CN102412365A - Heat-conducting substrate and radiating module structure of LED (light-emitting diode) - Google Patents
Heat-conducting substrate and radiating module structure of LED (light-emitting diode) Download PDFInfo
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- CN102412365A CN102412365A CN2010102904642A CN201010290464A CN102412365A CN 102412365 A CN102412365 A CN 102412365A CN 2010102904642 A CN2010102904642 A CN 2010102904642A CN 201010290464 A CN201010290464 A CN 201010290464A CN 102412365 A CN102412365 A CN 102412365A
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Abstract
The invention provides a heat-conducting substrate and a radiating module structure of an LED (light-emitting diode). The heat-conducting substrate comprises a composite-material heat-conducting substrate formed by combination of a plurality of heat-conducting lines or fibers and an insulating material; the heat-conducting lines or fibers are distributed at intervals, penetrate through the front surface and the back surface of the composite-material heat-conducting substrate and are separated by the insulating material; electrode welding pads are combined on the front surface of the composite-material heat-conducting substrate so as to form electric connection with electrode pins of an LED member, and heat-conducting welding pads are also combined on the front surface of the composite-material heat-conducting substrate so as to form heat-conducting contact with heat-sink parts of an LED component of the LED member; and insulating layers corresponding to the electrode welding pads are combined on the back surface of the composite-material heat-conducting substrate. In the invention, the characteristics with high heat conductivity in the thickness direction but insulation in the plane direction can be achieved by a simple structure, so that the heat can be quickly conducted to a radiating member. The invention can be used for high-brightness LED illuminating products.
Description
Technical field
The present invention relates to heat-conducting substrate and the radiating module structure of a kind of LED (light-emitting diode); Particularly a kind of thermal conductive wire that adopts metal or material with carbon element or fiber and insulating properties material form the high heat conduction of thickness direction but the high thermal conductive substrate structure of in-plane insulation.
Background technology
In the actual use of LED, the conversion efficiency of its electric energy and luminous energy is still on the low side, can produce heat energy when causing its work; Wherein for the high-capacity LED that high brightness uses; The heat that produces is higher, if can not heat be derived, therefore the temperature of LED can raise; And then the generation color offset phenomenon, finally cause the LED deterioration and can't work.
The heat radiation be the design focal point of LED always, its mainly via Heat Conduction Material with thermal energy conduction to thermal energy converter, the big surface via thermal energy converter is dissipated to heat energy in the air again; Said thermal energy converter is generally by aluminium extrusion or the fin that is cast into, utilizes the high heat transfer property of aluminium that heat energy is sent to the fin surface, carries out heat exchange by the fin surface with air again.On illuminating product; Usually need to form light source with a plurality of LED; Therefore need the modular structure of a plurality of LED of assembling of design, and need a circuit substrate and weld a plurality of LED and power circuit, more need have the enough capacity of heat transmission; With with the thermal energy conduction of LED to heat exchanger, avoid substrate temperature to raise and cause assembly to damage.
LED uses required heat conduction design, has generally comprised Chip Packaging and modular structure two parts, and the two all has a substrate to be responsible for connecting the LED electrode and with the heat energy derivation of its generation.The substrate of Chip Packaging part is as the support plate of led chip; To obtain higher thermal conduction characteristic; Substrate uses material such as aluminium oxide and aluminium nitride, the metal substrate of gold-plated diamond film, the carborundum that contains aluminium or the diamond composite etc. of high heat conduction and insulating properties, such as patent JP2000297301, JP2000303126, TW224873, JP2003073169 etc. announcement.In addition; For obtaining higher interface contact tightness degree; The thermal resistance that interface is produced reduces; Can be directly make heat-conducting layer, or the composite design of utilizing heat-conducting layer to be reducing thermal stress at semiconductor substrate, such as patent US2005070048, JP2005072069, JP2006060247, JP2006190705, US708359 etc. announcement.In addition, derive fast outside the substrate, also have and on substrate, make through hole, in through hole, fill the method for high conductivity material such as metal-to-metal adhesive afterwards for making heat, such as patent JP2002289747, JP5090437, US2006006524 etc. announcement.The electrode pad that led chip arranged again is with sheet metal welding, the method for utilizing the high heat conduction of sheet metal that heat is derived, such as patent JP2009266972, JP2009194277, JP2009188308 etc. announcement.Because the substrate size of Chip Packaging is little, can use all high ceramic material of insulating properties and thermal conductivity, cooperate through hole making heat conduction path, make the LED after the encapsulation have high heat conducting structure.Further chip cooling can be derived via the heat conduction solder joint that is connected in chip bottom, such as patent US20100110692, US20070176182 announcement.
The LED that encapsulation is accomplished has termination electrode or metal electrode pin and heat conduction contact, and so that LED to be provided welding electrode and the heat conduction contact when circuit substrate is assembled, being electrically connected with heat through circuit substrate derives.A plurality of LED are generally arranged on the circuit substrate, and the substrate that size is used than Chip Packaging is big, uses the substrate of pure pottery to have the problem on the mechanical strength, and that often uses is printed circuit board (PCB).Printed circuit board (PCB) is phenolic resins and glass fiber material, and its coefficient of heat conduction generally is lower than 0.5W/m ° of K, and the application high to power has problem of temperature rise.Be improving the substrate heat conducting effect, generally is to adopt the two sides to cover the metal substrate of insulating barrier, such as patent US20080057333, JP2004047863, US2009151982, US20080190542, JP2009123980, JP2008159827 announcement.Other has the substrate that uses crystalline macromolecule to cooperate thermohardening and organic thermoplastic; The powder or fiber such as metal or the nitride etc. that wherein contain high-termal conductivity; Such as patent US2008057333, JP2008060535, JP2006165158, JP2154049, JP2004165421, KR20080028258, US2008073623, JP2008081722 etc. announcement, all utilize high molecular crystallinity to improve the heat conductivity of material.But the substrate that uses macromolecule organic material to make is subject to the lower factor of the heat conductivity of organic material own, makes the substrate of this type of material, and its coefficient of heat conduction is difficult for reaching 5W/m ° of K.Ceramic material has high heat-conducting property than organic material; Use porous ceramic, in hole the filling highly heat-conductive material technology such as patent US20090290362, JP2007173536 etc. announcement, can obtain thermal conduction effect than traditional organic material plate hight.
The substrate of LED has the conduction of electrode and heat conduction two parts requirement of heat conduction contact, though metal material has high-termal conductivity, directly welding electrode can cause short circuit on metal substrate, so the metal surface must be provided with electrically insulated structures.Insulating material is except that diamond and nitride, and thermal conduction characteristic is all not good, and its anti-mechanical impact property is also poor, so if directly use the high thermal conductivity insulating material substrate, have the problem of cost height and mechanical resistance properties difference.If with the printed circuit board (PCB) is substrate,, can't be applicable to the lighting use of high brightness though the low heat conductivity of cost is poor.If use the mode of metallic substrate surfaces plating dielectric film, because of the not good factor of heat conductivity that is subject to plated film, so the heat conductivity of whole composite base plate is relatively poor relatively.The market demand of high-capacity LED illuminating product is big, the LED cost of universalness utilization to reduce; Therefore, have low cost and high-termal conductivity concurrently, and its surface can directly make the board structure of LED electrode pad, become the important directions of correlation technique research and development.
In view of this, the inventor is based on the manufacturing development of being engaged in Related product for many years and design experiences, to above-mentioned target, in detail after design and the scrupulous assessment, eventually the present invention of true tool practicality.
Summary of the invention
Main purpose of the present invention provides heat-conducting substrate and the radiating module structure of a kind of LED, and it is to how developing a kind of new-type LED radiator structure that has more desirable practicality;
Technical characterstic of the present invention; Mainly comprise: a composite material heat-conducting substrate; Serve as reasons many thermal conductive wires or fiber combines the plate body that forms with insulating material, it has a front and the back side, and said thermal conductive wire or fibrous septum distribute; And thermal conductive wire or fiber connect should the front and the back side, then is insulated material between each thermal conductive wire or the fiber and separates; The LED member is incorporated into the front of composite material heat-conducting substrate, and said LED member comprises LED assembly and electrode pin; Electrode pad is incorporated into the front of composite material heat-conducting substrate, and is electrically connected with the electrode pin of LED member; Insulating barrier is incorporated into the back side of composite material heat-conducting substrate, and its position is corresponding with the position at electrode pad place; The heat conduction weld pad is incorporated into the front of composite material heat-conducting substrate, and contacts with heat sink (heat sink) heat conduction of the LED assembly of LED member; Through above-mentioned design, make the present invention as far as prior art, roughly can reach following advantage:
The heat-conducting substrate of LED and radiating module structure are able to reach the high heat conduction of thickness direction but the characteristic of in-plane insulation through easy structure; Can conduct heat to radiating component fast; Simultaneously have due circuit insulating properties again concurrently, the present invention can provide the suitable tool practicality of of high-brightness LED illuminating product and meet the radiator structure of preferable industrial economy benefit.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The 1st figure: the combination stereogram of preferred embodiment of the present invention.
The 2nd figure: the sketch map when composite material heat-conducting substrate of the present invention forms assembled state through stationary fixture.
The 3rd figure: the schematic perspective view of composite material heat-conducting substrate of the present invention.
The 4th figure: the sketch map of a plurality of LED component compositions of the present invention when a composite material heat-conducting substrate.
The 5th figure: composite material heat-conducting substrate of the present invention is applied to the vertical view of the embodiment of led chip encapsulation.
The 6th figure: composite material heat-conducting substrate of the present invention is applied to the end view of the embodiment of led chip encapsulation.
Embodiment
Fig. 1 is the preferred embodiment of heat-conducting substrate and the radiating module structure of LED of the present invention to shown in Figure 3, but this embodiment only supplies explanation, and scope of patent protection does not receive the restriction of this structure; Heat-conducting substrate and the radiating module structure of said LED (light-emitting diode) comprise:
One composite material heat-conducting substrate 10; It is the plate body that combines and form by many thermal conductive wires 101 or fiber and insulating material 102; It has positive 11 and one back side 12; Wherein said thermal conductive wire 101 or fiber are spaced apart from each other, and said thermal conductive wire 101 or fiber connect should the front 11 and the back side 12, then be insulated material 102 between each thermal conductive wire 101 or fiber and separate;
At least one LED member 20 is incorporated into the front 11 of this composite material heat-conducting substrate 10, and said LED member 20 comprises LED assembly 21 and electrode pin 22;
Insulating barrier 40; Be incorporated into the back side 12 of this composite material heat-conducting substrate 10; And its position is corresponding with the position at electrode pad 30 places; When avoiding composite material heat-conducting substrate 10 to be connected with heat dissipation metal member 60 thus, produce the short circuit of 30 of electrode pad, wherein said insulating barrier 40 is formed by the insulative resin materials, printed on that contains ceramic powder;
Heat conduction weld pad 50 is made up of Heat Conduction Material, is incorporated on the front 11 of this composite material heat-conducting substrate 10, and contacts with heat sink (heat sink) 24 position heat conduction of the LED assembly 21 of LED member 20.
Wherein, the back side 12 combinations of this composite material heat-conducting substrate 10 have a radiating component 60; This radiating component 60 is by any one radiating fin that constitutes in aluminium, copper, the graphite.
Wherein, This composite material heat-conducting substrate 10 is combined with radiating component 60 through stationary fixture 13 fitted bolts 14; To reduce the space of 60 of composite material heat-conducting substrate 10 and radiating components; And, can avoid 60 of composite material heat-conducting substrate 10 and radiating components because of heat generation stress rupture, thereby avoid getting loose of fixed position because stationary fixture 13 has elasticity; And a prior advantage is; Owing to adopt said stationary fixture 13, make composite material heat-conducting substrate 10 can be drilled with bolt hole, so area capable of using can increase; Add the good characteristics of said composite material heat-conducting substrate 10 heat radiations, so LED member 20 can be covered with as far as possible.
Wherein, Each thermal conductive wire 101 or fiber are spaced apart in parallel to each other to each other; Make LED member 20 along thermal conductive wire 101 or machine direction heat conduction and conduction, but the in-plane insulation, because composite material heat-conducting substrate 10 is non-conductive in the in-plane insulation; And can directly on composite material heat-conducting substrate 10, make electrode pad 30, can not produce situation of short circuit between weld pad.
Wherein, said thermal conductive wire 101 or fiber are line body or the corpus fibrosum of diameter between metal between the 0.05mm to 0.5mm or material with carbon element.
Wherein, the insulating material 102 of this composite material heat-conducting substrate 10 is any one in pottery or glass material of thermosetting or thermoplastic resin insulating material, insulating properties etc., and the resistance coefficient of said insulating material 102 is higher than 10
9Ω .cm.
Wherein, Said electrode pad 30 and heat conduction weld pad 50 are by sputter or electroplating metal film or print in the tin cream any one and constitute; Because said tin cream can directly be printed on the composite material heat-conducting substrate 10; Through heating soldering technology, can be with electrode pad 30, heat conduction weld pad 50 and composite material heat-conducting substrate 10 stable engagement; But and the 10 surperficial heat-conducting glues of going up the filling insulating properties of the composite material heat-conducting substrate between electrode pad 30 and heat conduction weld pad 50, further the heat with LED member 20 is sent to thermal conductive wire 101 or fiber.
Wherein, the area of said heat conduction weld pad 50 is 2 to 5 times of area of electrode pad 30, and thermal conductive wire 101 numbers that make the heat conduction weld pad cover for 50 times increase, and to increase the approach of heat conduction, reaches the effect that improves heat conduction to radiating component 60.
According to said structure, as follows with regard to use operation situation explanation of the present invention:
Thermal energy conduction to the heat conduction weld pad 50 that the LED assembly 21 of said LED member 20 is produced; And engage with radiating component 60 through this thermal conductive wire 101 or fiber; Can conduct heat to radiating component 60 apace; Via the high surface of radiating component 60 with heat exchange in air, to reach the heat radiation purpose;
As shown in Figure 4; Heat-conducting substrate and radiating module structure for many group LED; Conduction between the said LED member 20 is carried out through carrying out external wire 23, and makes with the mode of wire jumper, and on composite material heat-conducting substrate 10, does not make the lead-in wire pattern in addition; The wire jumper conduction portion heat of metal material capable of using increases the radiating effect of LED in air thus.
Following is to explain about the making of composite material heat-conducting substrate 10: can be with thermal conductive wire 101 like metal or the fine bunchy of concentrating of carbon; Resin material perfusion with insulating properties is filled between thermal conductive wire; Resin drying solidifies the back and forms the resin bar that includes the bunchy thermal conductive wire; Make the resin bar become sheet through cutting technique again, promptly obtain like the disclosed composite material heat-conducting substrate 10 that contains parallel thermal conductive wire 101 or fiber.The manufacture method of another kind of composite material heat-conducting substrate 10 is; Use preformed pottery or the glass board material that contains parallel hole; Behind sintering, become compactness pottery or glass plate with parallel hole; Perfusion molten metal or graphite paint form the heat conduction wire rod in hole again, accomplish the making of composite material heat-conducting substrate 10.
Wherein, said LED assembly 21 can be for being encapsulated the assembly that forms or any one in the chip (chip) of encapsulation etc. not as yet by an electrode layer; Like Fig. 5, shown in Figure 6; In the present embodiment; This LED assembly 21 directly is fixed on the composite material heat-conducting substrate 10 with electrode pad 30 and heat conduction weld pad 50 with tin cream or routing mode, and on this composite material heat-conducting substrate 10, makes pin 15, and connects metal derby as heat sink in heat-conducting substrate 10 back sides with tin cream 41; With encapsulating material (molding compound) or enclosure (package encapsulation) overall structure is encapsulated again, to form predetermined LED finished product.In the present embodiment, the position of corresponding heat conduction weld pad 50 is combined with tin cream 41 between two insulating barriers 40 that these composite material heat-conducting substrate 10 back sides 12 are combined, and obtains preferable heat to connect below radiating component 60 and passes effect.
The present invention compares the as follows effect improved of prior art:
Disclosed " heat-conducting substrate of LED and radiating module structure " mainly is made up of said composite material heat-conducting substrate, LED member, electrode pad, insulating barrier and heat conduction weld pad; Thus; Can make heat-conducting substrate and the radiating module structure of LED be able to reach the high heat conduction of thickness direction but the architectural characteristic of in-plane insulation through easy structure; Can conduct heat to radiating component fast; Simultaneously have due circuit insulating properties again concurrently, the present invention can provide the suitable tool practicality of high-brightness LED illuminating product and meet the radiator structure of preferable industrial economy benefit.
The present invention can produce following new effect:
1, utilizes thermal conductive wire or fiber to form the composite substrate of the high heat conduction in-plane height of thickness direction insulation, solve high heat conduction and be difficult for problem in same substrate realization with high insulation.
2, said composite material heat-conducting substrate forms combination through stationary fixture fitted bolt and radiating component; Thus; Reduce the space between composite material heat-conducting substrate and radiating component; And because stationary fixture has elasticity, thus can avoid between composite material heat-conducting substrate and radiating component because of heat generation stress rupture, thus avoid getting loose of fixed position.
3, because said electrode pad and heat conduction weld pad are any one in sputter or electroplating metal film or the printing tin cream; So said tin cream can directly be printed on the composite material heat-conducting substrate; Through heating soldering technology, can be with electrode pad, heat conduction weld pad and composite material heat-conducting substrate stable engagement.
4, because the area of said heat conduction weld pad is 2 to 5 times of area of electrode pad,, can increase the approach of heat conduction, reach the effect of increase heat conduction to radiating component so the thermal conductive wire number that the heat conduction weld pad covers down increases.
The above; Be merely embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technical staff who is familiar with the present technique field is in the technical scope that the present invention discloses; The variation that can expect easily or replacement, all should be encompassed in protection scope of the present invention in.Therefore, protection scope of the present invention should be as the criterion with the protection range of said claim.
Claims (11)
1. the heat-conducting substrate of a LED and radiating module structure comprise:
One composite material heat-conducting substrate; It is the plate body that combines and form with insulating material by many thermal conductive wires or fiber; It has a positive and back side; Wherein said thermal conductive wire or fibrous septum distribute, and said thermal conductive wire or fiber connect the said front and the back side, are insulated material between each thermal conductive wire or fiber and separate;
At least one LED member is incorporated into the front of said composite material heat-conducting substrate, and said LED member comprises LED assembly and electrode pin;
Electrode pad is made up of electric conducting material, is incorporated into the front of said composite material heat-conducting substrate, and is electrically connected with the electrode pin formation of said LED member;
Insulating barrier is incorporated into the back side of said composite material heat-conducting substrate, and its position is corresponding with the position at said electrode pad place;
The heat conduction weld pad is made up of Heat Conduction Material, is incorporated into the front of said composite material heat-conducting substrate, and contacts with the heat sink heat conduction of the LED assembly of said LED member.
2. the heat-conducting substrate of LED according to claim 1 and radiating module structure, the back side combination of wherein said composite material heat-conducting substrate has a radiating component.
3. the heat-conducting substrate of LED according to claim 2 and radiating module structure, wherein said radiating component is the radiating fin that is made up of any one material in aluminium, copper, the graphite.
4. the heat-conducting substrate of LED according to claim 2 and radiating module structure, wherein said composite material heat-conducting substrate is combined through stationary fixture and bolt and radiating component.
5. the heat-conducting substrate of LED according to claim 1 and radiating module structure, wherein each said thermal conductive wire or fiber are parallel each other.
6. the heat-conducting substrate of LED according to claim 1 and radiating module structure, wherein said thermal conductive wire or fiber are the metal of diameter between 0.05mm to 0.5mm or the line body or the corpus fibrosum of material with carbon element.
7. the heat-conducting substrate of LED according to claim 1 and radiating module structure; The insulating material of wherein said composite material heat-conducting substrate is the pottery of thermosetting or thermoplastic resin-insulated material, insulating properties or in the glass material any one, and the resistivity of said insulating material is higher than 10
9Ω .cm.
8. the heat-conducting substrate of LED according to claim 1 and radiating module structure, wherein said electrode pad and heat conduction weld pad are by sputter or electroplating metal film or print in the tin cream any one and constitute.
9. the heat-conducting substrate of LED according to claim 1 and radiating module structure, the area of wherein said heat conduction weld pad are 2 to 5 times of area of electrode pad.
10. the heat-conducting substrate of LED according to claim 1 and radiating module structure, wherein said insulating barrier is formed by the insulative resin materials, printed on that contains ceramic powder.
11. the heat-conducting substrate of LED according to claim 1 and radiating module structure, wherein said LED assembly is for being encapsulated assembly that forms or the chip that does not encapsulate as yet by an electrode layer; Said LED assembly directly is fixed on the said composite material heat-conducting substrate with tin cream or routing mode; And on said composite material heat-conducting substrate, make pin; Connect metal derby as heat sink in the said composite material heat-conducting substrate back side with tin cream again, with encapsulating material or enclosure overall structure is encapsulated again.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010290464.2A CN102412365B (en) | 2010-09-25 | 2010-09-25 | The radiating module structure of LED |
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| CN201010290464.2A CN102412365B (en) | 2010-09-25 | 2010-09-25 | The radiating module structure of LED |
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| CN102412365A true CN102412365A (en) | 2012-04-11 |
| CN102412365B CN102412365B (en) | 2015-07-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103378020A (en) * | 2012-04-23 | 2013-10-30 | 新加坡商格罗方德半导体私人有限公司 | Method for forming heat sink with through silicon vias |
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