CN109348616A - A kind of wiring board and preparation method thereof with heat conduction structure - Google Patents
A kind of wiring board and preparation method thereof with heat conduction structure Download PDFInfo
- Publication number
- CN109348616A CN109348616A CN201811434815.5A CN201811434815A CN109348616A CN 109348616 A CN109348616 A CN 109348616A CN 201811434815 A CN201811434815 A CN 201811434815A CN 109348616 A CN109348616 A CN 109348616A
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- Prior art keywords
- wiring board
- heat conduction
- conduction structure
- hole
- heat
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- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 239000010410 layer Substances 0.000 claims description 87
- 239000004020 conductor Substances 0.000 claims description 81
- 239000002356 single layer Substances 0.000 claims description 36
- 239000003292 glue Substances 0.000 claims description 23
- 238000009413 insulation Methods 0.000 claims description 11
- 238000011049 filling Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 4
- 210000000481 breast Anatomy 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 239000004831 Hot glue Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 17
- 238000000034 method Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000005266 casting Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000035508 accumulation Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229920001197 polyacetylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- -1 phenolic aldehyde Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of wiring boards with heat conduction structure, including multilayer circuit board, it is characterized in that, at least one supporter is installed between every adjacent two layers wiring board, make to form cavity between two sandwich circuit boards, heat-conducting medium is filled in the cavity, heat-conducting medium and supporter form heat conduction structure.The structure realizes the heat dissipation of wiring board using the small heat conduction structure of size, conveniently adapts to the lightening radiating requirements of miniaturized electronic devices, furthermore, configuration of the addition of the heat conduction structure without changing existing line plate does not increase the design cost of wiring board.A kind of preparation method of wiring board with heat conduction structure is also disclosed, the preparation method is easy to operate, and the wiring board being prepared has very strong heat dissipation characteristics.
Description
Technical field
The invention belongs to printed wiring board technical fields, and in particular to a kind of wiring board and its system with heat conduction structure
Make method.
Background technique
In today of the lightening demand of electronic equipment, electronic device increasingly microminiaturization and integrated, circuit board structure
More to it is complicated with it is compact.And highdensity electronic device and circuit cause the heat dissipation problem that can not avoid.Especially handle
The fever rich and influential family such as chip and high power device, if heat cannot timely and effectively be conducted to the external world, bring high temperature will be tight
Ghost image rings the performance of electronic equipment, and is likely to result in the exception and damage of electronic equipment.Therefore, the heat dissipation pole of electronic equipment
The earth affects product design and routine use.
Currently, the miniaturized electronic devices such as smartwatch, mobile phone, tablet computer are generally in the circuit board to realize heat dissipation
Coat all kinds of heat dissipating layers；And for biggish electronic equipment such as laptop, integral computer etc., common radiating mode packet
It includes: in assist side and electronic device surface, mounting such as copper sheet, copper pipe cooling fin or coating heat dissipating silicone grease, or in cooling fin
Upper coating heat dissipating silicone grease etc., under normal circumstances, high heating device are required to attachment cooling fin and coat heat dissipating silicone grease, at this point, also
It needs to connect fan to radiate.
As can be seen that existing radiating mode focuses on external cooling more, i.e. radiator structure is set to outside wiring board, but same
When, wiring board itself is internal, and there is also the accumulations of heat.Conventional wiring board has PCB (hardboard) and R-FPC (Rigid Flex),
It can press to obtain by multiple single layers, there is electronic circuit arrangement on each single layer, interlayer by it is blind, bury or through-hole connection.Line
The substrate of road plate is generally the macromolecular substances such as phenolic aldehyde, polyester, epoxy, is the non-conductor of heat, thus its height warm area
Between thermal convective efficiency it is low, high temperature is easily lasting.The accumulation bring main problem of heat is the deterioration of electrical property, and may
Influence the stability of circuit board structure.
Application publication number be CN108012412A disclose a kind of multilayer insulation radiating circuit plate, comprising: from top to bottom according to
It is secondary include upper ceramic layer, upper insulating layer, upper wiring layer, middle insulating layer, lower line layer, lower insulating layer and lower ceramic layer, i.e., online
Road interlayer is equipped with insulating layer, and cavity is opened up in insulating layer, fills heat sink material in cavity, insulating layer include insulation board and
It is set to the metal plate of insulation board two sides, and is provided with several heat sinks on the outside of metal plate.The heat of line layer through insulating layer, dissipate
Hot material, metal plate are conducted to heat sink, and then play the role of radiating to line layer.
However, application publication number is in the multilayer insulation radiating circuit plate of CN108012412A announcement, structural member increases
Necessarily lead to the complication of circuit board structure and the increase of volume, makes it difficult to be suitable for small, microcircuit, also run counter to electricity
The lightweight trend of sub- equipment；Further, since the presence of insulating layer, the route of route interlayer need to be avoided, so as to cause line
Road arrangement densification, increases the difficulty of route design, while intensive cabling also will affect the transmission of signal.
Summary of the invention
The object of the present invention is to provide a kind of wiring boards with heat conduction structure, utilize the small heat conduction structure of size
The heat dissipation for realizing wiring board, conveniently adapts to the lightening radiating requirements of miniaturized electronic devices, furthermore, the addition of the heat conduction structure
Without changing the configuration of existing line plate, the design cost of wiring board is not increased.
It is a further object of the present invention to provide a kind of preparation method of wiring board with heat conduction structure, the preparation methods
Easy to operate, the wiring board being prepared has very strong heat dissipation characteristics.
For achieving the above object, the present invention the following technical schemes are provided:
A kind of wiring board with heat conduction structure, including multilayer circuit board, be equipped between every adjacent two layers wiring board to
A few supporter, makes to form cavity between two sandwich circuit boards, and heat-conducting medium, heat-conducting medium and support are filled in the cavity
Body forms heat conduction structure.
The heat conduction structure being made of supporter and heat-conducting medium is added between two sandwich circuit boards, what such wiring board generated
Heat can be from higher temperatures block transitive to heat-conducting medium, then is rapidly transferred to through heat-conducting medium compared with low-temperature space and then distributes, with
Formation temperature is distributed relatively uniform wiring board, realizes the heat dissipation of wiring board.
Preferably, the supporter has included the insulated hole of insulation and buffer action, the electric conductor being installed in insulated hole.
Supporter is set to the structure of insulated hole package electric conductor, the opposite upper and lower surface of supporter is supported on offline
The apparent surface of road plate, such electric conductor both may be implemented under conditions of the configuration without changing existing line plate
The conduction of lower two sandwich circuit boards, has expanded the application environment of the heat conduction structure, while not increasing setting for wiring board rewiring
Count cost.Electric conductor is encapsulated by insulated hole, is realized the isolation of electric conductor and heat-conducting medium, is prevented heat-conducting medium to electric conductor
It impacts, while plating space when insulator can also be used as following plated conductive bodies, in addition, electric conductor is generally rigidity
Structure, while realizing conductive, additionally it is possible to support two wiring boards up and down, make to form cavity between wiring board up and down, be led with filling
Thermal medium.
Preferably, the supporter includes electric conductor.The electric conductor is directly and at the line node of upper layer and lower layer wiring board,
The conduction for realizing upper layer and lower layer wiring board, during preparation, in order to limit the fixation position of electric conductor, the electric conductor packet
It is with the insulated hole of position-limiting action, the insulated hole height is lower than the electric conductor.
Preferably, the insulated hole is the glue hole that glue material is constituted.Further, the insulated hole is wiring board casting glue structure
At glue hole, for multilayer circuit board, the present invention prepares glue hole as insulated hole using wiring board casting glue, is using filling
While sealing bonding effect, also dexterously utilize casting glue insulating effect, provide a kind of enclosed environment for electric conductor, with every
From band electric conductor and heat-conducting medium.
Preferably, the height of insulated hole is 10~1000 μm, and heat-conducting medium will not both be dramatically increased more under the height
The thickness of sandwich circuit board, while realizing enough and the high temperature heat of wiring board is transmitted in heat-conducting medium, utilize heat-conducting medium
The heat dissipation to wiring board is realized in the heat dissipation of large area.
Preferably, the electric conductor is metal material, or the structure formed by organic conductive material.Wherein, conductive metal
Can be for gold, silver, copper, iron, molybdenum, tungsten etc., further preferably copper, copper other than with excellent electric conductivity, certain shapes
Copper electric conductor tool also has certain intensity, it is sufficient to support fixed upper layer and lower layer wiring board, while copper is also more suitable for volume production.It can
The conductive polymer materials such as the also organic conductive material, such as conductive polyacetylene of choosing.
For the ease of the conducting of upper layer and lower layer wiring board, it is preferable that the supporter attaches peace with upper surface or lower surface
At the circuit connection point of PCB surface.The electric conductor of supporter and circuit connection point (namely electric contact) are direct at this time
Contact, to realize the conducting of electric current.
Preferably, the corresponding position of upper layer and lower layer wiring board is equipped at least a pair of of connecting hole, and the connecting hole is to set in advance
It is placed in the through-hole of wiring board, it is internal that there is route and extend outward using leading to as connection line plate upper and lower surface circuit
Road, the insulated hole are set on wiring board in such a way that its center is aligned with connecting hole center, and electric conductor connects the connecting hole
And insulated hole, and the land of connecting hole is fitted in, realize support fixation and electrical connection to upper layer and lower layer wiring board.This
Sample, electric conductor more firmly can be supported fixation to upper layer and lower layer wiring board.On this basis, the connecting hole is respectively arranged on
On upper layer and lower layer wiring board at corresponding line node.Since electric conductor is directly fitted and connected with connecting hole, such upper layer and lower layer
Wiring board can be directly connected by electric conductor.
Preferably, the heat-conducting medium is or to have solid with high thermal conductivity coefficient, low-expansion liquid thermal conductivity media
Change characteristic, high thermal conductivity coefficient, low-expansion heat-conducting glue.Liquid thermal conductivity media has certain mobility, when facilitating preparation
The filling of heat-conducting medium, in addition, mobility can speed up the heat transfer of heat-conducting medium, to accelerate the heat dissipation of wiring board.Into one
Step ground, the liquid thermal conductivity media are conduction oil.Heat-conducting glue has curing characteristics, once molding, it is not necessary to worry heat-conducting medium
It overflows and leaks, the requirement to sealing is lower, in addition, heat-conducting glue makes heat conduction structure stability strong, and then also increases more
The structural stability of sandwich circuit board.
A kind of preparation method of the wiring board with heat conduction structure, comprising the following steps:
(1) supporter is prepared at the circuit connection point on single layer wiring board；
(2) another single layer wiring board is set in insulated hole in the mode parallel with single layer wiring board in step (1), with insulation
It after the bonding of hole and is pressed down, guarantees that internal current conductor is contacted with two sandwich circuit boards, then solidify insulated hole；
(3) outer edge of two sandwich circuit boards is sealed, makes to form the cavity for having feed inlet between two sandwich circuit boards,
Heat-conducting medium is had one's bosom filled with through feed inlet filling after body, and sealed feed inlet obtains the wiring board with heat conduction structure.
By fixed two wiring boards up and down of support body supports, then route edges of boards edge is encapsulated to form a cavity, will lead
Thermal medium is filled in cavity, is increased heat conduction structure between assist side to realize, is completed the wiring board with heat conduction structure
Preparation, the preparation method is easy to operate, and prepare wiring board have very strong heat dissipation characteristics.
Preferably, in step (1), electric conductor is prepared, insulating layer is wrapped up on the outside of electric conductor, is then cut out to form multistage
Supporter, and supporter is adhered to single layer route on-board circuitry tie point corresponding position.In this scheme, first it is integrally formed multiple
Supporter, then multiple supporters are secured on single layer wiring board, it can guarantee the otherness for reducing supporter in this way, and can
Promote the producing efficiency of above-mentioned heat conduction structure.
Preferably, in step (1), insulated hole is prepared, and insulated hole stickup is fixed on single layer wiring board, insulated hole
Paste position corresponds to the circuit connection point of single layer wiring board, then carries out ultraviolet irradiation to insulated hole and is formed with primary solidification,
Then, the electric conductor that height is lower than insulated hole is formed in insulated hole.It, can be using spot gluing equipment preparation insulation in this scheme
Hole is forming the electric conductor for being highly lower than insulated hole using techniques such as plating, change plating, deposition, attachments in insulated hole.
The device have the advantages that are as follows:
It is formed by the heat conduction structure that supporter and heat-conducting medium form and is packaged between wiring board, wiring board can be dissipated
Internal heat since wiring board of the invention is small in size is more conducive to that other sinking paths is cooperated to reach preferably heat dissipation effect
Fruit；Heat conduction structure complexity is low, and manufacturing cost is low, is conducive to widespread adoption, is adapted to multi-field radiating requirements；Heat transfer
Configuration of the addition of structure based on existing line plate does not increase the design cost of wiring board without redesigning circuit；
The preparation method of wiring board with heat conduction structure is easy to operate, and the wiring board being prepared has very strong dissipate
Thermal characteristics.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to do simply to introduce, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art, can be with root under the premise of not making the creative labor
Other accompanying drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram with the wiring board of heat conduction structure；
Fig. 2 is the radiating principle schematic diagram of heat conduction structure；
Fig. 3 is another structural schematic diagram with the wiring board of heat conduction structure；
Fig. 4 is in wiring board preparation process, glue hole, the state of electric conductor and upper layer circuit plate and upper layer circuit plate
Pressed status schematic diagram；
Fig. 5 is the flow diagram of wiring board preparation method；
Fig. 6 is the cross-sectional view of existing line plate；
Fig. 7 is another flow diagram of wiring board preparation method.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, with reference to the accompanying drawings and embodiments to this
Invention is described in further detail.It should be appreciated that the specific embodiments described herein are only used to explain the present invention,
And the scope of protection of the present invention is not limited.
The fever for the component installed on existing line plate and wiring board is uneven on region, will lead to high-temperature region with
The temperature difference of low-temperature space is larger, and the poor board substrate of thermal conductivity hinders the transfer and diverging of heat.To solve this problem,
Present embodiments provide a kind of wiring board with heat conduction structure.
As shown in Figure 1, the wiring board 100 with heat conduction structure that embodiment provides includes upper layer circuit plate 101, lower layer
Wiring board 102, the route 103 on upper layer circuit plate 101, lower sandwich circuit board 102, both ends support are adjacent to upper layer circuit plate
101 and lower sandwich circuit board 102 at least one supporter 104, be uniformly filled in upper layer circuit plate 101 and lower sandwich circuit board 102
Between heat-conducting medium 105, wherein supporter includes insulated hole 1041 and the electric conductor 1042 that is mounted in insulated hole.
It is worth noting that, the upper and lower in upper layer circuit plate and lower sandwich circuit board are the restrictions of relative position, because
This upper layer circuit plate and lower sandwich circuit board are relative concepts, when one by three layers of single layer route board group at multilayer circuit board when,
For top layer single layer wiring board, the lower sandwich circuit board that middle single-layer wiring board is, for bottom single layer wiring board, in
Between single layer wiring board be upper layer circuit plate.
Upper layer circuit plate 101 and lower sandwich circuit board 102 are fixed by the support of supporter 104, can be in upper layer circuit plate 101
A gap is formed between lower sandwich circuit board 102,105 uniformly dispersing of heat-conducting medium is full of in this gap, with 104 shape of supporter
At heat conduction structure, the heat that such wiring board generates can be fast from higher temperatures block transitive to heat-conducting medium, then through heat-conducting medium
It is transferred to and is distributed compared with low-temperature space fastly, relatively uniform wiring board is distributed with formation temperature, and then realize the heat dissipation of wiring board, such as
Shown in Fig. 2.
Insulated hole 1041 is used to support upper layer circuit plate 101 and lower sandwich circuit board 102, carries heat-conducting medium 105 to be formed
Interlayer interval, meanwhile, insulated hole 1041 is also used to completely cut off heat-conducting medium 105 and electric conductor 1042, prevent electric conductor 1042 leak
Electricity has an impact heat-conducting medium 105, while heat-conducting medium 105 also being avoided to damage electric conductor 1042.
Insulated hole 1041 can be the hollow cylinder or other column structures that height is 10~1000 μm.It is thermally conductive under the height
The thickness of multilayer circuit board will not be not only dramatically increased in medium 105, but also enough by upper layer circuit plate 101 and lower sandwich circuit
The heat transfer of plate 102 is realized using the heat dissipation of the large area of heat-conducting medium 105 to upper layer circuit plate into heat-conducting medium 105
101 and lower sandwich circuit board 102 heat dissipation.
Insulated hole 1041 can be selected as wiring board casting glue material.Glue hole is prepared as insulated hole using wiring board casting glue
1041, while using casting glue bonding effect, the insulating effect of casting glue is also dexterously utilized, is provided for electric conductor 1042
A kind of enclosed environment, electric conductor 1042 and heat-conducting medium 105 is isolated.
Electric conductor 1042 is supported between upper layer circuit plate 101 and lower sandwich circuit board 102, without changing existing line plate
Configuration under conditions of, it can realize upper layer and lower layer wiring board conduction, that is, be connected to different pcb layers, expand
The application environment of heat conduction structure does not increase the design cost of wiring board, and electric conductor is generally rigid structure, realizes the same of conduction
When, additionally it is possible to two wiring boards up and down are supported, make to form cavity between wiring board up and down, to fill heat-conducting medium.
Electric conductor 1042 can be conductive metal, such as gold, silver, copper, iron, molybdenum, tungsten, comprehensively consider electric conductivity, cost with
And after intensity, electric conductor 1042 can be the copper electric conductor with certain shapes, which is formed and insulate
The identical shape and structure of 1041 inner space of hole, to adapt to insulated hole 1041, which also has certain other than conduction
Intensity, it is sufficient to support fixed upper layer and lower layer wiring board.Electric conductor 1042 can also be the structure formed by organic conductive material,
Such as the above-mentioned shape and structure made of conductive polyacetylene.
In another embodiment, supporter 104 is an electric conductor.The electric conductor directly with upper layer and lower layer wiring board
Circuit connection point at, can be realized stablize, the conduction of reliable upper layer and lower layer wiring board.During preparation, in order to limit
The fixation position of conductive body, electric conductor have been surrounded by the insulated hole of position-limiting action, and insulated hole height is lower than electric conductor.At this point,
When upper layer circuit plate is attached above supporter, wiring board first with conductive body contact so that between electric conductor and wiring board
Conductive connection more reliably and intuitively.In this embodiment, since electric conductor is higher than insulated hole, so that electric conductor is higher than insulation
The part in hole can be exposed in heat-conducting medium, and heat-conducting medium needs are insulation, show inert material to electric conductor at this time, such as be had
There is the heat-conducting glue of curing characteristics.
Specifically, supporter 104 may be mounted at and route on-board circuitry tie point corresponding position, such electric conductor
1042 just directly contact with circuit connection point (namely electric contact), and to realize the conducting of electric current, such conduction is more steady
It is fixed reliable.In addition, not increasing the design cost of wiring board without the configuration for changing existing line plate in this way.Supporter 104
It can also uniformly be mounted between upper layer circuit plate 101 and lower sandwich circuit board 102, to improve the structural stability of wiring board.
Specifically, as shown in figure 3, the corresponding position of upper layer circuit plate 101 and lower sandwich circuit board 102 is equipped at least a pair
Connecting hole 301, connecting hole 301 are the through-hole for being pre-set at wiring board, it is internal have route and extend outward using as
The channel of connection line plate upper and lower surface circuit, insulated hole 1041 are pasted in such a way that its center is aligned with 301 center of connecting hole
It is fixed on upper layer circuit plate 101 and lower sandwich circuit board 102, electric conductor 1042 is also cross a pair of of connecting hole 301 and insulated hole
1041, and it is fitted and connected 301 land of hole, realize the support fixation to upper layer circuit plate 101 and lower sandwich circuit board 102 and electricity
Connection.The support of upper layer and lower layer wiring board is fixed in this way, electric conductor 1042 can more consolidate.On this basis, connecting hole 301 is gone back
Can be set to upper layer circuit plate 101 and lower sandwich circuit board 102 on route at, due to electric conductor 1042 directly with connect hole surface
It is fitted and connected, the circuit on such upper layer and lower layer wiring board can be directly connected by electric conductor.
Heat-conducting medium 105 can be for high thermal conductivity coefficient, low-expansion liquid thermal conductivity media, such as conduction oil.Liquid
Body heat-conducting medium has certain mobility, the filling of heat-conducting medium when facilitating preparation, in addition, the temperature difference in different temperatures area can be
Convection current is generated inside liquid thermal conductivity media, to accelerate the thermal conduction rate between height warm area, to accelerate the heat dissipation of wiring board.
Heat-conducting medium 105 can also be the heat-conducting glue with curing characteristics, the characteristic of heat-conducting glue be with cementability with
Curability, once molding, so that heat conduction structure stability is strong, and then also increases the structural stability of multilayer circuit board.Institute
Stating heat-conducting glue is preferably to have to match thermal expansion coefficient (CTE) with route plate, to reduce in solidification and after solidification because heat is swollen
The structural deformation of swollen generation.For example, optionally there are various epoxy-modified heat-conducting glues, have identical as most route plates
Material of main part, can preferably reduce thermal expansion generate structural deformation.
For multilayer circuit board, above-mentioned heat conduction structure may be mounted at any two adjacent single-layer wire road in multilayer circuit board
Between plate or between multiple single layer wiring boards, the size and installation site of above-mentioned heat conduction structure can be arbitrary, herein not
It is restricted.
Another embodiment additionally provides the preparation method of the above-mentioned wiring board with heat conduction structure, specifically include with
Lower step:
S101, spot gluing equipment, which is tentatively generated insulated hole and adhered to and pushed with bottom surface, to be fixed on single layer wiring board, insulation
The adhesion locations in hole correspond to the circuit connection point of single layer wiring board, then carry out thermosetting or ultraviolet irradiation with primary solidification at
Type can guarantee the isolation inside and outside insulated hole by pushing insulated hole to improve the adhesive strength with single layer wiring board in the step
Property；
S102 forms the electric conductor that height is lower than insulated hole, the height of electric conductor by techniques such as plating in insulated hole
It may insure the external side of the complete coated with conductive of insulated hole lower than insulated hole；
S103, another single layer wiring board are set in insulated hole in parallel, by insulated hole top surface it is Nian Jie with insulated hole after and quilt
It pushes, to guarantee the electrical contact of internal current conductor and two sandwich circuit boards, then carrying out curing operation again, this is exhausted with final molding
Marginal pore；
S104 is sealed the outer edge of two sandwich circuit boards, makes to form the chamber for having feed inlet between two sandwich circuit boards
Body, heat-conducting medium are had one's bosom filled with through feed inlet filling after body, and sealed feed inlet is to obtain the wiring board with single layer heat conduction structure；
S105 repeats S101~S104, can obtain the multilayer circuit board with multi-layer heat-transfer structure.
As shown in figure 4, the craft precision due to glue hole forming limits, the top surface of the insulated hole is difficult to realize higher flat
Whole degree, thus will appear the surface of fluctuating, and influence the leakproofness of insulated hole.In the present invention, the average roughness of insulated hole top surface
Degree is a, while electric conductor top surface for b is entirely insulated hole institute with the side wall for ensuring electric conductor lower than the distance of insulated hole top surface
Cladding prevents electric conductor from generating short circuit, rust due to the contact with heat-conducting medium to guarantee the isolation of electric conductor and heat-conducting medium
It the problems such as erosion, and ensure the electrical connection between electric conductor top surface and single layer wiring board, needs to make b > a, therefore, in S103 need pair
Upper layer circuit plate pushes, and volume under pressure is minimum (b+a/2), at this point, electric conductor is directly contacted with wiring board, and is insulated completely
Hole is sealed.
In the wiring board with single layer heat conduction structure that this method is prepared, electric conductor and circuit connection point are (also
It is electric contact) directly contact, to realize the conducting of electric current, such conduction is more reliable and more stable.Further, since electric conductor is direct
It is arranged on existing circuit connection point, in this way without the configuration for changing existing line plate, does not increase the design of wiring board
Cost.
In another embodiment, electric conductor can be through single layer wiring board to connect multilayer circuit board, therefore, upper
On the basis of stating S101~S105, as shown in figure 5, the preparation method of wiring board includes:
S201 is pre-formed opposite multipair connecting hole on upper and lower sandwich circuit board；
S202, using S101 lower sandwich circuit board connection hole fabrication and installation insulated hole；
S203, use S103 by upper layer circuit plate by connecting hole alignment in a manner of pressing in insulated hole；
S204, using gap filling heat-conducting medium of the S104 between upper and lower sandwich circuit board；
S205, the plated conductive body in connecting hole and insulated hole obtain the wiring board with single layer heat conduction structure.
In the wiring board with single layer heat conduction structure that this method is prepared, electric conductor is by connecting hole through simultaneously electricity
Multiple single layer wiring boards are connected, and play the fixed effect of support.
In another embodiment, above-mentioned supporter can also prepare in advance, optionally, in existing conductance
After external side is wrapped to form insulating layer by encapsulated technique, then according to the height dimension of required supporter it is cut into multistage supporter,
Supporter is pasted on single layer route on-board circuitry tie point corresponding position later, tool is then prepared using S103~S105
There is the multilayer circuit board of multi-layer heat-transfer structure.Since supporter obtains to be previously prepared, wiring board preparation can simplify
The preparation section of method.
Existing line plate sectional structure on every sandwich circuit board as shown in fig. 6, making route and hole and successively pressing, formation
Complicated Wiring structure has connection surface layer with internal blind hole 601, connect the buried via hole 602 of inner layers and through whole
The through-hole 603 of plate.
In another embodiment, as shown in fig. 7, the preparation method packet of the above-mentioned wiring board with heat conduction structure
It includes:
S301 coats one layer of thermosetting or the solid heat-conducting medium of light on first line plate, and the second wiring board is attached to
On heat-conducting medium, after heat-treated or lighting process, a sandwich plate is formed；
S302 makes through-hole at interlayer on-board circuitry tie point, using plating mode in forming electric conductor in through-hole, with
Obtain the wiring board with heat conduction structure.
It can be made at interlayer on-board circuitry tie point by the way of machine drilling, laser-induced thermal etching or chemical etching logical
The position in hole, hole need to meet cabling requirement.
S303 repeats S301 and S302, by the arrangement that can obtain different through-holes in single layer punching.
When making multilayer circuit board, first each single layer wiring board make buried via hole, then again in whole plate according to S301~
S303 obtains the through-hole of different arrangements.
In above-described embodiment, in order to ensure being electrically connected between sandwich circuit board and electric conductor, can also top plate with lead
After electric body contact, make sandwich circuit board connection integrated with electric conductor using modes such as ultrasonic bonds.Wherein, ultrasonic bond refers to logical
Crossing ultrasonic wave makes the surface for being bonded both objects interpenetrate, so that the two steadily combines.
The preparation method of the wiring board with heat conduction structure is easy to operate, and process flow is shorter.
Technical solution of the present invention and beneficial effect is described in detail in above-described specific embodiment, Ying Li
Solution is not intended to restrict the invention the foregoing is merely presently most preferred embodiment of the invention, all in principle model of the invention
Interior done any modification, supplementary, and equivalent replacement etc. are enclosed, should all be included in the protection scope of the present invention.
Claims (15)
1. a kind of wiring board with heat conduction structure, including multilayer circuit board, which is characterized in that between every adjacent two layers wiring board
At least one supporter is installed, makes to form cavity between two sandwich circuit boards, heat-conducting medium, thermally conductive Jie are filled in the cavity
Matter and supporter form heat conduction structure.
2. as described in claim 1 with the wiring board of heat conduction structure, which is characterized in that the supporter has included insulation
With the insulated hole of buffer action, the electric conductor being installed in insulated hole.
3. as described in claim 1 with the wiring board of heat conduction structure, which is characterized in that the supporter includes conduction
Body.
4. as claimed in claim 3 with the wiring board of heat conduction structure, which is characterized in that the electric conductor has been surrounded by limit
The insulated hole of position effect, the insulated hole height are lower than the electric conductor.
5. the wiring board as claimed in claim 2 or 4 with heat conduction structure, which is characterized in that the insulated hole is glue material
The glue hole of composition.
6. the wiring board as claimed in claim 2 or 4 with heat conduction structure, which is characterized in that the height of the insulated hole
It is 10~1000 μm.
7. as claimed in claim 2 or claim 3 with the wiring board of heat conduction structure, which is characterized in that the electric conductor is metal
Material, or the structure formed by organic conductive material.
8. as claimed in claim 2 or claim 3 with the wiring board of heat conduction structure, which is characterized in that the above table of supporter
Face or lower surface, which attach, to be mounted at the circuit connection point of PCB surface.
9. as claimed in claim 2 or claim 3 with the wiring board of heat conduction structure, which is characterized in that upper layer and lower layer wiring board
Corresponding position is equipped at least a pair of of connecting hole, and the connecting hole is the through-hole for being pre-set at wiring board, internal to have route
And extend outward using the channel as connection line plate upper and lower surface circuit, the insulated hole is with its center and connecting hole center
The mode of alignment is set on wiring board, and electric conductor connects the connecting hole and insulated hole, and fits in the land of connecting hole,
Realize the support fixation and electrical connection to upper layer and lower layer wiring board.
10. as claimed in claim 9 with the wiring board of heat conduction structure, which is characterized in that the connecting hole is respectively arranged on
On upper layer and lower layer wiring board at corresponding line node.
11. as described in claim 1 with heat conduction structure wiring board, which is characterized in that the heat-conducting medium be with
High thermal conductivity coefficient, low-expansion liquid thermal conductivity media, or there is curing characteristics, high thermal conductivity coefficient, low-expansion lead
Hot glue.
12. as claimed in claim 11 with the wiring board of heat conduction structure, which is characterized in that the liquid thermal conductivity media is
Conduction oil.
13. a kind of preparation method of the described in any item wiring boards with heat conduction structure of claim 2~12, including it is following
Step:
(1) supporter is prepared at the circuit connection point on single layer wiring board；
(2) another single layer wiring board is set in insulated hole in the mode parallel with single layer wiring board in step (1), viscous with insulated hole
It after connecing and is pressed down, guarantees that internal current conductor is contacted with two sandwich circuit boards, then solidify insulated hole；
(3) outer edge of two sandwich circuit boards is sealed, makes to form the cavity for having feed inlet between two sandwich circuit boards, it is thermally conductive
Medium is had one's bosom filled with through feed inlet filling after body, and sealed feed inlet obtains the wiring board with heat conduction structure.
14. the preparation method of the wiring board with heat conduction structure as claimed in claim 13, which is characterized in that step (1)
In, electric conductor is prepared, insulating layer is wrapped up on the outside of electric conductor, is then cut out to form multistage supporter, and supporter is adhered to
In single layer route on-board circuitry tie point corresponding position.
15. the preparation method of the wiring board with heat conduction structure as claimed in claim 13, which is characterized in that step (1)
In, insulated hole is generated, and insulated hole stickup is fixed on single layer wiring board, the paste position of insulated hole corresponds to single layer route
The circuit connection point of plate is then carried out ultraviolet irradiation to insulated hole and is formed with primary solidification, then, height is formed in insulated hole
Lower than the electric conductor of insulated hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811434815.5A CN109348616B (en) | 2018-11-28 | 2018-11-28 | Circuit board with heat conduction structure and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811434815.5A CN109348616B (en) | 2018-11-28 | 2018-11-28 | Circuit board with heat conduction structure and manufacturing method thereof |
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| US11470713B2 (en) | 2020-09-21 | 2022-10-11 | Avary Holding (Shenzhen) Co., Limited. | Circuit board with heat dissipation structure and method for manufacturing same |
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|---|---|
| CN109348616B (en) | 2024-09-03 |
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