CN214177634U

CN214177634U - Halogen-free insulating copper-clad plate

Info

Publication number: CN214177634U
Application number: CN202023169129.5U
Authority: CN
Inventors: 周培峰
Original assignee: Jiangmen Kingboard Laminates Holdings Ltd
Current assignee: Jiangmen Kingboard Laminates Holdings Ltd
Priority date: 2020-12-25
Filing date: 2020-12-25
Publication date: 2021-09-10
Anticipated expiration: 2030-12-25

Abstract

The utility model discloses a there is not steamed insulating copper-clad plate, which comprises a substrate, the top fixedly connected with fixed bed of base plate, the top fixedly connected with copper foil layer of fixed bed, the bottom fixedly connected with inlayer of base plate, the bottom fixedly connected with heat dissipation layer of inlayer, the bottom fixedly connected with fin on heat dissipation layer, the base plate includes the basic unit, the surface fixedly connected with of basic unit does not have the halogen insulation layer, the inlayer includes the enhancement layer, the bottom fixedly connected with heat-conducting layer of enhancement layer, the bottom fixedly connected with heat-conducting glue of heat-conducting layer, the bottom of heat-conducting glue and the top fixed connection on heat dissipation layer. This practicality possesses the advantage that the radiating effect is good, has solved current copper-clad plate at the in-process that uses, and is relatively poor to the radiating effect of copper-clad plate, causes the heat to pile up in the inside of copper-clad plate easily, influences the life of copper-clad plate, the lower problem of copper-clad plate bending strength.

Description

Halogen-free insulating copper-clad plate

Technical Field

The utility model relates to a copper-clad plate technical field specifically is a there is not insulating copper-clad plate of halogen.

Background

The copper clad laminate is a plate-shaped material formed by soaking a reinforcing material with resin, coating copper foil on one surface or two surfaces of the reinforcing material and carrying out hot pressing, is called a copper clad laminate, is a basic material of the electronic industry, is mainly used for processing and manufacturing printed circuit boards, is widely used for electronic products such as televisions, radios, computers, mobile communication and the like, has the history of nearly one hundred years in the copper clad industry, and is a technological development history which is developed synchronously with the electronic information industry, particularly with the PCB industry and is inseparable.

The existing copper-clad plate has poor heat dissipation effect on the copper-clad plate in the use process, heat is easily accumulated in the copper-clad plate, the service life of the copper-clad plate is influenced, the bending strength of the copper-clad plate is low, and the copper-clad plate is easily damaged.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a there is not steamed insulating copper-clad plate, possess the good advantage of radiating effect, solved current copper-clad plate at the in-process that uses, relatively poor to the radiating effect of copper-clad plate, cause the heat to pile up in the inside of copper-clad plate easily, influence the life of copper-clad plate, the anti bending strength of copper-clad plate is lower, causes the problem that the copper-clad plate damaged easily.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a there is not steamed insulating copper-clad plate, includes the base plate, the top fixedly connected with fixed bed of base plate, the top fixedly connected with copper foil layer of fixed bed, the bottom fixedly connected with inlayer of base plate, the bottom fixedly connected with heat dissipation layer of inlayer, the bottom fixedly connected with fin on heat dissipation layer, the base plate includes the basic unit, the surface fixedly connected with of basic unit does not have the halogen insulation layer, the inlayer includes the enhancement layer, the bottom fixedly connected with heat-conducting layer of enhancement layer, the bottom fixedly connected with heat-conducting glue of heat-conducting layer.

Preferably, the number of the radiating fins is several, and the radiating fins are uniformly distributed at the bottom of the radiating layer.

Preferably, the fixing layer is made of an adhesive, and the heat-conducting glue is made of heat-conducting silicone grease.

Preferably, the heat dissipation layer and the heat dissipation fins are made of aluminum alloy, and the bottom of the heat conduction glue is fixedly connected with the top of the heat dissipation layer.

Preferably, the base layer is made of glass fiber cloth, and the halogen-free insulating layer is made of halogen-free epoxy resin.

Preferably, the reinforcing layer is made of carbon fibers, and the heat conduction layer is made of nano carbon.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a cooperation of heat dissipation layer, fin, enhancement layer, heat-conducting layer and heat-conducting glue is used, has solved current copper-clad plate and at the in-process that uses, and is relatively poor to the radiating effect of copper-clad plate, causes the heat to pile up in the inside of copper-clad plate easily, influences the life of copper-clad plate, and the bending strength of copper-clad plate is lower, causes the problem that the copper-clad plate damaged easily.

2. The utility model discloses a set up the fixed bed, can be convenient for fix the copper foil layer, through setting up the copper foil layer, can be convenient for shield electromagnetism, through setting up the heat dissipation layer, can be convenient for dispel the heat that the copper-clad plate produced, through setting up the fin, can be convenient for discharge the heat that the heat dissipation layer distributes out fast, through setting up the enhancement layer, the intensity that can be convenient for increase the base plate avoids its damage, through setting up the heat-conducting layer, can be convenient for derive the heat that the copper-clad plate produced, through setting up the heat-conducting glue, can be convenient for make heat conduction on the heat-conducting layer conduct the heat dissipation layer.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic cross-sectional view of the base plate of the present invention;

fig. 3 is a schematic cross-sectional view of the inner layer of the present invention.

In the figure: the heat-conducting plate comprises a base plate 1, a fixing layer 2, a copper foil layer 3, an inner layer 4, a heat-radiating layer 5, a heat-radiating fin 6, a base layer 7, a halogen-free insulating layer 8, a reinforcing layer 9, a heat-conducting layer 10 and heat-conducting glue 11.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model provides a parts such as base plate 1, fixed bed 2, copper foil layer 3, inlayer 4, heat dissipation layer 5, fin 6, basic unit 7, halogen-free insulating layer 8, enhancement layer 9, heat-conducting layer 10 and heat-conducting glue 11 are the parts that general standard spare or field technician know, and its structure and principle all can learn through the technical manual or learn through conventional experimental method for field technician.

Referring to fig. 1-3, a halogen-free insulating copper clad laminate comprises a substrate 1, wherein a fixing layer 2 is fixedly connected to the top of the substrate 1, the copper foil layer 3 can be conveniently fixed by arranging the fixing layer 2, the fixing layer 2 is made of an adhesive, the copper foil layer 3 is fixedly connected to the top of the fixing layer 2, the copper foil layer 3 is arranged to facilitate electromagnetic shielding, an inner layer 4 is fixedly connected to the bottom of the substrate 1, a heat dissipation layer 5 is fixedly connected to the bottom of the inner layer 4, heat dissipation fins 6 are fixedly connected to the bottom of the heat dissipation layer 5, the heat generated by the copper clad laminate can be conveniently dissipated by arranging the heat dissipation fins 5, the heat dissipated by the heat dissipation fins 5 can be conveniently and rapidly dissipated by arranging the heat dissipation fins 6, the heat dissipation layers 5 and the heat dissipation fins 6 are made of aluminum alloy, the number of the heat dissipation fins 6 is several, and the heat dissipation fins are uniformly distributed at the bottom of the heat dissipation layer 5, the base plate 1 comprises a base layer 7, a halogen-free insulating layer 8 is fixedly connected to the outer surface of the base layer 7, the base layer 7 is made of glass fiber cloth, the halogen-free insulating layer 8 is made of halogen-free epoxy resin, the inner layer 4 comprises a reinforcing layer 9, the reinforcing layer 9 is arranged to facilitate strength increase of the base plate 1 and avoid damage of the base plate, a heat conducting layer 10 is fixedly connected to the bottom of the reinforcing layer 9, heat generated by a copper-clad plate can be led out conveniently by arranging the heat conducting layer 10, heat conducting glue 11 is fixedly connected to the bottom of the heat conducting layer 10 and can be conducted to the heat dissipation layer 5 by arranging the heat conducting glue 11, the bottom of the heat conducting glue 11 is fixedly connected with the top of the heat dissipation layer 5, the reinforcing layer 9 is made of carbon fiber, the heat conducting layer 10 is made of nano carbon, the heat conducting glue 11 is made of heat conducting silicone grease, and is matched with the heat dissipation layer 5, the heat dissipation fin 6, the reinforcing layer 9, the heat conducting layer 10 and the heat conducting glue 11, the problems that the existing copper-clad plate is poor in heat dissipation effect of the copper-clad plate in the using process, heat is easily accumulated in the copper-clad plate, the service life of the copper-clad plate is affected, the bending strength of the copper-clad plate is low, and the copper-clad plate is easily damaged are solved.

During the use, through setting up fixed layer 2, can be convenient for fix copper foil layer 3, through setting up copper foil layer 3, can be convenient for shield electromagnetism, through setting up heat dissipation layer 5, can be convenient for dispel the heat that the copper-clad plate produced, through setting up fin 6, can be convenient for discharge the heat that heat dissipation layer 5 distributed fast, through setting up enhancement layer 9, can be convenient for increase the intensity of base plate 1 and avoid its damage, through setting up heat-conducting layer 10, can be convenient for derive the heat that the copper-clad plate produced, through setting up heat-conducting glue 11, can be convenient for make heat conduction on the heat-conducting layer 10 on the heat dissipation layer 5.

In summary, the following steps: this no halogen insulation copper-clad plate uses through the cooperation of heat dissipation layer 5, fin 6, enhancement layer 9, heat-conducting layer 10 and heat conduction glue 11, has solved current copper-clad plate and at the in-process that uses, and is relatively poor to the radiating effect of copper-clad plate, causes the heat to pile up in the inside of copper-clad plate easily, influences the life of copper-clad plate, and the bending strength of copper-clad plate is lower, causes the problem that the copper-clad plate damaged easily.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a halogen-free insulating copper-clad plate, includes base plate (1), its characterized in that: the heat-conducting type solar battery is characterized in that the top fixedly connected with fixed layer (2) of the substrate (1), the top fixedly connected with copper foil layer (3) of the fixed layer (2), the bottom fixedly connected with inner layer (4) of the substrate (1), the bottom fixedly connected with heat-radiating layer (5) of the inner layer (4), the bottom fixedly connected with heat-radiating fins (6) of the heat-radiating layer (5), the substrate (1) comprises a base layer (7), the outer fixedly connected with halogen-free insulating layer (8) of the base layer (7), the inner layer (4) comprises a reinforced layer (9), the bottom fixedly connected with heat-conducting layer (10) of the reinforced layer (9), and the bottom fixedly connected with heat-conducting glue (11) of the heat-conducting layer (10).

2. The halogen-free insulating copper-clad plate according to claim 1, characterized in that: the number of the radiating fins (6) is a plurality, and the radiating fins are uniformly distributed at the bottom of the radiating layer (5).

3. The halogen-free insulating copper-clad plate according to claim 1, characterized in that: the fixing layer (2) is made of an adhesive, and the heat-conducting glue (11) is made of heat-conducting silicone grease.

4. The halogen-free insulating copper-clad plate according to claim 1, characterized in that: the heat dissipation layer (5) and the heat dissipation fins (6) are made of aluminum alloy, and the bottom of the heat conduction glue (11) is fixedly connected with the top of the heat dissipation layer (5).

5. The halogen-free insulating copper-clad plate according to claim 1, characterized in that: the base layer (7) is made of glass fiber cloth, and the halogen-free insulating layer (8) is made of halogen-free epoxy resin.

6. The halogen-free insulating copper-clad plate according to claim 1, characterized in that: the reinforcing layer (9) is made of carbon fibers, and the heat conduction layer (10) is made of nano carbon.