CN215121679U

CN215121679U - Circuit board based on protection is glued to high fever

Info

Publication number: CN215121679U
Application number: CN202121064326.2U
Authority: CN
Inventors: 王振海; 郭胜智; 吴蔚; 宁方为
Original assignee: Guangdong Xiangsi New Material Co ltd
Current assignee: Guangdong Xiangsi New Material Co ltd
Priority date: 2021-05-18
Filing date: 2021-05-18
Publication date: 2021-12-10
Anticipated expiration: 2031-05-18

Abstract

The utility model relates to the technical field of circuit boards, in particular to a circuit board based on high thermal adhesive protection, which comprises a base, a substrate connected with the base, a heat conduction layer arranged on the surface of the substrate, a heat dissipation layer coated on the heat conduction layer and a printed circuit printed on the heat dissipation layer; the heat dissipation layer is uniformly provided with heat dissipation micropores, the heat dissipation layer is a coating formed by a graphene layer and a ceramic mixed layer, the heat dissipation micropores are uniformly distributed in the ceramic mixed layer, an insulating heat conduction adhesive is arranged between the printed circuit and the heat dissipation layer, the graphene layer is sprayed on the surface of the heat conduction layer, the ceramic mixed layer is arranged on the surface of the graphene layer, and the printed circuit is arranged on the surface of the ceramic mixed layer; the utility model discloses a base plate cooperation heat-conducting layer to with printed circuit printing at the surperficial formation circuit board on heat dissipation layer again behind heat-conducting layer surface coating heat dissipation layer, solved the not good problem of traditional circuit board radiating effect.

Description

Circuit board based on protection is glued to high fever

Technical Field

The utility model relates to a circuit board technical field especially relates to a circuit board based on protection is glued to high fever.

Background

A PCB, also known as a printed circuit board, is an important electronic component, which is a support for electronic components and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. The PCB is mainly designed in a domain, and the adoption of the PCB has the main advantages of greatly reducing errors of wiring and assembly, improving the automation level and the production labor rate, and in order to increase the area of wiring, a printed circuit board with a double-sided inner layer and two single-sided outer layers or two double-sided inner layers and two single-sided outer layers is used, and the printed circuit boards which are alternately connected together through a positioning system and an insulating bonding material and are interconnected by conductive patterns according to the design requirement are changed into four-layer or six-layer printed circuit boards, which are also called multilayer PCB.

The circuit board on the market generally has a single structure, does not have a heat conduction structure per se, leads to the fact that a heat radiation structure must be equipped with in use, leads to the heat radiation structure to hardly meet the requirements on some small-sized structures, so can make further improvement aiming at the heat radiation structure of the existing circuit board, and the purpose is to promote the heat radiation and heat transfer effects.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides an adopted base plate cooperation heat-conducting layer to with printed circuit printing at the surperficial formation circuit board on heat dissipation layer again behind heat-conducting layer surface coating heat dissipation layer, solved the circuit board based on protection is glued to high fever of the not good problem of traditional circuit board radiating effect.

The utility model adopts the technical proposal that: a circuit board based on high thermal adhesive protection comprises a base, a substrate connected to the base, a heat conduction layer arranged on the surface of the substrate, a heat dissipation layer coated on the heat conduction layer and a printed circuit printed on the heat dissipation layer; the heat dissipation layer is evenly distributed with heat dissipation micropores, the heat dissipation layer is a coating formed by the graphene layer and the ceramic mixing layer, the heat dissipation micropores are evenly distributed in the ceramic mixing layer, insulating heat-conducting glue is arranged between the printed circuit and the heat dissipation layer, the graphene layer is sprayed on the surface of the heat-conducting layer, the ceramic mixing layer is arranged on the surface of the graphene layer, and the printed circuit is arranged on the surface of the ceramic mixing layer.

The further improvement of the scheme is that the base comprises a plurality of groups of upright columns, and the upright columns are connected with the base plate through screws.

The scheme is further improved in that the upright posts are metal upright posts or insulating upright posts.

The scheme is further improved in that the substrate is an aluminum substrate or a copper substrate.

The further improvement of the scheme is that one side of the substrate, which is far away from the heat conducting layer, is provided with a plurality of heat dissipation grooves.

The further improvement to the above scheme is that the heat dissipation grooves are formed in the substrate through laser engraving, and the heat dissipation grooves are uniformly distributed in a horizontal shape, a vertical shape or crossed and uniformly distributed.

The further improvement of the scheme is that the heat conducting layer is an aluminum alloy layer, and the heat conducting layer and the substrate are integrally and compositely molded.

The further improvement of the scheme is that the heat conduction layer is an aluminum alloy layer or a copper layer, and the heat conduction layer is connected with the substrate through high-heat-conduction glue.

In a further improvement of the above aspect, a thickness dimension of the heat conductive layer is smaller than or equal to a thickness dimension of the substrate layer.

The further improvement of the scheme is that one side of the heat conduction layer, which corresponds to the heat dissipation layer, is provided with a plurality of arc-shaped grooves, and the heat dissipation layer is filled with the arc-shaped grooves through spraying.

The utility model has the advantages that:

compare traditional circuit board, the utility model discloses a base plate cooperation heat-conducting layer to print printed circuit again behind heat-conducting layer surface coating heat dissipation layer at the surperficial formation circuit board on heat dissipation layer, solved the not good problem of traditional circuit board radiating effect, because under the cooperation of heat-conducting layer and heat dissipation layer, can realize dual heat conduction and heat dissipation, and the heat dissipation layer adopts graphite alkene and ceramic mixed structure to form, adopts the heat dissipation micropore to dispel the heat, and the radiating effect is splendid. The heat dissipation device comprises a base, a substrate connected with the base, a heat conduction layer arranged on the surface of the substrate, a heat dissipation layer coated on the heat conduction layer and a printed circuit printed on the heat dissipation layer; the heat dissipation layer is uniformly provided with heat dissipation micropores, the heat dissipation layer is a coating formed by the graphene layer and the ceramic mixed layer, the heat dissipation micropores are uniformly distributed in the ceramic mixed layer, and insulating heat conduction glue is arranged between the printed circuit and the heat dissipation layer. The effect that sets up insulating heat-conducting glue is the insulation protection between effect printed circuit and the heat dissipation layer, adopts the insulating heat-conducting glue of high heat conduction moreover, and the heat conduction is effectual, and the radiating effect is good, and structural stability is good.

Drawings

Fig. 1 is an explosion structure diagram of the circuit board based on high thermal adhesive protection of the present invention;

fig. 2 is a schematic structural diagram of the circuit board based on high thermal adhesive protection in fig. 1.

Description of reference numerals: the heat dissipation structure comprises a base 1, a stand column 11, a substrate 2, a heat dissipation groove 21, a heat conduction layer 3, an arc-shaped groove 31, a heat dissipation layer 4, a graphene layer 41, a ceramic mixing layer 42, heat dissipation micropores 43, a printed circuit 5 and insulating heat conduction glue 51.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

As shown in fig. 1 to 2, a circuit board based on high thermal adhesive protection includes a base 1, a substrate 2 connected to the base 1, a heat conduction layer 3 disposed on the surface of the substrate 2, a heat dissipation layer 4 coated on the heat conduction layer 3, and a printed circuit 5 printed on the heat dissipation layer 4; the heat dissipation layer 4 is uniformly distributed with heat dissipation micropores 43, the heat dissipation layer 4 is a coating formed by the graphene layer 41 and the ceramic mixing layer 42, the heat dissipation micropores 43 are uniformly distributed on the ceramic mixing layer 42, and an insulating heat conduction adhesive 51 is arranged between the printed circuit 5 and the heat dissipation layer 4.

The base 1 includes the stand 11 of a plurality of groups, stand 11 passes through the screw and connects in base plate 2, and the further improvement does, and stand 11 is metal stand 11 or insulating stand 11, selects metal or insulation system's stand 11 according to installation environment and application range, and the purpose is with the unsettled installation of circuit board for the better unsettled heat dissipation of base plate 2.

In this embodiment, the substrate 2 is an aluminum substrate 2 or a copper substrate 2, the material is selected according to the use environment, and different structures of the substrate 2 are adopted according to the heat dissipation requirement.

The base plate 2 deviates from the heat-conducting layer 3 one side and is equipped with a plurality of heat dissipation slot 21, and the further improvement is that, heat dissipation slot 21 passes through laser engraving and forming in base plate 2, heat dissipation slot 21 is horizontal form equipartition, erects form equipartition, or alternately equipartition, sets up heat dissipation slot 21 on base plate 2, can further promote the radiating effect.

In this embodiment, heat-conducting layer 3 is the aluminum alloy layer, heat-conducting

layer

3 and 2 integrative compound molding of base plate adopt the heat conduction and the heat dissipation of a body structure, and an organic whole nature is strong to adopt metallurgical compound connection, heat conduction radiating efficiency is high.

In another embodiment, the heat conduction layer 3 is an aluminum alloy layer or a copper layer, the heat conduction layer 3 is connected with the substrate 2 through high heat conduction glue, the high heat conduction glue is adopted for attaching connection, and quick heat transfer and heat dissipation can be achieved.

In this embodiment, the thickness of the heat conducting layer 3 is smaller than or equal to the thickness of the substrate 2, and the thickness of the heat conducting layer 3 is required to ensure rapid heat transfer due to heat dissipation, so that the thickness is generally smaller than the basic thickness.

A plurality of arc slots 31 have been seted up to heat-conducting layer 3 corresponding heat dissipation layer 4 one side, heat dissipation layer 4 is filled arc slot 31 through the spraying, adopts arc slot 31 and packs, can greatly increased heat-conducting layer 3 and heat dissipation layer 4's area of contact to heat transfer heat dissipation that can be better.

The utility model discloses a 2 cooperation heat-conducting layers 3 of base plate to print printed circuit 5 again at the surperficial formation circuit board of heat dissipation layer 4 behind 3 surface coating heat dissipation layers 4 of heat-conducting layer, solved the not good problem of traditional circuit board radiating effect, because under the cooperation of heat-conducting layer 3 and heat dissipation layer 4, can realize dual heat conduction and heat dissipation, and heat dissipation layer 4 adopts graphite alkene and ceramic mixed structure to form, adopts heat dissipation micropore 43 to dispel the heat, and the radiating effect is splendid. Specifically, the heat dissipation device is provided with a base 1, a substrate 2 connected with the base 1, a heat conduction layer 3 arranged on the surface of the substrate 2, a heat dissipation layer 4 coated on the heat conduction layer 3 and a printed circuit 5 printed on the heat dissipation layer 4; the heat dissipation layer 4 is uniformly distributed with heat dissipation micropores 43, the heat dissipation layer 4 is a coating formed by the graphene layer 41 and the ceramic mixing layer 42, the heat dissipation micropores 43 are uniformly distributed on the ceramic mixing layer 42, and an insulating heat conduction adhesive 51 is arranged between the printed circuit 5 and the heat dissipation layer 4. The effect of setting up insulating heat-conducting glue 51 is the insulation protection between effect printed circuit 5 and heat dissipation layer 4, adopts the insulating heat-conducting glue 51 of high heat conduction moreover, and the heat conduction is effectual, and the radiating effect is good, and structural stability is good.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a circuit board based on protection is glued to high fever, its characterized in that: the heat dissipation device comprises a base, a substrate connected with the base, a heat conduction layer arranged on the surface of the substrate, a heat dissipation layer coated on the heat conduction layer and a printed circuit printed on the heat dissipation layer; the heat dissipation layer is evenly distributed with heat dissipation micropores, the heat dissipation layer is a coating formed by the graphene layer and the ceramic mixing layer, the heat dissipation micropores are evenly distributed in the ceramic mixing layer, insulating heat-conducting glue is arranged between the printed circuit and the heat dissipation layer, the graphene layer is sprayed on the surface of the heat-conducting layer, the ceramic mixing layer is arranged on the surface of the graphene layer, and the printed circuit is arranged on the surface of the ceramic mixing layer.

2. The circuit board based on high thermal adhesive protection of claim 1, wherein: the base comprises a plurality of groups of upright columns, and the upright columns are connected with the base plate through screws.

3. The circuit board based on high thermal adhesive protection of claim 2, wherein: the upright posts are metal upright posts or insulating upright posts.

4. The circuit board based on high thermal adhesive protection of claim 1, wherein: the substrate is an aluminum substrate or a copper substrate.

5. The circuit board based on high thermal adhesive protection of claim 1, wherein: the base plate deviates from the heat-conducting layer one side and is equipped with a plurality of heat dissipation grooves.

6. The circuit board based on high thermal adhesive protection of claim 5, wherein: the heat dissipation groove is formed in the substrate through laser engraving, and the heat dissipation groove is horizontally and uniformly distributed, vertically and uniformly distributed or alternately and uniformly distributed.

7. The circuit board based on high thermal adhesive protection of claim 1, wherein: the heat conduction layer is an aluminum alloy layer, and the heat conduction layer and the substrate are integrally and compositely molded.

8. The circuit board based on high thermal adhesive protection of claim 1, wherein: the heat conduction layer is an aluminum alloy layer or a copper layer, and is connected with the substrate through high heat conduction glue.

9. The circuit board based on high thermal adhesive protection of claim 1, wherein: the thickness dimension of the heat conduction layer is smaller than or equal to that of the substrate layer.

10. The circuit board based on high thermal adhesive protection of claim 1, wherein: a plurality of arc-shaped grooves are formed in one side, corresponding to the heat dissipation layer, of the heat conduction layer, and the arc-shaped grooves are filled in the heat dissipation layer through spraying.