CN206430068U - Radiator with wire mark or spraying circuit - Google Patents
Radiator with wire mark or spraying circuit Download PDFInfo
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- CN206430068U CN206430068U CN201720070459.8U CN201720070459U CN206430068U CN 206430068 U CN206430068 U CN 206430068U CN 201720070459 U CN201720070459 U CN 201720070459U CN 206430068 U CN206430068 U CN 206430068U
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- circuit
- wire mark
- radiating part
- spraying
- radiator
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Abstract
The utility model discloses the radiator with wire mark or spraying circuit, it includes circuit layer and insulating barrier.Circuit layer is formed by wire mark or spraying containing equally distributed glue material and Low ESR electrical conductivity powder, and in the one side with wire mark or the radiating part for the radiator for spraying circuit.Insulating barrier is on the face of circuit layer and radiating part.The utility model is direct to form circuit layer in a face wire mark of radiating part or spraying, and circuit board is set without extra, to reach radiating part and the purpose of circuit layer link, and has effects that to reduce cost and simplify processing procedure.
Description
Technical field
The utility model is related to a kind of radiator, more particularly to a kind of to form circuit layer by wire mark or spraying method
Radiator with wire mark or spraying circuit.
Background technology
Current lighting apparatus includes the species such as street lighting, advertising lighting, room lighting and machinery equipment illumination, general to shine
The lighting source of bright equipment is mostly using species such as incandescent lamp bulb, fluorescent tube, mercury vapor lamps, except mercury vapour causes environment dirty
Dye, illumination efficiency is poor, outside power consumption is relatively high, is also easy to damage, its service life is short, so that replacing must be often repaired, it is unrestrained
Take human and material resources and time, therefore have improvement to be strengthened.
Now, the lighting source of the lighting apparatus such as indoor and outdoor, machine, advertisement, which has contemplated that, changes using solid state light emitter light-emitting diodes
Pipe, to improve illumination efficiency, and saves electric power.Only this lighting source must on circuit substrate arranged several luminous two
Pole pipe, but with setting quantity and the power output increase of light emitting diode, in the transfer process of electric ＞ light ＞ heat, relative production
Raw high-temperature heat, it is therefore necessary to radiator is conducted heat to by the insulating barrier of circuit substrate and its fin is radiated.
However, the circuit substrate of LED light emitting diodes must fit in spreader surface by viscose, so that it can not be complete
Face property is firmly closely sealed with radiator, influences heat conduction efficiency, and easily occurs aging and come off, and causes radiating efficiency poor, scattered
Thermal velocity is slow, therefore during light emitting diode long-term luminous, easily causes that temperature is too high, has a strong impact on the illumination effect of light emitting diode
Can, light decay is in turn resulted in, reduces service life, it is therefore necessary to further creation improvement.
Thus prior art could be improved and improve.
Utility model content
In view of in place of above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide a kind of with wire mark or spraying
The radiator of circuit, to solve problem encountered in the prior art.
Based on above-mentioned purpose, the utility model provides a kind of radiator with wire mark or spraying circuit, comprising：Pass through net
Print or spraying are formed containing equally distributed glue material and electrical conductivity powder, and are located at wire mark or spray the radiator of circuit
Radiating part one side on circuit layer；And the insulating barrier in the one side of circuit layer and radiating part.
Preferably, radiating part can be heat dissipation metal portion, and wire mark or spraying are containing uniform between heat dissipation metal portion and circuit layer
The heat transfer powder of distribution and form thermally conductive insulating layer.
Preferably, the thickness of thermally conductive insulating layer can be 0.01 to 15mm.
Preferably, the another side of radiating part can have several radiating fins.
Preferably, radiating part can be ceramic heat-dissipating portion, plastic cement radiating part or glass radiating part.
Preferably, the thickness of circuit layer can be 0.005 to 0.2mm.
From the above, the radiator of the present utility model with wire mark or spraying circuit is directly in a face wire mark of radiating part
Or spraying forms circuit layer, circuit board is set without extra, to reach radiating part and the purpose of circuit layer link, and with drop
Low cost and the effect for simplifying processing procedure.
Brief description of the drawings
Fig. 1 is the first profile of the present utility model with wire mark or the radiator for spraying circuit.
Fig. 2 is the first schematic diagram of the present utility model with wire mark or the radiator for spraying circuit.
Fig. 3 is the second schematic diagram of the present utility model with wire mark or the radiator for spraying circuit.
Fig. 4 is the second profile of the present utility model with wire mark or the radiator for spraying circuit.
Fig. 5 is the schematic diagram of the radiating part of the present utility model with wire mark or the radiator for spraying circuit.
Embodiment
It is hereby that this practicality is new for ease of the effect that understands feature of the present utility model, content and advantage and its can reach
Type coordinates accompanying drawing, and as follows with the expression-form detailed description of embodiment, and wherein used accompanying drawing, and its purport is only signal
And aid in illustrating book and be used, the actual proportions after may not implementing for the utility model and precisely configuration, thus not should it is appended attached
The ratio of figure is understood with configuration relation, interest field of the limitation the utility model on actually implementing.
Advantage of the present utility model, feature and the technical method reached will enter with reference to exemplary embodiments and appended accompanying drawing
Row is more fully described and is easier to understand, and the utility model can also multi-form realize, therefore not it is understood that only limiting
In embodiments set forth herein, on the contrary, for those skilled in the art, the embodiment provided will disclose this
More thoroughly with comprehensively and intactly passing on category of the present utility model, and the utility model will only be attached claim
Defined.
Fig. 1, Fig. 2 and Fig. 3 are referred to, Fig. 1 is the first of the radiator of the present utility model with wire mark or spraying circuit
Profile；Fig. 2 is the first schematic diagram of the present utility model with wire mark or the radiator for spraying circuit；Fig. 3 is that this practicality is new
The second schematic diagram that there is wire mark or the radiator of circuit is sprayed of type.As illustrated, of the present utility model have wire mark or spray
The radiator 100 for applying circuit contains circuit layer 120 and insulating barrier 130.
Circuit layer 120 contains equally distributed glue material and Low ESR electrical conductivity powder, by wire mark or spraying containing equal
The glue material of even distribution and an electrical conductivity powder and constitute, circuit layer 120 be located at wire mark or spray circuit radiator 100
Radiating part 110 one side on.The electrical conductivity powder is Low ESR electrical conductivity powder.
Contact 121 is then provided with the circuit layer 120, is able to be electrically connected with the relative of electronic component 200 by contact 121
Pin 210；Wherein, above-mentioned glue material is mixed with Low ESR electrical conductivity powder by different proportion, makes the gold of circuit layer 120
It is 10 to belong to impedance value-1Ω to 10-6Ω；Above-mentioned circuit layer 120 is located on the surface of radiating part 110 and imposes surface treatment,
This Surface Treatment Engineering is chemical sinking nickel engineering, and the characteristic of this engineering can be satisfied with the regulations such as the RoHs/WEEE of electronic industry, also
Its hardness, wearability and the reduction resistance coefficient of circuit layer 120 can be strengthened to meet the parameter value of appliance circuit design, this chemistry is heavy
Nickel engineering alternative is only arranged on the circuit layer 120 containing equally distributed glue material and Low ESR electrical conductivity powder；On
The surface treatment process stated is as follows：
1. de- ester removes the grease of radiating part surface residual.
2. activator activates circuit layer surface.
3. operated without the heavy nickel of electricity：Without the complexing agent that the heavy nickel depositing plating solution nickel sulfate of electricity is host.
4. cleaned by hot water.
In general, the Low ESR that circuit layer 120 is preferably selected between the glue material and 95% to 30% between 5% to 70% is electrical
Conduct powder collocation, this Low ESR electrical conductivity powder can select silver powder, silver-bearing copper powder, silver-colored aluminium powder, silver nickel powder and copper powder etc. and do not advised
Then type particle is arranged in pairs or groups, and optimal average particle size is about at 0.01 to 400 μm.
And, glue material can select such as：Epoxy resin, phenolic resin, acrylic resin, polyester vinyl acetate resin (PVAC), silicon
Plain (Silicon) resin or synthetic rubber etc., and the glue material can be with the one of previous materials or by more than two kinds materials mixing
Into.
In actual fabrication program, Low ESR electrical conductivity powder and glue material are via kneading after processing procedure, with wire mark or spraying
Mode, the one side of radiating part 110 set 0.005 to 0.2mm thickness circuit layer 120, and the molecular structure for passing through its glue material
Combined with close and firm, and reach the copper foil layer function of general printed circuit board (PCB).
Insulating barrier 130 is in the one side of circuit layer 120 and radiating part 110（Insulating barrier 130 is arranged at circuit layer
120 and radiating part 110 on）, it can be acted on as anti-soldering, made the element or IC that thermal source is produced in general circuit, be able to comprehensively
Property directly spread rapid radiating, thermal resistivity is greatly lowered, it is ensured that the efficiency and service life of electronic component 200；And, electronics
Element 200 preferably can be light emitting diode, but be not limited thereto.
The above-mentioned radiating part 110 being previously mentioned be used for by produced by electronic component 200 heat effectively discharge, its can by metal,
The materials such as ceramics, graphite, glass, plastic cement (conductive plastic) are made.Referring to Fig. 4, its for it is of the present utility model have wire mark or
Spray the second profile of the radiator of circuit.As illustrated, when radiating part is heat dissipation metal portion 110 ', heat dissipation metal portion
Between 110 ' and circuit layer 120 can wire mark or spraying containing equally distributed heat transfer powder and form thermally conductive insulating layer 140.
Thermally conductive insulating layer 140 includes heat transfer powder and the dispersion liquid for combining heat transfer powder particles
Body, and the heat transfer powder is uniformly distributed in dispersing liquid using processing procedure is kneaded.Heat transfer powder can select such as：Oxidation
The high electrical resistance powder such as aluminium, aluminium nitride, boron nitride, carborundum, and heat transfer powder can be by one of previous materials or by two kinds
Above material is mixed, and thermally conductive insulating layer 140 is had the electrical impedance 10 of high insulation-6To 10-19 Ω-cm.And heat transfer powder
Body material can be ball-type or irregular crystalline particle, and its suitable particle mean size is about at 0.01 to 100 μm.
And, heat transfer powder by technical finesse, its method such as with alcohols for example ethanol, isopropanol dissolving fluorine compounds or
Organosilicon etc. is hydrolyzed and (for example soaked), is added one of previous materials or is mixed by more than two kinds heat transfer powder body materials
Again with about 60 DEG C to 150 DEG C bakings of low temperature, the air on surface and hydrone are removed into the clean thermal conductive ceramic powder that must dry.
After the processing of heat transfer powder surface in addition to good dispersiveness is obtained, its surface also coats one layer of fluorine compounds or organosilicon completely
And sintering crystallization scattered etc. favourable powder and intermolecular crosslinking.
Heat transfer powder surface sinter fluent material configuration, it is optional with the following method：This aqueous liquids is alcohols and first
Base ethane and ketone (butanone), ether equal solvent, with corresponding order dissolving organosilicon phenolic aldehyde (phenol aldehyde modified organic silicon monomer) or
Organosilicon (modified organic silicon such as epoxy-phenolic aldehyde-polyester) and fourth is fine or the elastic gel such as neoprene or polysulfide adds colloidal sol
A little filler of (AlOH+H2O+ ethanol) sinters matching somebody with somebody for fluent material to dissolving each other completely and completing the heat transfer powder surface
Put.Furthermore, thermally conductive insulating layer 140 can sinter fluent material by above-mentioned surface and be mixed with the part by weight of heat transfer powder, with
High thermal conductivity and the material such as flexibility, temperature tolerance, shearing strength, ageing-resistant, peel strength, wear-resistant, impact resistance needed for obtaining
Material；In general, the thermally conductive insulating layer 140 generally from the surface sintering fluent material between 3% to 15% weight ratio with
Heat transfer powder collocation between 97% to 85%, to obtain about 3W/mk to the thermally conductive insulating layer 140 of 150W/mk heat transfer coefficients.
After above-mentioned heat transfer powder and surface sintering liquid are via mixing processing procedure, to be coated with or spray or screen painting etc.,
Set and be molded with repeatedly overlapped way, 0.01 leading to 15mm thickness is set out between radiating part 110 and circuit layer 120
Thermal insulation layer 140, the molecular structure for sintering fluent material by surface is combined with close and firm.
Referring to Fig. 5, its schematic diagram for the radiating part of the present utility model with wire mark or the radiator for spraying circuit.
As illustrated, the another side (one side i.e. relative with circuit layer) of radiating part 110 can have several radiating fins 111, for adding
Strong radiating effect.
From the above, the radiator of the present utility model with wire mark or spraying circuit is directly in a face wire mark of radiating part
Or spraying forms circuit layer, circuit board is set without extra, to reach radiating part and the purpose of circuit layer link, and with drop
Low cost and the effect for simplifying processing procedure；In addition, circuit layer 120 and insulating barrier 130 are mainly located at by the utility model has wire mark
Or one end of the radiator of spraying circuit, circuit composite radiating effect can be reached, comprehensive direct diffusion is rapid to be dissipated to carry out
Heat, is greatly reduced thermal resistivity, it is ensured that the efficiency of electronic component and effect of service life.
Embodiment described above is only explanation technological thought of the present utility model and feature, and its purpose makes to be familiar with this
The personage of skill can understand content of the present utility model and implement according to this, when can not with restriction patent model of the present utility model
Enclose, i.e., the equivalent change made generally according to the spirit disclosed in the utility model or modification should be covered of the present utility model
In the scope of the claims.
Claims (6)
1. a kind of radiator with wire mark or spraying circuit, it is characterised in that include：
Formed by wire mark or spraying containing equally distributed glue material and electrical conductivity powder, and there is wire mark or spray positioned at described
Circuit layer in the one side for the radiating part for applying the radiator of circuit；And
Insulating barrier in the one side of the circuit layer and the radiating part.
2. the radiator according to claim 1 with wire mark or spraying circuit, it is characterised in that the radiating part is gold
Belong to radiating part, wire mark or spraying contain equally distributed heat transfer powder and shape between the heat dissipation metal portion and the circuit layer
Into thermally conductive insulating layer.
3. the radiator according to claim 2 with wire mark or spraying circuit, it is characterised in that the thermally conductive insulating layer
Thickness be 0.01 to 15mm.
4. it is according to claim 1 with wire mark or spray circuit radiator, it is characterised in that the radiating part it is another
Simultaneously there are several radiating fins.
5. the radiator according to claim 1 with wire mark or spraying circuit, it is characterised in that the radiating part is pottery
Porcelain radiating part, plastic cement radiating part or glass radiating part.
6. the radiator according to claim 1 with wire mark or spraying circuit, it is characterised in that the thickness of the circuit layer
Spend for 0.005 to 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720070459.8U CN206430068U (en) | 2017-01-20 | 2017-01-20 | Radiator with wire mark or spraying circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720070459.8U CN206430068U (en) | 2017-01-20 | 2017-01-20 | Radiator with wire mark or spraying circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206430068U true CN206430068U (en) | 2017-08-22 |
Family
ID=59582836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720070459.8U Active CN206430068U (en) | 2017-01-20 | 2017-01-20 | Radiator with wire mark or spraying circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206430068U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108679583A (en) * | 2018-04-08 | 2018-10-19 | 伍连彬 | A kind of lighting apparatus and its manufacturing method |
-
2017
- 2017-01-20 CN CN201720070459.8U patent/CN206430068U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108679583A (en) * | 2018-04-08 | 2018-10-19 | 伍连彬 | A kind of lighting apparatus and its manufacturing method |
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