CN102036476A - Two-sided metal based circuit board and production method thereof - Google Patents
Two-sided metal based circuit board and production method thereof Download PDFInfo
- Publication number
- CN102036476A CN102036476A CN201010572775.8A CN201010572775A CN102036476A CN 102036476 A CN102036476 A CN 102036476A CN 201010572775 A CN201010572775 A CN 201010572775A CN 102036476 A CN102036476 A CN 102036476A
- Authority
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- China
- Prior art keywords
- circuit board
- hole
- layer
- metal base
- metal substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 46
- 239000002184 metal Substances 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 21
- 239000012212 insulator Substances 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 abstract description 5
- 238000005553 drilling Methods 0.000 abstract description 4
- 230000009191 jumping Effects 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a two-sided metal based circuit board which comprises a metal base plate, a heat conducting insulating plate covering two sides of the metal base plate and a circuit layer covering the outer side of the heat conducting insulating layer, wherein a through hole is arranged on the circuit board and filled with an insulating body, a conducting hole is arranged in the insulating body, and a conductive layer communicated with the circuit board layer covers the inner wall of the conducting hole. The invention also provides a production method used for the circuit board, which comprises the following steps of: drilling the base plate, filling the through hole with insulating resin, covering the heat conducting insulating layer and the circuit board layer on the metal base plate sequentially, drilling the middle of the resin filled in the through hole, and plating copper on the inner wall of the hole to form the conducting layer. The two-sided metal based circuit board provided by the invention can effectively solve the insulation problem of the metal base plate and the circuit board layer during circuit board drilling and wire jumping, realizes wire jumping in the hole, and reduces the circuit board structure problem needing considering when the circuit is designed.
Description
Technical field
The present invention relates to a kind of wiring board, especially a kind of double-sided metal base circuit board and production method thereof.
Background technology
The basic structure of existing double-sided metal wiring board is, and to be the center with metal substrate (normally made of aluminum) cover insulator in its both sides, and cover circuit layer (being generally Copper Foil) on insulator.Because middle Metal Substrate just plays the structural re-enforcement of heat radiation, can not switch on, the Copper Foil of both sides just can play electric action, however the Copper Foil of both sides often need connect conducting in line design.This problem can be by punching in the circuit board when using ordinary circuit board, with wire jumper or copper facing mode the two sides Copper Foil is connected conducting again and is solved.Yet wire jumper can cause the conducting of metal substrate and circuit layer in the hole when using metal base circuit board, thereby design can be restricted when using the double-sided metal base circuit board, and existing Electronic Design just need be considered this structure problem in wiring.
Summary of the invention
At above situation, the invention provides a kind of novel double-sided metal base circuit board, solve the Insulation Problems of double-sided metal base circuit board boring wire jumper, and relatedly provide a kind of method of producing this kind wiring board.
The technical solution used in the present invention can be described as:
A kind of double-sided metal base circuit board, the circuit layer that comprises metal substrate, covers the heat conductive insulating layer of metal substrate both sides and cover the heat conductive insulating layer outside, have through hole on the described wiring board, described through hole is filled with insulator, be provided with via in the described insulator, described via inwall is coated with the conductive layer that is connected with circuit layer.
As a kind of improvement of above technical scheme, the aperture of described via is less than the aperture of through hole.
As a kind of improvement of above technical scheme, described insulator is the heat conductive insulating resin, and its thermal coefficient of expansion is with close as the thermal coefficient of expansion of metal substrate.
As a kind of improvement of above technical scheme, described metal substrate is an aluminium base.
The present invention also provides a kind of production method that is used to produce above-described double-sided metal base circuit board, and it may further comprise the steps:
1) boring forms through hole on metal substrate;
2) carrying out baking-curing behind the use insulating resin filling vias handles;
3) successively cover the heat conductive insulating layer on the metal substrate and as the Copper Foil of circuit layer after carry out high-temperature high-pressure and close cured;
4) boring forms intercommunicating pore in the middle of clogging the resin of through hole;
5) form conductive layer with conducting upper and lower circuit layer in the via inner wall copper plating.
The invention has the beneficial effects as follows:
The Insulation Problems that the double-sided metal base circuit board that the present invention proposes can solve metal substrate and circuit layer when holing wire jumper has in the circuit board effectively realized wire jumper in the hole, and the circuit board structure problem that need consider when having reduced circuit design.
Description of drawings
Fig. 1 is the structural representation of wiring board proposed by the invention.
Embodiment
As shown in Figure 1, a kind of double-sided metal base circuit board proposed by the invention, comprise the metal substrate of making of aluminium 1, the circuit layer 3(Copper Foil that covers the heat conductive insulating layer 2 of metal substrate 1 both sides and cover heat conductive insulating layer 2 outside), have through hole 4 on the described wiring board, and select for use the coefficient of expansion heat conductive insulating resin close to be filled in the through hole 4 as insulator 5 with aluminium.The via 6 less than through hole 4 in internal drilling footpath, insulator 5 center has so just kept one deck resin as insulating barrier on through hole 4 inwalls then.The Copper Foil of copper facing connection upper and lower surface on this layer resin forms the conductive layer 7 that is connected with circuit layer 3 again.Like this, conductive layer 7 separates by the heat conductive insulating resin of filling with aluminium base 1, solved Insulation Problems between the two, and the thermal coefficient of expansion of employed resin is close with aluminium base, this has just guaranteed when wiring board is heated, and can not come off as the resin of insulating barrier.
In addition, a kind of production method that is used to produce above-described double-sided metal base circuit board may further comprise the steps:
Boring forms through hole 4 on the metal substrate 1 that aluminium is made;
Carry out the baking-curing processing after using the heat conductive insulating resin filling vias 4 close with the aluminium coefficient of expansion;
Successively cover heat conductive insulating layer 2 on the metal substrate 1 and as the Copper Foil of circuit layer 3 after carry out high-temperature high-pressure and close cured;
Boring forms via 6 in the middle of clogging the heat conductive insulating resin of through hole 4, and the aperture of described via 6 should be less than through hole 4, and the heat conductive insulating resin that remainder is attached on through hole 4 inwalls constitutes insulator 5;
Form conductive layer 7 in via 6 inwalls (promptly on insulator 5) copper facing and be communicated with upper and lower circuit layer 3.
The Insulation Problems that the double-sided metal base circuit board that the present invention proposes can solve metal substrate and circuit layer when holing wire jumper has in the circuit board effectively realized wire jumper in the hole, and the circuit board structure problem that need consider when having reduced circuit design.
Claims (5)
1. double-sided metal base circuit board, the circuit layer (3) that comprises metal substrate (1), covers the heat conductive insulating layer (2) of metal substrate (1) both sides and cover heat conductive insulating layer (2) outside, it is characterized in that having on the described wiring board through hole (4), described through hole (4) is filled with insulator (5), be provided with via (6) in the described insulator (5), described via (6) inwall is coated with the conductive layer (7) that is connected with circuit layer (3).
2. a kind of double-sided metal base circuit board according to claim 1, the aperture of described via (6) is less than the aperture of through hole (4).
3. a kind of double-sided metal base circuit board according to claim 1, described insulator (5) is the heat conductive insulating resin, its thermal coefficient of expansion is with close as the thermal coefficient of expansion of metal substrate (1).
4. a kind of double-sided metal base circuit board according to claim 1, described metal substrate (1) is an aluminium base.
5. production method that is used for the described double-sided metal base circuit board of production claim 1 is characterized in that may further comprise the steps:
1) goes up boring at metal substrate (1) and form through hole (4);
2) carrying out baking-curing behind the use insulating resin filling vias (4) handles;
3) successively metal substrate (1) go up to cover heat conductive insulating layer (2) and as the Copper Foil of circuit layer (3) after carry out high-temperature high-pressure and close cured;
4) boring forms intercommunicating pore (6) in the middle of clogging the resin of through hole (4);
5) form conductive layer (7) to be communicated with upper and lower circuit layer (3) in via (6) inner wall copper plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105727758A CN102036476B (en) | 2010-12-04 | 2010-12-04 | Two-sided metal based circuit board and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105727758A CN102036476B (en) | 2010-12-04 | 2010-12-04 | Two-sided metal based circuit board and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102036476A true CN102036476A (en) | 2011-04-27 |
| CN102036476B CN102036476B (en) | 2012-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105727758A Active CN102036476B (en) | 2010-12-04 | 2010-12-04 | Two-sided metal based circuit board and production method thereof |
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| Country | Link |
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Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102223767A (en) * | 2011-06-01 | 2011-10-19 | 何忠亮 | Production process for high heat-conduction circuit board |
| CN102316679A (en) * | 2011-09-16 | 2012-01-11 | 深圳市万泰伟业科技有限公司 | Manufacture method for double-side aluminum circuit board |
| CN102427665A (en) * | 2011-09-16 | 2012-04-25 | 深圳市万泰伟业科技有限公司 | Manufacturing technology of three-dimensional double-face aluminium substrate |
| CN102740591A (en) * | 2012-07-09 | 2012-10-17 | 苏州热驰光电科技有限公司 | Double-sided aluminum base circuit board with super-high thermal conductivity and preparation method thereof |
| CN103052264A (en) * | 2012-12-03 | 2013-04-17 | 深圳崇达多层线路板有限公司 | Pressing method for sandwich aluminum-base printed circuit board |
| CN103118486A (en) * | 2013-01-29 | 2013-05-22 | 惠州中京电子科技股份有限公司 | Aluminum based circuit board with component plug holes and manufacturing method of aluminum based circuit board |
| CN103906345A (en) * | 2012-12-25 | 2014-07-02 | 株式会社京滨 | Radiating structure for printed circuit board |
| CN104902694A (en) * | 2014-03-05 | 2015-09-09 | 深南电路有限公司 | Internal-layer thick-copper circuit board processing method and internal-layer thick-copper circuit board |
| CN104994682A (en) * | 2015-07-14 | 2015-10-21 | 广东欧珀移动通信有限公司 | PCB having good heat-dissipation performance and mobile terminal applied therewith |
| CN106376176A (en) * | 2016-09-14 | 2017-02-01 | 广东达进电子科技有限公司 | Printed circuit board and fabrication method thereof |
| CN106879167A (en) * | 2017-04-06 | 2017-06-20 | 昆山苏杭电路板有限公司 | Double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision and preparation method thereof |
| CN107564882A (en) * | 2016-06-30 | 2018-01-09 | 施韦策电子公司 | Circuit board member and the method for manufacturing circuit board member |
| CN107949156A (en) * | 2017-12-22 | 2018-04-20 | 珠海欣中祺电子科技有限公司 | A kind of double-sided wiring board |
| CN108040416A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | A kind of production method of double-face aluminium substrate |
| CN108990322A (en) * | 2018-08-16 | 2018-12-11 | 鹤山市得润电子科技有限公司 | A kind of double-sided PCB and its manufacturing method |
| CN110062537A (en) * | 2018-12-29 | 2019-07-26 | 博罗康佳精密科技有限公司 | A kind of preparation process of multiple layer metal substrate |
| CN111093317A (en) * | 2019-12-10 | 2020-05-01 | 温州大学新材料与产业技术研究院 | LED aluminum substrate and printing method thereof |
| CN112752400A (en) * | 2020-12-10 | 2021-05-04 | 诚亿电子（嘉兴）有限公司 | Manufacturing method of double-sided copper-based PCB |
| CN112788835A (en) * | 2019-11-11 | 2021-05-11 | 无锡深南电路有限公司 | Circuit board and manufacturing method thereof |
| CN113301715A (en) * | 2021-04-01 | 2021-08-24 | 珠海精路电子有限公司 | Circuit board and manufacturing process thereof |
| CN114390773A (en) * | 2021-12-30 | 2022-04-22 | 江苏迪飞达电子有限公司 | Double-sided aluminum substrate and processing technology thereof |
| WO2022152183A1 (en) * | 2021-01-13 | 2022-07-21 | 华为技术有限公司 | Printed circuit board, fabrication method therefor, and electronic communication device |
| CN114980573A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
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| CN101553094A (en) * | 2008-03-25 | 2009-10-07 | 钰桥半导体股份有限公司 | A method for manufacturing a circuit board provided with an embedded typed metal conduction column |
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| CN201893993U (en) * | 2010-12-04 | 2011-07-06 | 廖萍涛 | Double-sided MBPCB |
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| CN101553094A (en) * | 2008-03-25 | 2009-10-07 | 钰桥半导体股份有限公司 | A method for manufacturing a circuit board provided with an embedded typed metal conduction column |
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| CN201893993U (en) * | 2010-12-04 | 2011-07-06 | 廖萍涛 | Double-sided MBPCB |
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102223767A (en) * | 2011-06-01 | 2011-10-19 | 何忠亮 | Production process for high heat-conduction circuit board |
| CN102316679A (en) * | 2011-09-16 | 2012-01-11 | 深圳市万泰伟业科技有限公司 | Manufacture method for double-side aluminum circuit board |
| CN102427665A (en) * | 2011-09-16 | 2012-04-25 | 深圳市万泰伟业科技有限公司 | Manufacturing technology of three-dimensional double-face aluminium substrate |
| CN102427665B (en) * | 2011-09-16 | 2013-05-08 | 深圳市万泰伟业科技有限公司 | Manufacturing technology of three-dimensional double-face aluminium substrate |
| CN102740591A (en) * | 2012-07-09 | 2012-10-17 | 苏州热驰光电科技有限公司 | Double-sided aluminum base circuit board with super-high thermal conductivity and preparation method thereof |
| CN103052264B (en) * | 2012-12-03 | 2015-04-22 | 深圳崇达多层线路板有限公司 | Pressing method for sandwich aluminum-base printed circuit board |
| CN103052264A (en) * | 2012-12-03 | 2013-04-17 | 深圳崇达多层线路板有限公司 | Pressing method for sandwich aluminum-base printed circuit board |
| CN103906345A (en) * | 2012-12-25 | 2014-07-02 | 株式会社京滨 | Radiating structure for printed circuit board |
| CN103118486A (en) * | 2013-01-29 | 2013-05-22 | 惠州中京电子科技股份有限公司 | Aluminum based circuit board with component plug holes and manufacturing method of aluminum based circuit board |
| CN103118486B (en) * | 2013-01-29 | 2016-01-27 | 惠州中京电子科技股份有限公司 | A kind of aluminum-based circuit board with element spliced eye and preparation method thereof |
| CN104902694A (en) * | 2014-03-05 | 2015-09-09 | 深南电路有限公司 | Internal-layer thick-copper circuit board processing method and internal-layer thick-copper circuit board |
| CN104902694B (en) * | 2014-03-05 | 2018-02-23 | 深南电路有限公司 | The processing method and inner-layer thick copper circuit board of inner-layer thick copper circuit board |
| CN104994682A (en) * | 2015-07-14 | 2015-10-21 | 广东欧珀移动通信有限公司 | PCB having good heat-dissipation performance and mobile terminal applied therewith |
| CN107564882A (en) * | 2016-06-30 | 2018-01-09 | 施韦策电子公司 | Circuit board member and the method for manufacturing circuit board member |
| CN107564882B (en) * | 2016-06-30 | 2023-03-24 | 施韦策电子公司 | Circuit board component and method for producing a circuit board component |
| CN106376176A (en) * | 2016-09-14 | 2017-02-01 | 广东达进电子科技有限公司 | Printed circuit board and fabrication method thereof |
| CN106879167A (en) * | 2017-04-06 | 2017-06-20 | 昆山苏杭电路板有限公司 | Double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision and preparation method thereof |
| CN106879167B (en) * | 2017-04-06 | 2023-11-28 | 昆山苏杭电路板有限公司 | Double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and manufacturing method thereof |
| CN108040416A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | A kind of production method of double-face aluminium substrate |
| CN107949156A (en) * | 2017-12-22 | 2018-04-20 | 珠海欣中祺电子科技有限公司 | A kind of double-sided wiring board |
| CN108990322A (en) * | 2018-08-16 | 2018-12-11 | 鹤山市得润电子科技有限公司 | A kind of double-sided PCB and its manufacturing method |
| CN110062537A (en) * | 2018-12-29 | 2019-07-26 | 博罗康佳精密科技有限公司 | A kind of preparation process of multiple layer metal substrate |
| CN112788835A (en) * | 2019-11-11 | 2021-05-11 | 无锡深南电路有限公司 | Circuit board and manufacturing method thereof |
| CN111093317A (en) * | 2019-12-10 | 2020-05-01 | 温州大学新材料与产业技术研究院 | LED aluminum substrate and printing method thereof |
| CN112752400A (en) * | 2020-12-10 | 2021-05-04 | 诚亿电子（嘉兴）有限公司 | Manufacturing method of double-sided copper-based PCB |
| WO2022152183A1 (en) * | 2021-01-13 | 2022-07-21 | 华为技术有限公司 | Printed circuit board, fabrication method therefor, and electronic communication device |
| CN114980573A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
| CN113301715A (en) * | 2021-04-01 | 2021-08-24 | 珠海精路电子有限公司 | Circuit board and manufacturing process thereof |
| CN114390773A (en) * | 2021-12-30 | 2022-04-22 | 江苏迪飞达电子有限公司 | Double-sided aluminum substrate and processing technology thereof |
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| CN102036476B (en) | 2012-07-18 |
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Effective date of registration: 20160825 Address after: Du Ruan Zhen Huan Zhen Lu Ting yuan Pengjiang District 529000 in Guangdong city of Jiangmen province No. 2 workshop two zone B Patentee after: JIANGMEN HUARUI ALUMINUM SUBSTANCE CO.,LTD. Address before: 529700 Jiangmen, Guangdong province Taoyuan Zhen Zhen Peach Industrial Zone Patentee before: Heshan Dongli Electronic Technologies Co.,Ltd. |
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Address after: 529000 area B, workshop 2, Tingyuan, Huanzhen Road, douruan Town, Pengjiang district, Jiangmen City, Guangdong Province Patentee after: Jiangmen Huarui aluminium substrate Co.,Ltd. Address before: 529000 area B, workshop 2, Tingyuan, Huanzhen Road, douruan Town, Pengjiang district, Jiangmen City, Guangdong Province Patentee before: JIANGMEN HUARUI ALUMINUM SUBSTANCE CO.,LTD. |
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Address after: Building 1, No. 96, Du Ruan North 3rd Road, Du Ruan Town, Pengjiang District, Jiangmen City, Guangdong Province, 529000 Patentee after: Guangdong Huarui High-tech Materials Co.,Ltd. Address before: 529000 area B, workshop 2, Tingyuan, Huanzhen Road, douruan Town, Pengjiang district, Jiangmen City, Guangdong Province Patentee before: Jiangmen Huarui aluminium substrate Co.,Ltd. |