CN102980159A - Heat dissipation device and manufacture method thereof and light-emitting diode (LED) light source provided with the same - Google Patents
Heat dissipation device and manufacture method thereof and light-emitting diode (LED) light source provided with the same Download PDFInfo
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- CN102980159A CN102980159A CN2012104576374A CN201210457637A CN102980159A CN 102980159 A CN102980159 A CN 102980159A CN 2012104576374 A CN2012104576374 A CN 2012104576374A CN 201210457637 A CN201210457637 A CN 201210457637A CN 102980159 A CN102980159 A CN 102980159A
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Abstract
The invention discloses a heat dissipation device, a manufacture method thereof and a light-emitting diode (LED) light source provided with the same. The heat dissipation device is used for dissipating heat of LED chips and comprises a first heat conduction base plate and a porous structure layer, the LED chips contact one side of the first heat conduction base plate in a thermal mode, and the porous structure layer contact the other side of the first heat conduction base plate in a thermal mode. With the method, the heat dissipation device has excellent heat dissipation effect.
Description
Technical field
The present invention relates to a kind of semiconductor devices, relate in particular to the manufacture method of a kind of heat abstractor, heat abstractor and have the led light source of this heat abstractor.
Background technology
Because light emitting diode has the advantages such as low power consumption, lower calorific value, life-span length; Therefore, in fields such as electronical display and illuminations, light emitting diode is replacing energy consumption height, short traditional lighting light fixture of life-span gradually.
Existing LED source comprises luminescence chip and heat-conducting substrate, and luminescence chip is arranged on the heat-conducting substrate.Luminescence chip can produce very large heat usually when carrying out predetermined work; These caloric requirements distribute by heat-conducting substrate.If these heats can't effectively by loss, will have influence on the normal operation of LED source.
Summary of the invention
The technical problem that the present invention mainly solves provides the manufacture method of a kind of heat abstractor with improved radiating effect, heat abstractor and has the led light source of this heat abstractor.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of heat abstractor is provided, be used for led chip is dispelled the heat, heat abstractor comprises the first heat-conducting substrate and porous structure layer, one side thermo-contact of led chip and the first heat-conducting substrate, the opposite side thermo-contact of porous structure layer and the first heat-conducting substrate.
Wherein, the lateralarea of porous structure layer and the first heat-conducting substrate is all greater than the lateralarea of led chip.
Wherein, porous structure layer directly is formed on the opposite side of the first heat-conducting substrate.
Wherein, heat abstractor further comprises the second heat-conducting substrate, and porous structure layer is formed on the side of the second heat-conducting substrate, the opposite side thermo-contact of the opposite side of the second heat-conducting substrate and the first heat-conducting substrate.
Wherein, the lateralarea of the second heat-conducting substrate and porous structure layer is greater than the lateralarea of the first heat-conducting substrate.
Wherein, heat abstractor further comprises the heat conducting film layer that is formed on the first heat-conducting substrate, the thermal conductivity of heat conducting film layer is greater than the first heat-conducting substrate, heat conducting film layer and led chip thermo-contact, and the lateralarea of heat conducting film layer is greater than the lateralarea of led chip.
Wherein, porous structure layer comprises porous polymer materials and is doped in infrared emanation powder in the porous polymer materials, perhaps comprises foamed cement material and is doped in infra-red radiation powder in the foamed cement material.
Wherein, porous polymer materials comprises that at least a in porous printing ink, porous colloid and the porous plastics, infrared emanation powder comprise at least a in graphite, aluminium oxide, white carbon, zircon sand, silica, cobalt oxide, magnesia, manganese dioxide, nickel oxide, titanium oxide, cupric oxide, chromium oxide, iron oxide, molybdenum oxide, the carborundum.
For solving the problems of the technologies described above, another technical solution used in the present invention is: a kind of led light source is provided, and led light source comprises led chip and aforesaid heat abstractor.
For solving the problems of the technologies described above, another technical solution used in the present invention is: a kind of manufacture method of heat abstractor is provided, and this manufacture method comprises: the first heat-conducting substrate is provided; Porous polymer materials, infrared emanation powder and diluent are uniformly mixed into pasty mixture according to a certain percentage; Pasty mixture is coated on the first heat-conducting substrate; Baking is coated in the pasty mixture on the first heat-conducting substrate, to form porous structure layer.
The invention has the beneficial effects as follows: be different from the situation of prior art, heat abstractor of the present invention comprise the first heat-conducting substrate and with the porous structure layer of a side thermo-contact of the first heat-conducting substrate; This porous structure layer has been Duoed a kind of heat radiation approach---heat loss through radiation than heat-radiating substrate in the past, so that the surface area of heat abstractor increases, strengthens the heat conduction efficiency of heat abstractor simultaneously; The special structure that this porous structure layer has can also improve the thermal convection current efficient of heat abstractor; In addition, the siphonic effect that porous structure layer produces can enter the space with airborne moisture absorption, and the heat of hot-fluid will evaporate the moisture in the space, and then water vapour is dispersed in the surrounding air, thereby further strengthen the radiating effect of heat abstractor.
Description of drawings
Fig. 1 is the schematic diagram of led light source the first embodiment of the present invention;
Fig. 2 is the schematic diagram of led light source the second embodiment of the present invention.
Fig. 3 is the flow chart of the manufacture method of heat abstractor of the present invention.
The specific embodiment
Consult Fig. 1, first embodiment of the invention led light source 100 comprises heat abstractor 1 and LED(Light Emitting Diode) chip 2.Heat abstractor 1 comprises heat-conducting substrate 10, porous structure layer 11 and heat conducting film layer 12.
Led chip 2, heat conducting film layer 12, heat-conducting substrate 10 and porous structure layer 11 are cascading along first direction X.Heat-conducting substrate 10 roughly is tabular, comprises the second side 102 that the first side 101 and the first side 101 are oppositely arranged.Extend along the second direction Y perpendicular to first direction X the first side 101, the second side 102.
Heat-conducting substrate 10 is composite beds that one or more materials in pottery, metal or the high heat-conducting plastic form.Pottery, for example aluminium oxide, aluminium nitride etc., metal, for example copper, aluminium, silver etc.Be that heat abstractor is applicable to traditional PCB (Printed Circuit Board, printed circuit board (PCB)), MCPCB(metal core PCB, metal-cored printed circuit board), DBC (Dircet Bonding Copper covers the copper ceramic substrate), ceramic packaging substrate, composite base plate etc.
Heat conducting film layer 12 is formed on the first side 101 of heat-conducting substrate 10, and the thermal conductivity of heat conducting film layer 12 is greater than heat-conducting substrate 10.Preferably, heat conducting film layer 12 is DLC coating, and in the practical application, heat conducting film layer 12 can also be the metallic films such as silver, aluminium, copper, ceramic membranes such as diamond thin or aluminium nitride etc.
Led chip 2 is arranged on the heat conducting film layer 12, with heat conducting film layer 12 thermo-contacts and by first side 101 thermo-contacts of heat conducting film layer 12 with heat-conducting substrate 10.
Because led chip 2, heat conducting film layer 12, heat-conducting substrate 10, porous structure layer 11 be along the stacked setting of first direction X, and said elements all roughly in the form of sheets or tabular.In order to narrate conveniently, specific adopted said elements is the side along the surface on the second direction Y, and side described herein comprises the first side 101 and second side 102 of heat-conducting substrate 10.
In order to obtain better radiating effect, the lateralarea of heat conducting film layer 12, heat-conducting substrate 10 and porous structure layer 11 is all greater than the lateralarea of led chip 2.In the present embodiment, because heat conducting film layer 12 and porous structure layer 11 all directly are respectively formed on first side 101 and the second side 102 of heat-conducting substrate 10, therefore, the lateralarea of heat-conducting substrate 10 is more than or equal to the lateralarea of heat conducting film layer 12 or loose structure 11.
Please refer to Fig. 2, second embodiment of the invention led light source 100 ' comprises heat abstractor 1 ' and LED(Light Emitting Diode) chip 2.Heat abstractor 1 ' comprises heat conducting film layer 12 ', the first heat-conducting substrate 10 ', the second heat-conducting substrate 13 and the porous structure layer 11 ' that is cascading along first direction X.The first heat-conducting substrate 10 ' comprises the first side 101 ' and second side 102 ' of extending along second direction Y.The second heat-conducting substrate 13 comprises the first side 131 and second side 132 of extending along second direction Y.
Compare with the first embodiment led light source 100, the porous structure layer 11 ' of present embodiment led light source 100 ' is formed on the second side 132 of the second heat-conducting substrate 13, heat conducting film layer 12 ' is formed on the first side 101 ' of the first heat-conducting substrate 10 ', the first side 131 of the second heat-conducting substrate 13 and the second side 102 ' thermo-contact of the first heat-conducting substrate 10 '.
In order to obtain better radiating effect, the lateralarea of the second heat-conducting substrate 13 and porous structure layer 11 ' is greater than the lateralarea setting of the first heat-conducting substrate 10 '.
Compared with prior art, led light source 100 of the present invention, 100 ' heat abstractor 1,1 ' comprise the first heat-conducting substrate 10,10 ' and with the porous structure layer 11,11 ' of a side thermo-contact of the first heat-conducting substrate; The loose structure that this porous structure layer 11,11 ' has has been Duoed a kind of heat radiation approach---heat loss through radiation than heat-radiating substrate in the past, so that the surface area of heat abstractor increases, so the heat conduction efficiency of heat abstractor is improved simultaneously; The structure of the porous that this porous structure layer 11,11 ' has can also improve the thermal convection current efficient of heat abstractor; In addition, porous structure layer 11, the 11 ' siphonic effect that produces can enter the space with airborne moisture absorption, and the heat of hot-fluid will evaporate the moisture in the space, and then water vapour is dispersed in the surrounding air, thereby further strengthen the radiating effect of heat abstractor.
The present invention further provides a kind of aforesaid heat abstractor 1 or 1 '.The concrete structure of heat abstractor is described in detail in led light source, repeats no more.
Please in the lump with reference to Fig. 3, the present invention also provides a kind of preparation method of heat abstractor, and manufacture method comprises:
S1 provides heat-conducting substrate.
Heat-conducting substrate 10 is composite beds that one or more materials in pottery, metal or the high heat-conducting plastic form.Be that heat abstractor is applicable to traditional PCB (Printed Circuit Board, printed circuit board (PCB)), MCPCB(metal core PCB, metal-cored printed circuit board), DBC (Dircet Bonding Copper covers the copper ceramic substrate), ceramic packaging substrate, composite base plate etc.
S2 is uniformly mixed into pasty mixture according to a certain percentage with porous polymer materials, infrared emanation powder and diluent.
Among the step S2, porous polymer materials comprises at least a in porous printing ink, porous colloid, the porous plastics; The infra-red radiation powder comprises a kind of or combination in graphite powder, the alumina powder.The preferred organic solvent of diluent.
S3 is coated in pasty mixture on the heat-conducting substrate.
Pasty mixture evenly is coated on the side side of heat-conducting substrate by modes such as spraying, immersion liquid or printings, makes a side side of heat-conducting substrate form mixture layer.
S4, baking is coated in the pasty mixture on the heat-conducting substrate, to form porous structure layer.
The heat abstractor that makes by above-mentioned preparation method can directly use, and also can use as heat abstractor after the formation of the opposite side side of heat-conducting substrate or thermally coupled heat conducting film layer.The present invention does not limit this.
The above only is embodiments of the present invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. heat abstractor, be used for led chip is dispelled the heat, it is characterized in that described heat abstractor comprises the first heat-conducting substrate and porous structure layer, one side thermo-contact of described led chip and described the first heat-conducting substrate, the opposite side thermo-contact of described porous structure layer and described the first heat-conducting substrate.
2. heat abstractor according to claim 1 is characterized in that, the lateralarea of described porous structure layer and described the first heat-conducting substrate is all greater than the lateralarea of described led chip.
3. heat abstractor according to claim 2 is characterized in that, described porous structure layer directly is formed on the opposite side of described the first heat-conducting substrate.
4. heat abstractor according to claim 2, it is characterized in that, described heat abstractor further comprises the second heat-conducting substrate, and described porous structure layer is formed on the side of described the second heat-conducting substrate, the opposite side thermo-contact of the opposite side of described the second heat-conducting substrate and described the first heat-conducting substrate.
5. heat abstractor according to claim 4 is characterized in that, the lateralarea of described the second heat-conducting substrate and described porous structure layer is greater than the lateralarea of described the first heat-conducting substrate.
6. heat abstractor according to claim 2, it is characterized in that, described heat abstractor further comprises the heat conducting film layer that is formed on described the first heat-conducting substrate, the thermal conductivity of described heat conducting film layer is greater than described the first heat-conducting substrate, described heat conducting film layer and described led chip thermo-contact, and the lateralarea of described heat conducting film layer is greater than the lateralarea of described led chip.
7. heat abstractor according to claim 1, it is characterized in that, described porous structure layer comprises porous polymer materials and is doped in infrared emanation powder in the described porous polymer materials, perhaps comprises foamed cement material and is doped in infra-red radiation powder in the foamed cement material.
8. heat abstractor according to claim 7, it is characterized in that, described porous polymer materials comprises that at least a in porous printing ink, porous colloid and the porous plastics, described infrared emanation powder comprise at least a in graphite, aluminium oxide, white carbon, zircon sand, silica, cobalt oxide, magnesia, manganese dioxide, nickel oxide, titanium oxide, cupric oxide, chromium oxide, iron oxide, molybdenum oxide, the carborundum.
9. a led light source is characterized in that, described led light source comprises led chip and such as the described heat abstractor of claim 1 ~ 8 any one.
10. the manufacture method of a heat abstractor is characterized in that, described manufacture method comprises:
Heat-conducting substrate is provided;
Porous polymer materials, infrared emanation powder and diluent are uniformly mixed into pasty mixture according to a certain percentage;
Described pasty mixture is coated on described the first heat-conducting substrate;
Baking is coated in the described pasty mixture on the described heat-conducting substrate, to form porous structure layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210457637.4A CN102980159B (en) | 2012-11-14 | 2012-11-14 | The manufacture method of heat abstractor, heat abstractor and there is the LED light source of this heat abstractor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210457637.4A CN102980159B (en) | 2012-11-14 | 2012-11-14 | The manufacture method of heat abstractor, heat abstractor and there is the LED light source of this heat abstractor |
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| CN102980159A true CN102980159A (en) | 2013-03-20 |
| CN102980159B CN102980159B (en) | 2016-05-18 |
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Cited By (9)
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| CN104990018A (en) * | 2015-06-02 | 2015-10-21 | 南通苏禾车灯配件有限公司 | Environmentally-friendly and energy-saving LED daytime running light and production technology thereof |
| CN106116699A (en) * | 2016-06-21 | 2016-11-16 | 宁波伏尔肯陶瓷科技有限公司 | A kind of silicon carbide ceramics fin and preparation method thereof |
| CN106151900A (en) * | 2016-06-20 | 2016-11-23 | 保定威控光电科技有限公司 | A kind of light-duty fluorescence is without dead angle luminescence bulb lamp |
| CN106482003A (en) * | 2015-09-01 | 2017-03-08 | Bgt材料有限公司 | The method of the LED bulb of manufacture tool Graphene filament |
| CN106931331A (en) * | 2015-12-31 | 2017-07-07 | 深圳市光峰光电技术有限公司 | A kind of cooling base and preparation method thereof, related light emitting module and preparation method |
| CN107453104A (en) * | 2017-07-13 | 2017-12-08 | 广东欧珀移动通信有限公司 | Connector, power supply module and terminal device |
| CN107606557A (en) * | 2017-11-10 | 2018-01-19 | 彭从文 | High heat dissipation street lamp |
| CN109994923A (en) * | 2019-03-26 | 2019-07-09 | 中国科学院半导体研究所 | Temperature detection device and preparation method thereof |
| WO2023159411A1 (en) * | 2022-02-24 | 2023-08-31 | 万德辉 | Radiation-based heat dissipation device for electronic component, and preparation method therefor |
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| CN106116699A (en) * | 2016-06-21 | 2016-11-16 | 宁波伏尔肯陶瓷科技有限公司 | A kind of silicon carbide ceramics fin and preparation method thereof |
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| CN107453104B (en) * | 2017-07-13 | 2020-07-24 | Oppo广东移动通信有限公司 | Connector, power supply module and terminal equipment |
| CN107606557A (en) * | 2017-11-10 | 2018-01-19 | 彭从文 | High heat dissipation street lamp |
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| CN109994923A (en) * | 2019-03-26 | 2019-07-09 | 中国科学院半导体研究所 | Temperature detection device and preparation method thereof |
| WO2023159411A1 (en) * | 2022-02-24 | 2023-08-31 | 万德辉 | Radiation-based heat dissipation device for electronic component, and preparation method therefor |
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