CN201487854U - High thermal conductivity LED lamp - Google Patents

High thermal conductivity LED lamp Download PDF

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Publication number
CN201487854U
CN201487854U CN2009201633631U CN200920163363U CN201487854U CN 201487854 U CN201487854 U CN 201487854U CN 2009201633631 U CN2009201633631 U CN 2009201633631U CN 200920163363 U CN200920163363 U CN 200920163363U CN 201487854 U CN201487854 U CN 201487854U
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high thermal
substrate
thermal conductivity
heat
led
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Expired - Fee Related
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CN2009201633631U
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Chinese (zh)
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庄育丰
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Individual
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Individual
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Abstract

The utility model relates to a high thermal conductivity LED lamp, which mainly comprises a substrate consisting of a high thermal conductivity ceramic material, wherein the substrate is directly provided with a pre-designed metallic circuit; the metallic circuit is provided with a preset number of LEDs and is connected with an external power supply; the other end of the substrate is provided with a heat dissipation layer if necessary; and when the LEDs are turned on, the heat generated by the LEDs can be conducted and dissipated by the high thermal conductivity substrate quickly or dissipated by the heat dissipation layer quickly. The high thermal conductivity LED lamp adopts the nonmetallic high thermal conductivity substrate capable of being provided with the circuit directly, and can overcome the defects of the prior art that a metal substrate is provided with an LED chip and adopts an insulating layer which influences the heat dissipation efficiency of the LED chip, if the insulating layer is too thick, the heat dissipation efficiency is poor, and if the insulating layer is too thin, the insulating efficiency is lost.

Description

High thermal conductance LED lamp
Technical field
The utility model belongs to high thermal conductance LED lamp technical field, provides illumination to use, and has splendid heat conduction, radiating effect, and directly the LED structure is loaded on non-metal base plate to simplify the LED assembling structure.
Background technology
At present, LED is the abbreviation of light emitting diode (Light-emitting Diode), it is the solid-state light emitting element that semi-conducting material is made, material uses III-V family's chemical element (as: gallium phosphide (GaP), GaAs (GaAs) etc.), principle of luminosity is to convert electrical energy into light, just compound semiconductor is applied electric current, (claim the hole again by electronics and electric hole, Electron hole) combination, superfluous energy can disengage with the form of light, reach luminous effect, it is luminous to belong to cold property, and the life-span reached more than 100,000 hours.The characteristics of LED maximum are: need not warm up the lamp time (idling time), reaction speed is fast, volume is little, power-saving, shatter-proof, pollute low, be fit to volume production, the tool high-reliability, the needs on the fit applications are made the element of minimum or array easily.But,, promptly be to utilize the chip energising because LED is a solid-state illumination, the quantum excite state is replied and is sent energy (light), and in luminous process, the light energy in the chip can not reach the external world fully, energy that can not bright dipping just can be absorbed in chip internal and packaging body, forms heat.The conversion efficiency that LED is general has only 10%~30% approximately, so the electricity of 1W only becomes the light that you can see less than 0.2W, other all is a heat, if do not dispel the heat, these accumulation of heat can cause damage to chip efficient and life-span.So will apply to the problem that lighting apparatus at first will solve heat radiation with high efficiency LED.
With LED heat radiation patent is example, the novel M314505 in Taiwan number " high-capacity LED bulb radiator structure " patent (patent announcement data reference on 06 21st, 2007), mainly be on a lamp holder, to be fixed with a substrate, the end face of this substrate is fixed with at least one heat pipe, sheathed two above fin and the top substrate of being fixed with of heat pipe, the end face of top substrate is provided with the high-capacity LED of corresponding heat pipe quantity, and the bottom surface bonding of this high-capacity LED is supported in the top of heat pipe.Novel M314433 number " the heat radiation module of light-emittingdiode encapsulation " patent in Taiwan (patent announcement data reference on 06 21st, 2007), this heat radiation module comprises: a led circuit plate; One radiating block comprises two above fin; And a thermal paste material, so as to directly fixing this led circuit plate on this radiating block; Wherein between this led circuit plate and this radiating block, do not have a metal substrate.I260798 number " high-radiating light-emitting diode " patent (patent announcement data reference on 08 21st, 2006) invented in Taiwan, comprises at least: a mushy material layer; One heat conduction layer is located at this mushy material laminar surface; And a chip, be located at this heat conduction layer, by this heat conduction layer the heat that this chip sent is conducted to this mushy material layer, and by this mushy material layer with this heat to flowing to the outside.By above patent as can be known the LED heat radiation of prior art mostly adopt metal fin, or in conjunction with modes such as heat pipe, cooling chip, soaking plate, radiator fans for it, have generally that radiating effect is not good, radiating rate inadequately rapidly, defectives such as complicated, the cost height of radiating module structure.And the structure of led chip dress mode is example (patent announcement data reference on 05 01st, 2007) with novel M311116 number " the printed circuit board arrangement improvement of the light-emittingdiode support plate " patent in Taiwan, and it includes: a substrate; One first insulating barrier, this first insulating barrier is stacking on the one side of aforesaid substrate; One bronze medal layer, this copper change on the one side of above-mentioned first insulating barrier layer by layer, and have second insulating barrier on this copper layer; And the top layer, this top layer changes on the one side of above-mentioned copper layer and is adjacent to a side of second insulating barrier; Wherein, this substrate can be aluminium sheet, aluminium flake.This patent is structure dress led chip on the aluminum metal substrate, because the substrate of structure dress is a metal material, so must be in the stacking insulating barrier of the one side of this substrate, but the setting of this insulating barrier will influence the heat dissipation of led chip, too thick heat dissipation is poor, the too thin insulation usefulness that loses again, this is the defective of this patent.This defective is exactly the greatest drawback that prior art exists, and this defective also becomes the difficult problem that industry is demanded urgently overcoming.
The utility model content
The present utility model people after constantly studying, improveing, has of the present utility model grinding to create successfully in view of the defective of prior art eventually, makes known publicly.
Therefore, main purpose of the present utility model is providing a kind of high thermal conductance LED lamp, mainly include the substrate that constitutes by High Thermal Conductivity Ceramic Materials, and on this substrate, directly be provided with in advance the metallic circuit of design, the LED of predetermined quantity is set on the metallic circuit, metallic circuit also links external power source, in the substrate other end heat dissipating layer is set in case of necessity, when lighting LED, the heat that LED produces can be conducted by high thermal conductive substrate rapidly, heat radiation, or dispel the heat rapidly by heat dissipating layer, the utility model adopts nonmetallic high thermal conductance substrate, circuit can directly be set on substrate, and the prior art of can forgoing is structure dress led chip on metal substrate, must adopt insulating barrier on metal substrate, and influence the heat dissipation of led chip, too thick heat dissipation is poor, and the too thin defective that loses insulation usefulness again has the effect of simplifying LED assembling structure and quick heat radiating.
The substrate that the aforementioned High Thermal Conductivity Ceramic Materials of the utility model constitutes by non-conductive and heat conduction, good heat dissipation effect nonmetallic materials constitute, and with: aluminium nitride AlN, carborundum SiC, beryllium oxide BeO, hexagonal boron nitride BN are good.
Description of drawings
Fig. 1 is the upright sectional view of the utility model embodiment group.
The main element symbol description:
1 substrate, 2 metallic circuits, 3LED, 4 heat dissipating layers.
The specific embodiment
For reaching the technological means of the aforementioned purpose of the utility model, enumerate an embodiment now, and conjunction with figs. explanation as after, can by to structure of the present utility model, feature and the effect reached, obtain better to understand.
At first, see also shown in Figure 1, the utility model mainly includes the substrate 1 that is made of High Thermal Conductivity Ceramic Materials as seen from the figure, and on this substrate 1, directly be provided with in advance the metallic circuit 2 of design, the LED3 of predetermined quantity is set on the metallic circuit 2, and the external power source that metallic circuit 2 can binding figure show is to provide required electric power, can hold in addition in substrate 1 in case of necessity heat dissipating layer 4 is set, improve radiating efficiency.When lighting LED, the heat that LED produces can be conducted by high thermal conductive substrate 1 and dispel the heat rapidly, or dispel the heat rapidly by heat dissipating layer 4, the utility model adopts nonmetallic high thermal conductance substrate 1, because 1 of substrate is as insulating materials, metallic circuit 2 can directly be set on substrate 1, the prior art of can forgoing is structure dress led chip on metal substrate, must be prior to adopting insulating barrier on the metal substrate, and influence the heat dissipation of led chip, too thick heat dissipation is poor, and the too thin defective that loses insulation usefulness again has the effect of simplifying LED assembling structure and quick heat radiating.
The substrate 1 that the aforementioned High Thermal Conductivity Ceramic Materials of the utility model constitutes is that the nonmetallic materials by non-conductive and heat conduction, good heat dissipation effect constitute, and with: aluminium nitride AlN, carborundum SiC, beryllium oxide BeO, hexagonal boron nitride BN are good.The mechanism of solid material heat conduction has two kinds, and a kind of is the transmission of carrying out heat by free electron, and this is the main mechanism of metal material heat conduction.Another kind is by dot matrix or lattice vibration, promptly carries out the transmission of heat by lattice wave or heat wave, and this promptly is the mechanism of the utility model High Thermal Conductivity Ceramic Materials.Have following characteristic:
1. the high heat conductance crystal all is covalent bond crystal or the very strong crystal of covalent bond, and this point can guarantee the key directionality that the high key of crystal is strong and extremely strong, makes the thermal fluctuation of crystal structure primitive be restricted to bottom line.
2. the species number of high heat conductance crystal structure primitive is few, and atomic weight or mean atomic weight are lower.And the structural motif kind is many and the quality height all can strengthen interference and scattering to lattice wave, thereby makes the thermal conductivity reduction.
3. for the crystal of some layer structure, can guarantee high thermal conductivity is arranged along the synusia direction along the strong covalent bonds of synusia direction.
So reach the utility model purpose of design, can be rated as the technical scheme of a practicality.
In sum, the disclosed a kind of high thermal conductance LED lamp of the utility model was not had by former times, also do not seen on the domestic and international disclosed publication, the patent requirement that has had novelty, the utility model defective of prior art of really can forgoing again, and reach purpose of design, also fully meet the practicality patent requirement of utility model, so file an application in accordance with the law.
But, the above, only be of the present utility model one preferable feasible embodiment, be not in order to arrest limit scope of the present utility model, every those of ordinary skills, the equivalent structure that utilization the utility model specification and claim are done changes, and ought to be included in the claim of the present utility model.

Claims (3)

1. one kind high thermal conductance LED lamp is characterized in that, mainly includes: by the substrate that High Thermal Conductivity Ceramic Materials constitutes, directly be provided with the metallic circuit of design in advance on the described substrate, described metallic circuit is provided with the LED of predetermined quantity.
2. high thermal conductance LED lamp as claimed in claim 1 is characterized in that the described substrate that is made of High Thermal Conductivity Ceramic Materials is selected among aluminium nitride AlN, carborundum SiC, beryllium oxide BeO, the hexagonal boron nitride BN at least a.
3. high thermal conductance LED lamp as claimed in claim 1 is characterized in that the described substrate other end is provided with heat dissipating layer.
CN2009201633631U 2009-07-08 2009-07-08 High thermal conductivity LED lamp Expired - Fee Related CN201487854U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201633631U CN201487854U (en) 2009-07-08 2009-07-08 High thermal conductivity LED lamp

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Application Number Priority Date Filing Date Title
CN2009201633631U CN201487854U (en) 2009-07-08 2009-07-08 High thermal conductivity LED lamp

Publications (1)

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CN201487854U true CN201487854U (en) 2010-05-26

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102980159A (en) * 2012-11-14 2013-03-20 深圳大学 Heat dissipation device and manufacture method thereof and light-emitting diode (LED) light source provided with the same
CN104456178A (en) * 2014-10-22 2015-03-25 浙江天时光电科技有限公司 Multifunctional LED bulb
CN104617204A (en) * 2015-01-16 2015-05-13 隆科电子(惠阳)有限公司 Silicon carbide based circuit board and preparation method thereof
CN108679583A (en) * 2018-04-08 2018-10-19 伍连彬 A kind of lighting apparatus and its manufacturing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102980159A (en) * 2012-11-14 2013-03-20 深圳大学 Heat dissipation device and manufacture method thereof and light-emitting diode (LED) light source provided with the same
CN102980159B (en) * 2012-11-14 2016-05-18 深圳大学 The manufacture method of heat abstractor, heat abstractor and there is the LED light source of this heat abstractor
CN104456178A (en) * 2014-10-22 2015-03-25 浙江天时光电科技有限公司 Multifunctional LED bulb
CN104617204A (en) * 2015-01-16 2015-05-13 隆科电子(惠阳)有限公司 Silicon carbide based circuit board and preparation method thereof
CN104617204B (en) * 2015-01-16 2017-07-14 隆科电子(惠阳)有限公司 A kind of silicon carbide-based circuit board and preparation method thereof
CN108679583A (en) * 2018-04-08 2018-10-19 伍连彬 A kind of lighting apparatus and its manufacturing method

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100526

Termination date: 20160708

CF01 Termination of patent right due to non-payment of annual fee