CN108679583A - A kind of lighting apparatus and its manufacturing method - Google Patents
A kind of lighting apparatus and its manufacturing method Download PDFInfo
- Publication number
- CN108679583A CN108679583A CN201810307290.2A CN201810307290A CN108679583A CN 108679583 A CN108679583 A CN 108679583A CN 201810307290 A CN201810307290 A CN 201810307290A CN 108679583 A CN108679583 A CN 108679583A
- Authority
- CN
- China
- Prior art keywords
- layer
- heat radiating
- lighting apparatus
- circuit
- radiating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention provides a kind of lighting apparatus and its manufacturing method, the lighting apparatus includes：Heat radiating material, the circuit layer being pasted onto on the heat radiating material surface, and at least one electronic component for being welded in the circuit layer on circuit.Lighting apparatus provided by the present invention is the process that manufacture pcb board is omitted, electronic component is pasted on heat radiating material, therefore the heat generated can be conducted directly by heat radiating material, intermediate link is not needed, therefore accumulation of heat will not be caused on electronic component, to extend the electronic component service life, simultaneously because not using PCB material, therefore the manufacturing cost of lighting apparatus is reduced.
Description
Technical field
The present invention relates to novel illumination electronic device field more particularly to a kind of lighting apparatus and its manufacturing methods.
Background technology
Present lamps and lanterns or display device backlight system are all to use electronic component and lamp bead, and welding is on circuit boards.
Circuit board is fixed on the device with heat sinking function again.It does so and has several drawbacks in that：
1, PCB circuit board is manufactured, needs, using hazardous chemicals such as sulfuric acid, to pollute environment.But the present invention does not use PCB.
2, the heat that lamp generates in luminescence process is needed first to be transmitted to pcb board, is then transmitted to again from PCB circuit board
On radiating element.PCB circuit board this intermediacy is increased, radiating efficiency is seriously affected.
3, increase cost using PCB circuit board.
4, need fixed PCB circuit board on radiating element, thus to increase hand labor cost, heat-conducting glue and other
The cost of raw material.
Therefore, the prior art is up for further improving.
Invention content
In view of above-mentioned shortcoming in the prior art, it is an object of the invention to provide to the user a kind of lighting apparatus and
Its manufacturing method overcomes and uses pcb board to carry electronic component in the prior art, increases cost and influences the defect of radiating efficiency.
First embodiment provided by the invention is：A kind of lighting apparatus, wherein including：Heat radiating material is pasted onto described dissipate
Circuit layer on hot substrate surface, and at least one electronic component for being welded in the circuit layer on circuit.
Optionally, insulating layer is additionally provided on the surface of the heat radiating material, the insulating layer is by gathering cruel resin, poly-vinegar
Phthalimide resin, poly- ammonia is cruel, epoxy resin, span carry out the manufacture of one or more of phthalimide resin, organic siliconresin
Insulated paint is coated in heat radiating material surface, is formed after solidification.
Optionally, the insulating layer is coated in the heat radiating material surface for being pasted with circuit layer.
Optionally, it is provided with mucigel between the circuit layer and insulating layer；
The circuit layer is fitted to using the mucigel on insulating layer.
Optionally, the heat radiating material is not pasted is provided with reflective layer on the surface of circuit layer；
And/or it is additionally provided with light reflecting cover above the heat radiating material, it is provided on the surface of the light reflecting cover reflective
Layer or the light reflecting cover have reflection function.
Second embodiment provided by the invention is a kind of manufacturing method of the lighting apparatus, wherein the manufacturer
The step of method includes：
Circuit layer is pasted on the surface of heat radiating material；
At least one electronic component is welded on the circuit in the circuit layer.
Optionally, the step of manufacturing method further includes：
One layer is coated by gathering cruel resin, poly-vinegar phthalimide resin, poly- ammonia cruel, epoxy resin, double on the surface of the heat radiating material
The insulated paint that the manufacture of one or more of Malaysia phthalimide resin, organic siliconresin is formed；
Insulating layer is formed after the insulated paint is carried out curing process.
Optionally, the step further includes：
One layer of mucigel is coated on the surface of the insulating layer；
By conductive membrane layer bedding on the mucigel, and carry out curing process；
The method for prolonging cutting or mold cutting with laser, according to the design in preinstalled circuit domain to coated with conductive film
Insulating layer is cut, and circuit layer is obtained.
Optionally, the step further includes：
The electronic component that will weld on the circuit in the circuit layer using mask is covered；
The spray insulation paint on the heat radiating material；
Mask is removed, the insulated paint forms reflective layer after carrying out curing process.
Optionally, the manufacturing method further includes：
Light reflecting cover is set above the heat radiating material, reflective layer or described is provided on the surface of the light reflecting cover
Light reflecting cover has reflection function.
Advantageous effect, the present invention provides a kind of lighting apparatus and its manufacturing method, the lighting apparatus includes：Radiate base
Material, the circuit layer being pasted onto on the heat radiating material surface, and at least one electricity for being welded in the circuit layer on circuit
Subcomponent.Lighting apparatus provided by the present invention is the process that manufacture pcb board is omitted, and electronic component is pasted heat radiating material
On, therefore the heat generated can be conducted directly by heat radiating material, not need intermediate link, therefore will not be in electronics member
Accumulation of heat is caused on part, to extend the electronic component service life, simultaneously because not using PCB material, therefore reduces equipment
Manufacturing cost.
Description of the drawings
A kind of Fig. 1 structural schematic diagrams of lighting apparatus provided by the invention；
Fig. 2 is a kind of manufacturing method flow chart of steps of lighting apparatus provided by the invention；
Fig. 3 is the structural schematic diagram one provided by the present invention that manufacture lighting apparatus is cut using mold；
Fig. 4 is the structural schematic diagram two provided by the present invention that manufacture lighting apparatus is cut using mold；
Fig. 5 is the structural schematic diagram three provided by the present invention that manufacture lighting apparatus is cut using mold.
Specific implementation mode
To make the objectives, technical solutions, and advantages of the present invention clearer and more explicit, develop simultaneously embodiment pair referring to the drawings
The present invention is further described.It should be appreciated that specific embodiment described herein is used only for explaining the present invention, and do not have to
It is of the invention in limiting.
Traditional lighting system, display, backlight of television system are all that LED lamp bead is welded on pcb board.But
Since LED light calorific value is big, and itself and pcb board can not effectively radiate.Therefore only the PCB modules for being welded with lamp bead are consolidated
It is scheduled on iron, aluminium, copper, ceramics, heat radiator or other base materials with heat sinking function.It is helped by radiator or base material
Heat dissipation is helped, has the function that cooling.It since pcb board heat dissipation performance itself is low, and manufactures pcb board and needs cost, so cannot
Reach preferably heat dissipation and inexpensive effect.
First embodiment provided by the invention is：A kind of lighting apparatus, as shown in Figure 1, the lighting apparatus includes：Heat dissipation
Base material 11, the circuit layer 14 being pasted onto on 11 surface of the heat radiating material, and be welded in the circuit layer 14 on circuit
At least one electronic component 12.
Lighting apparatus provided by the present invention, abandon it is traditional using pcb board carrying by the way of, directly by electronic component
It pastes on heat radiating material, heat radiating material directly conducts the heat that electronic component distributes, therefore can obtain preferably
Heat dissipation effect, and the lighting apparatus of the present invention is not due to needing pcb board, it is possible to save cost.
Specifically, in order to obtain better installation effect, insulating layer 13 is additionally provided on the surface of the heat radiating material 11,
The insulating layer 13 is by gathering cruel resin, poly-vinegar phthalimide resin, poly- ammonia cruel, epoxy resin, span come phthalimide resin, organic
The insulated paint of one or more of silicones manufacture is coated in 11 surface of heat radiating material, is formed after solidification.
By the insulating layer of above-mentioned setting, short circuit between circuit layer 14 and heat radiating material 11 is avoided, ensure that circuit layer
With the normal work of both heat radiating materials, while but also circuit layer fits closely with heat radiating material together with, improve thermal conductivity
Energy.
It is envisioned that in order to save cost, the insulating layer 13 can only be applied only to be pasted with dissipating for circuit layer
11 surface of hot substrate.
In order to realize that circuit layer is fitted tightly over, mucigel is provided between the circuit layer 14 and insulating layer 13；It is described
Circuit layer 14 is fitted to using the mucigel on insulating layer 13.The mucigel is mixed with the resin single group of heat conduction function raw material
Part glue or the resin double-component glue for being mixed with heat conduction function raw material.Wherein, the Heat Conduction Material of addition can be graphene,
Can also be aluminium nitride, aluminium oxide either other Heat Conduction Materials.If the thickness of mucigel than relatively thin, can also be not added with heat conduction
Material.In order to ensure that circuit layer paste List is needed to insulating layer, the coating position and area of the mucigel and the circuit of design
Keep 1：1 ratio.
Optionally, the heat radiating material 11 is not pasted is provided with reflective layer on the surface of circuit layer 14；The reflective layer by
White coating coats to be formed；Preferably, selection uses white resin coating.
And/or 11 top of heat radiating material is additionally provided with light reflecting cover, is provided on the surface of the light reflecting cover
Reflective layer, the reflective layer coated by white resin coating formed or the reflector itself have reflection function.
To the surface spraying white resin coating of possible extinction, the absorption to light is reduced.And reflective work can be formed
With making light be reflected toward the vertical direction of plane where circuit as far as possible.
Alternatively, the applying coating that other can be reflective can also be used, or a light reflecting cover is done, the above method is mutually tied
Conjunction reaches reflecting effect can.
Second embodiment provided by the invention is a kind of manufacturing method of the lighting apparatus, as shown in Fig. 2, the system
The step of making method include：
Step S21, circuit layer is pasted on the surface of heat radiating material；
Step S22, at least one electronic component is welded on the circuit in the circuit layer.
Further include before the step S21：
The surface of the heat radiating material of circuit layer to be pasted is cleaned, roughening treatment is preferably formed with.It can ensure to paste matter in this way
Measure higher.
Preferably, the step of manufacturing method, further includes：
One layer is coated by gathering cruel resin, poly-vinegar phthalimide resin, poly- ammonia cruel, epoxy resin, double on the surface of the heat radiating material
The insulated paint that the manufacture of one or more of Malaysia phthalimide resin, organic siliconresin is formed；
Insulating layer is formed after the insulated paint is carried out curing process.
Also may be used in the specific implementation specifically, applying one layer of insulated paint on the surface for carrying out the heat radiating material of roughening treatment
With only to the place coating of circuit layer to be pasted by gather cruel resin, poly-vinegar phthalimide resin, poly- ammonia cruel, epoxy resin, span Lai
The ultraviolet light insulated paint that phthalimide resin, organic siliconresin manufacture, and curing process is carried out, form insulating layer.It, can when implementing
In a manner of using purple light light irradiation, curing process is carried out to insulated paint.
Specifically, the step further includes：
One layer of mucigel is coated on the surface of the insulating layer；
By conductive membrane layer bedding on the mucigel, and carry out curing process；
Specifically, including the step of the surface of the insulating layer coats one layer of mucigel：
One piece of conductive film that can just cover all circuits of clip, clean rear smooth bedding is on being coated with the position of glue
And it is compacted.It is toasted 5 minutes or so in 80 degree of high-temperature cabinets, solidification can be completed in glue, and conductive film is secured on glue.It leads
Conductive film can be copper foil, aluminium foil, tinfoil paper, zinc foil or Alloy Foil, synthesize paper tinsel film.
Specifically, the method for manufacture circuit layer includes：
The method for prolonging cutting or mold cutting with laser, according to the design in preinstalled circuit domain to coated with conductive film
Insulating layer is cut, and circuit layer is obtained.
The edge cutting for prolonging sprayed glues part with laser, can also be cut with mold.Since the position of glue application is led
Conductive film has been stuck, and the partially electronically conductive film of glue will be because of the Automatic-falling by cutting.To form circuit.
It is produced with numerically-controlled machine tool completely the same with circuit in conjunction with shown in Fig. 3-Fig. 5 using the method that mold is cut
Two molds of male model and master mold（Male mould 31 in respectively Fig. 3 and master tooling 33）.The necessary convex-concave of two molds is symmetrical, completely
Unanimously.Wherein, master tooling is cavity plate, is through-hole mould, is made of smooth low carbon steel plate, and thickness is 3-5 millimeters.Male mould 31 is convex
The protrusion of mould must be consistent with die thickness.First by male mould 31, conductive film 32, master tooling 31,34 and of insulating layer
Heat radiating material 35, is arranged in order from top to bottom, then is overlapped mutually, and laminated state shown in Fig. 4 is obtained, and then utilizes punching press
Machine carries out punching press and obtains the semi-finished product for being superimposed with circuit layer, insulating layer and heat radiating material, as long as 10 kilograms of the pressure of wherein punching press
It can be operated realization above.
Electronic component 51 is welded in the circuit layer on the semi-finished product, the electronic component 51 can be lamp bead, or
Other power for illumination components of person.
In order to which more illuminating effect, the step further include：
The electronic component that will weld on the circuit in the circuit layer using mask is covered；
The spray insulation paint on the heat radiating material；
Mask is removed, the insulated paint is formed after carrying out curing process into reflective layer.
It is covered with mask and the pad of welding electronic component or lamp bead is needed to cover up.Position to being coated with glue sprays white
Color（Or other can be reflective）Insulated paint.It takes away and is shaped after carrying out curing process after mask.
In pad locations, electronic component, LED and other luminescent devices are welded according to circuit diagram.It can use by hand
Soldering can also use chip mounter automatic chip mounting, then be welded after reflow machine.
Specifically, the manufacturing method further includes：
Light reflecting cover is set above the heat radiating material, reflective layer is provided on the surface of the light reflecting cover, it is described reflective
Layer is coated by white coating to be formed.
The present invention provides a kind of lighting apparatus and its manufacturing method, the lighting apparatus includes：Heat radiating material is pasted onto
Circuit layer on the heat radiating material surface, and at least one electronic component for being welded in the circuit layer on circuit.This
The there is provided lighting apparatus of invention is the process that manufacture pcb board is omitted, and electronic component is pasted on heat radiating material, therefore is produced
Raw heat can be conducted directly by heat radiating material, not need intermediate link, therefore will not be caused on electronic component
Accumulation of heat simultaneously because not using PCB material, therefore reduces being manufactured into for equipment to extend the electronic component service life
This.
It, can according to the technique and scheme of the present invention and its hair it is understood that for those of ordinary skills
Bright design is subject to equivalent substitution or change, and all these changes or replacement should all belong to the guarantor of appended claims of the invention
Protect range.
Claims (10)
1. a kind of lighting apparatus, which is characterized in that including：Heat radiating material, the circuit layer being pasted onto on the heat radiating material surface,
And at least one electronic component on circuit is welded in the circuit layer.
2. lighting apparatus according to claim 1, which is characterized in that be additionally provided with insulation on the surface of the heat radiating material
Layer, the insulating layer be by gather cruel resin, poly-vinegar phthalimide resin, poly- ammonia cruel, epoxy resin, span come phthalimide resin, have
The insulated paint of one or more of machine silicones manufacture is coated in heat radiating material surface, is formed after solidification.
3. lighting apparatus according to claim 2, which is characterized in that the insulating layer, which is coated in, is pasted with dissipating for circuit layer
Hot substrate surface.
4. lighting apparatus according to claim 3, which is characterized in that be provided with viscose between the circuit layer and insulating layer
Layer；
The circuit layer is fitted to using the mucigel on insulating layer.
5. lighting apparatus according to claim 3, which is characterized in that the heat radiating material is not pasted on the surface of circuit layer
It is provided with reflective layer；
And/or it is additionally provided with light reflecting cover above the heat radiating material；
Reflective layer or the light reflecting cover are provided on the surface of the light reflecting cover has reflection function.
6. a kind of manufacturing method of lighting apparatus as described in claim 1, which is characterized in that the step of manufacturing method wraps
It includes：
Circuit layer is pasted on the surface of heat radiating material；
At least one electronic component is welded on the circuit in the circuit layer.
7. the manufacturing method of lighting apparatus according to claim 6, which is characterized in that the step of manufacturing method also wraps
It includes：
One layer is coated by gathering cruel resin, poly-vinegar phthalimide resin, poly- ammonia cruel, epoxy resin, double on the surface of the heat radiating material
The insulated paint that the manufacture of one or more of Malaysia phthalimide resin, organic siliconresin is formed；
Insulating layer is formed after the insulated paint is carried out curing process.
8. the manufacturing method of lighting apparatus according to claim 7, which is characterized in that the step further includes：
One layer of mucigel is coated on the surface of the insulating layer；
By conductive membrane layer bedding on the mucigel, and carry out curing process；
The method for prolonging cutting or mold cutting with laser, according to the design in preinstalled circuit domain to coated with conductive film
Insulating layer is cut, and circuit layer is obtained.
9. the manufacturing method of lighting apparatus according to claim 8, which is characterized in that the step further includes：
The electronic component that will weld on the circuit in the circuit layer using mask is covered；
The spray insulation paint on the heat radiating material；
Mask is removed, the insulated paint forms reflective layer after carrying out curing process.
10. the manufacturing method of lighting apparatus according to claim 8, which is characterized in that the manufacturing method further includes：
Light reflecting cover is set above the heat radiating material, reflective layer or described is provided on the surface of the light reflecting cover
Light reflecting cover has reflection function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810307290.2A CN108679583A (en) | 2018-04-08 | 2018-04-08 | A kind of lighting apparatus and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810307290.2A CN108679583A (en) | 2018-04-08 | 2018-04-08 | A kind of lighting apparatus and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108679583A true CN108679583A (en) | 2018-10-19 |
Family
ID=63800737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810307290.2A Pending CN108679583A (en) | 2018-04-08 | 2018-04-08 | A kind of lighting apparatus and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108679583A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022049181A1 (en) * | 2020-09-03 | 2022-03-10 | Signify Holding B.V. | A lighting board and luminaire using the lighting board |
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