CN107734836A - A kind of PCB - Google Patents
A kind of PCB Download PDFInfo
- Publication number
- CN107734836A CN107734836A CN201711155843.9A CN201711155843A CN107734836A CN 107734836 A CN107734836 A CN 107734836A CN 201711155843 A CN201711155843 A CN 201711155843A CN 107734836 A CN107734836 A CN 107734836A
- Authority
- CN
- China
- Prior art keywords
- pcb
- heat
- copper
- radiating substrate
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Abstract
The present invention relates to board production technical field, specifically disclose a kind of PCB, including the heat-radiating substrate being embedded in PCB, the inner surface of the heat-radiating substrate is provided with layers of copper, and it is provided with line pattern in the layers of copper, position corresponding with heat-radiating substrate the PCB opens up fluted, and the side wall of the groove is provided with the cell wall copper connected with the layers of copper of heat-radiating substrate inner surface, and the cell wall copper connects the line pattern of heat-radiating substrate inner surface with the outer-layer circuit figure of PCB outer surface.PCB of the present invention, the radiating rate of heater element is improved, reduce the usage amount of heat sink material, reduce PCB manufacturing cost.
Description
Technical field
The present invention relates to board production technical field, more particularly to a kind of PCB.
Background technology
Printed circuit board (Printed circuit board, abbreviation PCB), it is the offer of electronic component electrical connection
Person.Before printed circuit board appearance, the interconnection between electronic component is all to be directly connected to by electric wire and form complete line
Road.In the present age, circuit board is intended only as effective experimental tool and existed, and printed circuit board has accounted in the electronics industry
According to the status of empery.
As electronic system product is towards multifunction, miniaturization and light-weighted development trend, electronic system is to PCB
Performance requirement it is more and more, especially PCB heat dispersion.The PCB heat dissipation technologys of current main-stream mainly have metal substrate to dissipate
Thermal technology, ceramic substrate heat dissipation technology and bury, embedding copper billet technology, PCB surface is sent out using the high thermal conductivity of metal or ceramics
Heat caused by thermal element work distributes in time, and so as to reduce the temperature of heater element and electronic product, improving it makes
With life-span and electric property.
But to ensure radiating effect in above-mentioned heat dissipation technology, heat sink material usage amount is big, causes PCB manufacturing cost
It is high.Therefore a kind of new PCB is needed to solve the above problems.
The content of the invention
It is an object of the invention to provide a kind of PCB, improves the radiating rate of heater element, reduces the use of heat sink material
Amount, PCB manufacturing cost is reduced, make power component sink to being arranged in groove, save PCB space.
To use following technical scheme up to this purpose, the present invention：
A kind of PCB, including the heat-radiating substrate being embedded in PCB, the inner surface of the heat-radiating substrate are provided with layers of copper, and described
It is provided with line pattern in layers of copper, position corresponding with heat-radiating substrate the PCB opens up fluted, and the side wall of the groove is set
Have the cell wall copper that the layers of copper with heat-radiating substrate inner surface connects, the cell wall copper by the line pattern of heat-radiating substrate inner surface with
The outer-layer circuit figure connection of PCB outer surface.
Specifically, power component is placed in the groove, saves PCB assembly space, the copper of heat-radiating substrate inner surface
The radiating rate of layer quickening power component, the cell wall copper of recess sidewall can realize effective shielding to power component signal, improve
The transmission quality of PCB signals.
Line pattern is made on heat-radiating substrate, effectively improves the design density of line pattern, so as to enter one beneficial to PCB
Step miniaturization.
As optimal technical scheme, the flush with outer surface of the outer surface of the heat-radiating substrate and PCB remote groove side.
As optimal technical scheme, the outer surface of the heat-radiating substrate is provided with layers of copper, and the layers of copper and PCB are away from groove
The layers of copper connection of the outer surface of side.
As optimal technical scheme, the horizontal section area of the groove greater than, equal to or less than heat-radiating substrate level
Area of section.
And specifically, it is preferable to the horizontal section area of groove be less than heat-radiating substrate horizontal section area, make heat-radiating substrate with
PCB stable connection is good, it is not easy to the loose or dislocation from PCB, and the whole of heat-radiating substrate coverage power element can be ensured
Individual bottom surface, so as to improve the efficiency of radiating.In addition, the horizontal section area of groove can also be more than or equal to the water of heat-radiating substrate
Plane section area.
As optimal technical scheme, the heat-radiating substrate is provided with non-heavy copper hole or heavy copper hole.
Specifically, the non-heavy copper hole is mainly mounting hole, plays installation fixation；Mainly realize in the heavy copper hole
The electrical communication of the layers of copper of the heat-radiating substrate inner surface and the layers of copper of outer surface.
As optimal technical scheme, the PCB is provided with periphery holes, and the periphery holes are located at the outer of the heat-radiating substrate
Portion.
Specifically, the periphery holes include through hole, non-heavy copper hole, laser hole or back drill hole, and the through hole is to connect
PCB each sandwich circuit figure；The non-heavy copper hole is mainly mounting hole, plays a part of to be fixedly mounted；The laser hole is on PCB
Blind hole, be by two layers therein on PCB or multilayer line figure electrical connection；The purpose for making back drill hole is to shorten
The wiring of line pattern, and then reduce the volume of pcb board.
As optimal technical scheme, the PCB is at least four laminates.
As optimal technical scheme, the heat-radiating substrate is ceramic substrate.
Specifically, using the high ceramic substrate of thermal conductivity factor, the PCB dielectric constants provided with ceramic substrate are high, dielectric constant
The wiring of high pcb board can be shortened, and then reduce PCB volume, save PCB installing space.
In addition, the heat-radiating substrate can also be the metal substrates such as iron, aluminium, copper or other arbitrarily enable to high power
The substrate that the heat of component efficiently distributes.
Specifically, the ceramic substrate is lighter than the substrate weight of metal material, and the layers of copper on the surface of ceramic substrate is effective
Prevent that potsherd is contaminated and corrodes.
As optimal technical scheme, radiating groove is provided with the PCB, the heat-radiating substrate is arranged on the radiating groove
It is interior, it is filled with the semi-solid preparation flowed into bonding processes in the gap between the side wall of the heat-radiating substrate and the radiating groove
Piece.
Specifically, the heat-radiating substrate coordinates with PCB gaps, and the horizontal section area for the groove that radiates is more than heat-radiating substrate
Horizontal section area, the prepreg for making to melt in bonding processes flow in gap the connection for realizing heat-radiating substrate and PCB.
Beneficial effects of the present invention：A kind of PCB is provided, is embedded to the heat-radiating substrate of high heat conduction in the pcb, and in heat-radiating substrate
Inner surface setting line pattern, the line pattern of heat-radiating substrate inner surface and the outer-layer circuit figure of PCB outer surface electrically connect
Connect, first, by the way that component is arranged in radiating groove, thickness during PCB applications can be effectively reduced, save PCB dress
With space, beneficial to applications of the PCB in more tight space or structure；Secondly, by setting the heat-radiating substrate line pattern,
The design density of line pattern can be improved, so as to the further miniaturization beneficial to PCB；Finally, the radiating base is buried by interior
Plate, pcb board have higher dielectric constant, and the setting of heat-radiating substrate can effectively improve dissipating for local location high power component
The thermal efficiency, component is set to be in relatively low operating temperature, so as to extend the service life of component and PCB entirety, moreover it is possible to
Reduce PCB thickness.
Brief description of the drawings
Fig. 1 is the PCB construction schematic diagram described in the embodiment of the present invention.
In figure：
1、PCB；2nd, heat-radiating substrate；201st, layers of copper；3rd, groove；301st, cell wall copper；4th, radiate groove.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
As shown in figure 1, a kind of PCB is present embodiments provided, including the heat-radiating substrate 2 being embedded in PCB 1, the radiating
The inner surface of substrate 2 is provided with layers of copper 201, and line pattern is provided with the layers of copper 201, the PCB 1 and the phase of heat-radiating substrate 2
Corresponding position opens up fluted 3, and the side wall of the groove 3 is provided with the groove connected with the layers of copper 201 of the inner surface of heat-radiating substrate 2
Wall copper 301, the cell wall copper 301 is by the outer-layer circuit figure of the line pattern of the inner surface of heat-radiating substrate 2 and the outer surfaces of PCB 1
Connection.
Specifically, radiating groove 4 is provided with the PCB 1, the heat-radiating substrate 2 is arranged in the radiating groove 4, institute
The horizontal section area for stating radiating groove 4 is more than the horizontal section area of heat-radiating substrate 2, the heat-radiating substrate 2 and radiating groove 4
Between have gap, when high-temperature laminating is embedded with the PCB of heat-radiating substrate 2, the side wall of the heat-radiating substrate 2 with it is described radiating groove 4
Between gap in be filled with the prepreg that flows into bonding processes.
Open up fluted 3 on PCB 1 with 2 corresponding position of heat-radiating substrate, the horizontal section area of the groove 3 is more than,
Equal to or less than the horizontal section area of heat-radiating substrate 2, the preferably horizontal section area of groove 3 is less than the level of heat-radiating substrate 2
Area of section, make heat-radiating substrate 2 and PCB 1 stable connection good, heat-radiating substrate 2 is not easy to come off from PCB 1.In addition,
It can bury multiple heat-radiating substrates 2 on PCB 1, open up groove 3 on PCB 1 with 2 corresponding opening position of heat-radiating substrate, used in groove 3
In placement power component.
The side wall of the groove 3 is provided with cell wall copper 301, and the inner surface of the heat-radiating substrate 2 is provided with layers of copper 201, the groove
The electrical communication of layers of copper 201 of wall copper 301 and the inner surface of heat-radiating substrate 2, the cell wall copper 301 can be realized to power component signal
Effective shielding, improve the transmission quality of the signals of PCB 1, the layers of copper 201 can realize effective radiating to power component.
Further, line pattern is made in the layers of copper 201 of the inner surface of heat-radiating substrate 2, the line pattern passes through
Cell wall copper 301 is realized and connected with the outer-layer circuit figure of the outer surfaces of PCB 1, and line pattern is made on heat-radiating substrate 2, is effectively carried
The design density of elevated track figure, so as to be advantageous to PCB 1 further miniaturization.
The outer surface of the heat-radiating substrate 2 and flush with outer surface of the PCB 1 away from the side of groove 3, the heat-radiating substrate 2
Outer surface can be provided with layers of copper 201, and the layers of copper 201 connects with the layers of copper of outer surfaces of the PCB 1 away from the side of groove 3.
In the present embodiment, above-mentioned heat-radiating substrate 2 is ceramic substrate, and the thermal conductivity factor of ceramic substrate is high, is provided with pottery
The PCB 1 of porcelain substrate has higher dielectric constant, and the high PCB 1 of dielectric constant can shorten PCB1 wiring, and then reduce PCB
1 volume, save PCB 1 installing space.
The layers of copper 201 of ceramic base plate surface can ensure that high power component is bonded well with ceramic substrate, improve and dissipate
Thermal effect.In addition, one layer of layers of copper is laid on ceramic substrate is also equipped with following advantage：1. the surface of ceramic substrate is easily contaminated
And corrosion, adhesion is influenceed, and the chemical property of copper is gentleer, is not easy contaminated and corrodes；One layer of layers of copper 201 of laying can be with
Antipollution and anticorrosive；2. the heat-conducting effect of layers of copper 201 is better than ceramic substrate, heat conduction can be improved after laying one layer of layers of copper 201
Effect；3. the cell wall copper 301 in the side wall of 201 fit of layers of copper 3 of ceramic base plate surface can also be to being arranged on ceramic substrate
The component on surface plays signal shielding.
In addition, the heat-radiating substrate 2 can also be the metal substrates such as iron, aluminium, copper or other arbitrarily enable to Gao Gong
The substrate that the heat of rate component efficiently distributes.
In the present embodiment, non-heavy copper hole or heavy copper hole are set on the heat-radiating substrate 2, and the non-heavy copper hole is mainly
Mounting hole, play installation fixation；The heavy copper hole be mainly realize the heat-radiating substrate 2 inner surface layers of copper 201 with
The electrical communication of the layers of copper 201 of outer surface.
On the PCB 1 positioned at the heat-radiating substrate 2 outside periphery holes include through hole, non-heavy copper hole, laser hole or
Back drill hole, the through hole are each sandwich circuit figures for connection PCB 1；The non-heavy copper hole is mainly mounting hole, rises and fixes
The effect of installation；The laser hole is the blind hole on PCB 1, is by both sides therein on PCB 1 or multilayer line figure electricity
Gas connects；The purpose for making back drill hole is to shorten the wiring of line pattern, and then reduces the volume of the plates of PCB 1.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating example of the present invention, and it is pair to be not
The restriction of embodiments of the present invention.For those of ordinary skill in the field, may be used also on the basis of the above description
To make other changes in different forms.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement made within the spirit and principle of invention etc., should be included in the claims in the present invention
Protection domain within.
Claims (9)
1. a kind of PCB, it is characterised in that including the heat-radiating substrate being embedded in PCB, the inner surface of the heat-radiating substrate is provided with copper
Layer, and is provided with line pattern in the layers of copper, position corresponding with heat-radiating substrate the PCB open up it is fluted, it is described recessed
The side wall of groove is provided with the cell wall copper that is connected with the layers of copper of heat-radiating substrate inner surface, and the cell wall copper is by the line of heat-radiating substrate inner surface
Road figure connects with the outer-layer circuit figure of PCB outer surface.
2. PCB according to claim 1, it is characterised in that the outer surface of the heat-radiating substrate and PCB remote groove one
The flush with outer surface of side.
3. PCB according to claim 2, it is characterised in that the outer surface of the heat-radiating substrate is provided with layers of copper, and the copper
Layer connects with the layers of copper of outer surfaces of the PCB away from groove side.
4. PCB according to claim 1, it is characterised in that the horizontal section area of the groove greater than, equal to or be less than
The horizontal section area of heat-radiating substrate.
5. PCB according to claim 1, it is characterised in that the heat-radiating substrate is provided with non-heavy copper hole or heavy copper hole.
6. PCB according to claim 1, it is characterised in that the PCB is provided with periphery holes, and the periphery holes are located at institute
State the outside of heat-radiating substrate.
7. according to the PCB described in claim any one of 1-6, it is characterised in that the PCB is at least four laminates.
8. according to the PCB described in claim any one of 1-6, it is characterised in that the heat-radiating substrate is ceramic substrate.
9. PCB according to claim 1, it is characterised in that radiating groove, the heat-radiating substrate peace are provided with the PCB
In the radiating groove, bonding processes are filled with the gap between the side wall of the heat-radiating substrate and the radiating groove
The prepreg of middle inflow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711155843.9A CN107734836A (en) | 2017-11-20 | 2017-11-20 | A kind of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711155843.9A CN107734836A (en) | 2017-11-20 | 2017-11-20 | A kind of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107734836A true CN107734836A (en) | 2018-02-23 |
Family
ID=61216361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711155843.9A Pending CN107734836A (en) | 2017-11-20 | 2017-11-20 | A kind of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107734836A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11412618B2 (en) | 2020-12-29 | 2022-08-09 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
| US11439018B2 (en) | 2020-12-29 | 2022-09-06 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103517576A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Printed circuit board processing method, printed circuit board and electronic device |
| CN103517557A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Method for processing groove on printed circuit board, printed circuit board and electronic device |
| CN204272486U (en) * | 2014-11-21 | 2015-04-15 | 先丰通讯股份有限公司 | Ceramic embedded circuit board |
| CN205491427U (en) * | 2016-01-12 | 2016-08-17 | 乐健科技（珠海）有限公司 | High frequency printed circuit board and LED light source module with pottery radiator |
-
2017
- 2017-11-20 CN CN201711155843.9A patent/CN107734836A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103517576A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Printed circuit board processing method, printed circuit board and electronic device |
| CN103517557A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Method for processing groove on printed circuit board, printed circuit board and electronic device |
| CN204272486U (en) * | 2014-11-21 | 2015-04-15 | 先丰通讯股份有限公司 | Ceramic embedded circuit board |
| CN205491427U (en) * | 2016-01-12 | 2016-08-17 | 乐健科技（珠海）有限公司 | High frequency printed circuit board and LED light source module with pottery radiator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11412618B2 (en) | 2020-12-29 | 2022-08-09 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
| US11439018B2 (en) | 2020-12-29 | 2022-09-06 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180223 |
|
| RJ01 | Rejection of invention patent application after publication |