CN101472449A - Combined structure and method of radiator and circuit - Google Patents
Combined structure and method of radiator and circuit Download PDFInfo
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- CN101472449A CN101472449A CNA2007103056367A CN200710305636A CN101472449A CN 101472449 A CN101472449 A CN 101472449A CN A2007103056367 A CNA2007103056367 A CN A2007103056367A CN 200710305636 A CN200710305636 A CN 200710305636A CN 101472449 A CN101472449 A CN 101472449A
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Abstract
The invention relates to a combination structure of a heat radiator and a circuit, as well as a combination method thereof. The structure comprises an extrusion-type aluminum-base plate, a first insulating layer, a conducting layer, a second insulating layer and an electronic element, wherein, the extrusion-type aluminum-base plate is covered with the first insulating layer; the conducting layer is wired on the first insulating layer and provided with a conducting wire and a plurality of guidance and connection points; the conducting wire is covered with the second insulating layer; the electronic element is provided with two conducting terminals; and the two conducting terminals are electrically connected with each guidance and connection point respectively. In addition, the invention further provides the method for combining the heat radiator and the circuit. Therefore, the invention can not only shorten process time and save the element consumption, thereby reducing the cost, but also increase the thermal conduction efficiency and improve the radiating efficiency.
Description
Technical field
The present invention relates to a kind of integrated structure, relate in particular to the integrated structure and the associated methods of a kind of radiator and circuit.
Background technology
Because light-emitting diode (LED) has good brightness, long life-span, plurality of advantages such as power saving more, is widely used on indoor or outdoor light structures or the device by manufacturer at present.Yet, how to reduce cost of manufacture and significantly reduce the use of element, thereby lighting device can cheaper price be accepted extensively and adopt by masses, be the important topic that the present invention studies.
Existing light-emitting diode is that the Chinese invention patent application of CN1893122A is disclosed as publication number, and it is provided with two installing holes on a substrate, and in the substrate upper fixed at the interval of this two installing hole diode chip for backlight unit is arranged.This diode chip for backlight unit and substrate are insulated with alumina layer, and are connected with two wiring respectively above diode chip for backlight unit, and diode chip for backlight unit and two wiring are coated by the glue closure material.In addition corresponding to the outside involution of this glue closure material lens are arranged at substrate.Like this, promptly be combined into light-emitting diode.Desire to be applied to light structures or when device when this light-emitting diode, then on the plane of a radiator, be processed with most screws, wear the installing hole of light-emitting diode again by retaining elements such as screws one by one, thereby reach combining of radiator and light-emitting diode.
Summary of the invention
A purpose of the present invention is to solve the problem of electronic element radiating, wherein the invention provides the integrated structure and the associated methods of a kind of radiator and circuit, makes circuit or electronic component can more press close to radiator, to increase radiating efficiency.
Another object of the present invention, be to provide the integrated structure and the associated methods of a kind of radiator and circuit, it directly welds light-emitting diode and ties on composite membrane and extrusion pressing type aluminium base, not only can effectively shorten integrally-built built-up time, more the use of retaining elements such as screw be can omit, and assembly cost and element cost significantly reduced.
Another purpose of the present invention is to provide the integrated structure and the associated methods of a kind of radiator and circuit, and it attaches mutually with the extrusion pressing type aluminium base by light-emitting diode and contacts, and increases the heat conduction usefulness of light structures and promote radiating efficiency.
In order to reach described purpose, integrated structure according to radiator provided by the invention and circuit, comprise extrusion pressing type aluminium base, first insulating barrier, conductive layer, second insulating barrier and at least one electronic component, first insulating barrier is covered on the described extrusion pressing type aluminium base, conductive layer wiring (layout) is on described first insulating barrier, and wherein said conductive layer has conducting wire and a plurality of connecting a little; Second insulating barrier is covered on the described conducting wire; Electronic component has at least two conducting terminals, and described two conducting terminals are electrically connected with each described connecting respectively.
In order to reach described purpose, the associated methods according to a kind of radiator provided by the invention and circuit comprises:
One first insulating barrier is pasted on the extrusion pressing type aluminium base;
One conductive layer wiring (layout) on described first insulating barrier, there are conducting wire and a plurality of connecting a little on the wherein said conductive layer;
One second insulating barrier is pasted on the described conducting wire; And
Two conducting terminals of one electronic component are pasted on described these respectively connect a little, described conducting terminal and described these are connected be electrically connected.
In order to reach described purpose, the associated methods according to another kind of radiator provided by the invention and circuit comprises the steps:
One extrusion pressing type aluminium base is provided;
One composite membrane is provided, and described composite membrane has first insulating barrier, conductive layer and second insulating barrier, and wherein said conductive layer has a plurality of connecting a little;
Described extrusion pressing type aluminium base of hot pressing and described composite membrane are pasted described extrusion pressing type aluminium base and described composite membrane; And
Two conducting terminals of one electronic component are pasted on described a plurality of connecting a little respectively, described conducting terminal is electrically connected with described a plurality of connecting.
Description of drawings
Fig. 1 is a manufacture method flow chart of the present invention;
Fig. 2 is that aluminium base of the present invention is in conjunction with conductive layer and each insulating barrier vertical view;
Fig. 3 is the 3-3 cutaway view of Fig. 2;
Fig. 4 is an assembled sectional view of the present invention;
Fig. 5 is the another embodiment of the present invention assembled sectional view;
Fig. 6 is the another embodiment of the present invention assembled sectional view;
Fig. 7 is an embodiment assembled sectional view more of the present invention;
Fig. 8 is another manufacture method flow chart of the present invention;
Fig. 9 is the produced integrated structure of method shown in Figure 8.
Embodiment
In the combining of known aluminium base and light-emitting diode, aluminium base cuts off through punching press with the en plaque of fine aluminium A1100 or A1050 etc. and forms, and after its combination mostly adopts indivedual making, carries out solid lock one by one with retaining elements such as screws again and connect.Not only need to expend a large amount of assembling manpowers, also have the cost problem of retaining elements such as screw, thereby significantly reduce its practicality and economic benefit.
Below in conjunction with accompanying drawing technology contents of the present invention is elaborated, yet institute's accompanying drawing is only for reference and the usefulness of explanation, is not to be used for the present invention is limited.
Please refer to shown in Fig. 1-4, the associated methods according to a kind of radiator provided by the invention and circuit comprises the steps:
At first, one first insulating barrier 10 is pasted on the extrusion pressing type aluminium base 20 (as shown in Figure 3).In this step, extrusion pressing type aluminium base 20 is generally radiator material, and it is good with aluminium alloys such as A6063, A6061, and it has plate body 21.Plate body 21 has last plane 211 and is formed at the lower plane 212 of 211 belows, plane, the lower plane 212 of plate body 21 is arranged on the workbench (not shown), again with first insulating barrier 10 of epoxy resin etc. with the screen painting method, drench a curtain rubbing method, spraying process or pressure sintering and be pasted on the last plane 211 of plate body 21.
Secondly, a conductive layer 30 is connected up (layout) on first insulating barrier 10.Conducting wire 31 and a plurality of connecting a little 32 (as shown in Figure 2) are wherein arranged on the conductive layer 30.In this step, this conductive layer 30 is goldleaf or Copper Foil, is that embodiment illustrates with the Copper Foil at this.Then with this Copper Foil with after 10 stickups of aforesaid first insulating barrier combine, again conductive layer 30 is carried out etching, and form a conducting wire 31 and corresponding mutually in twos and be formed at conducting wire 31 connect a little 32, and form one and conducting wire 31 non-touching binding sites 33 in office two adjacent first insulating barriers 10 that connect a little 32 interval.In addition, also can lay a composite copper foil layer at first insulating barrier 10, wherein the composite copper foil layer has a copper foil layer and a barrier layer (not shown).Other uses circuit shielding shielding on this barrier layer, and with illumination, ultraviolet light for example, according to being located at the place that is not shielded by circuit, again with the irradiated barrier layer of a chemistry flushing, then further remove the copper foil layer under the irradiated barrier layer again, remove the circuit shielding then, wash the whole of this barrier layer with chemistry at last.The circuit shielding mode promptly is equal to the method for aforementioned circuit etching, and purpose is to realize the circuit of copper foil layer.Generation as for copper foil circuit should have multiple different producing method, and the present invention is not limited.
One second insulating barrier 40 is pasted on (as shown in Figure 2) on the conducting wire 31.In this step, with second insulating barrier 40 of epoxy resin etc. with the screen painting method, drench a curtain rubbing method, spraying process or pressure sintering and be pasted on the conducting wire 31 of aforementioned conductive layer 30, aforesaid respectively connect a little 32 and each binding site 33 then be naked state.Second insulating barrier 40 is mainly used in impaired in the isolated soldering tin technique, more can avoid the oxidative phenomena of conducting wire 31.
At last, two conducting terminals 54,55 of an electronic component 50 are pasted on these respectively connect a little on 32, make conducting terminal 54,55 32 be electrically connected (as shown in Figure 4) with connecting a little.The electronic component 50 of present embodiment describes with light-emitting diode, in this step, this electronic component 50 have base plate 51, insulation be connected in the diode chip for backlight unit 52, involution of base plate in the lens 53 of diode chip for backlight unit 52 outsides, and two be connected to diode chip for backlight unit 52 and protrude out the conducting terminal 54,55 that exposes in lens 53 outsides.Wherein the material of base plate 51 can be copper or aluminium.During making, aforesaid connect a little 32 and binding site 33 on smear bonds such as tin cream, again with the base plate 51 of electronic component 50 corresponding to aforesaid binding site 32, each conducting terminal 54,55 then corresponds respectively to connecting a little of each binding site 33 both sides and 32 is fitted and connected.Again aforesaid combining structure is sent in the brazier, made two conducting terminals 54,55 and respectively connect a little 32 solder bond with surperficial technology for applying (SMT).Be noted that at this binding site 33 is an electrical isolation point, and binding site 33 the bests are conductive, can be copper in this embodiment, with base plate 51 quick conductive that help electronic component 50 to radiating bottom plate.
Please refer to Fig. 5 and shown in Figure 6, it is respectively another and another embodiment assembled sectional view of the present invention.The present invention also can be as shown in Figure 5 except the kenel that can be above-mentioned enforcement, and bag is also drawn together the L shaped radiating fin 22 of the lower surface 212 that a plurality of attachings are connected in plate body 21, and is formed with heat dissipation channel 23 between wantonly two adjacent radiating fins 22.Perhaps as shown in Figure 6, also comprise a plurality of " I " shape radiating fins 22 that are plugged in described plate body 21 '.In like manner, also in office two adjacent radiating fins 22 ' between be formed with a heat dissipation channel 23, thereby increase considerably heat dissipation.
Please refer to shown in Figure 7ly, it is an embodiment assembled sectional view more of the present invention.Comprise heat pipe 24 and auxiliary heat dissipation body 25 in the present embodiment.Auxiliary heat dissipation body 25 is made up of seat board 251 and a plurality of fin 252 that is connected in seat board 251.And heat pipe 24 has heating section 241 and heat release section 242, heating section 241 attaches mutually with plate body 21 and contacts, heat release section 242 then attaches mutually with seat board 251 and contacts, thereby the vapour-liquid of utilizing heat pipe 24 heat mutually passes mechanism, will be from the quick diversion of the heat that electronic component 50 produced to auxiliary heat dissipation body 25 and dissipation.
Please refer to Fig. 8 and shown in Figure 9, the produced integrated structure of method of its difference another manufacture method flow chart of the present invention and Fig. 8, its step comprises:
At first, provide an extrusion pressing type aluminium base 20.In this step, extrusion pressing type aluminium base 20 has plate body 21, and plate body 21 has last plane 211 and is formed at the lower plane 212 of 211 belows, plane, and the lower plane 212 of plate body 21 is arranged on the workbench (not shown).
Secondly, provide a composite membrane a.This composite membrane a has first insulating barrier 10, conductive layer 30 and second insulating barrier 40.Wherein this conductive layer 30 has and a plurality ofly connects a little 32.In this step, this composite membrane a is a flexible circuit board.
Once more, with extrusion pressing type aluminium base 20 and composite membrane a hot pressing, extrusion pressing type aluminium base 20 and composite membrane a are pasted.In this step, a conductive layer 30 is pasted on first insulating barrier 10 of epoxy resin etc., conductive layer 30 is carried out etching, and form conducting wire 31 and corresponding mutually in twos and be formed at a little 32 (as shown in Figure 2) that connect of conducting wire 31; Secondly, with second insulating barrier 40 of epoxy resin etc. with the screen painting method, drench a curtain rubbing method, spraying process or pressure sintering and be coated on the conducting wire 31 of aforementioned conductive layer 30, being combined into composite membrane a, and a little offer a through hole b (as shown in Figure 9) who runs through first insulating barrier 10 between 32 wantonly two adjacent connecting of this composite membrane; This composite membrane a is incorporated on the last plane 211 of extrusion pressing type aluminium base 20 in the hot pressing mode.
At last, two conducting terminals 54,55 of an electronic component 50 are pasted on respectively connect a little on 32, conducting terminal 54,55 is connected a little with these 32 be electrically connected.In this step, smear bonds such as tin cream aforesaid connecting a little on 32, plate body 21 corresponding to aforesaid through hole b is then smeared the heat-conducting medium (not shown), again the base plate 51 of light-emitting diode 50 is inserted corresponding to aforesaid through hole b, contact to attach mutually with the last plane 211 of plate body 21, each conducting terminal 54,55 then corresponds respectively to connecting a little of each through hole b both sides and 32 is fitted and connected; Aforesaid combining structure is sent in the brazier, made two conducting terminals 54,55 and respectively connect a little 32 solder bond with surperficial technology for applying (SMT).In addition, the heat that present embodiment can be produced electronic component 50 directly conduction is given plate body 21, significantly to increase heat dissipation and radiating efficiency.
The foregoing description only supplies explanation the present invention's usefulness, and is not limitation of the present invention.Those skilled in the art under the premise without departing from the spirit and scope of the present invention, the various equivalent structures of being made change all within the scope of the present invention.Protection scope of the present invention is defined by the claims.
Claims (16)
1. the integrated structure of radiator and circuit is characterized in that, comprising:
The extrusion pressing type aluminium base;
First insulating barrier is covered on the described extrusion pressing type aluminium base;
Conductive layer is routed on described first insulating barrier, and wherein said conductive layer has conducting wire and a plurality of connecting a little;
Second insulating barrier is covered on the described conducting wire; And
At least one electronic component, it has at least two conducting terminals, and described two conducting terminals are electrically connected with each described connecting respectively.
2. the integrated structure of radiator according to claim 1 and circuit is characterized in that, described extrusion pressing type aluminium base is A6063 or A6061.
3. the integrated structure of radiator according to claim 1 and circuit is characterized in that, described extrusion pressing type aluminium base also connects a plurality of radiating fins.
4. the integrated structure of radiator according to claim 1 and circuit is characterized in that, also comprises at least one auxiliary heat dissipation body and at least one heat pipe, and described heat pipe connects described extrusion pressing type aluminium base and described auxiliary heat dissipation body.
5. the integrated structure of radiator according to claim 1 and circuit is characterized in that, described first insulating barrier is an epoxy resin.
6. the integrated structure of radiator according to claim 1 and circuit is characterized in that, described conductive layer is goldleaf or Copper Foil.
7. the integrated structure of radiator according to claim 1 and circuit is characterized in that, described electronic component is a light-emitting diode.
8. the integrated structure of radiator according to claim 7 and circuit is characterized in that described light-emitting diode has base plate, and described base plate is directly connected in described extrusion pressing type aluminium base.
9. the integrated structure of radiator according to claim 7 and circuit is characterized in that described conductive layer also has a binding site, and described light-emitting diode has base plate, and described base plate connects described binding site, and wherein said binding site is an electrical isolation point.
10. the associated methods of radiator and circuit is characterized in that, comprises the steps:
One first insulating barrier is pasted on the extrusion pressing type aluminium base;
One conductive layer is routed on described first insulating barrier, conducting wire and a plurality of connecting are a little arranged on the wherein said conductive layer;
One second insulating barrier is pasted on the described conducting wire; And
Two conducting terminals of one electronic component are pasted on described a plurality of connecting a little respectively, described two conducting terminals are electrically connected with described a plurality of connecting.
11. the associated methods of radiator according to claim 10 and circuit, it is characterized in that, wherein described first insulating barrier being pasted in the step on the described extrusion pressing type aluminium base, is to be pasted on described extrusion pressing type aluminium base with screen painting method, any mode of drenching a curtain rubbing method, spraying process or pressure sintering.
12. the associated methods of radiator according to claim 10 and circuit is characterized in that, wherein described conductive layer is routed in the step on described first insulating barrier, comprises laying a copper foil layer and the above-mentioned copper foil layer of etching part.
13. the associated methods of radiator according to claim 10 and circuit is characterized in that, wherein described conductive layer is routed in the step on described first insulating barrier, comprising:
Lay a composite copper foil layer, wherein said composite copper foil layer has a copper foil layer and a barrier layer;
Use circuit shielding shielding on described barrier layer;
With the described barrier layer of light illuminated portion;
The chemistry rinse part divides described barrier layer;
Remove described circuit shielding; And
The whole described barrier layers of chemistry flushing.
14. the associated methods of radiator according to claim 10 and circuit is characterized in that, two conducting terminals of an electronic component are pasted on respectively in described a plurality of step that connects a little, uses surperficial technology for applying.
15. the associated methods of radiator and circuit is characterized in that, comprises the steps:
The extrusion pressing type aluminium base is provided;
Composite membrane is provided, and described composite membrane has first insulating barrier, conductive layer and second insulating barrier, and wherein above-mentioned conductive layer has a plurality of connecting a little;
With described extrusion pressing type aluminium base and described composite film heat pressing, described extrusion pressing type aluminium base and described composite membrane are pasted; And
Two conducting terminals of one electronic component are pasted on described a plurality of connecting a little respectively, described conducting terminal is electrically connected with described a plurality of connecting.
16. the associated methods of radiator according to claim 15 and circuit is characterized in that, wherein provides in the step of composite membrane, for a flexible circuit board is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007103056367A CN101472449A (en) | 2007-12-26 | 2007-12-26 | Combined structure and method of radiator and circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007103056367A CN101472449A (en) | 2007-12-26 | 2007-12-26 | Combined structure and method of radiator and circuit |
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| Publication Number | Publication Date |
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| CN101472449A true CN101472449A (en) | 2009-07-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007103056367A Pending CN101472449A (en) | 2007-12-26 | 2007-12-26 | Combined structure and method of radiator and circuit |
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| CN (1) | CN101472449A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102374505A (en) * | 2010-08-19 | 2012-03-14 | 汉达精密电子(昆山)有限公司 | LED (light emitting diode) heat radiation module |
| CN102519027A (en) * | 2011-11-21 | 2012-06-27 | 王振辉 | Radiation enhanced LED (light-emitting diode) circuit board and manufacturing method and application thereof |
| CN102537741A (en) * | 2012-01-17 | 2012-07-04 | 无锡市爱尔电子有限公司 | LED fluorescent lamp |
| CN102024883B (en) * | 2009-09-10 | 2012-07-25 | 陈一璋 | Preparation method of light-emitting diode radiating substrate |
| CN102637814A (en) * | 2011-02-15 | 2012-08-15 | 神基科技股份有限公司 | Light-emitting diode assembly structure and manufacturing method thereof |
| CN102714198A (en) * | 2010-01-13 | 2012-10-03 | 丰田自动车株式会社 | Power module production method, and power module produced thereby |
| CN102954453A (en) * | 2012-11-12 | 2013-03-06 | 华南理工大学 | LED (Light Emitting Diode) plastic heat radiator |
| CN102966860A (en) * | 2011-08-31 | 2013-03-13 | 奥斯兰姆有限公司 | LED (light-emitting diode) lamp and method for producing LED lamp |
| CN114927485A (en) * | 2022-04-29 | 2022-08-19 | 杭州阔博科技有限公司 | Electric conduction, heat storage and heat transfer method for components |
| CN115650758A (en) * | 2022-10-31 | 2023-01-31 | 华中科技大学 | Preparation method of composite material and composite material |
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2007
- 2007-12-26 CN CNA2007103056367A patent/CN101472449A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102024883B (en) * | 2009-09-10 | 2012-07-25 | 陈一璋 | Preparation method of light-emitting diode radiating substrate |
| CN102714198A (en) * | 2010-01-13 | 2012-10-03 | 丰田自动车株式会社 | Power module production method, and power module produced thereby |
| US8881386B2 (en) | 2010-01-13 | 2014-11-11 | Toyota Jidosha Kabushiki Kaisha | Power module production method, and power module produced thereby |
| CN102714198B (en) * | 2010-01-13 | 2015-05-27 | 丰田自动车株式会社 | Power module production method, and power module produced thereby |
| CN102374505A (en) * | 2010-08-19 | 2012-03-14 | 汉达精密电子(昆山)有限公司 | LED (light emitting diode) heat radiation module |
| CN102637814A (en) * | 2011-02-15 | 2012-08-15 | 神基科技股份有限公司 | Light-emitting diode assembly structure and manufacturing method thereof |
| CN102966860A (en) * | 2011-08-31 | 2013-03-13 | 奥斯兰姆有限公司 | LED (light-emitting diode) lamp and method for producing LED lamp |
| CN102519027A (en) * | 2011-11-21 | 2012-06-27 | 王振辉 | Radiation enhanced LED (light-emitting diode) circuit board and manufacturing method and application thereof |
| CN102537741A (en) * | 2012-01-17 | 2012-07-04 | 无锡市爱尔电子有限公司 | LED fluorescent lamp |
| CN102954453A (en) * | 2012-11-12 | 2013-03-06 | 华南理工大学 | LED (Light Emitting Diode) plastic heat radiator |
| CN114927485A (en) * | 2022-04-29 | 2022-08-19 | 杭州阔博科技有限公司 | Electric conduction, heat storage and heat transfer method for components |
| CN115650758A (en) * | 2022-10-31 | 2023-01-31 | 华中科技大学 | Preparation method of composite material and composite material |
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Open date: 20090701 |