CN217770471U - Circuit board copper foil substrate with black shielding effect - Google Patents

Abstract

The utility model relates to a circuit board copper foil base plate with effect is shielded to black, including the copper foil base plate body, the top fixed mounting of copper foil base plate body has glues glutinous layer, the top fixed mounting who glues glutinous layer has the light shielding layer, the bottom fixed mounting who glues glutinous layer has protection machanism, protection machanism includes waterproof layer, first heat-absorbing layer, second heat-absorbing layer, heat-conducting layer, heat dissipation layer and conducting strip. This circuit board copper foil base plate with effect is shielded to black, at first set up the copper foil base plate body in the inside of circuit board body, and set up the waterproof layer respectively in the top and the bottom of copper foil base plate body, polyethylene layer through the waterproof layer reaches water-proof effects, through with first heat-absorbing layer, the second heat-absorbing layer, heat-conducting layer and heat dissipation layer set up respectively to the aluminium oxide layer, graphite alkene heat dissipation film, silica gel lamella and carbon nanometer heat dissipation film, reach high-efficient radiating effect, at last derive the heat rapidly that the copper foil base plate body is outside through the conducting strip.

Description

Circuit board copper foil substrate with black shielding effect

Technical Field

The utility model relates to a circuit board technical field specifically is a circuit board copper foil substrate with effect is shielded to black.

Background

Circuit boards, also known as printed circuit boards or PCBs, are found in every electronic device in the world today, and in fact, circuit boards are considered the basis for electronic devices because they are the important mechanical component of PC boards where the various components are fixed in place and interconnected to make the electronic device work as intended.

The existing copper foil substrate is very wide in application and has the advantage of good insulation effect, most of the existing copper foil substrates in the existing market are unsatisfactory in heat conduction, heat cannot be discharged in time, the service life of the copper foil substrate is easily influenced, the existing copper foil substrate is poor in waterproof effect, and the service life of the copper foil substrate is shortened.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a circuit board copper foil base plate with effect is shielded to black possesses the good advantage of waterproof radiating effect, and it is unsatisfactory to have solved the most heat conductivities of the thin base plate of current copper foil on the existing market, and the heat can't in time be discharged, easily influences the life of the thin base plate of copper foil, and current copper foil base plate partial water-proof effects is not good, also can lead to the problem that copper foil base plate life shortens.

In order to achieve the above object, the utility model provides a following technical scheme: a circuit board copper foil substrate with a black shielding effect comprises a copper foil substrate body, wherein a sticky layer is fixedly mounted at the top of the copper foil substrate body, a light shielding layer is fixedly mounted at the top of the sticky layer, and a protection mechanism is fixedly mounted at the bottom of the sticky layer;

the protection mechanism comprises a waterproof layer, a first heat absorption layer, a second heat absorption layer, a heat conduction layer, a heat dissipation layer and a heat conduction sheet, the waterproof layer is fixedly mounted at the top of the copper foil substrate body, the first heat absorption layer is fixedly mounted at the top of the waterproof layer, the second heat absorption layer is fixedly mounted at the top of the first heat absorption layer, the heat conduction layer is fixedly mounted at the top of the second heat absorption layer, the heat dissipation layer is fixedly mounted at the top of the heat conduction layer, and the heat conduction sheet is fixedly mounted outside the heat conduction layer.

Furthermore, the outside fixed mounting of copper foil substrate body has the circuit board body, protection machanism is located the inside of circuit board body.

Further, the quantity of waterproof layer is two, two the waterproof layer is located the top and the bottom of copper foil base plate body respectively, the waterproof layer is the polyethylene layer, the quantity on gluing layer and light-resistant layer is two.

Further, two glue the layer respectively for the top and the bottom of copper foil base plate body, two the relative one side of light shielding layer respectively with two glue the relative one side fixed connection on layer, two the light shielding layer is the polyimide film.

Furthermore, the number of the first heat absorbing layers, the number of the second heat absorbing layers, the number of the heat conducting layers and the number of the heat radiating layers are two, the opposite sides of the two first heat absorbing layers are fixedly connected with the opposite sides of the two waterproof layers respectively, and the opposite sides of the two second heat absorbing layers are fixedly connected with the opposite sides of the two heat conducting layers respectively.

Furthermore, two mutually opposite sides of the heat dissipation layer are respectively fixedly connected with the opposite sides of the two sticky layers, the first heat absorption layer is an aluminum oxide layer, the second heat absorption layer is a graphene heat dissipation film, the heat conduction layer is a heat conduction silica gel sheet layer, and the heat dissipation layer is a carbon nanometer heat dissipation film.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

1. this circuit board copper foil base plate with effect is shielded to black, glue glutinous layer through the outside setting at the copper foil base plate body, the effect of gluing glutinous layer makes each layer of protection machanism inside more firm with this body coupling of copper foil base plate through gluing glutinous layer, through setting up the light shielding layer, the light shielding layer is black polyimide film, can prevent that circuit board body internal data from being read, through setting up the waterproof layer, the polyethylene layer can play better water-proof effects, prevent that the inside of copper foil base plate body from intaking, through first heat-sink shell, the second heat-sink shell, heat-conducting layer and heat dissipation layer combined action reach the better purpose of radiating effect.

2. This circuit board copper foil base plate with effect is shielded to black, at first the inside at the circuit board body sets up the copper foil base plate body, and set up the waterproof layer respectively in the top and the bottom of copper foil base plate body, polyethylene layer through the waterproof layer reaches water-proof effects, through with first heat-absorbing layer, the second heat-absorbing layer, heat-conducting layer and heat dissipation layer set up respectively to the aluminium oxide layer, graphite alkene heat dissipation film, silica gel lamella and carbon nanometer heat dissipation film, reach high-efficient radiating effect, at last derive the copper foil base plate body outside with the heat rapidly through the conducting strip, reach the radiating effect of rapid cooling.

Drawings

FIG. 1 is a partial three-dimensional schematic view of the present invention;

FIG. 2 is a schematic cross-sectional view of the present invention;

fig. 3 is a schematic view of the protection mechanism of the present invention.

In the figure: the heat-conducting type LED lamp comprises a foil substrate body 1, an adhesive layer 2, a shading layer 3, a protection mechanism 4, a waterproof layer 401, a first heat-absorbing layer 402, a second heat-absorbing layer 403, a heat-conducting layer 404, a heat-radiating layer 405, a heat-conducting sheet 406 and a circuit board body 5.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-3, a circuit board copper clad laminate with black shielding effect includes a copper clad laminate body 1, a sticky layer 2 is fixedly mounted on the top of the copper clad laminate body 1, the sticky layer 2 is used for enabling each layer inside a protection mechanism 4 to be connected with the copper clad laminate body 1 more stably through the sticky layer 2, a light shielding layer 3 is fixedly mounted on the top of the sticky layer 2, the light shielding layer 3 is a black polyimide film through the light shielding layer 3, so that data inside a circuit board body 5 can be prevented from being read, and the protection mechanism 4 is fixedly mounted at the bottom of the sticky layer 2;

protection machanism 4 includes waterproof layer 401, first heat-absorbing layer 402, second heat-absorbing layer 403, heat-conducting layer 404, heat dissipation layer 405 and conducting strip 406, the top fixed mounting of copper foil base plate body 1 has waterproof layer 401, through setting up waterproof layer 401, the polyethylene layer can play better water-proof effects, prevent the inside intaking of copper foil base plate body 1, the top fixed mounting of waterproof layer 401 has first heat-absorbing layer 402, the top fixed mounting of first heat-absorbing layer 402 has second heat-absorbing layer 403, the top fixed mounting of second heat-absorbing layer 403 has heat-conducting layer 404, the top fixed mounting of heat-conducting layer 404 has heat dissipation layer 405, through first heat-absorbing layer 402, second heat-absorbing layer 403, the better mesh of radiating effect is reached in heat-conducting layer 404 and the combined action of heat-conducting layer 405, the outside fixed mounting of heat-conducting layer 404 has conducting strip 406.

When the method is implemented, the method comprises the following steps:

1) Firstly, arranging a copper foil substrate body 1 in a circuit board body 5, respectively arranging waterproof layers 401 at the top and the bottom of the copper foil substrate body 1, and achieving a waterproof effect through a polyethylene layer of the waterproof layer 401;

2) The first heat absorption layer 402, the second heat absorption layer 403, the heat conduction layer 404 and the heat dissipation layer 405 are respectively arranged to be an aluminum oxide layer, a graphene heat dissipation film, a silica gel sheet layer and a carbon nano heat dissipation film, so that the effect of efficient heat dissipation is achieved;

3) Finally, heat is rapidly led out of the copper foil substrate body 1 through the heat conducting fins 406, and the effect of rapid cooling and heat dissipation is achieved.

To sum up, this circuit board copper foil base board with black effect of shielding, through set up in the outside of copper foil base board body 1 and glue glutinous layer 2, the effect of gluing glutinous layer 2 makes each layer of protection machanism 4 inside be connected more firmly with copper foil base board body 1 through gluing glutinous layer 2, through setting up light shading layer 3, light shading layer 3 is black polyimide film, can prevent that 5 inside data of circuit board body from being read, through setting up waterproof layer 401, the polyethylene layer can play better water-proof effects, prevent that 1 inside of copper foil base board body from intaking, through first heat-absorbing layer 402, second heat-absorbing layer 403, heat-conducting layer 404 and heat dissipation layer 405 combined action reach the better purpose of radiating effect.

And, at first, set up copper foil substrate body 1 in the inside of circuit board body 5, and set up waterproof layer 401 respectively at the top of copper foil substrate body 1 and bottom, polyethylene layer through waterproof layer 401 reaches water-proof effects, through setting up first heat-absorbing layer 402, second heat-absorbing layer 403, heat-conducting layer 404 and heat dissipation layer 405 respectively to the aluminium oxide layer, graphite alkene radiating film, silica gel lamella and carbon nanometer radiating film, reach high-efficient radiating effect, at last derive the heat outside of copper foil substrate body 1 rapidly through conducting strip 406, reach the radiating effect of rapid cooling, it is unsatisfactory to have solved the majority of current copper foil substrate in the existing market, the heat can't be in time discharged, the life of the easy influence copper foil substrate, and current copper foil substrate part water-proof effects is not good, also can lead to the problem that copper foil substrate life shortens.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a circuit board copper foil base with black shielding effect, includes copper foil base body (1), its characterized in that: the light shielding layer is characterized in that a sticky layer (2) is fixedly mounted at the top of the copper foil substrate body (1), a light shielding layer (3) is fixedly mounted at the top of the sticky layer (2), and a protection mechanism (4) is fixedly mounted at the bottom of the sticky layer (2);

the protection mechanism (4) comprises a waterproof layer (401), a first heat absorption layer (402), a second heat absorption layer (403), a heat conduction layer (404), a heat dissipation layer (405) and heat conduction sheets (406), the waterproof layer (401) is fixedly mounted at the top of the copper foil substrate body (1), the first heat absorption layer (402) is fixedly mounted at the top of the waterproof layer (401), the second heat absorption layer (403) is fixedly mounted at the top of the first heat absorption layer (402), the heat conduction layer (404) is fixedly mounted at the top of the second heat absorption layer (403), the heat dissipation layer (405) is fixedly mounted at the top of the heat conduction layer (404), and the heat conduction sheets (406) are fixedly mounted outside the heat conduction layer (404).

2. The copper foil substrate for circuit board with black shielding effect as claimed in claim 1, wherein: the outer fixed mounting of copper foil substrate body (1) has circuit board body (5), protection machanism (4) are located the inside of circuit board body (5).

3. The copper foil substrate for circuit board with black shielding effect as claimed in claim 1, wherein: the quantity of waterproof layer (401) is two, two waterproof layer (401) are located the top and the bottom of copper foil base plate body (1) respectively, waterproof layer (401) are the polyethylene layer, the quantity of gluing layer (2) and light-resistant layer (3) is two.

4. The copper foil substrate for circuit board with black shielding effect as claimed in claim 1, wherein: two it is in the top and the bottom of copper foil base plate body (1) respectively to glue layer (2), two the relative one side of light shielding layer (3) respectively with two glue one side fixed connection that glue layer (2) relatively, two light shielding layer (3) are the polyimide film.

5. The copper foil substrate with black shading effect for circuit board of claim 1, wherein: the number of the first heat absorbing layers (402), the number of the second heat absorbing layers (403), the number of the heat conducting layers (404) and the number of the heat radiating layers (405) are two, opposite sides of the two first heat absorbing layers (402) are fixedly connected with opposite sides of the two waterproof layers (401), and opposite sides of the two second heat absorbing layers (403) are fixedly connected with opposite sides of the two heat conducting layers (404).

6. The copper foil substrate with black shading effect for circuit board of claim 1, wherein: two heat dissipation layer (405) one side of carrying on the back mutually respectively with two relative one side fixed connection who glues glutinous layer (2), first heat-absorbing layer (402) are the aluminium oxide layer, second heat-absorbing layer (403) are graphite alkene heat dissipation film, heat-conducting layer (404) are heat conduction silica gel lamella, heat dissipation layer (405) are carbon nanometer heat dissipation film.

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