CN213818342U - High-efficient heat dissipation FPC circuit board - Google Patents
High-efficient heat dissipation FPC circuit board Download PDFInfo
- Publication number
- CN213818342U CN213818342U CN202023167534.3U CN202023167534U CN213818342U CN 213818342 U CN213818342 U CN 213818342U CN 202023167534 U CN202023167534 U CN 202023167534U CN 213818342 U CN213818342 U CN 213818342U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- fpc circuit
- heat
- heat dissipation
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a high-efficient heat dissipation FPC circuit board, including base plate, copper foil and the tectorial membrane layer that connects gradually, be equipped with a plurality of conducting strips in the base plate, the conducting strip runs through the base plate both sides. When the FPC circuit board is used, heat emitted by the lamp is transmitted to the substrate and conducted out through the heat conducting fins, so that the technical problem that the FPC circuit board is damaged due to the concentrated heat in the lamp is solved, and the heat dissipation effect of the FPC circuit board is improved.
Description
Technical Field
The utility model relates to a FPC circuit board technical field specifically is a high-efficient heat dissipation FPC circuit board.
Background
The FPC board, also called flexible circuit board, is a flexible printed circuit board with high reliability and excellent performance, which is made of polyimide or polyester film as base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property.
Because a large amount of heat can be generated in the lamp, the circuit board can be damaged when the heat is concentrated at the circuit board for a long time, and the lamp cannot normally run
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: the technical problem that the traditional FPC circuit board is poor in heat dissipation performance is solved.
The utility model provides a high-efficient heat dissipation FPC circuit board, including base plate, copper foil and the tectorial membrane layer that connects gradually, be equipped with a plurality of conducting strips in the base plate, the conducting strip runs through the base plate both sides.
When the FPC circuit board is used, heat emitted by the lamp is transmitted to the substrate and conducted out through the heat conducting fins, so that the technical problem that the FPC circuit board is damaged due to the concentrated heat in the lamp is solved, and the heat dissipation effect of the FPC circuit board is improved.
Furthermore, fins which are symmetrically arranged and integrally formed are arranged at two ends of the heat conducting fin, and the fins are clamped on two sides of the base plate. So set up, the conducting strip installation more firm, the fin has increased the area of contact of conducting strip with the air moreover, has further improved the radiating effect.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a front view of the present invention;
FIG. 2 is a cross-sectional view A-A of FIG. 1;
in the figure: 1. a substrate; 2. copper foil; 3. a film coating layer; 4. a heat conductive sheet; 5. and a fin.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.
As shown in fig. 1 and 2, the utility model relates to a high-efficient heat dissipation FPC circuit board, including base plate 1, copper foil 2 and the tectorial membrane layer 3 that connects gradually, be equipped with a plurality of conducting strips 4 in the base plate 1, conducting strip 4 runs through base plate 1 both sides.
Fins 5 which are symmetrically arranged and integrally formed are arranged at two ends of the heat conducting fin 4, and the fins 5 are clamped on two sides of the base plate 1. So set up, the installation of conducting strip 4 is more firm, and fin 5 has increased the area of contact of conducting strip 4 with the air moreover, has further improved the radiating effect.
When the FPC circuit board is used, heat emitted by the lamp is transmitted to the substrate 1 and conducted out through the heat conducting fins 4, so that the technical problem that the FPC circuit board is damaged due to the concentrated heat in the lamp is solved, and the heat dissipation effect of the FPC circuit board is improved.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (2)
1. The utility model provides a high-efficient heat dissipation FPC circuit board which characterized in that: the laminated heat-conducting film comprises a substrate (1), a copper foil (2) and a film coating layer (3) which are sequentially connected, wherein a plurality of heat-conducting fins (4) are arranged in the substrate (1), and the heat-conducting fins (4) penetrate through two sides of the substrate (1).
2. The FPC board of claim 1, wherein: the two ends of the heat conducting fin (4) are provided with fins (5) which are symmetrically arranged and integrally formed, and the fins (5) are clamped on the two sides of the base plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023167534.3U CN213818342U (en) | 2020-12-24 | 2020-12-24 | High-efficient heat dissipation FPC circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023167534.3U CN213818342U (en) | 2020-12-24 | 2020-12-24 | High-efficient heat dissipation FPC circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213818342U true CN213818342U (en) | 2021-07-27 |
Family
ID=76948446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023167534.3U Active CN213818342U (en) | 2020-12-24 | 2020-12-24 | High-efficient heat dissipation FPC circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213818342U (en) |
-
2020
- 2020-12-24 CN CN202023167534.3U patent/CN213818342U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101489159B1 (en) | Method for manufacturing metal printed circuit board | |
| JP4969332B2 (en) | Substrate and lighting device | |
| CN213818342U (en) | High-efficient heat dissipation FPC circuit board | |
| CN102893707B (en) | flexible substrate module | |
| CN213783693U (en) | Heat dissipation type LED lamp FPC circuit board | |
| WO2008141500A1 (en) | A circuit board for heat dispersion | |
| CN210807782U (en) | Substrate heat dissipation substrate structure | |
| CN210351765U (en) | Multilayer rigid-flex printed circuit board | |
| WO2012017725A1 (en) | Substrate module for having heat generating source mounted thereon, and lighting device | |
| KR20140082599A (en) | Method for manufacturing metal printed circuit board | |
| CN219780485U (en) | Flexible circuit board | |
| CN217770471U (en) | Circuit board copper foil substrate with black shielding effect | |
| CN206365149U (en) | A kind of bent aluminium base | |
| CN218998355U (en) | Stable-structure multilayer circuit board | |
| CN217777984U (en) | High-heat-dissipation multi-layer aluminum-based copper-clad plate | |
| CN2598151Y (en) | Structure of high power LED | |
| CN210601153U (en) | Lamp strip FFC | |
| CN210444557U (en) | Rigid-flex circuit board | |
| CN213534092U (en) | Aluminum-based copper-clad plate with efficient heat dissipation | |
| CN213426709U (en) | PCB substrate for display screen | |
| CN213991138U (en) | Short-circuit-proof FPC circuit board | |
| CN219876625U (en) | Heat abstractor and unmanned aerial vehicle | |
| CN111447728B (en) | Flexible circuit board and electronic equipment | |
| CN208572540U (en) | A kind of low thermal resistance can bending aluminum substrate | |
| CN220569706U (en) | LED deep ultraviolet reflection module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |