CN201242052Y - Combined component of LED and heat conducting device - Google Patents

Combined component of LED and heat conducting device Download PDF

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Publication number
CN201242052Y
CN201242052Y CNU2008201154064U CN200820115406U CN201242052Y CN 201242052 Y CN201242052 Y CN 201242052Y CN U2008201154064 U CNU2008201154064 U CN U2008201154064U CN 200820115406 U CN200820115406 U CN 200820115406U CN 201242052 Y CN201242052 Y CN 201242052Y
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CN
China
Prior art keywords
heat
led
transfer device
lead
conducting piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008201154064U
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Chinese (zh)
Inventor
赖耀惠
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Tai Sol Electronics Co Ltd
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Tai Sol Electronics Co Ltd
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Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Priority to CNU2008201154064U priority Critical patent/CN201242052Y/en
Application granted granted Critical
Publication of CN201242052Y publication Critical patent/CN201242052Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

The utility model relates to a combined component of an LED and a heat conducting device, which comprises the heat conducting device, at least two conducting pieces which are respectively provided with a line conductor and an insulating material which is arranged on the heat conducting device, and a plurality of LED units which are respectively provided with an LED chip and at least one connecting wire, wherein the top surfaces of the LED chips are provided with two electrode plates, the bottoms of the LED chips are provided with an insulating layer, the LED chips are arranged on the surface of the heat conducting device through the insulating layer, the electrode plates are connected with the line conductor through the connecting wire, the LED chips have the connection states of series connection and parallel connection, and the combined component also comprises a packaging piece which is used to wrap the LED units. Thereby, the LED chips can be arranged on the heat conducting device through modes of series connection and parallel connection, the heat dissipation effect can be achieved, and the demanded specifications of a power supply can be lowered.

Description

The combined member of LED and heat-transfer device
Technical field
The utility model is relevant with LED (light emitting diode) and heat dissipation technology, is meant the combined member of a kind of LED and heat-transfer device especially.
Background technology
High-brightness LED can produce high heat, in order to solve its heat dissipation problem when work now, Taiwan M313759 patent, promptly proposed a kind of led chip to be planted technology on fin, the heat that led chip is produced is directly conducted on the fin, reaches the purpose of quick heat radiating.
Yet, above-mentioned M313759 patent, though solved the problem of heat radiation, yet, because the negative pole of its led chip is directly to plant to have the effect that negative pole connects altogether on fin, therefore when being connected, promptly can form the state of parallel connection with circuit anodal.
Under the situation of all led chip parallel connections, can reduce overall electrical resistance in a large number, and caused the demand of low-voltage and high electric current, in the quantity of led chip for a long time, required electric current is just higher, but voltage requirements still changes, and this can cause the control of driving power very difficult, the difficult demand that meets low voltage and high current.In addition, also be easy to generate extra heat energy, occupied radiating resource partly on the contrary.
Summary of the invention
Main purpose of the present utility model is to provide the combined member of a kind of LED and heat-transfer device, it is that led chip is located on the heat-transfer device, and the mode with series connection or series connection and coexistence in parallel between these led chips connects, and reaches radiating effect, and the requirement specification of power supply is reduced.
Another purpose of the present utility model is to provide the combined member of a kind of LED and heat-transfer device, and it has integrated the conducting piece of representing two electrodes, and has the convenient effect that connects.
In order to reach aforementioned purpose, the combined member according to a kind of LED provided by the utility model and heat-transfer device includes: a heat-transfer device; At least two conducting pieces, respectively this conducting piece has a lead and an insulating materials respectively, and is located on this heat-transfer device with this insulating materials, this lead this insulating materials of mat and insulating promptly and between this heat-transfer device; Several LED unit have a led chip and at least one wiring respectively; Wherein, this led chip end face has two battery lead plates, is respectively positive pole and negative pole, and the bottom of this led chip has an insulating barrier, and this led chip plants in this heat-transfer device surface with this insulating barrier; Two battery lead plates on this led chip connect this wiring respectively; Be to see through these wiring to connect between these battery lead plates and these leads, and make these led chips have series connection and connection status in parallel to each other; And at least one packaging part, coat these LED unit.By this, led chip can be located on the heat-transfer device in the mode of series connection, be reached radiating effect, and the requirement specification of power supply is reduced, and have the convenient effect that connects by the setting of this two conducting piece.
Description of drawings
Fig. 1 is the combination stereogram of the utility model first preferred embodiment.
Fig. 2 is the vertical view of the utility model first preferred embodiment.
Fig. 3 is the side view of the utility model first preferred embodiment.
Fig. 4 is the partial enlarged drawing of Fig. 3, shows the led chip annexation of a string joint group in closing.
Fig. 5 is the combination stereogram of the utility model first preferred embodiment, shows that conducting piece is the state of circuit board.
Fig. 6 is the combination stereogram of the utility model second preferred embodiment.
Fig. 7 is the vertical view of the utility model second preferred embodiment.
The specific embodiment
In order to describe structure of the present utility model and characteristics place in detail, lift now following two preferred embodiments and conjunction with figs. explanation as after, wherein:
As shown in Figures 1 to 4, a kind of LED that the utility model first preferred embodiment is provided and the combined member 10 of heat-transfer device mainly are made up of a heat-transfer device 11, two conducting pieces 21, several LED unit 31 and two packaging parts 41, wherein:
This heat-transfer device 11 is a fin, several fins 14 that have a heat-conducting plate 12 and be located at these heat-conducting plate 12 end faces, and heat-conducting plate 12 bottom surfaces have two grooves 16.
This two conducting piece 21, have an insulating materials 22 and a lead 24 respectively, be embedded in this two groove 16, and be located on this heat-transfer device 11, respectively this lead 24 around coated insulation material 22, respectively the insulating materials 22 of this conducting piece 21 has at least one local hollow-out parts 23, and inner lead 24 is exposed.Be to insulate between this lead 24 and this heat-transfer device 11 by means of this insulating materials 22.
These LED unit 31 are adjacent to this two conducting piece 21, and respectively this LED unit 31 has a led chip 32 and at least one wiring 38; Wherein, these led chip 32 end faces have two battery lead plates 33, be respectively positive pole and negative pole, and the bottom of this led chip 32 has an insulating barrier 34, this led chip 32 plants in the bottom surface of this heat-transfer device 11 by then welding of a heat-conducting layer 36 with this insulating barrier 34, and wherein this heat-conducting layer 36 can be scolding tin or epoxy resin.Two battery lead plates 33 on this led chip 32 connect this wiring 38 respectively.These led chips 32 see through the negative pole that these wiring 38 are connected in another led chip 32 with the positive pole of a led chip 32 to each other, and these LED unit 31 promptly form series connection by this, and form two tandem compounds 39.Respectively in two electrodes of this tandem compound 39 (being negative pole and positive pole), its negative pole system is connected in inner lead 24 by this wiring 38 sees through the local hollow-out parts 23 of this conducting piece 21, anodal then lead 24 that see through the local hollow-out parts 23 of another this conducting piece 21 and be connected in inside by this wiring 38.These tandem compounds 39 are in parallel to each other by this.Therefore, these LED unit 31 are coupled to the state into series connection and coexistence in parallel mutually.
Two packaging parts 41 coat the respectively LED unit 31 of this tandem compound 39 respectively, and coat the part of this two conducting piece 21.
In the accompanying drawing of this case, in fact the assembly by this packaging part 41 coats should be represented by dotted lines, but because dotted line can cause unclear situation, therefore represents with solid line.
Via the structure of above announcement as can be known, led chip 32 of the present utility model forms at least one tandem compound 39, therefore can improve the voltage requirements at whole tandem compound 39 two ends, and can not improve the electric current demand.This can make that being used for the driving power of driving LED chip 32 is controlled easily, does not have the puzzlement of big electric current output.Simultaneously, the led chip 32 of series connection, because of the electric current of flowing through is little, thus itself since the electric current additional thermal energy passing through to be produced just lack than prior art, so can not occupy the integral heat sink resource, the relative radiating efficiency that yet improved.And these tandem compounds 39 reach the annexation that is in parallel by this two conducting piece 21, can allow the producer adjust the demand of its power supply by this.
In addition, because these led chips 32 directly plant in the surface of this heat-transfer device 11 with the insulating barrier 34 of its bottom, therefore the heat energy that produced of these led chips 32 can be directly transferred on this heat-transfer device 11, and then utilizes its heat-conducting effect that heat energy is directed at these fins 14 outwards to dispel the heat.
Please consult Fig. 5 again, these conducting pieces 21 ' also can be the kenel of circuit board, the epoxy resin material that its insulating barrier 22 ' is its circuit board bottom, and its lead 24 ' then is the Copper Foil on the circuit board.This figure mainly is the different shape that shows conducting piece 21 '.
Fig. 6 is to shown in Figure 7 for another example, and a kind of LED that the utility model second preferred embodiment is provided and the combined member 50 of heat-transfer device are taken off embodiment before mainly generally being same as, and difference is:
These led chips 62 are divided into several combinations 69 in parallel, there are three led chips 62 to be in parallel in each combination 69 in parallel, wherein two electrodes (being battery lead plate 63 formed both positive and negative polarities) of first combination 69 in parallel are connected in the lead 54 of first conducting piece 511 in these conducting pieces 51 and the lead 54 of second conducting piece 512, two electrodes of second combination 69 in parallel are connected in the lead 54 of second conducting piece 512 and the lead 54 of the 3rd conducting piece 513, two electrodes of the 3rd combination 69 in parallel are connected in the lead 54 of the 3rd conducting piece 513 and the lead 54 of the 4th conducting piece 514, by that analogy; Between these combinations 69 in parallel is to be series connection.Can reach series connection and the effect that has concurrently in parallel between the led chip 62 by this equally.
The quantity of the parallel connection combination 69 of this second embodiment is only for for example, be not quantity with parallel connection combination 69 be the scope of this case, 69 formed series systems are made up in the parallel connection of other quantity, the scope that is this case contains.
As from the foregoing, the utility model attainable effect be: with heat conduction and the effect that reduces power supply requirement.It mainly is to utilize led chip 32 directly to plant in these heat-transfer device 11 surfaces, makes heat energy can be directly conducted on this heat-transfer device 11, uses and dispels the heat.In addition, utilize series system between the led chip 32 to replace the problem of the low voltage and high current that complete parallel way of the prior art meets with, reach being connected in parallel between the tandem compound 39 by this two conducting piece 21 again, not only can reduce the demand of power specification, more can adjust series connection and state in parallel flexibly, make it more to meet the demand of power specification.

Claims (11)

1. the combined member of LED and heat-transfer device is characterized in that, includes:
One heat-transfer device;
At least two conducting pieces, respectively this conducting piece has a lead and an insulating materials respectively, and is located on this heat-transfer device with this insulating materials, this lead this insulating materials of mat and insulating promptly and between this heat-transfer device;
Several LED unit have a led chip and at least one wiring respectively; Wherein, this led chip end face has two battery lead plates, is respectively positive pole and negative pole, and the bottom of this led chip has an insulating barrier, and this led chip is to plant in this heat-transfer device surface with this insulating barrier; Two battery lead plates on this led chip connect this wiring respectively; Be to see through these wiring to connect between these battery lead plates and these leads, and make these led chips have series connection and connection status in parallel to each other; And
At least one packaging part coats these LED unit.
2. the combined member of LED according to claim 1 and heat-transfer device is characterized in that: the insulating barrier of this led chip bottom is to be located at this heat-transfer device surface by following of a heat-conducting layer.
3. the combined member of LED according to claim 2 and heat-transfer device is characterized in that: this heat-conducting layer is scolding tin or epoxy resin.
4. the combined member of LED according to claim 1 and heat-transfer device is characterized in that: respectively the insulating materials of this conducting piece coats its lead, and respectively the insulating materials of this conducting piece has at least one local hollow-out parts, and inner lead is exposed.
5. the combined member of LED according to claim 4 and heat-transfer device, it is characterized in that: these led chips see through the negative pole that these wiring are connected in another led chip with the positive pole of a led chip to each other, these LED unit promptly form series connection by this, and a string at least joint group of formation closes; Two electrode systems of this tandem compound see through the local hollow-out parts of this two conducting piece respectively and are connected in inner conducting piece.
6. the combined member of LED according to claim 5 and heat-transfer device, it is characterized in that: these LED unit form several tandem compound, in two electrodes of these tandem compounds, negative pole is connected in inner lead by this wiring sees through the local hollow-out parts of this conducting piece, anodal then be connected in the lead of inside by this wiring sees through the local hollow-out parts of another this conducting piece; These tandem compounds are in parallel to each other by this.
7. the combined member of LED according to claim 1 and heat-transfer device is characterized in that: this heat-transfer device has two grooves, and this two conducting piece is embedded in this two groove.
8. the combined member of LED according to claim 7 and heat-transfer device is characterized in that: this heat-transfer device is a fin, several fins that have a heat-conducting plate and be located at this heat-conducting plate end face, and this two groove is located at the bottom surface of this fin.
9. the combined member of LED according to claim 1 and heat-transfer device is characterized in that: this packaging part coats the part of this two conducting piece.
10. the combined member of LED according to claim 1 and heat-transfer device is characterized in that: this two conducting piece is two circuit boards, and its insulating materials is the epoxy resin material, and its lead is the Copper Foil on the circuit board.
11. the combined member of LED according to claim 1 and heat-transfer device, it is characterized in that: these led chips are divided into several combinations in parallel, have at least two led chips to be in parallel in each combination in parallel, wherein two electrode systems of first combination in parallel are connected in the lead of first conducting piece and the lead of second conducting piece, two electrode systems of second combination in parallel are connected in the lead of second conducting piece and the lead of the 3rd conducting piece, and two electrode systems of the 3rd combination in parallel are connected in the lead of the 3rd conducting piece and the lead of the 4th conducting piece; Be series connection between these combinations in parallel.
CNU2008201154064U 2007-10-31 2008-05-28 Combined component of LED and heat conducting device Expired - Fee Related CN201242052Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201154064U CN201242052Y (en) 2007-10-31 2008-05-28 Combined component of LED and heat conducting device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN200720193416.5 2007-10-31
CN200720302205 2007-10-31
CN200720302205.0 2007-10-31
CNU2008201154064U CN201242052Y (en) 2007-10-31 2008-05-28 Combined component of LED and heat conducting device

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Publication Number Publication Date
CN201242052Y true CN201242052Y (en) 2009-05-20

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CNU2008201154079U Expired - Fee Related CN201242053Y (en) 2007-10-31 2008-05-28 Combined component of LED and heat conducting device

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102109126A (en) * 2009-12-24 2011-06-29 东芝照明技术株式会社 Lighting apparatus
CN102142508A (en) * 2010-12-16 2011-08-03 西安炬光科技有限公司 Encapsulation structure and encapsulation method for high-power and high-brightness LED light source
CN102155634A (en) * 2010-02-11 2011-08-17 佰鸿工业股份有限公司 LED (light emitting diode) lighting module and method for manufacturing LED lighting module
CN102313175A (en) * 2011-07-20 2012-01-11 沈阳立晶光电有限公司 LED (light emitting diode) lighting module with thermoelectricity separation function
CN105987296A (en) * 2015-02-05 2016-10-05 佛山市禾才科技服务有限公司 Full-ambient-light LED lampwick

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102109126A (en) * 2009-12-24 2011-06-29 东芝照明技术株式会社 Lighting apparatus
CN102155634A (en) * 2010-02-11 2011-08-17 佰鸿工业股份有限公司 LED (light emitting diode) lighting module and method for manufacturing LED lighting module
CN102142508A (en) * 2010-12-16 2011-08-03 西安炬光科技有限公司 Encapsulation structure and encapsulation method for high-power and high-brightness LED light source
CN102313175A (en) * 2011-07-20 2012-01-11 沈阳立晶光电有限公司 LED (light emitting diode) lighting module with thermoelectricity separation function
CN105987296A (en) * 2015-02-05 2016-10-05 佛山市禾才科技服务有限公司 Full-ambient-light LED lampwick

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090520

Termination date: 20170528