CN204573961U - Radiator with embedded lines and LED module - Google Patents
Radiator with embedded lines and LED module Download PDFInfo
- Publication number
- CN204573961U CN204573961U CN201520243168.5U CN201520243168U CN204573961U CN 204573961 U CN204573961 U CN 204573961U CN 201520243168 U CN201520243168 U CN 201520243168U CN 204573961 U CN204573961 U CN 204573961U
- Authority
- CN
- China
- Prior art keywords
- radiator
- line layer
- embedded
- layer
- metal level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides a kind of radiator with embedded lines and LED module, radiator comprises radiator, it forms the line layer be embedded in radiator on the surface, and line layer comprises corrosion resistant metal level and heat radiating metallic layer, and line layer only has outer face to expose on the surface of radiator.The LED that this LED module comprises above-mentioned radiator and is arranged on radiator.Radiator manufacturing process of the present utility model is simple, and production cost is low, and good heat dissipation effect.
Description
Technical field
The utility model relates to LED lamp field, specifically, and the LED module relating to a kind of radiator with embedded lines and use this radiator to make.
Background technology
LED light device adopts light emitting diode (LED) as light-emitting component, and the advantages such as energy-conserving and environment-protective, consumed power are low, long service life that it has, are widely used in various illumination occasion.Existing LED light device has a LED module, and existing LED module has a printed circuit board, and printed circuit board (PCB) is provided with LED chip, excites LED chip luminous during LED light device work by powering to LED chip.
A large amount of heats is produced due to during LED chip luminescence, therefore LED light device needs to arrange the radiator be made up of the metals such as aluminium or the good material of other heat conductivilitys and distributes in time with heat LED chip produced, and avoids LED chip being gathered too much heat and causing the temperature of LED chip too high.In existing LED light device, printed circuit board (PCB) usually with radiator close contact, heat guide radiator after printed circuit board (PCB) of LED chip generation, is distributed heat in air by radiator.
In addition, LED light device is typically provided with a shell, and radiator is arranged on shell usually, and part heat sink will expose outside outside shell outward, is convenient to the ardent of radiator and is dispersed in air rapidly, thus distributed by the heat that LED chip produces.
During owing to making LED light device, need to make printed circuit board (PCB), also need to manufacture radiator, shell etc., during assembled LED lighting device, need printed circuit board (PCB) to be installed on radiator, then radiator is installed on shell.Like this, the packaging technology of LED light device is complicated, and production efficiency is low.Further, due to printed circuit board (PCB), often thickness is comparatively large, often causes the volume of LED light device comparatively large, be unfavorable for the miniaturization realizing LED light device after printed circuit board (PCB) being arranged on radiator.In addition, the printed circuit board (PCB) that thickness is larger also can affect the capacity of heat transmission of printed circuit board (PCB), causes the heat of LED chip cannot be passed to radiator in time, affects the radiating effect of LED light device.In addition, because printed circuit board (PCB) needs to fix on a heat sink, existing way arranges the device be fixedly connected with to be fixed on a heat sink by printed circuit board (PCB), but this method easily causes printed circuit board (PCB) to come off from radiator, even causes LED light device to be damaged.
Publication number is the innovation and creation that the Chinese invention patent application of CN102980066A discloses one " without substrate LED and preparation method thereof ", the method is that injection moulding forms insulator foot, then laser-induced thermal etching is carried out to base, base forms groove, then on base, adopt the method for chemical plating to form the coat of metal, namely form circuit, finally LED chip is mounted on the coat of metal.Although the LED light device made by the method does not have printed circuit board (PCB), form groove because needs etch on base, large to the difficulty of processing of base, the production cost of LED light device is high.
Summary of the invention
First object of the present utility model is to provide a kind of with embedded lines and the low radiator of production cost.
Second object of the present utility model is to provide a kind of good heat dissipation effect and the low LED module of production cost.
In order to realize the first above-mentioned object, the radiator with embedded lines that the utility model provides comprises radiator, radiator at least one be formed with line layer on the surface, wherein, line layer is embedded in radiator, line layer comprises the heat radiating metallic layer be positioned at inside the outermost corrosion resistant metal level of line layer and close radiator, and line layer only has outer face to expose on the surface of radiator, and the outer face of line layer is concordant with the surface being embedded with line layer in radiator.
From such scheme, the line layer of radiator wrap up by radiator, and line layer comprises corrosion resistant metal level and heat radiating metallic layer, generation circuit layer on the substrate can first made at easy etched metals such as copper when making radiator, then on substrate, injection moulding forms radiator, is finally fallen by the metal substrate etch such as copper thus forms the radiator with line layer.Do not need to make printed circuit board (PCB) when using such radiator to make LED light device, and line layer is directly embedded in radiator, good heat dissipation effect.
In addition, the technique manufacturing radiator is simple, owing to not needing to etch the groove being formed and hold line layer on a heat sink, reduces the production cost of radiator, also improves the production efficiency of radiator.
A preferred scheme is that radiator is injection molded by heat-conducting plastic.Heat-conducting plastic is the plastics containing Heat Conduction Materials such as graphite, because graphite has good heat conductivility, during injection moulding radiator, graphite is mixed into the radiating effect that greatly can improve radiator in plastics.
Further scheme is, corrosion resistant metal level is formed by gold, and heat radiating metallic layer is formed by copper, is also formed with tin layers between corrosion resistant metal level and heat radiating metallic layer.
Visible, by tin, gold and copper are bonded, gold and the bonding force of copper can be improved, avoid corrosion resistant metal level to come off from radiator.
For realizing the second above-mentioned object, the LED module that the utility model provides comprises radiator, radiator comprises a radiator, radiator at least one be formed with line layer on the surface, wherein, line layer is embedded in radiator, line layer comprises the heat radiating metallic layer be positioned at inside the outermost corrosion resistant metal level of line layer and close radiator, line layer only has outer face to expose on the surface of radiator, and the outer face of line layer is concordant with the surface being embedded with line layer in radiator, the outer face of line layer is provided with LED.
As can be seen here, above-mentioned LED module can be easy on etched metal substrate by being previously formed in by line layer, then injection moulding forms radiator on metallic substrates, is finally etched away by metal substrate thus is exposed at outside corrosion resistant metal level on radiator outer face.Such processing technology can reduce the production cost of LED module greatly, and saves the technique making printed circuit board (PCB), improves the production efficiency of LED module.
Accompanying drawing explanation
Fig. 1 is the sectional view of the radiator embodiment of the utility model band embedded lines.
Fig. 2 is the partial enlarged drawing of Fig. 1.
Fig. 3 is the structure chart of coated with resins on copper base in the radiator manufacture method embodiment of the utility model band embedded lines.
Fig. 4 is the structure chart forming line layer groove in the radiator manufacture method embodiment of the utility model band embedded lines.
Fig. 5 is the structure chart forming line layer in the radiator manufacture method embodiment of the utility model band embedded lines.
Fig. 6 is the partial enlarged drawing of Fig. 5.
Fig. 7 is the structure chart in the radiator manufacture method embodiment of the utility model band embedded lines after Scavenger resin.
Fig. 8 is the partial enlarged drawing of Fig. 7.
Fig. 9 is the structure chart in the radiator manufacture method embodiment of the utility model band embedded lines after injection moulding radiator.
Below in conjunction with drawings and Examples, the utility model is described in further detail.
Detailed description of the invention
LED module of the present utility model is also installed in the enclosure as the major part of LED light device, LED module comprises radiator and is mounted on the LED such as LED chip on radiator, and LED module of the present utility model does not arrange printed circuit board (PCB), therefore line layer is directly embedded in radiator, thus improves the radiating efficiency of LED chip.
See Fig. 1, radiator of the present utility model comprises and has radiator 10, and the shape of radiator 10 designs according to the actual requirement of different LED lighting device, and the radiator 10 of Fig. 1 is a kind of common radiator shape.Radiator 10 is injection molded by heat-conducting plastic, and preferably, the heat-conducting plastic that the present embodiment uses refers to the plastics containing graphite, and graphite can be grind to form powdered graphite or mix in the plastic in the mode of graphite granule.Because graphite has good heat conductivility, the radiator 10 using the plastics injection moulding being mixed with graphite to be formed has good heat dispersion.
The lower surface of radiator 10 is formed with line layer, and the outer face of line layer forms pad and connects the circuit of multiple pad, and LED chip can be mounted on pad.See Fig. 2, line layer is embedded on the lower surface of radiator 10, in the present embodiment, line layer is made up of three-layer metal, being positioned at line layer outermost is corrosion resistant metal level 11, is formed by gold, and being positioned at inside near radiator 10 is heat radiating metallic layer 13, formed by copper, between corrosion resistant metal level 11 and heat radiating metallic layer 13, be formed with tin layers 12.Jin Yutong can be bonded together by tin layers 12 securely, avoids gold to come off from line layer.Corrosion resistant metal level 11 can do very thin with the thickness of heat radiating metallic layer 13, between 0.1 millimeter to 1 millimeter, can certainly adjust the thickness of corrosion resistant metal level 11 and heat radiating metallic layer 13 according to actual needs.
Line layer is embedded in radiator 10, and only have be exposed at radiator 10 outside outer face lower surface on, and the outer face of line layer is concordant with the lower surface of radiator 10, other surface is all wrapped up by radiator 10, and such line layer not easily comes off from radiator 10.And, line layer and radiator 10 are close contacts, and the contact area of line layer and radiator 10 is comparatively large, rapidly the heat that LED chip produces can be passed to radiator 10, and by radiator 10 horizontal proliferation rapidly, be finally distributed in air by radiator 10.
Certainly, radiator 10 also can form line layer on multiple surfaces, as multiple surfaces of radiator 10 all form line layer, line layer then on each surface is all embedded in radiator 10, and all corresponding to radiator 10 surface, the outer face of line layer is concordant, line layer only has outer face to expose on the corresponding surface of radiator 10.
LED module of the present utility model comprises radiator as shown in Figure 1, and also comprise the LED chip be mounted on pad that line layer formed, LED chip can be fixed on line layer by surface-pasted technique.Certainly, LED chip also can pass through other techniques, as welding etc. is fixed on line layer.In addition, the alternative LED chip such as LED device, LED lamp bead can be used as LED.
When manufacturing radiator, as shown in Figure 3, first coated with resins 21,22 on one piece of copper base 20, thus formation mask, copper base 20 is one piece of smooth substrate be made of copper, thickness can between 0.2 millimeter to 0.3 millimeter, and resin 21, resin 22 are coated on copper base about 20 two surfaces respectively, and the thickness of the Thickness Ratio copper base 20 of resin 21, resin 22 is slightly thin.Certainly, forming the process not necessarily coated with resins on copper base 20 of mask, also can be immersed on the resin of liquid by copper base 20, thus forms mask.
Then, by copper base 20 surface needing the resin 21 in the region forming line layer remove, line layer groove 23 is formed, as shown in Figure 4.Line layer is pre-designed pattern, line layer comprises pad, connect the circuit etc. of pad and design complete in advance, during Scavenger resin 21, the resin of respective regions on copper base 20 washes by the pattern according to pre-designed line layer, thus forms line layer groove 23.
Then, gold-plated at the copper base 20 being formed with line layer groove 23, form line layer, as shown in figs. 5 and 6.Because the line layer of the present embodiment is made up of three-layer metal, the surface of copper base 20 is corrosion resistant metal level 11, tin layers 12 and heat radiating metallic layer 13 respectively, and time gold-plated, three-layer metal is plated in the line layer groove 23 of copper base 20 successively.
When forming line layer, first gold-plated to copper base 20, form the corrosion resistant metal level 11 be made up of gold.Corrosion resistant metal level 11 of the present utility model refers to the metal level formed by not easily etched metals such as gold.Because copper base 20 does not need the surface of formation line layer is coated with resin, time gold-plated, gold can not be attached on copper base 20, thus guarantees not need the region of formation circuit forms line layer.
After gold-plated, more zinc-plated to copper base 20, tin layers 12 will be formed on corrosion resistant metal level 11, and be covered by corrosion resistant metal level 11.Finally, to copper base 20 degree of copper, form heat radiating metallic layer 13, heat radiating metallic layer 13 of the present utility model refers to the metal level that the metal having excellent heat dispersion performance by copper etc. is formed.Jin Yutong can be bonded together securely by tin layers 12.
Certainly, three-layer metal can use various technique to be formed, and is formed in line layer groove 23 as used the mode such as chemical plating, plating.In addition, the line layer of the present embodiment is made up of the metal be formed in line layer groove 23.
Then, resin 21,22 on copper base 20 surface is removed, NaOH is such as used to clean the copper base 20 being formed with line layer, copper base 20 after cleaning as illustrated in figs. 7 and 8, only remaining line layer on the upper surface of copper base 20, line layer is included in corrosion resistant metal level 11, tin layers 12 and the heat radiating metallic layer 13 that copper base 20 upper surface is formed successively.
Finally on the copper base 20 being formed with line layer, injection moulding forms radiator 10, and as shown in Figure 9, the radiator 10 after injection moulding is positioned on the upper surface of copper base 20, and line layer wraps up by radiator 10 completely.During injection moulding, copper base 20 is placed in injection mold, with the surface of line layer towards the die cavity of mould, and the plastics being mixed with graphite is carried out injection moulding, thus form the radiator 10 of given shape.Due to the substrate that copper base 20 is surperficial smooth, after injection moulding, the lower surface of radiator 10 is also smooth surface, and the outer face of line layer is concordant with the lower surface of radiator 10.
Underside shape in order to ensure radiator 10 is the shape designed in advance, and the area of copper base 20 needs the surface being greater than radiator 10 lower surface, and the surface that therefore radiator 10 is adjacent with copper base 20 is positioned at the upper surface of copper base 20 completely.
Finally, etched away by copper base 20, the lower surface of radiator 10 and the outer face of line layer expose out, thus complete the manufacture of radiator.Because radiator 10 is injection molded by plastics, therefore can not be etched, radiator 10 can keep in good condition.In addition, because line layer is corrosion resistant metal level 11 near copper base 20, formed by gold in the present embodiment, therefore also not easily etched, in the process etch copper base 20, corrosion resistant metal level 11 can not be etched, and therefore line layer also can not be caused to be etched to the etching of copper base 20.
As shown in Figure 1, line layer is positioned at the lower surface of radiator 10 to radiator after etching, and line layer only has outer face to expose on the lower surface of radiator 10.
When applying above-mentioned radiator manufacture LED module, only need to mount LED chip on the pad that the line layer of radiator is corresponding.
Certainly, not necessarily wanting copper base as substrate when manufacturing radiator, can be that the easy etched metals such as aluminium base fake metal substrate.
Do not need to form groove by laser engraving technique on radiator 10 in process due to manufacture radiator, greatly can reduce the manufacturing cost of radiator like this, and the technique of groove is formed relative to laser engraving, radiator manufacture method efficiency of the present utility model is better, can improve the production efficiency of radiator and LED module.
In addition, because LED module does not arrange printed circuit board (PCB), and line layer is embedded in radiator 10 completely, line layer not easily comes off from radiator, and the thickness of line layer can do very thin, the heat that LED chip produces can be passed to radiator 10 rapidly, improves the radiating efficiency of radiator.
Certainly, above-described embodiment is only the preferred embodiment of the utility model, also can have more change during practical application, and such as, heat radiating metallic layer can use aluminium etc., and other have the metal substitute of good heat conductive performance; Or the metal of bonding corrosion resistant metal level and heat radiating metallic layer can use the metal substitutes such as nickel; Or line layer can be made up of more multi-layered metal, and such change can't affect enforcement of the present utility model.
Finally it is emphasized that the utility model is not limited to above-mentioned embodiment, as the change such as the change of radiator shape, the change of line layer shape also should be included in the protection domain of the utility model claim.
Claims (6)
1. be with the radiator of embedded lines, comprise
Radiator, described radiator at least one be formed with line layer on the surface;
It is characterized in that:
Described line layer is embedded in described radiator, described line layer comprises the heat radiating metallic layer be positioned at inside described line layer outermost corrosion resistant metal level and close described radiator, described line layer only has outer face to expose on the surface of described radiator, and the outer face of described line layer is concordant with the surface being embedded with described line layer in described radiator.
2. the radiator of band embedded lines according to claim 1, is characterized in that:
Described radiator is injection molded by heat-conducting plastic.
3. the radiator of band embedded lines according to claim 1 and 2, is characterized in that:
Described corrosion resistant metal level is formed by gold, and described heat radiating metallic layer is formed by copper, is also formed with tin layers between described corrosion resistant metal level and described heat radiating metallic layer.
4.LED module, comprises
Radiator, described radiator comprises a radiator, described radiator at least one be formed with line layer on the surface;
It is characterized in that:
Described line layer is embedded in described radiator, described line layer comprises the heat radiating metallic layer be positioned at inside described line layer outermost corrosion resistant metal level and close described radiator, described line layer only has outer face to expose on the surface of described radiator, and the outer face of described line layer is concordant with the surface being embedded with described line layer in described radiator;
The outer face of described line layer is provided with LED.
5. LED module according to claim 4, is characterized in that:
Described radiator is injection molded by heat-conducting plastic.
6. the LED module according to claim 4 or 5, is characterized in that:
Described corrosion resistant metal level is formed by gold, and described heat radiating metallic layer is formed by copper, is also formed with tin layers between described corrosion resistant metal level and described heat radiating metallic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520243168.5U CN204573961U (en) | 2015-04-21 | 2015-04-21 | Radiator with embedded lines and LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520243168.5U CN204573961U (en) | 2015-04-21 | 2015-04-21 | Radiator with embedded lines and LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204573961U true CN204573961U (en) | 2015-08-19 |
Family
ID=53866589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520243168.5U Expired - Fee Related CN204573961U (en) | 2015-04-21 | 2015-04-21 | Radiator with embedded lines and LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204573961U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104791734A (en) * | 2015-04-21 | 2015-07-22 | 乐健科技（珠海）有限公司 | Heat sink with embedded circuit, manufacturing method thereof, LED module and manufacturing method thereof |
-
2015
- 2015-04-21 CN CN201520243168.5U patent/CN204573961U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104791734A (en) * | 2015-04-21 | 2015-07-22 | 乐健科技（珠海）有限公司 | Heat sink with embedded circuit, manufacturing method thereof, LED module and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9482416B2 (en) | Flexible light emitting semiconductor device having a three dimensional structure | |
| CN203932096U (en) | Flexible light-emitting semiconductor device and for supporting and be electrically connected the flexible article of light-emitting semiconductor device | |
| US9698563B2 (en) | Flexible LED device and method of making | |
| TWI414716B (en) | Method of manufacturing an interconnect device which forms a heat sink and electrical connections between a heat generating device and a power source | |
| JP2011139008A (en) | Chip-on-board metal substrate structure having heat and electricity conduction paths separated | |
| CN107331659B (en) | LED circuit board, terminal equipment and manufacturing method of LED circuit board | |
| US20070215896A1 (en) | Light emitting diode package structure and method of manufacturing the same | |
| KR101367360B1 (en) | Flexible heat dissipating substrate for led lighting module and led lighting module with the same | |
| KR101134671B1 (en) | LED lamp module with the cooling structure | |
| WO2009022808A2 (en) | Circuit board for light emitting device package and light emitting unit using the same | |
| CN101509649A (en) | LED heat radiation structure and method for manufacturing the heat radiation structure | |
| CN114464608B (en) | COB (chip on board) double-color light source of photographic lamp and packaging method thereof | |
| US20100301365A1 (en) | Light emitting diode module and manufacture method thereof | |
| CN204573961U (en) | Radiator with embedded lines and LED module | |
| TW201705825A (en) | Multilayer substrate for a light emitting semi-conductor device package | |
| KR20120100303A (en) | Printed circuit board, light emitting module having the same, lighting unit having the light emitting unit and method of manufacturing the light emitting mudule | |
| CN104791734A (en) | Heat sink with embedded circuit, manufacturing method thereof, LED module and manufacturing method thereof | |
| KR101363070B1 (en) | Led lighting module | |
| KR101235176B1 (en) | Method for manufacturing high-heat dissipation circuit substrate useful to LED | |
| KR100616413B1 (en) | Light emitting diode and method of manufacturing the same | |
| KR101305543B1 (en) | Optical semiconductor based lighting apparatus and its manufacturing method | |
| KR100859496B1 (en) | Fabrication Method of LED Lamp | |
| CN203799604U (en) | LED display unit module with enhanced heat dissipation performance | |
| JP2015018847A (en) | Led module and illumination device including the same | |
| CN203309568U (en) | Led lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 Termination date: 20200421 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |