CN203181411U - FR4 printed circuit board with enhanced highly-heat-conductive nano diamond-like-carbon (DLC) coating - Google Patents
FR4 printed circuit board with enhanced highly-heat-conductive nano diamond-like-carbon (DLC) coating Download PDFInfo
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- CN203181411U CN203181411U CN 201320116613 CN201320116613U CN203181411U CN 203181411 U CN203181411 U CN 203181411U CN 201320116613 CN201320116613 CN 201320116613 CN 201320116613 U CN201320116613 U CN 201320116613U CN 203181411 U CN203181411 U CN 203181411U
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Abstract
The utility model discloses an FR4 printed circuit board with an enhanced highly-heat-conductive nano diamond-like-carbon (DLC) coating, which comprises a substrate. The substrate is provided with a resin base material layer, a DLC coating and an external circuit layer. The DLC coating and the external circuit layer are orderly and sequentially attached to one surface or the upper and lower surfaces of the resin base material layer, wherein the DLC coating is prepared through any one technology selected among the PVD technology, the CVD technology and the ion beam technology, and the external circuit layer is prepared through any one technology selected among the PVD technology, the CVD technology, the ion spraying technology and the chemical plating technology. According to the technical scheme of the utility model, the highly-heat-conductive nano DLC coating is adapted to the FR4 printed circuit board. In this way, not only the advantages of a traditional FR4 printed circuit board, namely high strength, good heat resistance, excellent dielectric property, metallically coated through holes on a substrate and the like, but also the high heat-conduction and heat-radiation characteristics of the nano DLC coating, can be realized. Therefore, the temperatures of electronic components are lowered. The heat radiation and the heat conduction are also facilitated. Meanwhile, the temperature difference among different regions of the FR4 printed circuit board is reduced, so that the sosimilarg conduction effect on the surface of the circuit board is realized.
Description
Technical field
The utility model relates to the FR4 wiring board that a kind of high heat conducting nano DLC coating strengthens, and belongs to electronic technology field.
Background technology
Under science and technology and the promotion of human demand, electronic device is towards littler external form, and direction such as performance develops faster.Wiring board is not only the supporter of electronic device as the important electronic unit of electronic device, and is the supplier that the electronic devices and components circuit connects, further also as the packaged direct heat conduction and heat radiation approach that can produce the high heat flux device usually.Therefore, encapsulating such as chip, power supply, circuit conversion and LED show or other unknown integrated circuit fields that the accumulation of heat problem that the high heat flux of electronic device brings becomes one of problem demanding prompt solution.
The FR4 wiring board, be FR4 copper-clad plate wiring board, generally refer to the glass-epoxy copper-clad plate, it has that intensity height, good heat resistance, dielectric property are good, substrate through-hole can plating etc. characteristics, and can realize circuit turn-on between two-sided or multilayered printed flaggy and the layer.Thereby the FR4 copper-clad plate is that purposes is the widest in all kinds of copper-clad plate, and a class of consumption maximum is widely used in products such as communication, mobile communication, computer, instrument and meter, Digital Television, numerical control sound equipment, satellite, radar.
The advantages such as maturation, cost is low, moulding is easy, insulation property are good though above-mentioned FR4 wiring board possesses skills, its conductive coefficient are about 0.03W/mk, and this inborn low capacity of heat transmission has limited its application in high requirement heat radiation field.The radiating mode of high heat flux components and parts is mainly finished by increasing fin, heat pipe and radiator fan at present.Though the wiring board of existing non-resin base produces at present, as metal base circuit board or ceramic base wiring board, but when the circuit that arranges on the wiring board is comparatively complicated, when maybe needing to arrange bilayer or multilayer line, the FR4 wiring board is because its traditional advantage is often irreplaceable.
The utility model content
The purpose of this utility model provides the FR4 wiring board that a kind of high heat conducting nano DLC coating strengthens, specifically relate to a kind of with high heat conducting nano DLC coatings applications in the FR4 wiring board, make its advantage that not only has the FR4 wiring board, and the characteristics of the high heat conduction and heat radiation performance of DLC are arranged.The purpose of this utility model realizes by following technical proposals:
The FR4 wiring board that a kind of high heat conducting nano DLC coating strengthens, comprise substrate, described substrate comprises a resin base material layer, and the DLC coating that any one method makes in employing PVD technology, CVD technology or ion beam technology that described resin base material layer one surface or upper and lower two surfaces are adhered to according to the order of sequence successively and adopt the outer-layer circuit layer that any one method makes in PVD technology, CVD technology, plasma spray technology or the electroless plating technology.
The utility model further, described resin base material layer is to open the resin sheet that material, etching make by a copper-clad plate.
The utility model further, described resin base material layer is through opening the combination resin sheet that contains internal layer circuit that material, internal layer circuit figure are made, lamination makes by a plurality of copper-clad plates.
The utility model also is included in the solder mask that arranges on the described substrate further.
The utility model also is included in the electronic devices and components that arrange on the described substrate further.
After the utility model application implementation, its significant technique effect is mainly reflected in:
By with high heat conducting nano DLC coatings applications in the FR4 wiring board, make not only that the utility model FR4 wiring board has that traditional F R4 wiring board intensity height, good heat resistance, dielectric property are good, substrate through-hole can plating etc. advantage, and have the advantages that nanometer DLC is coated with floor height heat conduction and heat radiation performance, thereby reduce electronic devices and components temperature, be conducive to the conduction of thermal radiation and heat energy, and reduce the temperature difference of zones of different on the FR4 wiring board, PCB surface is played equal conduction of heat.
Following constipation closes accompanying drawing, embodiment of the present utility model is described in further detail, so that technical solutions of the utility model are easier to understand, grasp.
Description of drawings
Fig. 1 is the structural representation of the utility model preferred embodiment;
Fig. 2 is the structural representation of another preferred embodiment of the utility model;
Fig. 3 is the soaking conduction schematic diagram of the utility model preferred embodiment;
Fig. 4 is thermal radiation and the heat conduction schematic diagram of the utility model preferred embodiment.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is described, for embodiment the utility model product or method are made the generality illustration, help to understand better the utility model, but can't limit the utility model scope.Experimental technique described in the following embodiment if no special instructions, is conventional method; Described material if no special instructions, all can obtain from commercial channels.
In the FR4 wiring board, utility model is a kind of both to have had the advantage of FR4 wiring board own, the composite line plate that has the high heat conduction and heat radiation performance of DLC again to the utility model with high heat conduction DLC coatings applications.The FR4 wiring board that a kind of high heat conducting nano DLC of the utility model coating strengthens, comprise substrate, see also Fig. 2, described substrate comprises a resin base material layer 13, and the outer-layer circuit layer 11 that any one method makes in the DLC coating 12 that any one method makes in employing PVD technology, CVD technology or ion beam technology that described resin base material layer 13 1 surface are adhered to according to the order of sequence successively and employing PVD technology, CVD technology, plasma spray technology or the electroless plating technology.Certainly, as shown in Figure 1, DLC coating 12 that also can any one method makes in employing PVD technology, CVD technology or ion beam technology that described resin base material layer 13 upper and lower two surface are adhered to according to the order of sequence successively as required and adopt the outer-layer circuit layer 11 that any one method makes in PVD technology, CVD technology, plasma spray technology or the electroless plating technology.
By following experiment as can be known, by with high heat conducting nano DLC coatings applications in the FR4 wiring board, the FR4 wiring board that the utility model high heat conducting nano DLC coating is strengthened has that traditional F R4 wiring board intensity height, good heat resistance, dielectric property are good, substrate through-hole can plating etc. advantage, and have the advantages that nanometer DLC is coated with floor height heat conduction and heat radiation performance, thereby reduce electronic devices and components temperature, be conducive to the conduction of thermal radiation and heat energy, and reduce the temperature difference of zones of different on the wiring board, PCB surface played equal conduction of heat:
(1) conductive coefficient of traditional F R4 wiring board is generally about 0.03W/mk, the conductive coefficient of DLC coating is generally 800 W/mk, the resin base material layer 13 of traditional F R4 wiring board, be generally glass-epoxy sheet material, the calorimetric diffusion coefficient is 0.375mm in fact
2/ s, increase by the nanometer DLC coating 12 of 1 μ m～5 μ m thereon by any one method in conventional PVD technology, CVD technology or the ion beam technology after, the thermal diffusion coefficient measured value that contains the resin base material layer 13 of nanometer DLC coating 12 rises to 6.9mm
2/ s;
(2) at the identical electronic devices and components of following two groups of wiring boards encapsulation caloric value, be that the thermal source that encapsulates on every group of wiring board is identical: one group is traditional F R4 wiring board, the FR4 wiring board that another group strengthens for the utility model high heat conducting nano DLC coating, and FR4 material model used in two groups of wiring boards is identical, in the time of 40 ℃～50 ℃, two groups of FR4 wiring boards all reach heat balance, test shows, heat source temperature on the FR4 wiring board that the utility model high heat conducting nano DLC coating strengthens is lower, than low 5 ℃～7 ℃ of heat source temperature on the traditional F R4 wiring board.
As known to the skilled person, the FR4 wiring board of a kind of high heat conducting nano DLC of the utility model coating enhancing also is included in solder mask and the electronic devices and components 31 that arrange on the described substrate.Therefore, as shown in Figure 3, adopt traditional F R4 wiring board, the heat that electronic devices and components produce is concentrated, and the heat that electronic devices and components produce on the FR4 wiring board that the utility model high heat conducting nano DLC coating strengthens spreads to DLC coat side territory.Reduce the temperature of electronic devices and components 31 on the one hand, on the other hand, when a plurality of components and parts of encapsulation, the temperature difference in territory is less above the FR4 wiring board that the utility model high heat conducting nano DLC coating strengthens, and namely plays equal heat effect.As shown in Figure 4, the heat of electronic devices and components 31 or thermal radiation conduct to resin base material layer 13 by DLC coating 12 and are arranged on solder mask on the utility model substrate on the utility model FR4 wiring board, finally are transmitted in the external environment.Increase because the horizontal heat conduction of DLC coating 12, DLC coating 12 conduct to the heat transfer area of resin base material layer 13 and solder mask, make that the thermal resistance of the FR4 wiring board that the utility model high heat conducting nano DLC coating strengthens is very little.And because the DLC emissivity is greater than 0.8, the transparent or semitransparent solder mask that is generally that the FR4 wiring board that strengthens in the utility model high heat conducting nano DLC coating arranges does not absorb infrared radiation basically, therefore, heat or thermal radiation that the electronic devices and components that encapsulate on the FR4 wiring board that the utility model high heat conducting nano DLC coating strengthens produce when work conduct to the DLC layer earlier, see through solder mask to extraneous radiations heat energy via the DLC layer again.
The utility model particularly, if the FR4 wiring board that the utility model high heat conducting nano DLC coating strengthens is the multi-layer sheet wiring board, according to classical production process, material, figure transfer making inner line figure, lamination, etching method removal outer copper foil are opened in two above copper-clad plates, namely get the resin base material layer 13 that contains internal layer circuit, the branch substrate layer 13 of this moment is combination resin sheets, i.e. the combination that obtains of resin sheet lamination.If the FR4 wiring board that the utility model high heat conducting nano DLC coating strengthens is single sided board wiring board or the double-sided wiring board of individual layer, according to classical production process, material, etching method removal outer copper foil are opened in one copper-clad plate, namely obtain resin base material layer 13, the branch substrate layer 13 of this moment is monolithic resin sheets.
Certainly, after the substrate of the FR4 wiring board that a kind of high heat conducting nano DLC coating described in the utility model is strengthened is good by prior art for preparing, can adopt traditional PCB technology to make the multilayer circuit board of complete FR4 wiring board, make outer-layer circuit figure → wire mark solder mask or photic solder mask → printed character figure → bond pad surface processing etc. as shifting through drill-over via → heavy copper → figure.
The above only is preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvement and modification, these improve and modification also should be considered as protection range of the present utility model.
Claims (5)
1. the FR4 wiring board that strengthens of a high heat conducting nano DLC coating is characterized in that: comprise substrate,
Described substrate comprises a resin base material layer (13), and the DLC coating (12) that any one method makes in employing PVD technology, CVD technology or ion beam technology that described resin base material layer (13) one surface or upper and lower two surfaces are adhered to according to the order of sequence successively and adopt the outer-layer circuit layer (11) that any one method makes in PVD technology, CVD technology, plasma spray technology or the electroless plating technology.
2. the FR4 wiring board that strengthens of a kind of high heat conducting nano DLC coating according to claim 1 is characterized in that: described resin base material layer (13) is to open the resin sheet that material, etching make by a copper-clad plate.
3. the FR4 wiring board that strengthens of a kind of high heat conducting nano DLC coating according to claim 1 is characterized in that: described resin base material layer (13) is through opening the combination resin sheet that contains internal layer circuit that material, internal layer circuit figure making, lamination make by a plurality of copper-clad plates.
4. the FR4 wiring board of a kind of high heat conducting nano DLC coating enhancing according to claim 1 is characterized in that: also be included in the solder mask that arranges on the described substrate.
5. the FR4 wiring board of a kind of high heat conducting nano DLC coating enhancing according to claim 1 is characterized in that: also be included in the electronic devices and components (31) that arrange on the described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320116613 CN203181411U (en) | 2013-03-14 | 2013-03-14 | FR4 printed circuit board with enhanced highly-heat-conductive nano diamond-like-carbon (DLC) coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320116613 CN203181411U (en) | 2013-03-14 | 2013-03-14 | FR4 printed circuit board with enhanced highly-heat-conductive nano diamond-like-carbon (DLC) coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203181411U true CN203181411U (en) | 2013-09-04 |
Family
ID=49078063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320116613 Expired - Fee Related CN203181411U (en) | 2013-03-14 | 2013-03-14 | FR4 printed circuit board with enhanced highly-heat-conductive nano diamond-like-carbon (DLC) coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203181411U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103228101A (en) * | 2013-03-14 | 2013-07-31 | 苏州热驰光电科技有限公司 | FR4 circuit board enhanced by high-thermal-conductive nano DLC (diamond-like carbon) coating |
| CN105704905A (en) * | 2014-11-26 | 2016-06-22 | 联想(北京)有限公司 | Printed circuit board, electronic equipment and method for manufacturing printed circuit board |
-
2013
- 2013-03-14 CN CN 201320116613 patent/CN203181411U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103228101A (en) * | 2013-03-14 | 2013-07-31 | 苏州热驰光电科技有限公司 | FR4 circuit board enhanced by high-thermal-conductive nano DLC (diamond-like carbon) coating |
| CN105704905A (en) * | 2014-11-26 | 2016-06-22 | 联想(北京)有限公司 | Printed circuit board, electronic equipment and method for manufacturing printed circuit board |
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Effective date of registration: 20170120 Granted publication date: 20130904 |
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| RINS | Preservation of patent right or utility model and its discharge | ||
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20170314 |