CN111093320A - Preparation method of metal heat-dissipation double-sided circuit board - Google Patents
Preparation method of metal heat-dissipation double-sided circuit board Download PDFInfo
- Publication number
- CN111093320A CN111093320A CN201911390562.0A CN201911390562A CN111093320A CN 111093320 A CN111093320 A CN 111093320A CN 201911390562 A CN201911390562 A CN 201911390562A CN 111093320 A CN111093320 A CN 111093320A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- conductive
- metal plate
- hole
- opposite surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a preparation method of a metal heat-dissipation double-sided circuit board, which comprises the following steps: forming a through hole penetrating through the metal plate at a preset position of the flat metal plate; manufacturing heat conduction bosses on two opposite sides of the metal plate; placing prepregs and insulating core plates with copper foil layers on the outer surfaces in sequence on two sides of the metal plate, wherein the prepregs and the insulating core plates are provided with windows for the heat conduction bosses to penetrate through; hot pressing, so that the prepreg is solidified to connect the insulating core board and the metal plate, the prepreg fills the insulating hole, and the surfaces of the copper foil layer and the heat conducting boss are flush; manufacturing a conductive through hole penetrating through the circuit board at a position corresponding to the through hole on the circuit board, wherein the diameter of the conductive through hole is smaller than that of the through hole; conductive circuits and device heat conduction pads are manufactured on two opposite surfaces of the circuit board, and the conductive circuits on the two opposite surfaces of the circuit board are electrically connected through the conductive through holes. The preparation method has the advantages of simple process and low manufacturing cost.
Description
Technical Field
The present invention relates to the field of printed circuit boards; and more particularly, to a method of manufacturing a circuit board.
Background
Power semiconductor devices such as LEDs (light emitting diodes), MOSFETs (power field effect transistors), IGBTs (insulated gate bipolar transistors) and the like generally have a circuit board as a mounting carrier, and the circuit board as the mounting carrier is required to have good heat conductivity because the power semiconductor devices generate a large amount of heat during operation.
Chinese patent application CN201110031935.2 discloses a method for manufacturing a double-layer high heat dissipation sandwich metal-based printed circuit board, in which a copper-based or aluminum-based heat dissipation plate is disposed at the core of an insulating substrate to form a "sandwich metal circuit board, so as to utilize the copper-based or aluminum-based heat dissipation plate to enhance the heat dissipation performance of the circuit board. However, since the copper-based or aluminum-based heat dissipation plate is disposed in the core portion of the insulating substrate, the power semiconductor device mounted on the insulating substrate cannot be directly connected to the copper-based or aluminum-based heat dissipation plate, and therefore the heat dissipation performance of the circuit board is still to be further improved.
Chinese patent application CN201110139947.7 discloses a method for preparing a printed circuit board with a metal micro-radiator, which comprises the steps of preparing a metal bottom layer and a metal micro-radiator which are connected into a whole, and combining a conventional printed circuit board with the metal bottom layer and the metal micro-radiator into a whole; the power semiconductor device is arranged on the surface of the metal micro radiator, and heat emitted during working can be conducted to the metal bottom layer through the metal micro radiator and then conducted to the outside of the printed circuit board through the metal bottom layer, so that the problem of heat conduction between the power semiconductor device and the metal plate is effectively solved. However, the circuit board obtained by the preparation method can only be provided with a power device on one side, and is more limited in application occasions.
Disclosure of Invention
In view of the shortcomings of the prior art, the main object of the present invention is to provide a method for manufacturing a circuit board, which can be performed efficiently and at low cost, and which can not only mount semiconductor devices on both sides of the circuit board, but also have good heat dissipation performance.
In order to achieve the main purpose, the invention provides a preparation method of a metal heat-dissipation double-sided circuit board, which comprises the following steps:
forming a through hole penetrating through the metal plate at a preset position of the flat metal plate;
manufacturing heat conduction bosses on two opposite sides of the metal plate;
sequentially placing prepregs and insulating core plates with copper foil layers on the outer surfaces on two sides of the metal plate; the prepreg and the insulating core board are provided with windows for the heat conduction bosses to pass through;
hot pressing, so that the prepreg is solidified to connect the insulating core plate and the metal plate, the prepreg fills the through hole, and the surfaces of the copper foil layer and the heat conduction boss are flush;
manufacturing a conductive through hole penetrating through the circuit board at a position corresponding to the through hole on the circuit board obtained by hot pressing, wherein the diameter of the conductive through hole is smaller than that of the through hole;
manufacturing a conductive circuit and a device heat conduction bonding pad on two opposite surfaces of the circuit board; the conductive circuits on the two opposite surfaces of the circuit board are electrically connected through the conductive through holes, and the device heat conduction bonding pad is directly connected with the heat conduction boss.
According to the technical scheme, when the prepreg and the insulating core plate are hot-pressed, the through hole of the metal plate is filled with the prepreg, and a step of filling the hole in the through hole with resin is not required to be additionally carried out, so that the preparation process of the circuit board is simplified, and the method can be carried out efficiently at low cost.
Conductive circuits electrically connected through the conductive through holes are manufactured on two opposite surfaces of the circuit board, so that semiconductor devices can be mounted on the two surfaces of the circuit board, and the circuit board is also beneficial to miniaturization; the device heat conduction pad is directly connected with the heat conduction boss, and heat generated by the power device arranged on the device heat conduction pad during working can be quickly diffused through the heat conduction boss and the metal plate, so that the circuit board has good heat conduction performance.
According to an embodiment of the present invention, two opposite surfaces of the metal plate are etched to fabricate the heat conductive bosses on two opposite sides of the metal plate.
According to another embodiment of the present invention, metal heat-conducting blocks are welded to both opposite surfaces of a metal plate to make heat-conducting bosses on opposite sides of the metal plate.
According to one embodiment of the present invention, the conductive via includes a conductive ring and a resin filled in the conductive ring, and the step of forming the conductive via includes:
forming an insulation hole penetrating through the circuit board at a position corresponding to the through hole on the circuit board, wherein the diameter of the insulation hole is smaller than that of the through hole;
forming a conductive ring on the entire inner wall of the insulating hole;
and filling resin in the conductive ring by a resin hole filling process.
Preferably, the step of manufacturing the conductive via further includes the step of grinding two opposite surfaces of the circuit board after filling the conductive ring with resin.
According to a more specific embodiment of the present invention, a first copper-clad layer connected to a conductive ring is formed on two opposite surfaces of a circuit board while the conductive ring is formed; after the resin is filled into the conductive ring, the copper foil layers and the first copper-clad layers on the two opposite surfaces of the circuit board are etched, so that conductive circuits and device heat-conducting bonding pads are manufactured on the two opposite surfaces of the circuit board.
According to another more specific embodiment of the present invention, the conductive ring is formed while forming the first copper clad layers connected to the conductive ring on two opposite surfaces of the circuit board; after filling resin into the conductive ring, forming second copper-clad layers on two opposite surfaces of the circuit board; and etching the copper foil layers, the first copper-clad layers and the second copper-clad layers on the two opposite surfaces of the circuit board so as to manufacture conductive circuits and device heat-conducting bonding pads on the two opposite surfaces of the circuit board.
In a preferred embodiment of the present invention, the metal plate is a copper substrate, and the heights of the heat conducting bosses on two opposite surfaces of the copper substrate are the same; and etching two opposite surfaces of the copper substrate to manufacture the heat conduction boss. Alternatively, the metal plate is an aluminum substrate; the heat conducting bosses of the two opposite surfaces of the metal plate have different heights and/or shapes.
In a preferred embodiment of the present invention, the device thermal pad is formed to completely cover the thermal conductive boss to promote minimization of thermal resistance therebetween.
The circuit board preparation method can also comprise other steps, such as a step of manufacturing solder masks on two opposite surfaces of the circuit board, wherein the solder masks are configured to expose the conductive pads in the conductive circuit and the device heat conduction pads.
To more clearly illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and detailed description.
Drawings
FIG. 1 is a schematic structural diagram of a through hole formed in a flat metal plate according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a method of manufacturing a metal plate according to an embodiment of the present invention, in which heat-conducting bosses are formed on two opposite surface sides of the metal plate;
FIG. 3 is a schematic structural view showing an embodiment of a method for manufacturing a prepreg according to the present invention, in which prepregs and an insulating core board are stacked on both opposite surface sides of a metal plate;
FIG. 4 is a schematic structural diagram of a circuit board after a hot-pressing step according to an embodiment of the manufacturing method of the present invention;
FIG. 5 is a schematic structural diagram of an embodiment of a manufacturing method of the present invention for forming an insulation hole penetrating a circuit board;
FIG. 6 is a schematic structural diagram of a conductive ring formed on the inner wall of the insulating hole and a first copper-clad layer formed on two opposite surfaces of the circuit board according to the embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a conductive ring filled with resin according to an embodiment of the present invention;
FIG. 8 is a schematic structural view of a second copper-clad layer formed on two opposite surfaces of a circuit board after resin is filled into holes according to an embodiment of the method of the present invention;
FIG. 9 is a schematic structural diagram of a method for manufacturing a circuit board according to an embodiment of the present invention, in which conductive traces and device heat-conducting pads are formed on two opposite surfaces of the circuit board;
fig. 10 is a schematic structural diagram of a solder resist layer manufactured by an embodiment of the manufacturing method of the present invention.
Detailed Description
The manufacturing method of the present invention includes a step of forming a through-hole penetrating a flat metal plate at a predetermined position of the metal plate. As an example of this step, referring to fig. 1, a through hole 111 penetrating through the metal plate 11 is formed at a predetermined position of the flat metal plate 11 by, for example, a mechanical drilling or laser drilling process; among them, the metal plate 11 is preferably a copper substrate. It should be noted that the two through holes 111 in fig. 1 are only schematic representations, and the number of the through holes 111 may be set as needed.
The preparation method comprises the steps of manufacturing heat conduction bosses on two opposite sides of a metal plate; preferably, the metal plate is etched on opposite surfaces thereof to form heat conductive bosses on opposite sides of the metal plate. For example, referring to fig. 2, the heat conductive bumps 112 are formed by etching two opposite surfaces of the flat metal plate 11, wherein the heights of the heat conductive bumps 112 on the two opposite surfaces of the metal plate 11 are the same. In other embodiments of the present invention, the metal heat-conducting blocks may also be welded to two opposite surfaces of the metal plate, so as to form heat-conducting bosses on two opposite sides of the metal plate. In the present invention, the height and/or shape of the heat conductive bosses 112 of the two opposite surfaces of the metal plate 11 may be the same or different.
The preparation method comprises the step of sequentially placing the prepreg and the insulating core board on two sides of the metal plate. As shown in fig. 3, a prepreg 21 and an insulating core board 31 having a copper foil layer 321 on the outer surface are sequentially placed on both sides of the metal plate 11; the prepreg 21 and the insulating core 31 have a window through which the heat conducting boss 112 passes, and a gap is formed between the heat conducting boss 112 and the window. It should be noted that the number of stacked prepregs 21 may be set as required, and is not necessarily only one prepreg as shown in fig. 3.
The preparation method comprises the step of carrying out hot pressing on the prepregs and the insulating core plates on the two sides of the metal plate. Referring to fig. 4, the semi-cured sheet 21 is cured after the hot pressing to connect the insulating core 31 and the metal plate 11, and the semi-cured sheet 21 flows to fill the through hole 111, and the surfaces of the copper foil layer 321 and the heat conductive bump 112 are flush. Preferably, the two opposite surfaces of the circuit board are ground after the hot pressing.
The preparation method comprises the step of manufacturing a conductive through hole penetrating through the circuit board at a position corresponding to the through hole on the circuit board obtained by hot pressing, wherein the diameter of the conductive through hole is smaller than that of the through hole. In the present invention, an example of the conductive via includes a conductive ring 42 and a resin 43 filled in the conductive ring 42, and the step of forming the conductive via includes: first, as shown in fig. 5, laser drilling or mechanical drilling is performed on the circuit board at a position corresponding to the through hole 111 to fabricate an insulation hole 41 penetrating the circuit board, wherein the diameter of the insulation hole 41 is smaller than that of the through hole 11; then, as shown in fig. 6, a conductive copper ring 42 is formed on the entire inner wall of the insulating hole 41 by electroless plating or electroless plating followed by electroplating; next, as shown in fig. 7, the conductive ring 42 is filled with resin 43 by a resin plug process. Preferably, after filling the conductive ring 42 with the resin 43, the opposite surfaces of the circuit board are ground again.
With continued reference to fig. 6, while the conductive ring 42 is formed, the first copper-clad layer 322 connected to the conductive ring 42 is formed on two opposite surfaces of the circuit board, and the first copper-clad layer 322 covers the copper foil layer 321 and the surfaces of the heat-conductive bumps 112 (i.e., the circuit board is subjected to full-sheet electroplating). Referring to fig. 8, the method of manufacturing the present invention further includes a step of forming a second copper-clad layer 323 covering the first copper-clad layer 322 and the resin 43 on two opposite surfaces of the circuit board after filling the resin 43 into the conductive ring 42.
The preparation method comprises the step of manufacturing a conductive circuit and a device heat conduction bonding pad on two opposite surfaces of a circuit board. As shown in fig. 9, the copper foil layer 321, the first copper-clad layer 322 and the second copper-clad layer 323 on two opposite surfaces of the circuit board are etched to form a conductive trace 3202 and a device thermal pad 3201 on the two opposite surfaces of the circuit board. The conductive traces 3202 are formed on the insulating core board 31, and the conductive traces 3202 on two opposite surfaces of the circuit board are electrically connected through conductive vias; the device heat conductive pad 3201 is directly connected to the heat conductive land 112, and the device heat conductive pad 3201 is formed to completely cover the heat conductive land 112. As shown in fig. 10, conductive line 3202 includes conductive pad 3203 formed on the conductive via.
It will be readily appreciated that when it is not necessary to form conductive pads at the conductive via locations, it may not be necessary to form second copper-clad layers on opposite surfaces of the circuit board covering the first copper-clad layers and the resin. That is, when the conductive pad is not required to be formed at the position of the conductive via, the copper foil layers and the first copper-clad layers on the two opposite surfaces of the circuit board may be etched to form the conductive circuit and the device heat-conducting pad on the two opposite surfaces of the circuit board.
The preparation method embodiment of the invention also comprises the step of manufacturing solder mask layers on two opposite surfaces of the circuit board. Referring to fig. 10, solder resist layer 50 is configured to expose device thermal pads 3201 and electrically conductive pads 3203 in electrically conductive traces 3202. The manufacturing method of the present invention may further include a step of forming a metal protection layer (e.g., a nickel/palladium/gold composite film) on the surfaces of the heat conductive pad 3201 and the electric conductive pad 3203.
Although the present invention has been described with reference to specific embodiments, these embodiments are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that various changes/substitutions may be made without departing from the scope of the invention, and it is intended that all equivalent changes and modifications made in accordance with the present invention shall be embraced by the scope of the invention.
Claims (10)
1. A preparation method of a metal heat-dissipation double-sided circuit board comprises the following steps:
forming a through hole penetrating through the metal plate at a preset position of the flat metal plate;
manufacturing heat conduction bosses on two opposite sides of the metal plate;
sequentially placing prepregs and insulating core plates with copper foil layers on the outer surfaces on two sides of the metal plate; the prepreg and the insulating core board are provided with windows for the heat conduction bosses to penetrate through;
hot pressing, so that the prepreg is solidified to connect the insulating core board and the metal plate, the prepreg fills the through hole, and the surfaces of the copper foil layer and the heat conduction boss are flush;
manufacturing a conductive through hole penetrating through the circuit board at a position corresponding to the through hole on the circuit board obtained by hot pressing, wherein the diameter of the conductive through hole is smaller than that of the through hole;
manufacturing a conductive circuit and a device heat conduction bonding pad on two opposite surfaces of the circuit board; the conductive circuits on two opposite surfaces of the circuit board are electrically connected through the conductive through holes, and the device heat conduction bonding pad is directly connected with the heat conduction boss.
2. The manufacturing method of claim 1, wherein both opposite surfaces of the metal plate are etched to fabricate the heat conductive bosses on opposite sides of the metal plate.
3. The manufacturing method of claim 1, wherein metal heat-conducting blocks are welded to both opposite surfaces of the metal plate to fabricate the heat-conducting bosses on opposite sides of the metal plate.
4. The method of claim 1, wherein the conductive via comprises a conductive ring and a resin filled in the conductive ring, and the step of forming the conductive via comprises:
forming an insulation hole penetrating through the circuit board at a position corresponding to the through hole on the circuit board, wherein the diameter of the insulation hole is smaller than that of the through hole;
forming the conductive ring on the entire inner wall of the insulating hole;
and filling the resin in the conductive ring by a resin hole plugging process.
5. The method of claim 4, wherein fabricating the conductive via further comprises grinding two opposing surfaces of a circuit board after filling the resin.
6. The production method according to claim 4, wherein the conductive ring is formed while a first copper-clad layer connected to the conductive ring is formed on both opposite surfaces of a circuit board; after the conductive ring is filled with the resin, the copper foil layers and the first copper-clad layers on the two opposite surfaces of the circuit board are etched, so that the conductive circuit and the device heat conduction bonding pad are manufactured on the two opposite surfaces of the circuit board.
7. The production method according to claim 4, wherein the conductive ring is formed while a first copper-clad layer connected to the conductive ring is formed on both opposite surfaces of a circuit board; after the resin is filled into the conductive ring, forming second copper-clad layers on two opposite surfaces of the circuit board; and etching the copper foil layers, the first copper-clad layers and the second copper-clad layers on the two opposite surfaces of the circuit board so as to manufacture the conductive circuit and the device heat-conducting bonding pad on the two opposite surfaces of the circuit board.
8. The manufacturing method according to claim 1, wherein the metal plate is a copper substrate, and the heights of the heat-conducting bosses on two opposite surfaces of the copper substrate are the same; and etching two opposite surfaces of the copper substrate to manufacture the heat conduction boss.
9. The manufacturing method of claim 1, wherein the device heat conduction pad is formed to entirely cover the heat conduction boss.
10. The method of manufacturing as claimed in claim 1, further comprising the step of forming solder masks on two opposing surfaces of the circuit board, the solder masks configured to expose the electrically conductive pads in the electrically conductive traces and the device thermally conductive pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911390562.0A CN111093320A (en) | 2019-12-30 | 2019-12-30 | Preparation method of metal heat-dissipation double-sided circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911390562.0A CN111093320A (en) | 2019-12-30 | 2019-12-30 | Preparation method of metal heat-dissipation double-sided circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111093320A true CN111093320A (en) | 2020-05-01 |
Family
ID=70397532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911390562.0A Pending CN111093320A (en) | 2019-12-30 | 2019-12-30 | Preparation method of metal heat-dissipation double-sided circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111093320A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112822876A (en) * | 2020-12-28 | 2021-05-18 | 广州广合科技股份有限公司 | Printed circuit board embedded with three-dimensional metal base and processing method thereof |
| CN114828458A (en) * | 2022-06-01 | 2022-07-29 | 深圳市深联电路有限公司 | Manufacturing method of double-faced boss copper-embedded plate, PCB and power battery |
-
2019
- 2019-12-30 CN CN201911390562.0A patent/CN111093320A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112822876A (en) * | 2020-12-28 | 2021-05-18 | 广州广合科技股份有限公司 | Printed circuit board embedded with three-dimensional metal base and processing method thereof |
| CN114828458A (en) * | 2022-06-01 | 2022-07-29 | 深圳市深联电路有限公司 | Manufacturing method of double-faced boss copper-embedded plate, PCB and power battery |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI569387B (en) | Method of making thermally enhanced wiring board having isolator incorporated therein | |
| US20140251658A1 (en) | Thermally enhanced wiring board with built-in heat sink and build-up circuitry | |
| KR100825451B1 (en) | Semiconductor package and method for producing the same | |
| TWI435666B (en) | Radiant heat circuit board and method for manufacturing the same | |
| CN107896421B (en) | PCB capable of fast radiating | |
| CN107896423B (en) | PCB capable of fast radiating | |
| CN111132476A (en) | Preparation method of double-sided circuit radiating substrate | |
| KR101181105B1 (en) | The radiant heat circuit board and the method for manufacturing the same | |
| US20110272179A1 (en) | Printed Circuit Board with Embossed Hollow Heatsink Pad | |
| JP2014165486A (en) | Power device module and manufacturing method thereof | |
| JP2006165299A (en) | Method of manufacturing printed circuit board | |
| JP4875925B2 (en) | Multilayer wiring board and manufacturing method thereof | |
| JP2006165299A5 (en) | ||
| CN111031687A (en) | Method for preparing heat dissipation circuit board | |
| US9345125B2 (en) | Wiring substrate | |
| CN111148353B (en) | Preparation method of circuit board with copper-based heat sink | |
| CN111093320A (en) | Preparation method of metal heat-dissipation double-sided circuit board | |
| KR101154644B1 (en) | The radiant heat circuit board and the method for manufacturing the same | |
| CN113825306B (en) | Circuit board and preparation method thereof | |
| JP2010062199A (en) | Circuit board | |
| JP5539453B2 (en) | Electronic component-mounted multilayer wiring board and manufacturing method thereof | |
| JP6119111B2 (en) | Circuit board, circuit board manufacturing method, electronic device, and electronic device manufacturing method | |
| CN110838475A (en) | Chip assembly and manufacturing method thereof | |
| JP2008243966A (en) | Printed circuit board mounted with electronic component and manufacturing method therefor | |
| CN114496808B (en) | Flip-chip plastic package assembly method, shielding system, heat dissipation system and application |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200501 |
|
| WD01 | Invention patent application deemed withdrawn after publication |