CN201571255U

CN201571255U - PCB structure with heat conductivity, heat radiation performance and self stickiness

Info

Publication number: CN201571255U
Application number: CN2009202601661U
Authority: CN
Inventors: 沈李豪
Original assignee: Individual
Current assignee: Individual
Priority date: 2009-11-04
Filing date: 2009-11-04
Publication date: 2010-09-01
Anticipated expiration: 2019-11-04

Abstract

The utility model provides a PCB structure with heat conductivity, heat radiation performance and self stickiness, which relates to an electronic circuit printing circuit board. The PCB structure comprises an electronic circuit PCB board, at least one electronic part and a carrying body, wherein the electronic part is assembled on the electronic circuit PCB board, the electronic circuit PCB board sequentially comprises a surface insulation layer, a conductive layer, an insulation rubber layer and a base plate, the base plate of the electronic circuit PCB board can be an aluminum base plate, a copper base plate, a heat conductive ceramic base plate, a heat conductive plastic base plate, a heat conductive glass base plate or a heat conductive glass cloth base, the carrying body is an attached installing body of the electronic circuit PCB board, the PCB structure also comprises a heat conductive and heat radiation pressure sensing rubber layer, and the electronic circuit PCB board and the carrying body are glued together through the pressure sensing rubber layer. The utility model has the advantages that the simple structure solves the problems of too heavy weight, high cost, complicated installation and poor heat radiation effect of a carrying plate or a heat radiator of the traditional electronic circuit PCB board, and in addition, the electronic circuit PCB board can be fast, firmly and directly glued on the carrying body.

Description

A kind of PCB structure with heat conduction and heat radiation and tack

Technical field:

The utility model relates to electronic circuit printed wiring board field, relates in particular to a kind of PCB (being printed wiring board) structure with heat conduction and heat radiation and tack.

Background technology

PCB (Printed Circuie Board) is the abbreviation of printed wiring board, usually on the insulation material, by predetermined design, make printed wiring, printed component or conductive pattern that both combine and be called printed circuit, and the conductive pattern that is electrically connected between the components and parts is being provided on the insulating substrate, be called printed wiring.Continuous development along with science and technology, pcb board is to multilayer, highly dense development, and the technology innovation of imbedding resistance, electric capacity, feasible heat conduction and heat radiation performance to the electronic circuit pcb board has had more and more higher requirement, so the heat dissipation problem of electronic circuit pcb board always is problem demanding prompt solution.With regard to the pcb board product that present traditional handicraft is on the market made, the support plate material of its heat conduction and heat radiation function dependence pcb board or additional heat fin type housing or fan are realized.

Traditional pcb board as depicted in figs. 1 and 2, this pcb board 06 connects the supporting body that can dispel the heat by the insulation glue-line, but be connected heat abstractors 062 such as the radiating fin 061 of heat conduction and heat radiation or other fan by heat-conducting cream 07 by supporting body again, though supporting body is a heat-conducting metal, itself play the heat conduction and heat radiation effect, but radiating rate is relatively slow, also need rely on heat abstractors 062 such as other fan to finish heat radiation in the electrical equipment connection procedure; So the radiator structure of traditional PCB plate 06 is not only installed complexity, cost height but also is not easy to carry and repairs and less-than-ideal radiating effect makes it be subjected to great limitation.

The utility model content

Radiating effect at conditional electronic circuit pcb board is undesirable, installation cost is high, volume is big, complex structure and other problems, and the utility model discloses a kind of PCB structure with heat conduction and heat radiation and tack.It has simple in structure, and good heat dissipation effect is used characteristics easily.

To achieve these goals, a kind of PCB structure of the utility model with heat conduction and heat radiation and tack, its technical scheme is as follows:

A kind of PCB structure with heat conduction and heat radiation and tack comprises an electronic circuit pcb board and at least one electronic component; Described electronic component is assemblied on the described electronic circuit pcb board; Described electronic circuit pcb board comprises surface insulation layer, conductive layer, insulation glue-line and substrate successively, the surface insulation layer of described electronic circuit pcb board and insulation glue-line are made by the macromolecular material of the tool bonding force of the heat conduction and heat radiation of insulation, or the ceramic material of the tool bonding force of heat conduction and heat radiation makes, and also the heat conduction PCB making sheet printing ink of tool bonding force makes; The substrate of described electronic circuit pcb board can be aluminium base, copper base, thermal conductive ceramic substrate, heat-conducting plastic substrate, heat conduction glass substrate or heat conduction glass fabricbase (heat-conduction epoxy resin FR4); The pressure sensing adhesive layer that also comprises heat conduction and heat radiation, the substrate bonding of described pressure sensing adhesive layer and described electronic circuit pcb board; When described electronic circuit pcb board was installed, the another side and the supporting body of described pressure sensing adhesive layer were bonding, and described supporting body is the supporter of described electronic circuit pcb board, and promptly described electronic circuit pcb board is installed on described supporting body.

Described pressure sensing adhesive layer is made by the macromolecular material of the tool bonding force of the heat conduction and heat radiation of insulation; Or the ceramic material of the tool bonding force of heat conduction and heat radiation makes, and this material is ceramic material and adds the preparation of heat conduction and heat radiation material; Also the heat conduction PCB making sheet printing ink of tool bonding force makes, and this printing ink is to add the Heat Conduction Material preparation in the traditional PCB making sheet printing ink.

The substrate of described electronic circuit pcb board can be the rigidity pcb board, also can be Flexible PCB plate (being FPC), and its number of plies can be individual layer or bilayer or multilayer.

Described supporting body can be the last lower casing (as lower cover on the module backlight etc.) of electronic circuit product, also can be the PCB carrier (as fluorescent lamp lamp, light steelframe light fixture, street lamp, bulb etc.) of LED lighting.

The pressure-sensing glue of described pressure sensing adhesive layer can directly be pasted on the surface of described supporting body fast, securely.

The utility model is compared with existing known technology, and its advantage is:

1, the utility model relies on its simple structure, problem such as not only solved the support plate of conditional electronic circuit pcb board or heat abstractor weight is excessive, cost is high, installation is numerous and diverse, and the heat conduction and heat radiation of himself has also improved the not good problem of pcb board radiating effect of tradition.

2, itself tack of the utility model, make the electronic circuit pcb board can directly be pasted on the last lower casing (as lower cover on the module backlight etc.) of electronic circuit product fast, securely, or on the PCB carrier of LED lighting (as fluorescent lamp lamp, light steelframe light fixture, street lamp, bulb etc.), this kind structure is not only installed simply, workable, heat radiation directly, excellent in efficiency, also further improved the speed of assembling.

Description of drawings

Fig. 1 is one of conditional electronic circuit pcb board radiator structure (profile);

Fig. 2 is two radiator structures (profile) of conditional electronic circuit pcb board;

Fig. 3 is one of the utility model electronic circuit pcb board radiator structure schematic diagram (profile);

Fig. 4 is two radiator structure schematic diagrames (profile) of the utility model electronic circuit pcb board;

Fig. 5 is the heat radiation mechanism schematic diagram (profile) of the utility model preferred embodiment.

Among the figure: 01, electronic circuit pcb board; 011, surface insulation layer; 012, conductive layer; 013, insulation glue-line; 014, substrate; 02, electronic component; 03, pressure sensing adhesive layer; 04, supporting body; 05, heat; 06, conditional electronic circuit pcb board; 061, radiating fin; 062, radiator fan; 07, heat-conducting cream.

Embodiment

As shown in Figure 3 and Figure 4, a kind of PCB structure with heat conduction and heat radiation and tack comprises an electronic circuit pcb board 01 and at least one electronic component 02, and described electronic component 02 is assemblied on the described electronic circuit pcb board 01; Described electronic circuit pcb board comprises surface insulation layer 011, conductive layer 012, insulation glue-line 013 and substrate 014 successively, and so-called conductive layer 012 is printed conductive figure (printed wiring); The pressure sensing adhesive layer 03 that also comprises heat conduction and heat radiation, described pressure sensing adhesive layer 03 is bonding with the substrate 014 of described electronic circuit pcb board 01; When described electronic circuit pcb board 01 was installed, the another side of described pressure sensing adhesive layer 03 and supporting body 04 were bonding, and described supporting body 04 is the supporter of described electronic circuit pcb board 01, and promptly described electronic circuit pcb board 01 is installed on described supporting body 04.To realize that described electronic circuit pcb board 01 Fast Installation is in described supporting body 04.

The material of the surface insulation layer 011 of described electronic circuit pcb board 01 and insulation glue-line 012 and pressure sensing adhesive layer 03 by insulation, easily the macromolecular material of heat conduction and heat radiation or ceramic material to add the heat conduction and heat radiation material formulated, also can in traditional PCB making sheet printing ink, add Heat Conduction Material and make; The surface insulation layer 011, insulation glue-line 012 and pressure sensing adhesive layer 03 that the utility model relies on described heat conduction and heat radiation is dispersed into heat 05 in the middle of the air in each interlayer heat conduction and with the heat 05 on electronic circuit pcb board 01 surface, and reaches heat balance.

The substrate 014 of described electronic circuit pcb board 01 can be aluminium base, copper base, thermal conductive ceramic substrate, heat-conducting plastic substrate, heat conduction glass substrate or heat conduction glass fabricbase (heat-conduction epoxy resin FR4), it can be the rigidity pcb board, also can be Flexible PCB plate (being FPC), its number of plies can be individual layer or bilayer or multilayer.

Described supporting body 04 can be the last lower casing (as lower cover on the module backlight etc.) of electronic circuit product, also can be the PCB carrier (as fluorescent lamp lamp, light steelframe light fixture, street lamp, bulb etc.) of LED lighting.

The surface that can directly be pasted on above-mentioned supporting body 04 fast, securely of described pressure sensing adhesive layer 03 pressure-sensing glue.

Electronic circuit pcb board 01 as shown in Figure 5, after described conductive layer 013 energising, the heat 05 that its electronic component 02 produces is absorbed by its described surface insulation layer 011 on the one hand and directly is dispersed in the middle of the air, on the other hand, described insulation glue-line 012 passes to following described PCB substrate 014 after heat 05 can being absorbed, a part of then heat 05 is directly exhaled by described PCB substrate 014, and another is partly passed on the following supporting body 04 after described pressure-sensing glue 03 absorption and is dispersed in the air.

From the above as can be known, it is good, easy for installation that this programme has been described a kind of heat conduction and heat radiation performance, pcb board structure simple in structure, and it can solve heat radiation and the defective mounting that exists in the prior art.

The foregoing description only is preferable preferred version in the utility model is implemented, and indefiniteness is exhaustive, and under the prerequisite that does not break away from its inventive concept, any small variation or modification all should be considered as within the utility model protection range.

Claims

1. the PCB structure with heat conduction and heat radiation and tack comprises an electronic circuit pcb board and at least one electronic component; Described electronic component is assemblied on the described electronic circuit pcb board; Described electronic circuit pcb board comprises surface insulation layer, conductive layer, insulation glue-line and substrate successively, the surface insulation layer of described electronic circuit pcb board and insulation glue-line are made by the macromolecular material of the tool bonding force of the heat conduction and heat radiation of insulation, or the ceramic material of the tool bonding force of heat conduction and heat radiation makes, and also the heat conduction PCB making sheet printing ink of tool bonding force makes; The substrate of described electronic circuit pcb board can be aluminium base, copper base, thermal conductive ceramic substrate, heat-conducting plastic substrate, heat conduction glass substrate or heat conduction glass fabricbase; It is characterized in that: also comprise the pressure sensing adhesive layer of heat conduction and heat radiation, the substrate bonding of described pressure sensing adhesive layer and described electronic circuit pcb board; When described electronic circuit pcb board was installed, the another side and the supporting body of described pressure sensing adhesive layer were bonding, and described supporting body is the supporter of described electronic circuit pcb board, and promptly described electronic circuit pcb board is installed on described supporting body.

2. a kind of PCB structure with heat conduction and heat radiation and tack as claimed in claim 1 is characterized in that: described pressure sensing adhesive layer is made by the macromolecular material of the tool bonding force of the heat conduction and heat radiation of insulation; Or the ceramic material of the tool bonding force of heat conduction and heat radiation is made; Also the heat conduction PCB making sheet printing ink of tool bonding force makes.

3. a kind of PCB structure as claimed in claim 1 with heat conduction and heat radiation and tack, it is characterized in that: described electronic circuit pcb board can be the rigidity pcb board, also can be the Flexible PCB plate, and its number of plies can be individual layer or bilayer or multilayer.

4. a kind of PCB structure with heat conduction and heat radiation and tack as claimed in claim 1, it is characterized in that: described supporting body can be the last lower casing of electronic circuit product, also can be the PCB carrier of LED lighting.