CN201426214Y

CN201426214Y - PCB with radiating structure having heat-conducting and heat-radiating printing ink

Info

Publication number: CN201426214Y
Application number: CN2009201361815U
Authority: CN
Inventors: 沈李豪
Original assignee: Individual
Current assignee: Individual
Priority date: 2009-03-23
Filing date: 2009-03-23
Publication date: 2010-03-17
Anticipated expiration: 2019-03-23
Also published as: WO2010108361A1

Abstract

A PCB (printed circuit board) with a radiating structure having heat-conducting and heat-radiating printing ink relates to the field of electronic circuit printed circuit boards. The PCB comprises a PCB carrier board and at least one conductive layer, and further comprises at least one surface insulating layer of the heat-conducting and heat-radiating printing ink and at least one insulating adhesive layer of the heat-conducting and heat-radiating printing ink, wherein the conductive layer and the PCB carrier board are correspondingly attached to the upper and the lower surfaces of the insulating adhesive layer respectively, the PCB carrier board and the conductive layer are correspondingly attached to the upper and the lower surfaces of the insulating adhesive layer respectively, or the corresponding conductive layers are attached to the upper and the lower surfaces of the insulating adhesive layer respectively; and one surface of the surface insulating layer is attached to the othersurface of the corresponding conductive layer. The utility model has the advantages that the problem of poor radiating effect because of consistent use of the PCB (printed circuit board) or any heating components is solved, and meanwhile, the problems of heavy weight, high cost, complicated installation and the like of the carrier board or a radiating device are solved; and a structural style which has direct radiation and good efficiency and is suitable for producing the rigid PCB or the flexible PCB at the same time is provided.

Description

But a kind of pcb board with radiator structure of heat conduction and heat radiation printing ink

Technical field

The utility model relates to electronic circuit printed wiring board field, but relates in particular to a kind of printed wiring board with radiator structure of heat conduction and heat radiation printing ink.

Background technology

PCB (Printed Circuie Board) is the abbreviation of printed wiring board, usually on the insulation material, by predetermined design, make printed wiring, printed component or conductive pattern that both combine and be called printed circuit, and the conductive pattern that is electrically connected between the components and parts is being provided on the insulating substrate, be called printed wiring.Continuous development along with science and technology, pcb board is to multilayer, highly dense development, and the technology innovation of imbedding resistance, electric capacity, feasible heat conduction and heat radiation performance to the electronic circuit pcb board has had more and more higher requirement, so the heat dissipation problem of electronic circuit pcb board always is problem demanding prompt solution.With regard to the pcb board product that present traditional handicraft is on the market made, the support plate material of its heat conduction and heat radiation function dependence pcb board or additional heat fin type housing or fan are realized.

Traditional pcb board as shown in Figure 1, this pcb board connects the support plate that can dispel the heat by the insulation glue-line, but the radiating fin or other heat abstractor that are connected heat conduction and heat radiation again by support plate, though support plate is a heat-conducting metal, itself play the heat conduction and heat radiation effect, but radiating rate is relatively slow, also need rely on other heat abstractor to finish heat radiation in the electrical equipment connection procedure; So the radiator structure of traditional PCB plate is not only installed complexity, cost height but also is not easy to carry and repairs and less-than-ideal radiating effect makes it be subjected to great limitation.

The utility model content

At the unfavorable problem of the radiating effect of traditional PCB plate, but the utility model discloses a kind of pcb board with radiator structure of heat conduction and heat radiation printing ink, and it has the characteristics of simple in structure, easy to make and good heat dissipation effect.

To achieve these goals, but a kind of pcb board of the utility model with radiator structure of heat conduction and heat radiation printing ink, and its technical scheme is as follows:

But a kind of pcb board with radiator structure of heat conduction and heat radiation printing ink of structure the utility model comprises a PCB support plate and at least one conductive layer: but but also comprise the surface insulation layer of at least one heat conduction and heat radiation printing ink and the insulation glue-line of at least one heat conduction and heat radiation printing ink; Described insulation glue-line upper and lower surface respectively with described conductive layer and corresponding the bonding together of described PCB carrier, perhaps described insulation glue-line upper and lower surface is respectively with described PCB carrier and described conductive layer is corresponding bonds together, and perhaps described insulation glue-line upper and lower surface all bonds together with corresponding described conductive layer respectively; The one side of described surface insulation layer bonds together with the another side of corresponding described conductive layer.

Described PCB carrier plate material can be aluminium, copper, pottery, plastics, glass or glass fabricbase.

Described PCB support plate surface can be plane or curved surface.

The utility model is compared with existing known technology, its advantage is: it has not only improved the not good problem of habitual pcb board radiating effect, problem such as simultaneously also solved support plate or heat abstractor weight is excessive, cost is high, installation is numerous and diverse, and provide a kind of workable, heat radiation directly, excellent in efficiency, be applicable to the structural shape that rigidity pcb board and flexible PCB plate (FPCB) are made simultaneously.

Description of drawings

Fig. 1 is traditional PCB harden (profile);

Fig. 2 is the utility model single sided board structural representation (profile);

Fig. 3 is the two-sided or multi-layer sheet structural representation (profile) of the utility model;

Fig. 4 is the heat radiation mechanism schematic diagram (profile) of the utility model preferred embodiment.

Among the figure: 01, PCB support plate, 02, surface insulation layer, 03, conductive layer, 04, traditional insulation glue-line, 05, traditional printing ink surface insulation layer, 07, heat abstractor, 08, the insulation glue-line.

Embodiment

As Fig. 2, shown in Figure 3, but a kind of pcb board with radiator structure of heat conduction and heat radiation printing ink comprises a PCB support plate 01 and at least one conductive layer 03; It is characterized in that: but but also comprise the surface insulation layer 02 of at least one heat conduction and heat radiation printing ink and the insulation glue-line 08 of at least one heat conduction and heat radiation printing ink; Described insulation glue-line 08 upper and lower surface respectively with conductive layer 03 and described PCB carrier 01 corresponding bonding together, perhaps described insulation glue-line 08 upper and lower surface respectively with PCB carrier 01 and conductive layer 03 corresponding bonding together, perhaps described insulation glue-line 08 upper and lower surface all bonds together with corresponding conductive layer 03 respectively; The one side of described surface insulation layer 02 bonds together with the another side of corresponding described conductive layer 03.

As shown in Figure 2, but a kind of pcb board of the utility model with radiator structure of heat conduction and heat radiation printing ink, and wherein a kind of is the single sided board structure, comprises a PCB support plate 01 and a conductive layer 03; But but also comprise the surface insulation layer 02 of a heat conduction and heat radiation printing ink and the insulation glue-line 08 of a heat conduction and heat radiation printing ink; Described insulation glue-line 08 upper and lower surface respectively with described conductive layer 03 and described PCB carrier 01 corresponding bonding together, the one side of described surface insulation layer 02 bonds together with the another side of described conductive layer 03.

As shown in Figure 3, but a kind of pcb board of the utility model with radiator structure of heat conduction and heat radiation printing ink, and wherein another kind of double sided board or multi-layer sheet structure comprise a PCB support plate 01 and two-layer above conductive layer 03; But but also comprise the surface insulation layer 02 of two-layer above heat conduction and heat radiation printing ink and the insulation glue-line 08 of two-layer above heat conduction and heat radiation printing ink; Described insulation glue-line 08 upper and lower surface respectively with conductive layer 03 and described PCB carrier 01 corresponding bonding together, perhaps described insulation glue-line 08 upper and lower surface respectively with PCB carrier 01 and conductive layer 03 corresponding bonding together, perhaps described insulation glue-line 08 upper and lower surface all bonds together with corresponding conductive layer 03 respectively; The one side of described surface insulation layer 02 bonds together with the another side of corresponding described conductive layer 03.

Described PCB support plate 01 material can be aluminium, copper, pottery, plastics, glass or glass fabricbase (epoxy resin copper coated foil plate FR-4), and it can be rigidity or rubbing property material, and described PCB support plate 01 surface can be the curved surface of plane or arbitrary shape.

But the heat conduction and heat radiation printing ink of described surface insulation layer 02 and described insulation glue-line 08 is formulated for material insulation and easy heat conduction and heat radiation, can also be in traditional PCB making sheet printing ink, to add the heat conduction and heat radiation material and get, the utility model rely on described heat conduction and heat radiation printing ink heat is dispersed into air in each interlayer heat conduction and with the heat of circuit board surface in the middle of ， Er Da to the Hot balance.

After described conductive layer 03 energising, the heat part of its generation is absorbed by its described surface insulation layer 02 (getting final product heat conduction and heat radiation printing ink) and directly is dispersed in the middle of the air, and the described PCB support plate 01 below the heat of another part passes to after described insulation glue-line 08 (being heat conduction and heat radiation printing ink) absorbs exhales (as Fig. 4).

It can be directly used in coating or spraying as traditional PCB making sheet printing ink described surface insulation layer 02 and described insulation glue-line 08, can be conveniently used on the PCB support plate 01 on any surface; Also can have on the described conductive layer 03 of circuit as surface insulation layer (being welding resisting layer), also can be by the insulation glue-line of lamination as single two-sided or multi-layer PCB board, more can on the described conductive layer 03 of whole no circuit, be coated with and use as fin.

Described PCB support plate 01 material can be aluminium, copper, pottery, plastics, glass or glass fabricbase (epoxy resin copper coated foil plate FR-4), and it can be rigidity or flexible material.When it was the rigidity material, the surface can be plane, curved surface or irregular surface 06 (as Fig. 4); When it is flexible material, not only can be used for the installation of plane, difformity curved surface carrier and can be used for simultaneously directly with difformity and type pcb board between be connected, also the while can heat conduction and heat radiation; It should have higher toughness, non-frangibility.

From the above as can be known, this programme has been described good, easy for installation, the simple in structure pcb board of a kind of heat conduction and heat radiation performance, and it can solve the heat radiation defective that exists in the prior art.

The foregoing description only is preferable preferred version in the utility model is implemented, and indefiniteness is exhaustive, and under the prerequisite that does not break away from its inventive concept, any small variation or modification all should be considered as within the utility model protection range.

Claims

1, but a kind of pcb board with radiator structure of heat conduction and heat radiation printing ink comprises a PCB support plate (01) and at least one conductive layer (03); It is characterized in that: but also comprise at least one heat conduction and heat radiation printing ink surface insulation layer (02) but and the insulation glue-line (08) of at least one heat conduction and heat radiation printing ink; Described insulation glue-line (08) upper and lower surface respectively with conductive layer (03) and corresponding the bonding together of described PCB carrier (01), described insulation glue-line (08) upper and lower surface respectively with PCB carrier (01) and corresponding the bonding together of conductive layer (03), perhaps described insulation glue-line (08) upper and lower surface all bonds together with corresponding conductive layer (03) respectively; The one side of described surface insulation layer (02) bonds together with the another side of corresponding described conductive layer (03).

But 2, a kind of pcb board with radiator structure of heat conduction and heat radiation printing ink as claimed in claim 1, it is characterized in that: described PCB support plate (01) material can be aluminium, copper, pottery, plastics, glass or glass fabricbase.

But 3, a kind of pcb board with radiator structure of heat conduction and heat radiation printing ink as claimed in claim 1, it is characterized in that: described PCB support plate (01) surface can be plane or curved surface.