JP3152088U - Electrical circuit composite radiator - Google Patents

Abstract

Disclosed is an electric circuit composite heat dissipator that achieves quick heat dissipation by diffusing heat directly over the entire surface, greatly reducing the thermal resistance coefficient, and ensuring the function and service life of an electronic device. A heat radiator includes a heat radiator, a plurality of heat radiating fins or a heat radiating material such as a metal plate and a ceramic plate on one side, and a heat conductive insulating layer on the other side. The insulating layer 20 includes a heat conductive powder that is uniformly distributed, and an electric circuit layer 30 is provided on the heat conductive insulating layer 20, and the electric circuit layer 30 includes an evenly distributed adhesive and a low resistance conductive powder, In addition, a contact 31 is provided thereon, the electronic device 50 is electrically connected through the contact 31, and an insulating paint layer 40 that functions as a solder resist is provided outside the heat conductive insulating layer 20 and the electric circuit layer 30. . [Selection] Figure 4

Description

  The present invention relates to an electric circuit composite radiator, and in particular, directly dissipates heat energy generated by an electric circuit directly to dissipate it quickly, greatly reducing the thermal resistance coefficient, and the functions and use of electric / electronic devices. The present invention relates to an electric circuit composite heat dissipating body that effectively ensures a life.

  Currently, there are various types of lighting equipment such as street lighting, advertising lighting, indoor lighting, and equipment lighting. In general, many of the lighting sources for lighting equipment use incandescent lamps, fluorescent lights, mercury lamps, etc. Steam causes environmental pollution, lighting efficiency is poor, power consumption is relatively increased, and it is easy to break and has a short service life, so it needs to be replaced regularly, resulting in waste of manpower, physical strength, and time. Therefore, improvement is necessary.

  Nowadays, the light sources of indoor and outdoor lighting equipment such as equipment and advertisements are already using solid-state light emitting diodes to increase lighting efficiency and save power. In this illumination light source, it is necessary to arrange a plurality of light emitting diodes on a circuit board. However, as the number of light emitting diodes installed and the output power increase, the power> light> heat conversion process causes a relatively high temperature. Since heat is generated, it is necessary to conduct heat to the radiator and its fin through the insulating layer of the circuit board.

  However, the LED light-emitting diode circuit board needs to be bonded to the surface of the heatsink with an adhesive, so it cannot be firmly and firmly fixed over the entire surface, which affects the heat conduction efficiency and further deteriorates and drops off. The heat dissipation efficiency is poor and the heat dissipation speed is slow. For this reason, when the light emitting diode is used for a long period of time, the temperature becomes too high, greatly affecting the illumination effect of the light emitting diode, and the light is attenuated to shorten the service life. Therefore, improvements are needed.

In order to overcome the above-mentioned problems, the types and structures of circuit board materials having a heat dissipation function that are currently used are as follows.
Type 1, FR4 base printed wiring board: The board material does not have heat conduction and heat dissipation functions.
Type 2, metal core printed wiring board Metal Core PCB (MCPCB): The structure is formed by stacking three different material layers of a copper foil (circuit) layer, an insulating (dielectric) layer, and an aluminum substrate (metal core) layer.
Type 3, ceramic substrate: The structure is formed by forming the circuit directly on the surface of the substrate with conductive silver paste.

  In order to enhance the heat dissipation of the LED, the FR4 printed wiring board of the same type cannot already cope with it. A printed wiring board (MCPCB) with a type 2 metal core accelerates heat dissipation by using a metal with excellent thermal conductivity such as aluminum or copper installed at the bottom of the circuit board. MCPCB) can achieve a heat dissipation effect, but its thermal conductivity is limited by the characteristics of the insulating layer. Type 3 ceramic substrates are applicable only to devices that have small dimensions, extremely high operating temperatures, and that can easily handle high power.

  As can be seen, the articles described above still have a number of drawbacks and are not complete and awaiting improvement.

  The inventor of the present invention has succeeded in developing the electric circuit composite heat dissipating body of the present invention after many years of research in view of the respective disadvantages derived from the above-mentioned conventional products.

  The purpose of the present invention is to connect the electric circuit layer on the surface of the radiator by installing a heat conductive insulating layer, and further connect the electric circuit layer to the surface of the radiator through the heat conductive insulating layer. It is an object of the present invention to provide an electric circuit composite heat dissipating body that diffuses heat directly to achieve rapid heat dissipation, greatly reduces the thermal resistance coefficient, and ensures the function and service life of electric / electronic devices.

  The electric circuit composite radiator of the present invention includes a radiator, a heat conductive insulating layer, an electric circuit layer, and an insulating paint layer.

  The heat radiator is provided with a plurality of heat radiating fins or a heat radiating material such as a metal plate, a ceramic plate, and a graphite plate on one side, and the heat energy generated by the electric / electronic device is effectively discharged by installing the heat radiating device.

  The heat conductive insulating layer contains heat conductive powder that is uniformly distributed, and is bonded to the other surface of the radiator, and the heat conductive powder is subjected to a surface treatment so that the surface of the powder is further coated with one fluorine compound or the like. Completely covered with a polymer material such as organic silicon, and after baking, the air and water molecules on the surface are completely removed and dried to obtain a thermally conductive ceramic powder. Further, this powder is added to the prepared liquid and dispersed. This liquid contains alcohol, methyl ethane, ketone, diethyl ether and the like, and is further added with a filler of elastic gel such as aluminum hydroxide (AlOH) and a small amount of nitrile, chloroprene, polysulfide. Thereafter, it is uniformly applied on the surface of the radiator and heated to sinter the surface of the radiator.

The electrical circuit layer includes a uniformly distributed adhesive and a low resistance conductive powder and is bonded onto the surface of the thermally conductive insulating layer. A contact is provided on the electric circuit layer, and an electronic device is electrically connected through the contact. The conductive powder may have a particle size of 10 to 4000 nm and a metal resistance value of 10 ¹ Ω to 10 ⁻⁶ Ω.

  The electric circuit layer is bonded onto the surface of the heat conductive insulating layer, and surface treatment is performed. This surface treatment process is a process such as nickel chemical plating and gold chemical plating, and the characteristics of this process can meet the standards of RoHs / WEEE etc. in the electronics industry, and its hardness, wear resistance, and ease of soldering , And the electric resistance coefficient of the electric circuit layer can be reduced to satisfy the electric circuit design parameter value. This nickel chemical plating process can be performed only on the electric circuit layer including the adhesive and the low-resistance conductive powder distributed selectively and uniformly.

  The insulating paint layer is bonded onto the surfaces of the heat conductive insulating layer and the electric circuit layer, and the insulating paint layer acts as a solder resist.

  The present invention directly diffuses the heat of elements and ICs, which are heat sources on general circuits, to quickly dissipate them, greatly reducing the thermal resistance coefficient, and ensuring the functions and service life of electrical and electronic devices. be able to.

It is a side view which shows the structure of the heat radiator and heat conductive insulating layer of the electric circuit composite heat radiator of this invention. It is a side view which shows the coupling structure of the electric circuit layer of the electric circuit composite heat radiator of this invention. It is a side view which shows the coupling | bonding structure of the insulating coating layer of the electric circuit composite heat radiator of this invention. It is a side view which shows the coupling | bonding structure of the electric / electronic device of the electric circuit composite heat radiator of this invention. It is a three-dimensional view of the heat radiator of the electric circuit composite heat radiator of the present invention. It is a three-dimensional view of the opposite surface of the radiator of the electric circuit composite radiator of the present invention. It is a three-dimensional view of the electric circuit composite radiator of the present invention.

  FIGS. 1 to 7 show a plan structure, a three-dimensional structure, and an operating state of the electric circuit composite radiator according to the present invention. The electric circuit composite radiator of the present invention can achieve the purpose of the utility model, and the electric circuit composite radiator includes the radiator 10, the heat conductive insulating layer 20, the electric circuit layer 30, and the insulating paint layer 40.

  The heat radiator 10 is provided with a plurality of heat radiating fins 12 or heat radiating materials such as a metal plate, a ceramic plate, and a graphite plate. By installing the heat radiating device 10, the heat energy generated by the electric / electronic device 50 is effectively discharged. The heat conductive insulating layer 20 is disposed on the other surface 11.

The heat conductive insulating layer 20 contains a uniformly distributed heat conductive powder and is bonded onto the surface 11 on the other side of the radiator 10. The thermally conductive insulating layer 20 includes a thermally conductive powder and a dispersion liquid used for bonding the thermally conductive powder particles, and the thermally conductive powder is uniformly distributed in the dispersed liquid using a kneading process. The heat conductive powder may be selected from high electrical resistance powders such as aluminum oxide, aluminum nitride, boron nitride, silicon carbide, etc., and the heat conductive powder may be one of the above-mentioned materials or two or more kinds of the heat conductive powder. The heat conductive insulating layer 20 is provided with a high insulating electric resistance of 10 ⁶ to 10 ¹⁹ Ω · cm. The material of the heat conductive powder is a spherical or irregular crystal granule, and can be appropriately selected and used with an average particle size of about 0.01 to 100 μm.

  The above-mentioned heat conductive powder is subjected to technical treatment, and the method is to dissolve a fluorine compound or organic silicon with alcohols such as ethanol and isopropanol to hydrolyze (eg, immersion), and to use one or two of the above materials The above heat conductive powder material is mixed and baked at a low temperature of about 60 ° C. to 150 ° C., and the air and water molecules on the surface are removed cleanly to obtain a dry heat conductive ceramic powder. After surface treatment of the heat conductive powder, good dispersibility is obtained, and the surface is completely covered with a single fluorine compound or organic silicon, which is advantageous for powder dispersion and crystal sintering, and cross-linking between molecules. is there.

  The following method can be selectively used for the preparation of the surface-sintered liquid material of the heat conductive powder.

  Liquids in this solution are alcohols, solvents such as methyl ethane, ketones (methyl ethyl ketone), diethyl ether, etc., organic silicon phenol (phenol-modified organic silicon alone), or organic silicon (modified organic silicon such as epoxy-phenol-polyester) and nitrile. Alternatively, elastic gels such as chloroprene and polysulfide are dissolved in order, and a small amount of sol (AlOH + H 2 O + ethanol) is added and completely dissolved to complete the preparation of the sintered liquid material on the surface of the heat conductive powder.

  Furthermore, the heat conductive insulating layer 20 has the necessary high thermal conductivity and flexibility, heat resistance, shear strength, deterioration resistance, and peel strength by mixing the above-mentioned surface sintered liquid material and heat conductive powder in a weight ratio. Further, material properties such as wear resistance and impact resistance can be obtained.

  In general, the heat conductive insulating layer 20 is formed by combining a surface sintered liquid material having a weight ratio of 3% to 15% and a heat conductive powder of 97% to 85%, and having a weight ratio of about 3 w / mk to 150 w / A heat conducting material layer having a heat conduction coefficient of mk is obtained.

  After the kneading process, the heat conductive powder and the surface sintered liquid are molded by repeatedly applying or spraying, screen printing, etc., and repeatedly stacked several times, and have a thickness of 0.01 to 15 mm on the surface 11 on the other side of the radiator 10. The heat conductive insulating layer 20 is formed. The surface sintered liquid material is bonded tightly and firmly by the molecular structure.

The electric circuit layer 30 includes a uniformly distributed adhesive and low-resistance conductive powder, and is bonded on the surface 21 on the other side of the heat conductive insulating layer 20. A contact 31 is provided on the electric circuit layer 30, and the opposing pin 51 of the electronic device 50 is electrically connected through the contact 31. Among them, the adhesive and the low resistance conductive powder are mixed at different ratios, and the metal resistance value of the electric circuit layer 30 is set to 10 ¹ Ω to 10 ⁻⁶ Ω.

  The electric circuit layer 30 described above is bonded onto the surface of the heat conductive insulating layer 20 and subjected to a surface treatment. This surface treatment process is a nickel chemical plating process, and the characteristics of this process can satisfy the standards such as RoHs / WEEE in the electronics industry, and the hardness and wear resistance thereof are enhanced. It is assumed that the electric circuit design parameter value can be satisfied by reducing the electric resistance coefficient of the electric circuit. This nickel chemical plating process can be performed only on the electric circuit layer 30 including the adhesive and the low-resistance conductive powder distributed selectively and uniformly. The surface treatment process is as follows.

1. Degrease and remove the oil remaining on the radiator surface.
2. Activate the surface of the electric circuit layer with an activator.
3. Electroless nickel treatment: The electroless nickel immersion plating solution is a complexing agent based on nickel sulfate.
4. Wash with warm water.

  Generally, the electric circuit layer 30 is best used by combining 5% to 70% adhesive and 95% to 30% low resistance conductive powder, which is silver powder, silver Irregularly shaped granules such as copper powder, silver aluminum powder, silver nickel powder and copper powder can be used in combination, and the best average particle size is about 10 to 4000 nm.

  As the adhesive, an epoxy resin, a phenol resin, an acrylic resin, a polyvinyl acetate resin (PVAC), a silicon resin, a synthetic rubber, or the like can be selected and used. Or a mixture of two or more kinds of materials.

  In an actual process, the low-resistance conductive powder and the adhesive are subjected to a kneading process, and then applied or sprayed, and screen printing is performed on the surface 21 on the other side of the heat-conducting insulating layer 20 with 0.005 to 0.00. The electric circuit layer 30 having a thickness of 1 mm is formed, and is closely and firmly bonded by the molecular structure of the adhesive, thereby achieving the function of a copper foil layer of a general printed wiring board.

  The insulating paint layer 40 is bonded onto the other surface of the heat conductive insulating layer 20 and the other surfaces 21 and 32 of the electric circuit layer 30. By installing the insulating paint layer 40, it can act as a solder resist. It is possible to directly diffuse the heat of the element or IC as a heat source on a general circuit and dissipate it quickly, greatly reduce the thermal resistance coefficient, and ensure the function and service life of the electric / electronic device 50 it can. The electronic device 50 described above can be a light emitting diode.

  The design of the electric circuit composite heat dissipation structure of the present invention mainly achieves the combined heat dissipation effect of the electric / electronic circuit by coupling the radiator 10 directly to the heat conductive insulating layer 20 and its electric circuit layer 30 and the insulating paint layer 40. It is possible to diffuse heat directly over the entire surface to quickly dissipate heat, greatly reduce the thermal resistance coefficient, and ensure the function and service life of the electric / electronic device 50.

  The above detailed description is a specific description of the best embodiment of the present invention, and this embodiment is not used to limit the patent scope of the present invention, and does not depart from the technical spirit of the present invention. All implementations and modifications are intended to be included in the patent scope of the present invention.

DESCRIPTION OF SYMBOLS 10 Radiator 11 Surface 12 of other side Radiation fin 20 Thermal insulation layer 21 Surface 30 of other side Electric circuit layer 31 Contact surface 32 Surface 40 of other side Insulating paint layer 50 Electrical / electronic device 51 Pin

Claims (6)

An electric circuit composite radiator including a radiator, a heat conduction insulating layer, an electric circuit layer, an insulating paint layer,
The radiator effectively discharges the thermal energy generated by the electric / electronic device,
The thermally conductive insulating layer is bonded on the other surface of the radiator, and the thermally conductive powder finely distributed, and the thermally conductive powder fine particles used in the surface treatment technique before the thermal conductive powder is surface treated. Including a sintered dispersion of liquid material,
The electrical circuit layer is bonded onto the other surface of the thermally conductive insulating layer, includes a uniformly distributed adhesive and low-resistance conductive powder, and a contact is provided on the electrical circuit layer. Electrically connected to opposite pins of the electronic device, the electrical circuit layer is bonded onto the surface of the thermally conductive insulating layer, and surface-treated with nickel chemical plating,
The electric circuit composite radiator is characterized in that the insulating paint layer is bonded on the other surface of the heat conductive insulating layer and the other surface of the electric circuit layer to reduce a thermal resistance coefficient. The electric circuit composite radiator according to claim 1, wherein the heat conductive powder material is a spherical or irregular crystal granule. 2. The electric circuit composite radiator according to claim 1, wherein the heat conductive powder material has a particle size of 0.01 to 100 μm. 2. The electric circuit composite radiator according to claim 1, wherein the heat conductive insulating layer is applied to a surface of the radiator and has a thickness of 0.01 to 15 mm. The electric circuit composite radiator according to claim 1, wherein the best average particle size of the low-resistance conductive powder is about 0.01 to 400 µm. The electric circuit composite radiator according to claim 1, wherein the electric circuit layer is bonded to the heat conductive insulating layer and has a thickness of 0.005 to 0.2 mm.

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