CN205491427U - High frequency printed circuit board and LED light source module with pottery radiator - Google Patents
High frequency printed circuit board and LED light source module with pottery radiator Download PDFInfo
- Publication number
- CN205491427U CN205491427U CN201620032533.2U CN201620032533U CN205491427U CN 205491427 U CN205491427 U CN 205491427U CN 201620032533 U CN201620032533 U CN 201620032533U CN 205491427 U CN205491427 U CN 205491427U
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- printed circuit
- circuit board
- pcb
- high frequency
- sheet material
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Abstract
The utility model discloses a high frequency printed circuit board and LED light source module with pottery radiator, this printed circuit board include the base plate, set up in the base plate and run through the base plate ceramic radiator, be located printed circuit board first surface side the first metal layer, be located the second metal level of printed circuit board second surface side. Wherein, the base plate includes the high frequency signal circuit formed at high frequency board material surface including the high frequency board material that is located printed circuit board first surface side at least, the first metal layer, at least, partly first surface by the base plate of the first metal layer extends to the first surface of ceramic radiator consecutively, and the second surface by the base plate partly at least of second metal level extends to the second surface of ceramic radiator consecutively. The utility model discloses have splendid heat dispersion, can carry out the loss of heat dissipation in order to reduce the signal fast to heating element.
Description
Technical field
This utility model relates to a kind of printed circuit board (PCB) and LED light source module；More particularly, this practicality is new
Type relates to a kind of high frequency printed circuit board with ceramic heat sink and LED light source module.
Background technology
Along with growth in the living standard, increasing electronic product realizes intelligent, but intelligentized electricity
The loss that signal is transmitted by sub-product requires the highest.To this end, it has been developed that low-k, low-loss
High frequency material be equipped with precise circuit to meet signal transmission loss requirement, but the loss of signal with work unit
The heating of device has certain association, and caloric value is the biggest, and the loss of signal is the biggest.Therefore, work is not required nothing more than
Printed circuit board (PCB) for components and parts mechanical support and electrical connection carrier has a less loss of signal, and requirement
It can heat radiation timely to components and parts.
Chinese patent CN201120011370.7 discloses the mixed pressure high frequency of a kind of implant region metal derby and prints electricity
Road plate, it includes high frequency sheet material and common sheet material, passes through prepreg between high frequency sheet material and common sheet material
Bonding, which is provided with the metal derby that heat conductivity is big, and high frequency sheet material and prepreg offer for accommodating gold
Belong to the blind slot of block.In this technical scheme, although metal derby itself has a preferable heat conductivity, but metal derby
Bottom be common sheet material, and the heat conductivity of common sheet material is the lowest, and the heat causing metal derby to be conducted exists
The biggest thermal resistance is run into so that the actual heat dispersion of printed circuit board (PCB) is the most poor at common sheet material.
Chinese patent application CN201180037321.3 discloses a kind of printed circuit with ceramic heat sink
Plate, wherein ceramic heat sink runs through the resin bed of the insulating carrier as printed circuit board (PCB) so that printed circuit
Plate has good heat dispersion in the thickness direction thereof.But due to pottery this radiator thermal coefficient of expansion and
There is marked difference between the thermal coefficient of expansion of insulation resin carrier, cause ceramic heat sink through certain time
Easily being separated with insulating carrier after the cold cycling of number, the heat stability of printed circuit board (PCB) is poor.
Therefore, it is necessary to provide the high frequency printed circuit board of a kind of improvement to design.
Summary of the invention
The main purpose of this practicality is to provide a kind of printed circuit board (PCB), and heater element can not only be carried out soon by it
Speed heat radiation is to reduce the loss of signal, and has good heat stability.
Another object of the present utility model is to provide a kind of LED light source mould using above-mentioned printed circuit board (PCB)
Group, to realize the quick heat radiating of LED light-emitting component, and carries out controlled in wireless to LED light-emitting component.
In order to realize above-mentioned main purpose, one side of the present utility model provides a kind of printed circuit board (PCB), bag
Include substrate, arrange in a substrate and run through the ceramic heat sink of substrate, be positioned at printed circuit board (PCB) first surface side
The first metal layer, be positioned at the second metal level of printed circuit board (PCB) second surface side；Wherein, substrate include to
Being positioned at the high frequency sheet material of printed circuit board (PCB) first surface side less, the first metal layer includes being formed at high frequency sheet material table
The high-frequency signal circuit in face；At least some of of the first metal layer is extended to continuously by the first surface of substrate
The first surface of ceramic heat sink, at least some of of the second metal level is prolonged continuously by the second surface of substrate
Extend the second surface of ceramic heat sink.
In technique scheme, the high-frequency signal circuit included by the first metal layer can further extend to pottery
Porcelain spreader surface.It addition, this utility model can also be internally formed high-frequency signal circuit, example at substrate
As formed high-frequency signal circuit on the inner surface of internal layer high frequency plate surface or outer layer high frequency sheet material.
In this utility model, high frequency sheet material can be selected from Tai Kangli (Taconic) high frequency sheet material (such as RF-30,
RF-35, RF-60), NPLDII sheet material, politef (PTFE) sheet material, Rogers (Rogers)
High frequency sheet material (such as RT/duroid 5880, RT/duroid 5880LZ, RT/duroid 6002, RT/duroid
6202) S7136 sheet material that, Shengyi Science and Technology Co., Ltd, Guangdong is produced and SCGA-500 series of plates
Any one in material, or have and any one the similar or identical dielectric in aforementioned high frequency sheet material
Constant and the high frequency sheet material of dissipation (scattering and disappearing) factor.
In this utility model, the first metal layer and the second metal level can be single metal level or include many
The complex metal layer of layer metal level.The material of the first metal layer and the second metal level can be identical or different,
Wherein metal level both can be normally used layers of copper in printed circuit board (PCB), it is also possible to be that other are suitable for application
Metal material.It addition, ceramic heat sink can use each of such as aluminium nitride ceramics, aluminium oxide ceramics etc.
Plant the pottery with good heat conductive performance.
In above technical scheme, owing to have employed low-k, the high frequency of low dissipation (scattering and disappearing) factor
Sheet material and there is the ceramic heat sink of excellent radiating effect, thus printed circuit board (PCB) has extremely low loss of signal.
Further, ceramic heat-dissipating is extended to due at least some of of the first metal layer continuously by the first surface of substrate
The first surface of device, at least some of of the second metal level is extended to pottery continuously by the second surface of substrate
The second surface of radiator, therefore ceramic heat sink can be played clamping by the first metal layer and the second metal level
Effect, and reduces the thermal stress in ceramic heat sink, thus avoid ceramic heat sink and substrate to be separated from each other or
Person reduces the probability separated therebetween so that it is steady that printed circuit board (PCB) of the present utility model has good heat
Qualitative.
According to a kind of detailed description of the invention of the present utility model, the first metal layer farther includes heater element peace
Dress position, at least some of of this heater element installation position is extended to ceramic dissipating continuously by the first surface of substrate
The first surface of hot device so that increase contacting between heater element installation position and ceramic heat sink as much as possible
Area, reduces the thermal resistance between heater element and ceramic heat sink.Selectively, heater element installation position is also
Can be formed in the second metal level.
In one of the present utility model more specifically embodiment, heater element installation position includes being arranged in pairs
Positive terminal pad and negative terminal pad.Such as, can adopt when for the installation/encapsulation of flip chip type LED light-emitting component
Use this design.Wherein, positive terminal pad and negative terminal pad can be simultaneously at the surface of ceramic heat sink and substrates
Surface on extend.
Of the present utility model another more specifically in embodiment, heater element installation position includes being arranged in groups
Positive terminal pad, negative terminal pad and thermal land, thermal land is positioned at described positive terminal pad and described negative terminal pad
Between.Such as, for this design can be used during with the installation/welding of heat sink LED lamp bead.Its
In, thermal land can all cover first surface or the second surface of ceramic heat sink, or thermal land,
Positive terminal pad and negative terminal pad extend respectively on the surface of ceramic heat sink and the surface of substrate.
In another more specifically embodiment of the present utility model, printed circuit board (PCB) includes one or more pottery
Radiator, the first surface of each ceramic heat sink is formed with one or more heater element installation position respectively,
This can be arranged the most flexibly.
In another detailed description of the invention of the present utility model, being completely covered at least partially of the second metal level
The second surface of ceramic heat sink, so that the contact area between ceramic heat sink and the second metal level is
Bigization, reduces thermal resistance therebetween, improves the heat dispersion of printed circuit board (PCB) further.Now, also may be used
With by the second metal level by printed circuit board (PCB) and external heat sink thermally coupled.
According to another detailed description of the invention of the present utility model, substrate farther includes to be positioned at printed circuit board (PCB)
Second high frequency sheet material of two face side, the second metal level includes the high frequency letter being formed at the second high frequency plate surface
Number circuit, thus, it is possible to two apparent surfaces at printed circuit board (PCB) concurrently form high-frequency signal circuit, it is achieved
The miniaturization of printed circuit board (PCB).
According to another detailed description of the invention of the present utility model, printed circuit board (PCB) farther includes to be arranged on substrate
Internal inner layer conductive circuit.It is to say, this utility model can be according to the application demand of printed circuit board (PCB)
The number of plies and conducting wire thereof to substrate design neatly, to meet different application.
According to another detailed description of the invention of the present utility model, substrate farther includes FR-4 sheet material, this FR-4
Connected by prepreg between sheet material and high frequency sheet material.By high frequency sheet material and the mutual mixed pressure of FR-4 sheet material
Mode, is arranged on all or part of for other beyond high-frequency signal circuit conducting wire on FR-4 sheet material, can
To be effectively reduced material cost.
In order to realize another object of the present utility model, another aspect of the present utility model additionally provides one
LED light source module, it includes any one above-mentioned printed circuit board (PCB) and arranges on a printed circuit
Wireless signal transmission module and LED light-emitting component.For carrying out the intellectualized LED light fixture of transmission of wireless signals
For, it is particularly useful for using the above-mentioned printed circuit board (PCB) with low signal loss.
In order to more clearly illustrate the purpose of this utility model, technical scheme and advantage, below in conjunction with the accompanying drawings and
This utility model is described in further detail by detailed description of the invention.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model printed circuit board embodiment 1；
Fig. 2 is the structural representation of this utility model printed circuit board embodiment 2；
Fig. 3 is the structural representation of this utility model printed circuit board embodiment 3；
Fig. 4 is the structural representation of this utility model printed circuit board embodiment 4；
Fig. 5 is the structural representation of this utility model LED light source module embodiment 1；
Fig. 6 is the structural representation of this utility model LED light source module embodiment 2.
Detailed description of the invention
Printed circuit board embodiment 1
As it is shown in figure 1, the printed circuit board (PCB) of the present embodiment includes substrate 10, is arranged in substrate 10 and runs through
The ceramic heat sink 20 of substrate 10, it is positioned at the first metal layer 31 of printed circuit board (PCB) first surface side, is positioned at
Second metal level 32 of printed circuit board (PCB) second surface side.Wherein, substrate 10 includes being positioned at printed circuit board (PCB)
The high frequency sheet material 11 of one face side and the high frequency sheet material 12 being positioned at printed circuit board (PCB) second surface side, high frequency sheet material
It is provided with prepreg 13 between 11 and high frequency sheet material 12, makes prepreg 13 occur by heat pressing process solid
Change and formed between high frequency sheet material 11 and high frequency sheet material 12 and connect, and the uncured tree in prepreg 13
Fat flows into and fills the gap between ceramic heat sink 20 and substrate 10 in hot pressing, and then solidification makes
Obtain fixing between ceramic heat sink 20 and substrate 10 connection.
The first metal layer 31 includes being formed at the high-frequency signal circuit 311 on high frequency sheet material 11 surface, conducting wire
313 and heater element installation position 312.Heater element installation position 312 includes positive terminal pad 3121, negative terminal pad
3123 and thermal land 3122 between positive terminal pad 3131 and negative terminal pad 3123.Wherein, just
Pole pad 3131 and negative terminal pad 3123 are extended continuously to ceramic heat sink 20 by the first surface of substrate 10
First surface.In another detailed description of the invention of the present utility model, thermal land all covers pottery and dissipates
The first surface of hot device also extends to the first surface of substrate, and positive terminal pad and negative terminal pad are made only in base
On the first surface of plate.
Second metal level 32 includes being formed at the high-frequency signal circuit 321 on high frequency sheet material 12 surface, all covering
The second surface of ceramic heat sink 20 also extends to the thermal diffusion pad 322 on frequency sheet material 12 surface.
Conducting wire 14 that substrate 10 also includes being respectively formed at high frequency sheet material 11 and 12 inner surface and
For realizing electrical connection and/or signal between conducting wire 313,14 and/or high-frequency signal circuit 311,321
The conductive via 33 connected.
Printed circuit board embodiment 2
Seeing Fig. 2, the present embodiment is with the difference of embodiment 1: be formed multiple in the first metal layer 31
Heater element installation position 312 ', heater element installation position 312 ' includes the positive terminal pad 3121 ' being arranged in pairs and bears
Pole pad 3123 '.Wherein, part positive terminal pad 3121 ' and negative terminal pad 3123 ' are made only in ceramic heat sink
The first surface of 20, part positive terminal pad 3121 ' and negative terminal pad 3123 ' are simultaneously at the of ceramic heat sink 20
The first surface of one surface and substrate 10 extends.In another detailed description of the invention of the present utility model, all
Positive terminal pad and negative terminal pad be all made only in the first surface of ceramic heat sink 20, and conducting wire and/
Or high-frequency signal circuit is extended to the first surface of ceramic heat sink continuously by the first surface of substrate.
Printed circuit board embodiment 3
As it is shown on figure 3, the printed circuit board (PCB) of the present embodiment includes substrate 10, is arranged in substrate 10 and runs through
The ceramic heat sink 20 of substrate 10, it is positioned at the first metal layer 31 of printed circuit board (PCB) first surface side, is positioned at
Second metal level 32 of printed circuit board (PCB) second surface side.Wherein, substrate 10 includes being positioned at printed circuit board (PCB)
The high frequency sheet material 11 of one face side and the FR-4 sheet material 12 ' being positioned at printed circuit board (PCB) second surface side, high frequency plate
It is provided with prepreg 13 between material 11 and FR-4 sheet material 12 ', makes prepreg 13 by heat pressing process
Life solidifies and is formed between high frequency sheet material 11 and FR-4 sheet material 12 ' and connect, and in prepreg 13 not
Solidification resin flows into and fills the gap between ceramic heat sink 20 and substrate 10, then in hot pressing
Solidification makes fixing between ceramic heat sink 20 and substrate 10 connection.
The first metal layer 31 includes being formed at the high-frequency signal circuit 311 on high frequency sheet material 11 surface, conducting wire
313 and heater element installation position 312 '.Heater element installation position 312 ' includes the positive terminal pad being arranged in pairs
3121 ' and negative terminal pad 3123 '.Wherein, part positive terminal pad 3121 ' and negative terminal pad 3123 ' are made only in
The first surface of ceramic heat sink 20, part positive terminal pad 3121 ' and negative terminal pad 3123 ' dissipate at pottery simultaneously
The first surface of hot device 20 and the first surface of substrate 10 extend.
Second metal level 32 includes being formed at FR-4 sheet material 12 ' surface for realizing the positive and negative of external electrical connections
Extreme son 321 ', positive and negative electrode terminal 321 ' are extended to ceramic heat-dissipating continuously by the surface of FR-4 sheet material 12 '
The second surface of device 20.
Substrate 10 also includes being formed at the high-frequency signal circuit 14 ' of high frequency sheet material 11 inner surface, being formed at
The conducting wire 14 of FR-4 sheet material 12 ' inner surface and be used for realizing conducting wire 313,14 and/or high frequency
The conductive via 33 that between signal line 311,14 ', electrical connection and/or signal connect.
Printed circuit board embodiment 4
As shown in Figure 4, the printed circuit board (PCB) of the present embodiment includes substrate 10, is arranged in substrate 10 and runs through
The ceramic heat sink 20 of substrate 10, it is positioned at the first metal layer 31 of printed circuit board (PCB) first surface side, is positioned at
Second metal level 32 of printed circuit board (PCB) second surface side.Wherein, substrate 10 includes being positioned at printed circuit board (PCB)
The high frequency sheet material 11 of one face side and the FR-4 sheet material 12 ' being positioned at printed circuit board (PCB) second surface side, high frequency plate
It is provided with prepreg 13 between material 11 and FR-4 sheet material 12 ', makes prepreg 13 by heat pressing process
Life solidifies and is formed between high frequency sheet material 11 and FR-4 sheet material 12 ' and connect, and in prepreg 13 not
Solidification resin flows into and fills the gap between ceramic heat sink 20 and substrate 10, then in hot pressing
Solidification makes fixing between ceramic heat sink 20 and substrate 10 connection.
The first metal layer 31 includes being formed at the high-frequency signal circuit 311 on high frequency sheet material 11 surface, conducting wire
313 and heater element installation position 312 '.Heater element installation position 312 ' includes the positive terminal pad being arranged in pairs
3121 ' and negative terminal pad 3123 '.Wherein, part positive terminal pad 3121 ' and negative terminal pad 3123 ' are made only in
The first surface of ceramic heat sink 20, part positive terminal pad 3121 ' and negative terminal pad 3123 ' dissipate at pottery simultaneously
The first surface of hot device 20 and the first surface of substrate 10 extend.
Second metal level 32 is extended to the second table of ceramic heat sink 20 continuously by the second surface of substrate 10
Face, and outer surface and the second surface of ceramic heat sink 20 of FR-4 sheet material 12 ' is completely covered.
LED light source module embodiment 1
Seeing Fig. 5, the LED light source module of the present embodiment includes the printed circuit board (PCB) shown in Fig. 1 and LED
Lamp bead 40.Wherein, the positive pole 41 of LED lamp bead 40, negative pole 42 and heat sink 43 connect (the most logical respectively
Cross SMT welding) to positive terminal pad 3121, negative terminal pad 3123 and the thermal land 3122 of printed circuit board (PCB).
It addition, LED light source module farther includes wireless signal transmission module, it is wireless that high-frequency signal circuit constitutes this
A part for signal transmission module.
LED light source module embodiment 2
Seeing Fig. 6, the LED light source module of the present embodiment is a kind of LED light using COB packaged type
Source module (package lens not shown in figure), including the printed circuit board (PCB) of embodiment 2 and multiple flip chip type
LED chip 40 ', wherein, the positive pole 41 ' of chip 40 ', negative pole 42 ' connect respectively (such as by eutectic work
Skill or gluing process) to the positive terminal pad 3121 ' of printed circuit board (PCB) and negative terminal pad 3123 '.It addition, LED
Light source module farther includes wireless signal transmission module, and high-frequency signal circuit constitutes this transmission of wireless signals mould
A part for block.
Although depicting this utility model above by preferred implementation, but it is to be understood that, this area
Those of ordinary skill without departing from invention scope of the present utility model, according to this utility model made equal
Improve, should be invention scope of the present utility model and contained.
Claims (10)
1. a printed circuit board (PCB), including substrate, the pottery that is arranged in described substrate and runs through described substrate
Radiator, it is positioned at the first metal layer of described printed circuit board (PCB) first surface side, is positioned at described printed circuit board (PCB)
Second metal level of second surface side；It is characterized in that:
Described substrate includes the high frequency sheet material being located at least in described printed circuit board (PCB) first surface side, described first
Metal level includes the high-frequency signal circuit being formed at described high frequency plate surface；
At least some of of described the first metal layer is extended to described pottery continuously by the first surface of described substrate
The first surface of porcelain radiator, at least some of of described second metal level is connected by the second surface of described substrate
Extend to the second surface of described ceramic heat sink continuously.
2. printed circuit board (PCB) as claimed in claim 1, it is characterised in that: described the first metal layer also includes
Heater element installation position, at least some of of described heater element installation position is connected by the first surface of described substrate
Extend to the first surface of described ceramic heat sink continuously.
3. printed circuit board (PCB) as claimed in claim 2, it is characterised in that: described heater element installation position is wrapped
Include the positive terminal pad and negative terminal pad being arranged in pairs.
4. printed circuit board (PCB) as claimed in claim 2, it is characterised in that: described heater element installation position is wrapped
Including positive terminal pad, negative terminal pad and the thermal land being arranged in groups, described thermal land is positioned at the weldering of described positive pole
Between dish and described negative terminal pad.
5. printed circuit board (PCB) as claimed in claim 2, it is characterised in that: described printed circuit board (PCB) includes one
Individual or multiple ceramic heat sinks, the first surface of each described ceramic heat sink is formed with one or many respectively
Individual heater element installation position.
6. printed circuit board (PCB) as claimed in claim 1, it is characterised in that: described second metal level is at least
A part is completely covered the second surface of described ceramic heat sink.
7. printed circuit board (PCB) as claimed in claim 1, it is characterised in that: described substrate farther includes position
In the second high frequency sheet material of described printed circuit board (PCB) second surface side, described second metal level includes being formed at institute
State the high-frequency signal circuit of the second high frequency plate surface.
8. printed circuit board (PCB) as claimed in claim 1, it is characterised in that: also include being arranged on described substrate
Internal inner layer conductive circuit.
9. printed circuit board (PCB) as claimed in claim 1, it is characterised in that: described substrate farther includes
FR-4 sheet material, is connected by prepreg between described FR-4 sheet material and described high frequency sheet material.
10. a LED light source module, it is characterised in that: described module includes according to claim 1 to 9
Printed circuit board (PCB) described in any one and arrange wireless signal transmission module on the printed circuit board and
LED light-emitting component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620032533.2U CN205491427U (en) | 2016-01-12 | 2016-01-12 | High frequency printed circuit board and LED light source module with pottery radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620032533.2U CN205491427U (en) | 2016-01-12 | 2016-01-12 | High frequency printed circuit board and LED light source module with pottery radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205491427U true CN205491427U (en) | 2016-08-17 |
Family
ID=56667716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620032533.2U Expired - Fee Related CN205491427U (en) | 2016-01-12 | 2016-01-12 | High frequency printed circuit board and LED light source module with pottery radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205491427U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734836A (en) * | 2017-11-20 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN108055763A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
| CN108055766A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | A kind of PCB and its manufacturing method |
| CN108055764A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
| CN108055765A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
| CN109699115A (en) * | 2017-10-23 | 2019-04-30 | 苏州旭创科技有限公司 | Optical module |
-
2016
- 2016-01-12 CN CN201620032533.2U patent/CN205491427U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109699115A (en) * | 2017-10-23 | 2019-04-30 | 苏州旭创科技有限公司 | Optical module |
| CN107734836A (en) * | 2017-11-20 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN108055763A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
| CN108055766A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | A kind of PCB and its manufacturing method |
| CN108055764A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
| CN108055765A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20200112 |
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| CF01 | Termination of patent right due to non-payment of annual fee |