the generation color offset phenomenon, finally cause the LED deterioration and can't work.
The heat radiation be the design focal point of LED always, its mainly via Heat Conduction Material with thermal energy conduction to thermal energy converter, the big surface via thermal energy converter is dissipated to heat energy in the air again; Described thermal energy converter is generally by aluminium extrusion or the fin that is cast into, utilizes the high heat transfer property of aluminium that heat energy is sent to the fin surface, carries out heat exchange by the fin surface with air again.On illuminating product, usually need to form light source with a plurality of LED, therefore need the modular structure of a plurality of LED of assembling of design, and need a circuit substrate and weld a plurality of LED and power circuit, more need to have the enough capacity of heat transmission, with with the thermal energy conduction of LED to heat exchanger, avoid substrate temperature to raise and cause assembly to damage.
LED uses required heat conduction design, has generally comprised Chip Packaging and modular structure two parts, and the two all has a substrate to be responsible for connecting the LED electrode and with the heat energy derivation of its generation.The substrate of Chip Packaging part is as the support plate of led chip, to obtain higher thermal conduction characteristic, substrate uses material such as aluminium oxide and aluminium nitride, the metal substrate of gold-plated diamond film, the carborundum that contains aluminium or the diamond composite etc. of high heat conduction and insulating properties, such as patent JP2000297301, JP2000303126, TW224873, JP2003073169 etc. announcement.In addition, for obtaining higher interface contact tightness degree, the thermal resistance that interface is produced reduces, can directly make heat-conducting layer at semiconductor substrate, or the composite design of utilizing heat-conducting layer to be reducing thermal stress, such as patent US2005070048, JP2005072069, JP2006060247, JP2006190705, US708359 etc. announcement.In addition, derive fast outside the substrate, also have and on substrate, make through hole, in through hole, fill the method for high conductivity material such as metal-to-metal adhesive afterwards for making heat, such as patent JP2002289747, JP5090437, US2006006524 etc. announcement.The electrode pad that led chip arranged again is with sheet metal welding, the method for utilizing the high heat conduction of sheet metal that heat is derived, such as patent JP2009266972, JP2009194277, JP2009188308 etc. announcement.Because the substrate size of Chip Packaging is little, can use all high ceramic material of insulating properties and thermal conductivity, cooperate through hole making heat conduction path, make the LED after the encapsulation have high heat conducting structure.Further chip cooling can be derived via the heat conduction solder joint that is connected in chip bottom, discloses as patent US20100110692, US20070176182.
The LED that encapsulation is finished has termination electrode or metal electrode pin and heat conduction contact, and so that LED to be provided welding electrode and the heat conduction contact when circuit substrate is assembled, being electrically connected with heat through circuit substrate derives.A plurality of LED are generally arranged on the circuit substrate, and the substrate that size is used than Chip Packaging is big, uses the substrate of pure pottery to have problem on the mechanical strength, and that often uses is printed circuit board (PCB).Printed circuit board (PCB) is phenolic resins and glass fiber material, and its coefficient of heat conduction generally is lower than 0.5W/m
0K, the application high to power has problem of temperature rise.For improving the substrate heat conducting effect, generally be to adopt the two sides to cover the metal substrate of insulating barrier, disclose as patent US20080057333, JP2004047863, US2009151982, US20080190542, JP2009123980, JP2008159827.Other has the substrate that uses crystalline macromolecule to cooperate thermohardening and organic thermoplastic, the powder or fiber such as metal or the nitride etc. that wherein contain high-termal conductivity, such as patent US2008057333, JP2008060535, JP2006165158, JP2154049, JP2004165421, KR20080028258, US2008073623, JP2008081722 etc. announcement, all utilize high molecular crystallinity to improve the heat conductivity of material.But the substrate that uses macromolecule organic material to make is subject to the lower factor of the heat conductivity of organic material own, makes the substrate of this type of material, and its coefficient of heat conduction is difficult for reaching 5W/m
0K.Ceramic material has high heat-conducting property than organic material, use porous ceramic, in hole the filling highly heat-conductive material technology such as patent US20090290362, JP2007173536 etc. announcement, can obtain than the high thermal conduction effect of traditional organic material substrate.
The substrate of LED has the conduction of electrode and heat conduction two parts requirement of heat conduction contact, though metal material has high-termal conductivity, directly welding electrode can cause short circuit on metal substrate, so the metal surface must be provided with electrically insulated structures.Insulating material is except that diamond and nitride, and thermal conduction characteristic is all not good, and its anti-mechanical impact property is also poor, so if directly use the high thermal conductivity insulating material substrate, have the problem of cost height and mechanical resistance properties difference.If with the printed circuit board (PCB) is substrate,, can't be applicable to the lighting use of high brightness though the low heat conductivity of cost is poor.If use the mode of metallic substrate surfaces plating dielectric film, because of the not good factor of heat conductivity that is subject to plated film, so the heat conductivity of whole composite base plate is relatively poor relatively.The market demand of high-capacity LED illuminating product is big, the LED cost of universalness utilization to reduce; Therefore, have low cost and high-termal conductivity concurrently, and its surface can directly make the board structure of LED electrode pad, become the important directions of correlation technique research and development.
In view of this, the inventor is based on the manufacturing development of being engaged in Related product for many years and design experiences, at above-mentioned target, in detail after design and the scrupulous assessment, eventually the utility model of true tool practicality.
The utility model content
Main purpose of the present utility model provides heat conduction and the radiator structure of a kind of LED, and it is at how developing a kind of new-type LED radiator structure that has more desirable practicality;
Technical characterstic of the present utility model, mainly comprise: a composite material heat-conducting substrate, serve as reasons many thermal conductive wires or fiber combines the plate body that constitutes with insulating material, it has a front and the back side, described thermal conductive wire or fibrous septum distribute, and thermal conductive wire or fiber connect this front and the back side, then are insulated material between each thermal conductive wire or the fiber and separate; The LED member is incorporated into the front of composite material heat-conducting substrate, and described LED member comprises LED assembly and electrode pin; Electrode pad is incorporated into the front of composite material heat-conducting substrate, and is electrically connected with the electrode pin of LED member; Insulating barrier be incorporated into the back side of composite material heat-conducting substrate, and its position is corresponding with the position at electrode pad place; The heat conduction weld pad is incorporated into the front of composite material heat-conducting substrate, and contacts with heat sink (heat sink) heat conduction of the LED assembly of LED member; By above-mentioned design, make the utility model for prior art, roughly can reach following advantage:
The heat conduction of LED and radiator structure are able to reach the high heat conduction of thickness direction but the characteristic of in-plane insulation by easy structure, can conduct heat to radiating component fast, simultaneously have due circuit insulating properties again concurrently, the utility model can provide the suitable tool practicality of of high-brightness LED illuminating product and meet the radiator structure of preferable industrial economy benefit.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The 1st figure: the combination stereogram of the utility model preferred embodiment.
The 2nd figure: the schematic diagram when the utility model composite material heat-conducting substrate forms assembled state by stationary fixture.
The 3rd figure: the schematic perspective view of the utility model composite material heat-conducting substrate.
The 4th figure: the schematic diagram of a plurality of LED component compositions of the present utility model when a composite material heat-conducting substrate.
The 5th figure: the utility model composite material heat-conducting substrate is applied to the vertical view of the embodiment of led chip encapsulation.
The 6th figure: the utility model composite material heat-conducting substrate is applied to the end view of the embodiment of led chip encapsulation.
Embodiment
Fig. 1 is the heat conduction of the utility model LED and the preferred embodiment of radiator structure to shown in Figure 3, but this embodiment is only for illustrating that scope of patent protection is not subjected to the restriction of this structure; Heat conduction and the radiator structure of described LED (light-emitting diode) comprise:
One composite material heat-conducting substrate 10, it is the plate body that combines and form by many thermal conductive wires 101 or fiber and insulating material 102, it has positive 11 and one back side 12, wherein said thermal conductive wire 101 or fiber are spaced apart from each other, and described thermal conductive wire 101 or fiber connect this front 11 and the back side 12, then are insulated material 102 between each thermal conductive wire 101 or fiber and separate;
At least one LED member 20 is incorporated into the front 11 of this composite material heat-conducting substrate 10, and described LED member 20 comprises LED assembly 21 and electrode pin 22;
Insulating barrier 40, be incorporated into the back side 12 of this composite material heat-conducting substrate 10, and its position is corresponding with the position at electrode pad 30 places, when avoiding composite material heat-conducting substrate 10 to be connected thus with heat dissipation metal member 60, produce the short circuit of 30 of electrode pad, wherein said insulating barrier 40 is formed by the insulative resin materials, printed on that contains ceramic powder;
Heat conduction weld pad 50 is made of Heat Conduction Material, is incorporated on the front 11 of this composite material heat-conducting substrate 10, and contacts with heat sink (heat sink) 24 position heat conduction of the LED assembly 21 of LED member 20.
Wherein, the back side 12 combinations of this composite material heat-conducting substrate 10 have a radiating component 60; This radiating component 60 is by any one radiating fin that constitutes in aluminium, copper, the graphite.
Wherein, this composite material heat-conducting substrate 10 is combined with radiating component 60 by stationary fixture 13 fitted bolts 14, to reduce the space of 60 of composite material heat-conducting substrate 10 and radiating components, and because stationary fixture 13 has elasticity, can avoid 60 of composite material heat-conducting substrate 10 and radiating components to produce stress rupture, thereby avoid getting loose of fixed position because of heat; And a prior advantage is, owing to adopt described stationary fixture 13, make composite material heat-conducting substrate 10 can be drilled with bolt hole, so can utilize area to increase, add the good characteristics of described composite material heat-conducting substrate 10 heat radiations, so LED member 20 can be covered with as far as possible.
Wherein, each thermal conductive wire 101 or fiber are spaced apart in parallel to each other to each other, make LED member 20 along thermal conductive wire 101 or machine direction heat conduction and conduction, but in-plane insulation, because composite material heat-conducting substrate 10 is non-conductive in the in-plane insulation, so can directly on composite material heat-conducting substrate 10, make electrode pad 30, can not produce situation of short circuit between weld pad.
Wherein, described thermal conductive wire 101 or fiber are line body or the corpus fibrosum of diameter between metal between the 0.05mm to 0.5mm or material with carbon element.
Wherein, the insulating material 102 of this composite material heat-conducting substrate 10 is any one in the pottery of thermosetting or thermoplastic resin insulating material, insulating properties or glass material etc., and the resistance coefficient of described insulating material 102 is higher than 10
9Ω .cm.
Wherein, described electrode pad 30 and heat conduction weld pad 50 are by sputter or electroplating metal film or print in the tin cream any one and constitute, because described tin cream can directly be printed on the composite material heat-conducting substrate 10, by heating soldering technology, can be with electrode pad 30, heat conduction weld pad 50 and composite material heat-conducting substrate 10 stable engagement; But and the 10 surperficial heat-conducting glues of going up the filling insulating properties of the composite material heat-conducting substrate between electrode pad 30 and heat conduction weld pad 50, further the heat with LED member 20 is sent to thermal conductive wire 101 or fiber.
Wherein, the area of described heat conduction weld pad 50 is 2 to 5 times of area of electrode pad 30, and thermal conductive wire 101 numbers that make the heat conduction weld pad cover for 50 times increase, and to increase the approach of heat conduction, reaches and improves the effect of heat conduction to radiating component 60.
According to said structure, be described as follows with regard to use operation situation of the present utility model:
The thermal energy conduction that the LED assembly 21 of described LED member 20 is produced is to heat conduction weld pad 50, and engage with radiating component 60 by this thermal conductive wire 101 or fiber, can conduct heat to radiating component 60 apace, via the high surface of radiating component 60 with heat exchange in air, to reach the heat radiation purpose;
As shown in Figure 4, heat conduction and radiator structure for many group LED, conduction between the described LED member 20 connects is undertaken by external wire 23, and make in the mode of wire jumper, and on composite material heat-conducting substrate 10, do not make the lead-in wire pattern in addition, the wire jumper conduction portion heat that can utilize metal material thus increases the radiating effect of LED in air.
Following is about the making of composite material heat-conducting substrate 10 explanation: can be with thermal conductive wire 101 as metal or the fine concentrated bunchy of carbon, resin material perfusion with insulating properties is filled between thermal conductive wire, resin drying solidifies the back and forms the resin bar that includes the bunchy thermal conductive wire, make the resin bar become sheet through cutting technique again, the composite material heat-conducting substrate 10 that contains thermal conductive wire parallel to each other 101 or fiber that promptly obtains disclosing as the utility model.The manufacture method of another kind of composite material heat-conducting substrate 10 is, use preformed pottery or the glass board material that contains hole parallel to each other, behind sintering, become compactness pottery or glass plate with hole parallel to each other, perfusion molten metal or graphite paint form the heat conduction wire rod in hole again, finish the making of composite material heat-conducting substrate 10.
Wherein, described LED assembly 21 can be for being encapsulated the assembly that forms or any one in the chip (chip) of encapsulation etc. not as yet by an electrode layer; As Fig. 5, shown in Figure 6, in the present embodiment, this LED assembly 21 directly is fixed on the composite material heat-conducting substrate 10 with electrode pad 30 and heat conduction weld pad 50 with tin cream or routing mode, and on this composite material heat-conducting substrate 10, make pin 15, and connect metal derbies as heat sink with tin cream 41 in heat-conducting substrate 10 back sides, with encapsulating material (molding compound) or enclosure (package encapsulation) overall structure is encapsulated again, to form predetermined LED finished product.In the present embodiment, the position of corresponding heat conduction weld pad 50 is combined with tin cream 41 between two insulating barriers 40 of these composite material heat-conducting substrate 12 combinations in 10 back sides, obtains preferable heat to connect below radiating component 60 and passes effect.
Compared to existing technology effect improved as follows of the utility model:
" heat conduction of LED and radiator structure " that the utility model disclosed mainly is made of described composite material heat-conducting substrate, LED member, electrode pad, insulating barrier and heat conduction weld pad, thus, can make heat conduction and the radiator structure of LED be able to reach the high heat conduction of thickness direction but the architectural characteristic of in-plane insulation by easy structure, can conduct heat to radiating component fast, simultaneously have due circuit insulating properties again concurrently, the utility model can provide the suitable tool practicality of high-brightness LED illuminating product and meet the radiator structure of preferable industrial economy benefit.
The utility model can produce following new effect:
1, utilizes thermal conductive wire or fiber to form the composite substrate of the high insulation of the high heat conduction in-plane of thickness direction, solve high heat conduction and high insulation and be difficult for the problem that realizes at same substrate.
2, described composite material heat-conducting substrate forms combination by stationary fixture fitted bolt and radiating component, thus, reduce the space between composite material heat-conducting substrate and radiating component, and because stationary fixture has elasticity, so can avoid between composite material heat-conducting substrate and radiating component because of heat produces stress rupture, thereby avoid getting loose of fixed position.
3, because described electrode pad and heat conduction weld pad are any one in sputter or electroplating metal film or the printing tin cream, so described tin cream can directly be printed on the composite material heat-conducting substrate, by heating soldering technology, can be with electrode pad, heat conduction weld pad and composite material heat-conducting substrate stable engagement.
4, because the area of described heat conduction weld pad is 2 to 5 times of area of electrode pad,, can increase the approach of heat conduction, reach the effect of increase heat conduction to radiating component so the thermal conductive wire number that the heat conduction weld pad covers down increases.
The above; it only is embodiment of the present utility model; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement, all should be encompassed in protection range of the present utility model in.Therefore, protection range of the present utility model should be as the criterion with the protection range of described claim.
Claims (10)
1. the heat conduction of a LED and radiator structure comprise:
One composite material heat-conducting substrate, it is the plate body that combines and constitute with insulating material by many thermal conductive wires or fiber, it has a positive and back side, wherein said thermal conductive wire or fibrous septum distribute, and described thermal conductive wire or fiber connect the described front and the back side, are insulated material between each thermal conductive wire or fiber and separate;
At least one LED member is incorporated into the front of described composite material heat-conducting substrate, and described LED member comprises LED assembly and electrode pin;
Electrode pad is made of electric conducting material, is incorporated into the front of described composite material heat-conducting substrate, and is electrically connected with the electrode pin formation of described LED member;
Insulating barrier be incorporated into the back side of described composite material heat-conducting substrate, and its position is corresponding with the position at described electrode pad place;
The heat conduction weld pad is made of Heat Conduction Material, is incorporated into the front of described composite material heat-conducting substrate, and contacts with the heat sink heat conduction of the LED assembly of described LED member.
2. the heat conduction of LED according to claim 1 and radiator structure, it is the radiating fin that is made of any one material in aluminium, copper, the graphite that the back side combination of wherein said composite material heat-conducting substrate has a radiating component, described radiating component.
3. the heat conduction of LED according to claim 2 and radiator structure, wherein said composite material heat-conducting substrate is combined by stationary fixture and bolt and radiating component.
4. the heat conduction of LED according to claim 1 and radiator structure, wherein each described thermal conductive wire or fiber are parallel each other.
5. the heat conduction of LED according to claim 1 and radiator structure, wherein said thermal conductive wire or fiber are the metal of diameter between 0.05mm to 0.5mm or the line body or the corpus fibrosum of material with carbon element.
6. the heat conduction of LED according to claim 1 and radiator structure, the insulating material of wherein said composite material heat-conducting substrate is the pottery of thermosetting or thermoplastic resin-insulated material, insulating properties or in the glass material any one, and the resistivity of described insulating material is higher than 10
9Ω .cm.
7. the heat conduction of LED according to claim 1 and radiator structure, wherein said electrode pad and heat conduction weld pad are by sputter or electroplating metal film or print in the tin cream any one and constitute.
8. the heat conduction of LED according to claim 1 and radiator structure, the area of wherein said heat conduction weld pad are 2 to 5 times of area of electrode pad.
9. the heat conduction of LED according to claim 1 and radiator structure, wherein said insulating barrier is made of the insulative resin material that contains ceramic powder.
10. the heat conduction of LED according to claim 1 and radiator structure, wherein said LED assembly are the electrode layer package assembling or the chip of encapsulation not as yet; Described LED assembly is fixed on the described composite material heat-conducting substrate with tin cream or routing mode, and has pin on described composite material heat-conducting substrate, and the described composite material heat-conducting substrate back side connects metal derby as heat sink with tin cream; And packed material of its overall structure or enclosure encapsulation.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010205405069U CN201853747U (en) | 2010-09-25 | 2010-09-25 | Heat-conducting and heat-dissipating structure of LED |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205405069U CN201853747U (en) | 2010-09-25 | 2010-09-25 | Heat-conducting and heat-dissipating structure of LED |
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| CN201853747U true CN201853747U (en) | 2011-06-01 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412365A (en) * | 2010-09-25 | 2012-04-11 | 禾正实业股份有限公司 | Heat-conducting substrate and radiating module structure of LED (light-emitting diode) |
| CN102811550A (en) * | 2011-06-02 | 2012-12-05 | 李金连 | Circuit board with radiator and manufacturing method thereof |
| CN103094448A (en) * | 2011-10-27 | 2013-05-08 | 铼钻科技股份有限公司 | Light emitting diode with aluminum nitride layer, packaging structure and preparation method thereof |
| CN103872029A (en) * | 2012-12-14 | 2014-06-18 | 鸿富锦精密工业（深圳）有限公司 | Light emitting diode module |
| CN105803242A (en) * | 2016-03-21 | 2016-07-27 | 中南大学 | Composite enhanced through coupling of flaky and linear thermal conductive materials and preparation method |
| CN106898263A (en) * | 2017-03-01 | 2017-06-27 | 方迪勇 | A kind of electronic display module of utilization heat conduction bar radiating |
-
2010
- 2010-09-25 CN CN2010205405069U patent/CN201853747U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412365A (en) * | 2010-09-25 | 2012-04-11 | 禾正实业股份有限公司 | Heat-conducting substrate and radiating module structure of LED (light-emitting diode) |
| CN102412365B (en) * | 2010-09-25 | 2015-07-29 | 禾正实业股份有限公司 | The radiating module structure of LED |
| CN102811550A (en) * | 2011-06-02 | 2012-12-05 | 李金连 | Circuit board with radiator and manufacturing method thereof |
| CN103094448A (en) * | 2011-10-27 | 2013-05-08 | 铼钻科技股份有限公司 | Light emitting diode with aluminum nitride layer, packaging structure and preparation method thereof |
| CN103872029A (en) * | 2012-12-14 | 2014-06-18 | 鸿富锦精密工业（深圳）有限公司 | Light emitting diode module |
| CN105803242A (en) * | 2016-03-21 | 2016-07-27 | 中南大学 | Composite enhanced through coupling of flaky and linear thermal conductive materials and preparation method |
| CN106898263A (en) * | 2017-03-01 | 2017-06-27 | 方迪勇 | A kind of electronic display module of utilization heat conduction bar radiating |
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